CN213364820U

CN213364820U - MEMS chip test socket upper cover and socket

Info

Publication number: CN213364820U
Application number: CN202021790863.0U
Authority: CN
Inventors: 邹波; 王苏江
Original assignee: Shendi Semiconductor Shaoxing Co ltd
Current assignee: Shendi Semiconductor Shaoxing Co ltd; Senodia Technologies Shaoxing Co Ltd
Priority date: 2020-08-20
Filing date: 2020-08-20
Publication date: 2021-06-04
Anticipated expiration: 2030-08-20

Abstract

The utility model provides an MEMS chip test socket upper cover and a socket, wherein the MEMS chip test socket upper cover comprises a base, a movable part, a limiting part and an elastic component; the limiting piece is fixed on the base and defines a movable space with the base, and the movable space defines an extending direction; the movable member is disposed in the movable space, and the movable member is movable in the movable space in the extending direction; the elastic component abuts against the base and the movable part respectively, and provides elastic force to enable the movable part to be far away from the base; the thickness of the movable part along the extension direction is adjustable.

Description

MEMS chip test socket upper cover and socket

Technical Field

The utility model relates to a MEMS chip test field especially relates to a MEMS chip test socket upper cover and socket.

Background

Micro Electro Mechanical Systems (MEMS) are Micro integrated systems that use integrated circuit fabrication and micromachining techniques to fabricate Micro structures, Micro sensors, control and processing circuitry, and even interfaces, communications and power supplies, on one or more chips. In the process of testing the MEMS chip, it is usually necessary to fix the MEMS chip on a PCB board for testing through a test socket and communicate with the PCB board through a probe.

With the continuous improvement and innovation of MEMS chips, more requirements are put on the test conditions of the chips, and accordingly, those skilled in the art are also devoted to meet and enrich more test requirements by improving MEMS chip test sockets.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be suitable for the upper cover of MEMS chip test socket and socket of the stress that the adjustment MEMS chip receives when the test to can obtain the test data of MEMS chip under different stress condition.

The utility model provides an MEMS chip test socket upper cover, which comprises a base, a movable part, a limiting part and an elastic component; the limiting piece is fixed on the base and defines a movable space with the base, and the movable space defines an extending direction; the movable member is disposed in the movable space, and the movable member is movable in the movable space in the extending direction; the elastic component abuts against the base and the movable part respectively, and provides elastic force to enable the movable part to be far away from the base; the thickness of the movable part along the extension direction is adjustable.

Further, the movable part comprises at least one gasket, and the thickness of the movable part is changed by adjusting the thickness and/or the number of the gaskets.

Further, the gasket includes one or more thickness gauges.

Furthermore, the movable part further comprises a cover body and a cushion block, the cover body, the cushion block and the cushion block are sequentially stacked and detachably and fixedly connected, and the cushion block is arranged on one side close to the base.

Furthermore, a boss is arranged on one side, away from the base, of the cover body.

Further, a protrusion is arranged on the boss.

Further, the base comprises a first limiting structure, the cushion block comprises a second limiting structure, and the first limiting structure and the second limiting structure are matched to limit the installation position of the elastic assembly.

The utility model also provides an MEMS chip test socket upper cover, which comprises a base, wherein the base is provided with a plurality of structural units, and each structural unit comprises a movable part, a limiting part and an elastic component; the limiting piece is fixed on the base and defines a movable space with the base, and the movable space defines an extending direction; the movable member is disposed in the movable space, and the movable member is movable in the movable space in the extending direction; the elastic component abuts against the base and the movable part respectively, and provides elastic force to enable the movable part to be far away from the base; the thickness of the movable part along the extension direction is adjustable.

Furthermore, the plurality of structural units are distributed in an array form.

The utility model provides a pair of MEMS chip test socket, it includes foretell MEMS chip test socket upper cover.

The utility model discloses a MEMS chip test socket upper cover and socket are suitable for when the chip test, adjust the atress situation on the chip to obtain the test data of chip under different stress condition. The structure of this embodiment easily realizes, and thickness is adjusted portably, and the precision of adjusting is also convenient for control. In the mass test production, adopt the utility model discloses a MEMS chip test socket upper cover and socket with array structure unit under the prerequisite that can not influence production efficiency, realize the test of chip under multiple stress condition promptly.

The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings, so as to fully understand the objects, the features and the effects of the present invention.

Drawings

Fig. 1 is a schematic structural diagram of an upper cover of a MEMS chip test socket according to an embodiment of the present invention;

FIG. 2 is an exploded view of the embodiment of FIG. 1;

FIG. 3 is a schematic structural diagram of the base of the embodiment of FIG. 1;

FIG. 4 is a schematic diagram of the movable member of the embodiment of FIG. 1;

FIG. 5 is a system diagram of another perspective of the movable member of FIG. 4;

FIG. 6 is an exploded view of the movable member of FIG. 4;

FIG. 7 is a schematic diagram of a MEMS chip test socket base;

FIG. 8 is a schematic diagram of the change in the position of the chip under test before and after the change in the thickness of the movable member;

fig. 9 is a schematic structural diagram of a MEMS chip test socket cover according to another embodiment of the present invention.

Description of reference numerals:

10-structural unit, 100-base,

101 to 104 screw holes, 111 to 114 circular holes,

200-a movable part, 210-a cover body,

211-214-counter bore, 215-step,

216-a boss, 217-a protrusion,

220-spacers, 221-224-through holes,

230-cushion block, 231-234-threaded hole,

235 to 238-circular holes, 241 to 244-screws,

301 to 304-screws, 401 to 404-compression springs,

500-a chip to be tested, 600-a carrier,

601 to 604, screws, 700, a floating plate,

701-a groove, 800-a through hole,

900-spring probe.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Example one

FIGS. 1 and 2 show a MEMS chip test socket upper cover of the present embodiment, which includes a base 100, a movable member 200, screws 301 to 304, and compression springs 401 to 404. The base 100 is provided with screw holes 101 to 104 which are engaged with screws 301 to 304, as shown in FIG. 3. The movable member 200 is disposed in a space defined by the base 100 and the screws 301 to 304, the movable member 200 is movable in the space along and only along the extending direction of the screws 301 to 304, and the extreme positions of the movable range of the movable member 200 in the above direction are defined by the heads of the base 100 and the screws 301 to 304, respectively. Compression springs 401-404 are disposed between the movable member 200 and the base 100, and both ends of the compression springs 401-404 abut against the movable member 200 and the base 100, respectively, so that the spring force provided by the compression springs 401-404 keeps the movable member 200 away from the base 100. The movable member 200 is held in a position spaced apart from the base 100 by the spring force of the compression springs 401-404, which position is defined by the heads of the screws 301-304, i.e. the movable member 200 abuts against the heads of the screws 301-304.

As shown in fig. 4 to 6, the movable member 200 includes a cover 210, a spacer 220, and a spacer 230, the cover 210, the spacer 220, and the spacer 230 are sequentially stacked, and the spacer 230 is disposed on a side close to the base 100. The thickness of the movable member 200 is defined by the total thickness of the cover 210, the spacer 220 and the spacer 230, and the thickness of the movable member 200 is adjusted accordingly by adjusting the thickness and/or number of the spacers 220 (2 spacers 220 are used in the illustration of the present embodiment), the thickness of the movable member 200 directly affects the amount of compression of the compression springs 401 to 404 between the movable member 200 and the base 100, the amount of compression of the compression springs 401 to 404 increases with the increase in the thickness of the movable member 200, and similarly, the larger the thickness of the movable member 200 is, the larger the elastic force of the compression springs 401 to 404 is.

As shown in FIG. 6, the cover 210 is provided with counter bores 211-214, the gasket 220 is provided with through holes 221-224 respectively matched with the counter bores 211-214, and the cushion block 230 is provided with threaded holes 231-234 respectively matched with the counter bores 211-214. The cover 210, the spacer 220 and the spacer 230 are fixedly connected by screws 241 to 244.

As shown in FIGS. 3 and 5, the cushion block 230 has circular holes 235 to 238, and the base 100 has circular holes 111 to 114 respectively matching with the circular holes 235 to 238. One ends of the compression springs 401 to 404 are disposed in the circular holes 235 to 238, respectively, and the other ends of the compression springs 401 to 404 are disposed in the circular holes 111 to 114, respectively.

The cover 210 is further provided with a step 215, and when the movable member abuts against the heads of the screws 301 to 304, specifically, the step 215 abuts against the heads of the screws 301 to 304. Meanwhile, the height of the step 215 is matched with the head of the screws 301-304, so that the screws 301-304 are not higher than the outer surface of the cover body 210.

The cover 210 is further provided with a boss 216, and the boss 216 is provided with a protrusion 217. The MEMS chip test socket upper cover of the present embodiment is matched with a corresponding MEMS chip test socket base during chip test, and fig. 7 shows a MEMS chip test socket base, which includes a carrier 600 and a floating plate 700, wherein the floating plate 700 is disposed in a recess on the carrier 600, and similar to the movable member 200 in the MEMS chip test socket upper cover of the present embodiment, a compression spring is also disposed between the floating plate 700 and the carrier 600, and the limit position of the floating plate 700 away from the carrier 600 is defined by screws 601-604 fixed on the carrier 600. The floating plate 700 is provided with a groove 701, the shape of the groove 701 is matched with a chip to be tested, and the chip to be tested is placed in the groove 701 during testing. The MEMS chip test socket base is further provided with a plurality of through holes 800, the through holes 800 penetrate the floating plate 700 and the carrier 600, and spring probes for testing the chip are disposed in the through holes 800, and in an initial state (the floating plate 700 is at an extreme position away from the carrier 600), the probes do not expose the through holes 800 in the grooves 701.

When testing the chip, the upper cover of the MEMS chip test socket is closed with the base, the bumps 216 on the cover 210 are aligned with the floating plate 700, and the protrusions 217 are aligned with the grooves 701 on the floating plate 700 and are also aligned with the chip to be tested in the grooves 701. When the upper cover and the base are completely covered, the floating plate 700 is pressed down by the boss 216 for a preset distance, namely the height of the boss 216 is equal to that of the spring probe, so that the spring probe in the through hole 800 is exposed, the spring probe contacts with a test pin of a chip to be tested, the chip to be tested is pressed down by the boss 217, and finally the chip to be tested is clamped between the boss 217 and the spring probe, at the moment, the movable part 200 and the spring probe both have certain retraction amount, namely, the movable part 200 is jacked up from a limit position abutting against the head parts of the screws 301-304, so that the compression springs 401-404 are further compressed, and meanwhile, the spring probe in contact with the chip to be tested is also pressed down. The above state can be obtained by selecting the specifications of the compression springs 401 to 404 and the spring probe, for example, selecting an appropriate elastic modulus.

For the existing MEMS chip test socket, the upper cover and the base coverThen, the stress on the chip to be tested is determined, and the pressure F on the upper surface and the lower surface of the chip to be tested is determined_topAnd F_bottomRespectively as follows:

F_top＝F₁+G₁ (1)

F_bottom＝F₂ (2)

wherein, F₁The elastic force G provided by the compression springs 401-404₁Is the weight force, F, to which the movable part 200 is subjected₂Is the elastic force provided by the spring probe at this time, G₂Is the gravity that the chip under test is subjected to.

And is

F_bottom＝F_top+G₂ (3)

Substituting equations (1) and (2) into equation (3) yields:

F₂＝F₁+G₁+G₂ (4)

with the continuous development and innovation of the MEMS chip, in some chip design schemes, the external force applied to the chip is also monitored as an induction signal, for example, for capacitive gyroscopes, acceleration and other products, the capacitance output signal of the chip changes to some extent or even significantly under the strain state, so that the degree of the chip affected by the external force can be qualitatively or quantitatively determined, which is equivalent to the effect of a pressure sensor. For the improvement of such chips, in addition to the conventional test items, the test of the chip under different external forces must be considered when testing the chip. However, as mentioned above, in the conventional test structure, the stress condition of the chip under test is determined during the test and cannot be changed.

The utility model provides a MEMS chip test socket upper cover adjusts movable part 200's thickness through the thickness and/or the quantity of gasket 220 to the elastic force that compression spring 401 ~ 404 provided when the test condition changes. As shown in fig. 8, the thickness of the movable member 200 in the left drawing (hereinafter referred to as state 1) is smaller than that in the right drawing (hereinafter referred to as state 2), and the amount of retraction of the movable member 200 in state 2 is increased due to the increased thickness of the movable member 200Less in state 1 because if the movable part 200 in state 2 is also in position in state 1, according to equation (4), F is due to the thickening of the movable part 200 compared to the chip 500 under test in state 1₁Enlargement, G₁Slightly increased, while F₂And G₂The same is true, so that the position of the chip 500 under test in state 1 is not an equilibrium position for state 2. In state 2, the chip 500 under test is located relatively closer to the base, and the spring probe 900 is further compressed, i.e., F, relative to state 1₂Increase, and G₂Constant, as can be seen from equations (1) and (4), F_topAnd also increases. Therefore, the thickness of the movable part 200 can be changed to correspondingly change the external force applied to the chip to be tested.

In principle, as long as the movable component 200 is within the thickness adjustment range and the MEMS chip test socket is covered, the movable component 200 can provide different external forces to the chip to be tested depending on the different thicknesses of the movable component 200 as long as the movable component 200 has different retraction amounts, and thus the MEMS chip test socket is not limited to the above MEMS chip test socket form_bottomNamely, the elastic force provided by the spring probe and the floating plate together, even if the force of the chip to be tested can be adjusted according to the thickness of the movable part 200. In other embodiments, the floating plate 700 in fig. 7 may also be fixed, in which case the spring probes are exposed from the through holes 800, and after the socket is closed, the chip to be tested may be either supported by the spring probes below or pressed directly on the bottom of the groove 701. In either way, the external force applied to the chip under test can be adjusted by the thickness of the movable part 200 through the similar force analysis.

For the gasket 220, one or more thickness specifications of the gasket 220 may be prepared, such as 0.05mm, 0.1mm, etc., according to actual needs. In actual use, the thickness and/or number of spacers 220 may be increased or decreased at any time according to specific requirements. In some embodiments, a plurality of movable members 200 of various thicknesses may be prepared, i.e., each movable member 200 has a different thickness, so that the movable members 200 may be entirely replaced when adjustment is required, to save operation time.

After the MEMS chip test socket upper cover and the base cover are closed, the MEMS chip test socket upper cover and the base cover are kept relatively fixed, and any existing mode can be adopted, such as common buckle connection and the like.

Example two

Fig. 5 shows another embodiment of the MEMS chip test socket top cover, which includes a plurality of structural units 10, and each structural unit 10 includes the MEMS chip test socket top cover structure in the first embodiment, which is not described herein again.

The essence of this embodiment is to arrange the MEMS chip test socket in an array form, and the base 100 in each cover is combined together or integrally formed to form the base of this embodiment. The MEMS chip test socket upper cover in this embodiment is suitable for batch test, and meanwhile, the thicknesses of the movable components in different structural units 10 are set at one time as required, for example, a certain batch of chips need to test data in three stress states, the movable components with corresponding thicknesses may be set in different structural units in sequence, for example, the movable components are set to have a first thickness in a first column, a second thickness in a second column, a third thickness in a third column, and so on. During testing, the chips can be placed at all positions for testing (specifically, the chips are placed on the base matched with the upper cover), after the first round of testing is completed, the chips in each row are placed in another row for testing different stresses, and the chips are completely tested after three rounds of testing.

The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the teachings of the present invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.

Claims

1. An MEMS chip test socket upper cover is characterized by comprising a base, a movable part, a limiting piece and an elastic component; the limiting piece is fixed on the base and defines a movable space with the base, and the movable space defines an extending direction; the movable member is disposed in the movable space, and the movable member is movable in the movable space in the extending direction; the elastic component abuts against the base and the movable part respectively, and provides elastic force to enable the movable part to be far away from the base; the thickness of the movable part along the extension direction is adjustable.

2. The MEMS chip test socket cap of claim 1, wherein the movable member comprises at least one spacer, and the thickness of the movable member is varied by adjusting the thickness and/or number of the spacers.

3. The MEMS chip test socket cap of claim 2, wherein the gasket includes one or more thickness gauges.

4. The MEMS chip test socket cover according to claim 2, wherein the movable member further comprises a cover and a spacer, the cover, the spacer and the spacer are stacked in sequence and detachably fixed to each other, and the spacer is disposed on a side close to the base.

5. The MEMS chip test socket cap of claim 4, wherein a side of the cap body away from the base is provided with a boss.

6. The MEMS chip test socket upper cover according to claim 5, wherein a protrusion is provided on the boss.

7. The MEMS chip test socket cap of claim 4, wherein the base includes a first stop structure and the spacer includes a second stop structure, the first stop structure and the second stop structure cooperating to define a mounting location for the spring assembly.

8. The upper cover of the MEMS chip test socket is characterized by comprising a base, wherein a plurality of structural units are arranged on the base, and each structural unit comprises a movable part, a limiting part and an elastic component; the limiting piece is fixed on the base and defines a movable space with the base, and the movable space defines an extending direction; the movable member is disposed in the movable space, and the movable member is movable in the movable space in the extending direction; the elastic component abuts against the base and the movable part respectively, and provides elastic force to enable the movable part to be far away from the base; the thickness of the movable part along the extension direction is adjustable.

9. The MEMS chip test socket cover of claim 8, wherein the plurality of structural units are arranged in an array.

10. A MEMS chip test socket comprising the MEMS chip test socket upper cover according to any one of claims 1 to 9.