CN213365403U

CN213365403U - Server heat radiation structure

Info

Publication number: CN213365403U
Application number: CN202022075642.1U
Authority: CN
Inventors: 周康
Original assignee: Shenzhen Guoxin Hengyun Information Security Co Ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co Ltd
Priority date: 2020-09-21
Filing date: 2020-09-21
Publication date: 2021-06-04
Anticipated expiration: 2030-09-21

Abstract

The utility model discloses a server heat radiation structure, server heat radiation structure is applied to quick-witted case, machine case includes the box, server heat radiation structure set up in the box, server heat radiation structure including transversely arrange in a plurality of fans in the box, and arrange in quick-witted incasement with a plurality of wind scoopers that a plurality of fans correspond the connection, a plurality of wind scoopers form independent heat dissipation channel respectively. The utility model discloses an independent heat dissipation channel independently dispels the heat to the spare part of quick-witted incasement difference, can avoid the mutual interference between each spare part, improves the radiating effect.

Description

Server heat radiation structure

Technical Field

The utility model relates to a server technical field, in particular to server heat radiation structure.

Background

With the development of science and technology, the requirements on the computing and graphic processing capabilities of the server and the high-performance computing capability are higher and higher, the cost and the space requirements are considered, the server is required to support more cards such as GPU cards or network cards, and the like, and the server can stably run in a working state, and the heat dissipation of the whole system is a great challenge.

Due to the 2U space limitation, most manufacturers carry customized motherboards, so that the selectivity of consumers becomes very narrow, and different motherboards cannot be carried according to the actual application of the consumers. And adopt mainboard and GPU to mix among the prior art and dispel the heat usually, have the drawback, if carry on fixed mainboard and break down, can not solve rapidly, can only wait for the manufacturer to maintain and solve.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a server heat radiation structure, aims at realizing that GPU and mainboard separately dispel the heat, improve the radiating effect.

In order to achieve the above object, the utility model provides a server heat radiation structure, server heat radiation structure is applied to quick-witted case, quick-witted case includes the box, server heat radiation structure set up in the box, server heat radiation structure including transversely arrange in a plurality of fans in the box, and arrange in quick-witted incasement with a plurality of wind scoopers that a plurality of fans correspond the connection, a plurality of wind scoopers form independent heat dissipation channel respectively.

The utility model discloses a further technical scheme is, 2U8 positions or 2U12 positions are arranged to the front end of quick-witted case.

The utility model discloses a further technical scheme is, 2 GPUs have been arranged along width direction in the machine incasement.

The utility model discloses a further technical scheme is, full high PCIE module and half high PCIE module have been arranged to the rear end both sides of machine case.

The utility model discloses a further technical scheme is, the machine incasement in power module has been arranged to the below of half high PCIE module.

The utility model discloses server heat radiation structure's beneficial effect is: the utility model discloses an above-mentioned technical scheme is applied to quick-witted case, quick-witted case includes the box, server heat radiation structure set up in the box, server heat radiation structure including transversely arrange in a plurality of fans in the box, and arrange in quick-witted incasement with a plurality of wind scoopers that a plurality of fans correspond the connection, a plurality of wind scoopers form independent heat dissipation channel respectively, independently dispel the heat to the spare part of quick-witted incasement difference through independent heat dissipation channel, can avoid the mutual interference between each spare part, improve the radiating effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a chassis on which the server heat dissipation structure of the present invention is installed;

FIG. 2 is a first schematic view of a front panel of a chassis;

FIG. 3 is a second schematic view of a front panel of a chassis;

fig. 4 is a schematic diagram of a rear window of a chassis.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Server heat radiation structure	5	Fan frame
2	Box body	6	Full-high PCIE module
				3	Fan with cooling device	7	Half-high PCIE module
4	Wind scooper	8	Power supply module

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Consider that present server adopts mainboard and GPU mixed heat dissipation, has the drawback, if carry on fixed mainboard and break down, can not solve the trouble rapidly, can only wait for the firm maintenance to solve, from this, the utility model provides a solution, specifically one kind supports Intel and AMD domestic platform calculation type server structural design scheme.

Referring to fig. 1 to 4, fig. 1 is a schematic view of an overall structure of a server heat dissipation structure according to the present invention; FIG. 2 is a first schematic view of a front panel of a chassis; FIG. 3 is a second schematic view of a front panel of a chassis; fig. 4 is a schematic diagram of a rear window of a chassis.

The utility model provides a server heat radiation structure 1, server heat radiation structure 1 is applied to quick-witted case, quick-witted case includes box 2, server heat radiation structure 1 set up in the box 2, server heat radiation structure 1 including transversely arrange in a plurality of fans 3 in the box 2, and arrange in quick-witted incasement with a plurality of wind scoopers 4 that a plurality of fans 3 correspond the connection, a plurality of wind scoopers 4 form independent heat dissipation channel respectively. The fan 3 may be mounted in the chassis through a fan frame 5.

The utility model discloses a plurality of wind scoopers 4 form independent heat dissipation channel, and the wind direction machine incasement that will correspond 3 productions of fan is different spare part (for example GPU and mainboard) independently dispels the heat, can avoid the mutual interference between each spare part, improves the radiating effect.

The front end (chassis front panel) of the chassis is transversely provided with a 2U8 disk (shown in figure 2) or a 2U12 disk (shown in figure 3) for placing a hard disk, 2 GPUs are arranged in the chassis along the width direction, and a full-high PCIE module 6 and a half-high PCIE module 7 are arranged on two sides of the rear end of the chassis. The full-height PCIE module 6 supports a full-height full-length dual-width GPU card or a full-height full-length single-width card, and the half-height PCIE module 7 supports a half-height PCIE network card or an entire row of cards, P4, or T4 video cards, and the like.

And a power supply module 8 for supplying power to the fans 3 and the whole system in the case is arranged below the half-high PCIE module 7 in the case.

As an embodiment, the fan 3 may adopt an 8038 fan 3 or an 8056 fan 3.

The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims

1. The server heat dissipation structure is characterized by being applied to a case, the case comprises a box body, the server heat dissipation structure is arranged in the box body, the server heat dissipation structure comprises a plurality of fans transversely arranged in the box body and a plurality of air guiding covers arranged in the case and correspondingly connected with the fans, and the air guiding covers respectively form independent heat dissipation channels.

2. The heat dissipation structure of claim 1, wherein a 2U8 bay or a 2U12 bay is disposed at a front end of the chassis.

3. The heat dissipation structure for servers, according to claim 1, wherein 2 GPUs are arranged in the chassis in the width direction.

4. The server heat dissipation structure of any one of claims 1 to 3, wherein a full-high PCIE module and a half-high PCIE module are arranged on two sides of the rear end of the chassis.

5. The server heat dissipation structure of claim 4, wherein a power module is disposed in the chassis below the half-high PCIE module.