CN213340430U - Binding structure, display panel and display device - Google Patents

Abstract

The utility model discloses a binding structure, display panel and display device, include: a plurality of units of binding that set gradually, bind the unit and include: a first metal layer and a second metal layer which are sequentially stacked on the substrate base plate; the metal oxide layer is positioned on one side, away from the substrate, of the second metal layer; the metal oxide layer includes a first portion and a second portion; the first part covers the upper surface of one side of the second metal layer, which is far away from the substrate, and the second part covers the side surfaces of the second metal layer and the first metal layer; the passivation layer is positioned on one side, away from the substrate, of the metal oxide layer, and at least covers the second part; the passivation layer is provided with hollow out construction, and hollow out construction deviates from substrate base plate one side at metal oxide and sets up the passivation layer with the vertical projection overlap of first portion at substrate base plate, adopts the passivation layer to protect the side surface of the first metal level that is not covered by the second metal level, improves the yields of binding structure when the salt spray test.

Description

Binding structure, display panel and display device

Technical Field

The utility model relates to a show technical field, especially relate to a bind structure, display panel and display device.

Background

At present, the binding structure of the binding region in the display panel completed in the industrial manufacturing generally needs to be subjected to a salt spray test on the prepared binding structure, and the salt spray test is utilized to verify the corrosion resistance of the binding structure completed in the industrial manufacturing process.

The existing binding structure comprises a first metal layer, a second metal layer and a metal oxide layer which are sequentially stacked, wherein the second metal layer covers the surface of one side, close to the metal oxide layer, of the first metal layer, the activity of the first metal layer is passivated by using the second metal layer, and then the metal oxide layer is prepared on the second metal layer. However, because part of the side surface of the first metal layer of the existing binding structure is not covered by the second metal layer, when a metal oxide layer is formed by sputtering, the side surface of the first metal layer which is not covered by the second metal layer can generate oxidation reaction, when the binding structure is subjected to a salt spray test, a solution of the salt spray test contains active chloride ions, the balance of the second metal layer is damaged, the chloride ions can be adsorbed on the surface of the second metal layer to squeeze out cations, and then the chloride ions are combined with the cations in the second metal layer to form soluble chloride which corrodes on the surface of the metal oxide to influence the conductivity of the binding structure.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a binding structure, display panel and display device improve the yields of binding structure portion when the salt spray test.

In a first aspect, an embodiment of the present invention provides a binding structure, including: a plurality of binding units that set gradually, the binding unit includes:

a first metal layer and a second metal layer which are sequentially stacked on the substrate base plate;

the metal oxide layer is positioned on one side, away from the substrate, of the second metal layer; the metal oxide layer includes a first portion and a second portion; the first part covers the upper surface of one side of the second metal layer, which is far away from the substrate base plate, and the second part covers the side surfaces of the second metal layer and the first metal layer;

the passivation layer is positioned on one side, away from the substrate, of the metal oxide layer and at least covers the second part; the passivation layer is provided with a hollow structure, and the vertical projection of the hollow structure on the substrate base plate is overlapped with the vertical projection of the first part on the substrate base plate.

In a second aspect, the embodiment of the present invention further provides a display panel, which includes a display area and a non-display area, the non-display area includes a binding area, and the binding area includes any one of the first aspect.

In a third aspect, an embodiment of the present invention further provides a display device, including the display panel of any one of the second aspects;

the display panel further comprises a driving chip, and the driving chip is bound and connected in the binding area through each binding unit.

The embodiment of the utility model provides a binding structure, display panel and display device sets up the passivation layer through deviating from substrate base plate one side at the metal oxide layer, and the passivation layer covers the second portion on metal oxide layer, utilizes the passivation layer to not being protected by the first metal level that the second metal level covered, when binding structure is carrying out the salt spray test, avoids the contact of sodium chloride solution and first metal level and forms the chloride on binding structure surface, has improved binding structure's electric conductive property.

Drawings

Fig. 1 is a schematic structural diagram of a binding structure in the prior art according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a binding structure according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view AA' of the binding structure provided in FIG. 2;

fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Fig. 1 is a schematic structural diagram of a binding structure in the prior art, and as shown in fig. 1, the binding structure includes a plurality of binding units 100 'that are sequentially arranged, and the binding unit 100' includes: a first metal layer 20 'and a second metal layer 30' which are sequentially stacked on the substrate base plate 10', and a metal oxide layer 40' which is positioned on the side of the second metal layer 20 'far away from the substrate base plate 10'. Because part of the side surface of the first metal layer 20' of the existing binding structure is not covered by the second metal layer 30', when the metal oxide layer 40' is formed by sputtering, the side surface of the first metal layer 20' which is not covered by the second metal layer 30' can generate oxidation reaction, when the binding structure is subjected to a salt spray test, a solution of the salt spray test contains active chloride ions, the balance of the second metal layer is damaged, the chloride ions can be adsorbed on the surface of the second metal layer to squeeze out cations, and then the chloride ions are combined with the cations in the second metal layer to form soluble chloride, so that the chloride corrodes on the surface of the metal oxide to influence the conductivity of the binding structure. Through deviating from substrate base plate one side at the metal oxide layer and forming the passivation layer, and the passivation layer covers the second portion on metal oxide layer, avoid the contact of binding structure sodium chloride solution and first metal level when carrying out the salt spray test, and then can avoid forming chloride on the binding structure surface, influence the electric conductive property of binding structure.

Above is the core thought of the utility model, will combine the attached drawing in the embodiment of the utility model below, to the technical scheme in the embodiment of the utility model clearly, describe completely. Based on the embodiments in the present invention, under the premise that creative work is not done by ordinary skilled in the art, all other embodiments obtained all belong to the protection scope of the present invention.

Fig. 2 is a schematic structural diagram of a binding structure provided by an embodiment of the present invention, fig. 3 is a schematic structural diagram of a cross section of the binding structure provided by fig. 2 along AA', as shown in fig. 2 and fig. 3, the binding structure includes a plurality of binding units 100 (fig. 2 exemplarily shows 3 binding units 100 that are sequentially set), and the binding units 100 include: the metal oxide layer 40 is positioned on the side, away from the substrate 10, of the second metal layer 30, the metal oxide layer 40 comprises a first portion 41 and a second portion 42, the first portion 41 covers the upper surface, away from the side, away from the substrate 10, of the second metal layer 30, the second portion 42 covers the side surfaces of the second metal layer 30 and the first metal layer 20, the passivation layer 50 is positioned on the side, away from the substrate 10, of the metal oxide layer 40, the passivation layer 50 at least covers the second portion 42, the passivation layer 50 is provided with a hollow structure 51, and the vertical projection of the hollow structure 51 on the substrate 10 is overlapped with the vertical projection of the first portion 41 on the substrate 10.

Exemplarily, referring to fig. 2 and 3, the bonding structure includes a first metal layer 20, a second metal layer 30, a metal oxide layer 40 and a passivation layer 50, wherein the first metal layer 20 includes an aluminum material, the second metal layer 30 includes a molybdenum material, the second metal layer 30 covers an upper surface of a side of the first metal layer 20 facing away from the substrate 10, a first portion 41 of the metal oxide layer 40 covers an upper surface of a side of the second metal layer 30 facing away from the substrate 10, a second portion 42 of the metal oxide layer 40 covers side surfaces of the second metal layer 30 and the first metal layer 20, the second metal layer 30 is disposed to cover a portion of the first metal layer 20, so as to ensure that the metal oxide layer 40 is electrically contacted with the first metal layer 20, reduce impedance of the metal oxide layer 40 by using a characteristic of a lower resistance value of the first metal layer 20, and further ensure that the metal oxide layer 40 of the bonding structure is bonded to the driving chip of the display panel, the metal oxide layer 40 has a low impedance, and improves the signal transmission performance.

Because the second metal layer 30 only covers the upper surface of the first metal layer 20 on the side away from the substrate 10, when the metal oxide layer 40 is formed by a sputtering process, the side surface of the first metal layer 20 not covered by the second metal layer 30 is oxidized, and further when the corrosion resistance of the binding structure is verified by a salt spray test, chloride ions in a sodium chloride solution adopted by the salt spray test destroy the balance of oxides on the surface 30 of the second metal layer and squeeze out cations in the oxides, and at the moment, the cations in the second metal layer 30 are combined with the chloride ions in a sodium chloride solution to form soluble chlorides which are corroded on the surface of the metal oxide layer 40, so that the conductivity of the metal oxide layer 40 is affected. Therefore, by arranging the passivation layer 50 on the side of the metal oxide layer 40 away from the substrate base plate 10, and covering at least the second portion 42 of the metal oxide layer 40 with the passivation layer 50, the first metal layer 20 which is not covered by the second metal layer 30 is protected by the passivation layer 50, so that when the salt spray test is performed on the binding structure, the direct contact between the sodium chloride solution and the first metal layer 20 is avoided, and chloride is formed on the surface of the binding structure, which affects the conductivity of the binding structure.

The embodiment of the utility model provides a binding structure sets up the passivation layer through deviating from substrate base plate one side at the metal oxide layer, and the passivation layer covers the second portion on metal oxide layer, utilizes the passivation layer to not being protected by the first metal layer that the second metal layer covered, when binding structure is carrying out the salt spray test, avoids the contact of sodium chloride solution and first metal layer and forms the chloride on binding structure surface, has improved binding structure's electric conductive property.

Optionally, with continued reference to fig. 2 and fig. 3, a vertical projection of the hollow-out structure 51 on the substrate base plate 10 is located within a vertical projection of the first portion 41 on the substrate base plate 10.

Set up hollow out construction 51 and be located first portion 41 in the vertical projection of substrate base plate 10 at the vertical projection of substrate base plate 10, on the one hand can improve the area of contact of the metal oxide layer 40 of binding structure and the driver chip of display panel, guarantee the firm nature of binding, and then improve the transmission performance of signal, on the other hand can guarantee not set up the protection of passivation layer 50 of hollow out construction 51 position department to the first metal level 20 that is not covered by second metal level 30, avoid when the salt spray test, the contact of sodium chloride solution and first metal level 20 and form chloride influence binding structure's conductivity on the binding structure surface.

Alternatively, the metal oxide layer 40 of two adjacent binding units 100 is disconnected between two adjacent binding units 100.

Illustratively, with continuing reference to fig. 3, since the binding structure includes a plurality of binding units 100 arranged in sequence, and different binding units 100 are electrically connected to different binding pads of the driver chip, signal transmission is realized. The binding units 100 are electrically connected to the driver IC through the metal oxide layers 40, so that the metal oxide layers 40 of two adjacent binding units 100 are disconnected, thereby preventing crosstalk between signals transmitted by two adjacent binding units 100.

Optionally, the passivation layer 50 covers a gap between two adjacent binding units 100.

For example, referring to fig. 3, as shown in fig. 3, the passivation layer 50 is disposed to cover the gap between two adjacent binding units 100, that is, the passivation layer 50 between two adjacent binding units 100 may adopt a process, and then a mask is used to form the hollow-out structure 51 of the passivation layer 50 on the metal oxide layer 40, so as to reduce the complexity of the process.

Optionally, on the basis of the foregoing embodiment, fig. 4 is a schematic structural diagram of a display panel provided in an embodiment of the present invention, as shown in fig. 4, the display panel includes a display area 200 and a non-display area 300, the non-display area 300 includes a binding area 310, and the binding area 310 includes a binding structure described in any of the foregoing embodiments.

As shown in fig. 4, by providing the bonding region 310 in the non-display region 300 of the display panel, the driver IC of the non-display region 300 is electrically connected to the metal oxide layer in the bonding structure in the bonding region 310, and transmits a driving signal to the signal line of the display region through the bonding structure, thereby driving the display of the display panel.

Optionally, the first metal layer 40 in the binding structure is disposed on the same layer as the transistor gate of the display region 200 or the transistor source and drain of the display region.

Optionally, the second metal layer is disposed on the same layer as the transistor gate of the display region or the transistor source and drain of the display region.

Because the first metal layer and the second metal layer are made of metal materials, the first metal layer in the binding structure and the transistor grid electrode of the display area or the transistor source drain electrode of the display area can be arranged on the same layer, or the second metal layer and the transistor grid electrode of the display area or the transistor source drain electrode of the display area can be arranged on the same layer, and the overall thickness of the display panel is reduced.

Optionally, on the basis of the above embodiment, fig. 5 is a schematic cross-sectional structure diagram of a display panel provided in an embodiment of the present invention, as shown in fig. 5, the display panel is a liquid crystal display panel, and the metal oxide layer 40 and the pixel electrode layer 210 or the common electrode layer 220 of the display area 200 are disposed on the same layer (fig. 5 exemplarily shows that the metal oxide layer 40 and the pixel electrode layer 210 of the display area 200 are disposed on the same layer).

Illustratively, referring to fig. 5, the display panel includes a pixel electrode layer 210, a common electrode layer 220, and a liquid crystal layer 230, and the liquid crystal layer 230 is controlled to deflect by applying power between the pixel electrode 210 and the common electrode 220, so as to realize the display of the display panel. Since the pixel electrode layer 210 or the common electrode layer 220 generally uses a metal oxide material, the metal oxide layer 40 of the binding structure and the pixel electrode layer 210 or the common electrode layer 220 of the display area 200 can be disposed on the same layer, and at this time, the metal oxide layer 40 and the pixel electrode layer 210 or the common electrode layer 220 of the display area 200 can be formed by one process, so that on one hand, the overall thickness of the display panel can be reduced, and on the other hand, the complexity of the process can be reduced.

Optionally, on the basis of the above embodiment, fig. 6 is a schematic cross-sectional structure diagram of a display panel provided in an embodiment of the present invention, as shown in fig. 6, the display panel is an organic light emitting display panel, and the metal oxide layer 40 and the cathode layer 250 of the display area 200 are disposed on the same layer.

Illustratively, referring to fig. 6, the display panel includes an anode layer 240, a cathode layer 250, and a light emitting layer 260 disposed between the anode layer 240 and the cathode layer 250, and the display of the display panel is implemented by applying power between the cathode layer 250 and the anode layer 240 and controlling the light emitting layer 260 to emit light. Since the cathode layer 250 is generally made of a metal oxide material, the metal oxide layer 40 of the bonding structure and the cathode layer 250 of the display area 100 may be disposed on the same layer, and at this time, the metal oxide layer 40 and the cathode layer 250 of the display area may be formed in one process, so that on one hand, the overall thickness of the display panel may be reduced, and on the other hand, the complexity of the process may be reduced.

Optionally, on the basis of the above embodiment, the embodiment of the present invention further provides a display device, including any one of the above embodiments, the display panel further includes a driver chip, and the driver chip is bound and connected in the binding region through each binding unit. The embodiment of the utility model provides a display device can include the utility model discloses arbitrary embodiment display panel. It should be noted that the embodiment of the present invention provides a display device, which can be other circuits and devices for supporting normal operation of the display device, and also can be a computer, a television, an intelligent wearable display device, etc., and the embodiment of the present invention does not specially limit this.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. A binding structure, comprising a plurality of binding units arranged in sequence, the binding units comprising:

a first metal layer and a second metal layer which are sequentially stacked on the substrate base plate;

the metal oxide layer is positioned on one side, away from the substrate, of the second metal layer; the metal oxide layer includes a first portion and a second portion; the first part covers the upper surface of one side of the second metal layer, which is far away from the substrate base plate, and the second part covers the side surfaces of the second metal layer and the first metal layer;

the passivation layer is positioned on one side, away from the substrate, of the metal oxide layer and at least covers the second part; the passivation layer is provided with a hollow structure, and the vertical projection of the hollow structure on the substrate base plate is overlapped with the vertical projection of the first part on the substrate base plate.

2. The binding structure according to claim 1, wherein a vertical projection of the hollow structure on the substrate base plate is located within a vertical projection of the first portion on the substrate base plate.

3. The binding structure according to claim 1, wherein the metal oxide layers of two adjacent binding units are disconnected between the two adjacent binding units.

4. The bonding structure of claim 3, wherein the passivation layer covers a gap between two adjacent bonding units.

5. A display panel comprising a display area and a non-display area, the non-display area comprising a binding region, the binding region comprising the binding structure of any one of claims 1-4.

6. The display panel according to claim 5, wherein the first metal layer is disposed in the same layer as a gate of a transistor in the display region or a source/drain of the transistor in the display region.

7. The display panel according to claim 5, wherein the second metal layer is disposed in the same layer as a gate of a transistor in the display region or a source/drain of the transistor in the display region.

8. The display panel according to claim 5, wherein the display panel is a liquid crystal display panel; the metal oxide layer and the pixel electrode layer or the common electrode layer of the display area are arranged on the same layer.

9. The display panel according to claim 5, wherein the display panel is an organic light emitting display panel; the metal oxide layer and the cathode layer of the display area are arranged on the same layer.

10. A display device characterized by comprising the display panel according to any one of claims 5 to 9;

the display panel further comprises a driving chip, and the driving chip is bound and connected in the binding area through each binding unit.

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