CN213342820U

CN213342820U - High density HDI rigid-flex board circuit board

Info

Publication number: CN213342820U
Application number: CN202022719293.2U
Authority: CN
Inventors: 王东府; 赵俊; 张志强
Original assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Current assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Priority date: 2020-11-20
Filing date: 2020-11-20
Publication date: 2021-06-01
Anticipated expiration: 2030-11-20

Abstract

The utility model discloses a high density HDI rigid-flex board circuit board, it includes: an inner panel provided with a filling cavity; a screed plate mounted within the fill cavity; a flexible FPC fixedly mounted within the fill cavity; the upper line laminated plate is fixed on the top surface of the embedded plate; a lower laminate secured to the inner panel bottom surface; the support is symmetrically provided with two support arms, two arc-shaped flanges are arranged on the side surfaces of the inner sides of the support arms, notches are formed in the arc-shaped flanges, the support is fixed on the edge of the inner panel through the two support arms, and a pressing groove is formed in the top of the support; the pressing piece slides up and down in the pressing groove and is fixed through a locking screw; the circuit board is combined in a soft and hard mode, the structure of the board body is reinforced, and bending and falling of the interface and the board body are prevented.

Description

High density HDI rigid-flex board circuit board

Technical Field

The utility model relates to circuit board technical equipment field especially involves a high density HDI rigid-flex board circuit board.

Background

The existing circuit board is generally divided into a single-layer board and a multi-layer board, the integration degree of a circuit which can be arranged on a unit area is determined according to the number of layers, and meanwhile, the design and manufacturing cost is positively correlated with the design and manufacturing cost. For some circuit boards that need higher strength, better heat dissipation performance, and easy installation and use, the number of layers is usually increased or decreased, for example, the circuit board is designed as a single-layer circuit board.

The structure of the existing high-density connectable circuit board is generally fragile and poor in self heat dissipation effect, the heat dissipation of the board body needs to be carried out by means of high-power air cooling, and along with the development of the circuit board, in order to improve the use efficiency and the connection efficiency of the space, the flexible FPC and the high-density connectable circuit board need to be connected, the existing connection mode is generally a connection circuit board or a flying wire mode which is matched for use, more space is still occupied in use and stitch connection needs to be reserved, and the installation is often carried out by screws and is also inconvenient. And the existing high-density connectable circuit board is generally provided with an optical module, a USB or a lightning output port, and the board body is fragile and cannot be bent for many times. The unreliability of the existing high-density HDI on structure and heat dissipation causes the service life of the HDI on a complex environment to be not long, and the HDI can not be conveniently combined with a soft FPC and the like.

Therefore, a high density HDI rigid-flex circuit board that solves one or more of the above problems is desired.

SUMMERY OF THE UTILITY MODEL

For solving one or more problems that exist among the prior art, the utility model provides a high density HDI rigid-flex board circuit board. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: the utility model provides a high density HDI rigid-flex board circuit board, it includes: an inner panel provided with a filling cavity;

a screed plate having a shape that fits the fill cavity, the screed plate being mounted within the fill cavity;

a flexible FPC fixedly mounted within the fill cavity and held down by the screed plate;

the upper line laminate is fixed on the top surface of the embedded plate, the width of the embedded plate is larger than that of the upper line laminate, and the upper line laminate is provided with a mounting groove which is used for fixedly mounting an optical module or an interface;

the lower line laminate is fixed on the bottom surface of the inner panel, a notch is formed in the lower line laminate, the notch is matched with the flexible FPC, the width of the inner panel is larger than that of the lower line laminate, and the lower line laminate and the upper line laminate are matched with the inner panel to fixedly press and stretch the leveling plate and the flexible FPC;

the support is symmetrically provided with two support arms, two arc-shaped flanges are arranged on the side surfaces of the inner sides of the support arms, notches are formed in the arc-shaped flanges, the two arc-shaped flanges of the same support arm are matched and buckled on the edge of the inner panel, the support is fixed on the edge of the inner panel through the two support arms, a pressure groove is formed in the top of the support, and the pressure groove corresponds to the installation groove in position;

and the pressing piece slides up and down in the pressing groove and is fixed through a locking screw.

Furthermore, the top surface of the filling cavity is provided with a buckling groove, and the end part of the leveling plate is provided with a buckling bulge matched with the buckling groove.

Furthermore, the bottom surface of the leveling plate is provided with a positioning bulge, and the flexible FPC is provided with a positioning notch matched with the positioning bulge.

Further, still include: the pressfitting piece, the pressfitting lock is in the plywood of going up the standard grade with the both ends of plywood down the line will the plywood of going up the standard grade the interior panel with the plywood of down the line compresses tightly.

Further, the tip of line plywood both sides be provided with pressfitting complex step, the tip of line plywood both sides be provided with pressfitting complex second step.

Furthermore, the supporting arms are provided with locking holes, and the locking holes are arranged between the two arc-shaped flanges on the same supporting arm and are aligned with the side faces of the inner embedded plate.

Further, the nearest distance between the arc surfaces of the two arc-shaped flanges arranged on the same support arm is equal to or smaller than the thickness of the embedded plate.

The utility model has the advantages that the inner panel, the leveling plate, the flexible FPC, the upper line laminate, the lower line laminate, the support, the pressing piece and other parts are connected together through an ingenious structure, the flexible FPC, the upper line laminate provided with an electroplated layer and the lower line laminate are combined together, the arrangement of circuits and the arrangement of components are convenient, the components can be conveniently arranged or the outside can be connected through the gap on the lower line laminate, the integral structural strength is improved through the inner panel, the bending resistance is improved, the connection strength of the interface module on the plate body is enhanced by matching with the support and the pressing piece, the installation and the use of other parts are not influenced while the falling is prevented, the service life of the module arranged on the plate body is prolonged, the service life of the plate body is prolonged, and the assembly is convenient in production, the connection is convenient when in use. The utility model discloses a practical value has greatly improved above.

Drawings

Fig. 1 is a perspective view of a high density HDI rigid-flex circuit board according to the present invention;

FIG. 2 is an exploded view of a high density HDI rigid-flex circuit board according to the present invention;

FIG. 3 is a top view of a high density HDI rigid-flex circuit board according to the present invention;

FIG. 4 is a cross-sectional view along the direction of the top view A-A of the HDI rigid-flex circuit board of the present invention;

figure 5 is the utility model relates to a side view of high density HDI rigid-flex board circuit board.

[ reference numerals ]

101. Embedded plate

102. filling the cavity

103. buckling groove

110. screed

111. buckling bulge

112. positioning projection

120. flexible FPC

121. positioning notch

201. pressing part

210. lower heat dissipation paste

211. top heat dissipation paste

301. top line laminate

302. mounting groove

303. step

401. lower line laminate

402. second mounting groove

403. second step

404. notch

501 support

502. arm

503. arc flange

504. notch

505. indent

510. locking hole

601. casting die

610. locking screw

611. spring

701 DEG

702. fixed foot.

Detailed Description

In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.

As shown in fig. 1-5, the utility model discloses a high density HDI rigid-flex board circuit board, it includes: an inner panel 101, said inner panel 101 being provided with a filling cavity 102;

a screed plate 110, the screed plate 110 being shaped to fit within the fill cavity 102, the screed plate 110 being mounted within the fill cavity 102;

a flexible FPC120, the flexible FPC120 being fixedly mounted within the filling cavity 102 and pressed by the screed 110;

the upper line layer plate 301 is fixed on the top surface of the inner panel 101, the width of the inner panel 101 is greater than that of the upper line layer plate 301, the upper line layer plate 301 is provided with a mounting groove 302, and the mounting groove 302 is used for fixedly mounting an optical module 701 or an interface;

the lower line laminate 401 is fixed on the bottom surface of the inner panel 101, the lower line laminate 401 is provided with a notch 404, the notch 404 is matched with the flexible FPC120, the width of the inner panel 101 is larger than that of the lower line laminate 401, and the lower line laminate 401 and the upper line laminate 301 are matched with the inner panel 101 to fixedly press and stretch the leveling plate 110 and the flexible FPC 120;

the support 501 is symmetrically provided with two support arms 502, two arc-shaped flanges 503 are arranged on the inner side surfaces of the support arms 502, the arc-shaped flanges 503 are provided with notches 504, the two arc-shaped flanges 503 of the same support arm 502 are matched and buckled on the edge of the inner panel 101, the support 501 is fixed on the edge of the inner panel 101 through the two support arms 502, the top of the support 501 is provided with a pressing groove 505, and the pressing groove 505 corresponds to the position of the mounting groove 302;

and a pressing member 601 which slides up and down in the pressing groove 505 and is fixed by a locking screw 610, and the pressing member 601 is generally provided with a fitting step which is fitted to the pressing groove 505 to limit a sliding distance.

It should be noted that the notch 404 is used for connecting the flexible FPC120 to an external component or circuit, and is convenient for ventilation and heat dissipation. The leveling plate 110 is used for flatly stretching and fixing the flexible FPC120, and the leveling plate 110 may be provided with a through hole for vertically connecting the flexible FPC120 with the upper line laminate 301. The flexible FPC120 is generally insulated from the upper surface of the lower laminate 401, and the upper laminate 301 is separated from the flexible FPC120 by the leveling plate 110.

Note that the upper laminate 301 and the lower laminate 401 are laminated plates having plating layers provided on the surfaces thereof, and the inner panel 101, the upper laminate 301, and the lower laminate 401 are pressed together and formed. The inner panel 101 is generally insulated from the upper wiring board 301 and the lower wiring board 401, and when the inner panel 101 is made of metal, such as copper sheet, the upper and lower surfaces of the inner panel 101 are adhered with insulating films, and the insulating films may be provided with electromagnetic shielding films to reduce interference. The arc-shaped flange 503 has elasticity, the notch 504 will shrink when force is applied, and the bracket 501 is elastically pressed on the edge of the inner panel 101 through the arc-shaped flange 503 and slides along the edge. The width of the inner panel 101 is greater than the width of the upper line deck 301, primarily to leave an edge for mounting the bracket 501 while facilitating external contact for heat dissipation.

It should be noted that the optical module 701 is generally positioned and mounted through the mounting groove 302, and then is pressed against the upper line laminate 301 by the support 501 and the pressing piece 601, and under the condition that the inner panel 101 reinforces a plate body, the support 501 and the pressing piece 601 do not crush the optical module 701, the upper line laminate 301, and the lower line laminate 401, and simultaneously, it is ensured that the optical module 701 is not bent or broken when being bent or pulled. Generally, the down conductor plate 401 may be provided with a second mounting slot 402, the second mounting slot 402 is also used for mounting the optical module 701, and the mounting slot 302 and the second mounting slot 402 are matched with a fixing pin 702 on the optical module 701.

Specifically, as shown in fig. 2 and 4, in another embodiment, a fastening groove 103 is formed on the top surface of the filling cavity 102, and a fastening protrusion 111, which is engaged with the fastening groove 103, is formed at the end of the screed plate 110 to facilitate the snap-fit installation of the screed plate 110 on the inner panel 101. And, the screed 110 bottom surface is provided with location arch 112, flexible FPC120 be provided with location arch 112 complex location breach 121, location arch 112 generally sets up on four angles of screed 110, and the convenience will flexible FPC120 installs the bottom surface of screed 110 is opened flat simultaneously flexible FPC120 realizes the soft or hard combination of circuit board to improve circuit board compatibility and design upper limit, and then improve actual performance.

Specifically, as shown in fig. 2 and 4, in another embodiment, the method further includes: the upper heat dissipation sticker 211 is fixed between the upper line layer board 301 and the inner panel 101; a lower heat sink 210, the lower heat sink 210 being secured between the lower core board 401 and the inner panel 101; the shapes of the upper heat dissipation sticker 211 and the lower heat dissipation sticker 210 are consistent with the surface shape of the inner panel 101, leaving a through groove for mounting the leveling plate 110. And functions to cooperate with the inner panel 101 to assist in dissipating heat from the upper and

lower laminates

301, 401. In still another embodiment, the method further comprises: the pressfitting 201, the pressfitting 201 lock is in the plywood 301 of going up the line with the both ends of plywood 401 of going down the line, will the plywood 301 of going up the line the interior panel 101 with plywood 401 of going down compresses tightly.

Specifically, as shown in fig. 1 and 2, the ends of both sides of the upper line laminate 301 are provided with steps 303 matched with the pressing piece 201, and the ends of both sides of the lower line laminate 401 are provided with second steps 403 matched with the pressing piece 201; the function is as follows: mating the crimps 201 to fasten the upper strand board 301, the inner panel 101, the lower strand board 401 while keeping the surfaces of the upper strand board 301 and the lower strand board 401 flat and without protrusions. The width of the stitching 201 is generally equal to or less than the width of the upper ply board 301, while the width of the upper ply board 301 generally corresponds to the lower ply board 401.

Specifically, as shown in fig. 1 and 2, the arm 502 is provided with a locking hole 510, and the locking hole 510 is disposed between two arc-shaped flanges 503 on the same arm 502 and aligned with the side of the inner panel 101, so as to fix the position of the bracket 501 through the locking hole 510 using screws. Generally, the locking screw 610 is sleeved with a spring 611, so as to prevent the pressing member 601 and the optical module 701 from being crushed or deformed when the pressing member 601 is locked by the locking screw 610, and a certain buffer space is reserved by the spring 611, thereby protecting the pressing member 601 and the optical module 701. And it should be noted that, in general, the closest distance between the arc surfaces of the two arc-shaped flanges 503 on the same arm 502 is equal to or less than the thickness of the inner panel 101, so that the two arc-shaped flanges 503 on the same arm 502 can be pressed against the edge of the inner panel 101.

To sum up, the utility model realizes the combination of the flexible FPC, the upper line laminate 301, the lower line laminate 401, the support 501, the pressing piece 601 and other components by connecting the inner panel 101, the leveling plate 110, the flexible FPC120, the upper line laminate 301, the lower line laminate 401, the support 501 and other components together through an ingenious structure, facilitates the arrangement of circuits and the arrangement of components, can conveniently arrange components or connect the outside through the gap on the lower line laminate, simultaneously improves the integral structural strength through the inner panel, improves the bending resistance, and enhances the connection strength of the interface module on the plate body by matching with the support and the pressing piece, thereby preventing the falling off and simultaneously not influencing the installation and the use of other components, prolonging the service life of the module arranged on the plate body and the service life of the plate body, and being convenient to assemble on the production, the connection is convenient when in use. The utility model discloses a practical value has greatly improved above.

The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a soft or hard combination board circuit board of high density HDI which characterized in that includes: an inner panel provided with a filling cavity;

2. The HDI rigid-flex PCB of claim 1, wherein said cavity top surface is provided with a fastening groove, and said leveling plate end is provided with a fastening protrusion matching with said fastening groove.

3. The high-density HDI rigid-flex circuit board as recited in claim 1, wherein said leveling board bottom surface is provided with positioning protrusions, and said flexible FPC is provided with positioning notches matched with said positioning protrusions.

4. The high-density HDI rigid-flex circuit board of claim 1, further comprising: the pressfitting piece, the pressfitting lock is in the plywood of going up the standard grade with the both ends of plywood down the line will the plywood of going up the standard grade the interior panel with the plywood of down the line compresses tightly.

5. The high-density HDI rigid-flex PCB of claim 4, wherein the ends of both sides of said upper line laminate are provided with steps matched with said pressing piece, and the ends of both sides of said lower line laminate are provided with second steps matched with said pressing piece.

6. A high density HDI flex-hard board circuit board according to claim 1 wherein said arms are provided with locking holes, said locking holes being located between two said arcuate flanges on the same arm and aligned with the sides of said inner panel.

7. The high-density HDI rigid-flex circuit board as recited in claim 1, wherein the closest distance between the cambered surfaces of two cambered flanges arranged on the same support arm is equal to or less than the thickness of the embedded plate.