CN213340325U - High-density storage integrated chip packaging equipment - Google Patents
High-density storage integrated chip packaging equipment Download PDFInfo
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- CN213340325U CN213340325U CN202022090006.6U CN202022090006U CN213340325U CN 213340325 U CN213340325 U CN 213340325U CN 202022090006 U CN202022090006 U CN 202022090006U CN 213340325 U CN213340325 U CN 213340325U
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Abstract
The utility model discloses a high density storage integration chip package equipment, comprising a base plate, the lower extreme surface of bottom plate is provided with the supporting leg, the upper end surface of bottom plate is provided with the fixed plate, the side surface of fixed plate is provided with transmission, the side of fixed plate is provided with driving motor, driving motor's lower extreme is provided with the mounting panel, the upper end surface of bottom plate is provided with the locating plate, the side surface of locating plate is provided with the telescopic link. High density storage integration chip package equipment, simple structure, the connectivity is strong, convenient operation has the restriction location when encapsulating the chip, is favorable to improving the encapsulation quality, has convenient dismantlement and installation, is favorable to convenient maintenance and change, has dust removal effect to the chip surface, is favorable to saving process time, improves encapsulation efficiency, is convenient for collect, and practical function is good.
Description
Technical Field
The utility model relates to a chip package technical field, in particular to high density storage integration chip package equipment.
Background
The chip is a general name of semiconductor element products, is a carrier of an integrated circuit, is formed by dividing a wafer, is an integrated circuit, generally refers to all electronic components, is a circuit module for integrating various electronic components on a silicon plate to realize a certain specific function, is the most important part in electronic equipment, bears the functions of operation and storage, covers almost all electronic equipment for military and civil use, and mostly needs to be packaged and sealed after the chip is produced, so that the chip is effectively protected, the packaging equipment in the prior patent publication CN209774196U, and in the chip packaging production, a rail conveying device is used for packaging the chip, a limit structure is not adopted, so that the chip is easy to deviate from an industrial transportation channel, the packaging effect and the quality of the chip are poor, and the chip is easy to damage, secondly, the packaging equipment enables chips to easily enter a small amount of dust, manual cleaning is needed, the cleaning effect is poor, time and labor are wasted, a collecting device is not arranged on the packaged chips, and the efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides high density storage integration chip package equipment, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
high density storage integration chip packaging equipment, comprising a bottom plate, wherein the lower end outer surface of the bottom plate is provided with supporting legs, the upper end outer surface of the bottom plate is provided with a fixed plate, the side end outer surface of the fixed plate is provided with a transmission device, the side end of the fixed plate is provided with a driving motor, the lower end of the driving motor is provided with a mounting plate, the upper end outer surface of the bottom plate is fixedly connected with a positioning plate, the side end outer surface of the positioning plate is provided with a telescopic rod, the side end of the telescopic rod is fixedly connected with a limiting plate, the upper end outer surface of the bottom plate is provided with a mounting block, the upper end outer surface of the mounting block is provided with a supporting frame, the front end outer surface of the supporting frame is fixedly connected with a slide bar, and a connecting pipe is arranged at the joint of the control device and the support frame.
Preferably, bottom plate fixed mounting is in the upper end surface of supporting leg, the quantity of supporting leg is four, and is the array and arranges, fixed plate fixed mounting is in the front end surface of bottom plate, be swing joint between transmission and the fixed plate, be swing joint between driving motor and the fixed plate, mounting panel fixed mounting is in the upper end surface of bottom plate, telescopic link fixed mounting is in the side surface of locating plate.
By adopting the technical scheme, the following technical effects can be achieved: carry out spacing clamp to the chip through the telescopic link, skew when preventing the chip encapsulation leads to the packing effect and the quality of chip relatively poor.
Preferably, the mounting block is fixedly mounted at the upper end of the bottom plate, the support frame is fixedly mounted at the upper end of the mounting block, the fixing block is fixedly connected with the support frame, the connecting plate is slidably connected with the support frame through a slide bar, and the control device is fixedly mounted at the front end of the connecting plate.
By adopting the technical scheme, the following technical effects can be achieved: the sliding strip slides to enable the packaging device to move up and down for packaging, so that the packaging is convenient.
Preferably, the connecting pipe is fixedly installed at the upper end of the control device, the lower end of the control device is provided with the connecting ring, the connecting ring is fixedly installed at the lower end of the control device, the lower end of the connecting ring is provided with the packaging machine, the packaging machine is fixedly installed at the lower end of the connecting ring, the lower end of the connecting ring is provided with the connecting rod, the lower end of the packaging machine is provided with the positioning block, the lower end of the positioning block is provided with the fixing bolt, the positioning block and the connecting ring are in threaded connection through the connecting rod and the fixing bolt, and the connecting rod is fixedly.
By adopting the technical scheme, the following technical effects can be achieved: through threaded connection, the packaging machine can be conveniently detached and replaced.
Preferably, the lower end of the positioning block is provided with a thermoplastic molding device, the thermoplastic molding device is fixedly mounted at the lower end of the positioning block, the positioning block is circular, the lower end of the thermoplastic molding device is provided with a packaging rod, the packaging rod is fixedly mounted at the lower end of the thermoplastic molding device, the outer surface of the lower end of the packaging rod is provided with a packaging device, the packaging device is fixedly mounted at the lower end of the packaging rod, the upper end of the bottom plate is provided with a dust collector, and the dust collector is fixedly mounted at the upper end of the bottom plate.
By adopting the technical scheme, the following technical effects can be achieved: the dust absorption head is used for removing dust on the surface of the chip, so that the packaging effect is better, and the time is saved.
Preferably, the outer surface of the upper end of the dust collector is provided with a dust collection pipe, the dust collection pipe is fixedly mounted at the upper end of the dust collector, a dust collection head is arranged at the side end of the dust collection pipe, the dust collection head is fixedly connected with the dust collection pipe, a material receiving plate is arranged at the side end of the transmission device and fixedly mounted at the upper end of the bottom plate, a collection box is arranged at the lower end of the bottom plate, and the collection box is rectangular.
By adopting the technical scheme, the following technical effects can be achieved: the packaged chips are loaded into the collecting box through the material receiving plate, so that later-period packaging is facilitated.
Compared with the prior art, the utility model has the advantages that the telescopic rod is arranged to drive the limiting plate to limit the chip not to deviate on the conveying device, the poor packaging effect and quality of the chip can be avoided, the chip can be easily damaged, the quality of the chip package can be improved, the efficiency can be improved, the device is connected with the control device in a sliding way through the slide bar, the connectivity of the device is enhanced, the chip on the conveying device can be conveniently packaged, the packaging machine is fixed through the fixing bolt, the packaging machine is convenient to install and disassemble, the maintenance and replacement are convenient, the dust collector is arranged, the dust collection is carried out on the surface of the chip to be packaged through the dust collector, the packaging effect can be improved, the time of workers is saved, the packaging efficiency is improved, the chip packaged on the conveying device is conveyed into the collecting box along with the material receiving plate through the material receiving plate, convenient to collect makes things convenient for the later stage packing, whole high density storage integration chip package equipment, simple structure, the connectivity is strong, convenient operation has the restriction location when encapsulating the chip, is favorable to improving the encapsulation quality, has convenient dismantlement and installation, is favorable to convenient maintenance and change, has dust removal effect to the chip surface, is favorable to saving process time, improves encapsulation efficiency, is convenient for collect, and practical function is good.
Drawings
Fig. 1 is a schematic view of the overall structure of the high-density storage integrated chip packaging device of the present invention;
FIG. 2 is a front view of the high-density integrated chip packaging device of the present invention;
FIG. 3 is a side view of the high-density integrated chip packaging device of the present invention;
fig. 4 is an enlarged view of a in fig. 2 of the high-density storage integrated chip packaging apparatus of the present invention.
In the figure: 1. a base plate; 2. supporting legs; 3. a fixing plate; 4. a transmission device; 5. a drive motor; 6. mounting a plate; 7. positioning a plate; 8. a telescopic rod; 9. a limiting plate; 10. mounting blocks; 11. a support frame; 12. a slide bar; 13. a fixed block; 14. a connecting plate; 15. a control device; 16. a connecting pipe; 17. a connecting ring; 18. a packaging machine; 19. a connecting rod; 20. positioning blocks; 21. fixing the bolt; 22. a thermoplastic device; 23. a packaging rod; 24. an encapsulator; 25. a vacuum cleaner; 26. a dust collection pipe; 27. a dust collection head; 28. a material receiving plate; 29. and a collection box.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
The first embodiment is as follows:
as shown in FIG. 1, the high-density storage integrated chip packaging device comprises a bottom plate 1, wherein supporting legs 2 are arranged on the outer surface of the lower end of the bottom plate 1, a fixing plate 3 is arranged on the outer surface of the upper end of the bottom plate 1, a transmission device 4 is arranged on the outer surface of the side end of the fixing plate 3, a driving motor 5 is arranged on the side end of the fixing plate 3, a mounting plate 6 is arranged on the lower end of the driving motor 5, a positioning plate 7 is fixedly connected to the outer surface of the upper end of the bottom plate 1, a telescopic rod 8 is arranged on the outer surface of the side end of the positioning plate 7, a limiting plate 9 is fixedly connected to the side end of the telescopic rod 8, a mounting block 10 is arranged on the outer surface of the upper end of the mounting block 10, a supporting frame 11 is arranged on the outer surface of the front, the connection part of the control device 15 and the support frame 11 is provided with a connecting pipe 16.
The mounting block 10 is fixedly mounted at the upper end of the bottom plate 1, the support frame 11 is fixedly mounted at the upper end of the mounting block 10, the fixing block 13 is fixedly connected with the support frame 11, the connecting plate 14 is slidably connected with the support frame 11 through the slide bar 12, the control device 15 is fixedly mounted at the front end of the connecting plate 14, and the packaging device can move up and down to be packaged and is convenient to package through the slide bar 12.
Example two:
on the basis of the first embodiment, as shown in fig. 2 to 4, the connection pipe 16 is fixedly installed at the upper end of the control device 15, the lower end of the control device 15 is provided with the connection ring 17, the connection ring 17 is fixedly installed at the lower end of the control device 15, the lower end of the connection ring 17 is provided with the packaging machine 18, the packaging machine 18 is fixedly installed at the lower end of the connection ring 17, the lower end of the connection ring 17 is provided with the connection rod 19, the lower end of the packaging machine 18 is provided with the positioning block 20, the lower end of the positioning block 20 is provided with the fixing bolt 21, the positioning block 20 and the connection ring 17 are in threaded connection through the connection rod 19 and the fixing bolt 21, the connection rod 19 is fixedly installed at the lower end of the connection ring.
The lower end of the positioning block 20 is provided with a thermoplastic molding device 22, the thermoplastic molding device 22 is fixedly installed at the lower end of the positioning block 20, the positioning block 20 is circular, the lower end of the thermoplastic molding device 22 is provided with a packaging rod 23, the packaging rod 23 is fixedly installed at the lower end of the thermoplastic molding device 22, the outer surface of the lower end of the packaging rod 23 is provided with a packaging device 24, the packaging device 24 is fixedly installed at the lower end of the packaging rod 23, the upper end of the bottom plate 1 is provided with a dust collector 25, the dust collector 25 is fixedly installed at the upper end of the bottom plate 1, and dust is removed from the surface of the chip through the dust.
The outer surface of the upper end of the dust collector 25 is provided with a dust collection pipe 26, the dust collection pipe 26 is fixedly installed at the upper end of the dust collector 25, a dust collection head 27 is arranged at the side end of the dust collection pipe 26, the dust collection head 27 is fixedly connected with the dust collection pipe 26, a material receiving plate 28 is arranged at the side end of the transmission device 4, the material receiving plate 28 is fixedly installed at the upper end of the bottom plate 1, a collection box 29 is arranged at the lower end of the bottom plate 1, the collection box 29 is rectangular in shape, and packaged chips are loaded into the collection box 29 through the material receiving plate.
It should be noted that, when the high-density storage integrated chip packaging device of the present invention is used, the packaging machine 18 is fixed on the connection ring 17 by the connection rod 19 and the positioning ring 20 through the screw thread of the fixing bolt, so that the packaging machine 18 can be conveniently mounted and dismounted, and is convenient to maintain and replace, the chip is placed on the conveying device 4, the limiting plate 9 is driven by the telescopic rods 8 at two sides to limit the chip not to deviate on the conveying device 4, thereby avoiding the poor packaging effect and quality of the chip, which can easily cause damage to the chip itself, and is beneficial to improving the quality of chip packaging, further improving the efficiency, the slide bar 12 on the support frame 11 is slidably connected with the control device 15, enhancing the connectivity of the device, facilitating the packaging of the chip on the conveying device 4, and the dust removal is performed on the surface of the chip to be packaged by the dust collector 25 via the dust collector 27, be favorable to improving the packing effect, save staff's time, improve encapsulation efficiency, through the flitch 28 that connects of rear end, make the good chip of encapsulation on the conveyer 4 along with connect flitch 28 to transmit to the collection box in, be convenient for collect, make things convenient for the later stage packing.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. High density storage integration chip package equipment, including bottom plate (1), its characterized in that: the outer surface of the lower end of the bottom plate (1) is provided with supporting legs (2), the outer surface of the upper end of the bottom plate (1) is provided with a fixed plate (3), the outer surface of the side end of the fixed plate (3) is provided with a transmission device (4), the side end of the fixed plate (3) is provided with a driving motor (5), the lower end of the driving motor (5) is provided with a mounting plate (6), the outer surface of the upper end of the bottom plate (1) is fixedly connected with a positioning plate (7), the outer surface of the side end of the positioning plate (7) is provided with a telescopic rod (8), the side end of the telescopic rod (8) is fixedly connected with a limiting plate (9), the outer surface of the upper end of the bottom plate (1) is provided with a mounting block (10), the outer surface of the, the upper end surface of support frame (11) is provided with fixed block (13), the front end surface of draw runner (12) is provided with connecting plate (14), the front end surface of connecting plate (14) is provided with controlling means (15), the junction of controlling means (15) and support frame (11) is provided with connecting pipe (16).
2. The high-density storage integrated chip packaging device according to claim 1, wherein: bottom plate (1) fixed mounting is in the upper end surface of supporting leg (2), the quantity of supporting leg (2) is four, and is the array and arranges, fixed plate (3) fixed mounting is in the front end surface of bottom plate (1), be swing joint between transmission (4) and fixed plate (3), be swing joint between driving motor (5) and fixed plate (3), mounting panel (6) fixed mounting is in the upper end surface of bottom plate (1), telescopic link (8) fixed mounting is in the side surface of locating plate (7).
3. The high-density storage integrated chip packaging device according to claim 1, wherein: the mounting block (10) is fixedly mounted at the upper end of the bottom plate (1), the support frame (11) is fixedly mounted at the upper end of the mounting block (10), the fixing block (13) is fixedly connected with the support frame (11), the connecting plate (14) is slidably connected with the support frame (11) through a sliding strip (12), and the control device (15) is fixedly mounted at the front end of the connecting plate (14).
4. The high-density storage integrated chip packaging device according to claim 1, wherein: the connecting pipe (16) is fixedly installed at the upper end of the control device (15), the lower end of the control device (15) is provided with a connecting ring (17), the connecting ring (17) is fixedly installed at the lower end of the control device (15), the lower end of the connecting ring (17) is provided with a packaging machine (18), the packaging machine (18) is fixedly installed at the lower end of the connecting ring (17), the lower end of the connecting ring (17) is provided with a connecting rod (19), the lower end of the packaging machine (18) is provided with a positioning block (20), the lower end of the positioning block (20) is provided with a fixing bolt (21), the positioning block (20) and the connecting ring (17) are in threaded connection through the connecting rod (19) and the fixing bolt (21), and the connecting rod (19) is fixedly installed at the lower end.
5. The high-density storage integrated chip packaging device according to claim 4, wherein: the lower extreme of locating piece (20) is provided with thermoplasticity ware (22), thermoplasticity ware (22) fixed mounting is in the lower extreme of locating piece (20), the shape of locating piece (20) is circular, the lower extreme of thermoplasticity ware (22) is provided with encapsulation pole (23), encapsulation pole (23) fixed mounting is in the lower extreme of thermoplasticity ware (22), the lower extreme surface of encapsulation pole (23) is provided with wrapper (24), wrapper (24) fixed mounting is in the lower extreme of encapsulation pole (23), the upper end of bottom plate (1) is provided with dust catcher (25), dust catcher (25) fixed mounting is in the upper end of bottom plate (1).
6. The high-density storage integrated chip packaging device according to claim 5, wherein: the dust collector is characterized in that a dust suction pipe (26) is arranged on the outer surface of the upper end of the dust collector (25), the dust suction pipe (26) is fixedly mounted at the upper end of the dust collector (25), a dust suction head (27) is arranged at the side end of the dust suction pipe (26), the dust suction head (27) is fixedly connected with the dust suction pipe (26), a material receiving plate (28) is arranged at the side end of the transmission device (4), the material receiving plate (28) is fixedly mounted at the upper end of the bottom plate (1), a collecting box (29) is arranged at the lower end of the bottom plate (1), and the collecting box (29) is rectangular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022090006.6U CN213340325U (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022090006.6U CN213340325U (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213340325U true CN213340325U (en) | 2021-06-01 |
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ID=76065351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022090006.6U Active CN213340325U (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213340325U (en) |
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2020
- 2020-09-22 CN CN202022090006.6U patent/CN213340325U/en active Active
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