CN213327901U - High-temperature-resistant electroplating bath for electroplating production - Google Patents
High-temperature-resistant electroplating bath for electroplating production Download PDFInfo
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- CN213327901U CN213327901U CN202022198051.3U CN202022198051U CN213327901U CN 213327901 U CN213327901 U CN 213327901U CN 202022198051 U CN202022198051 U CN 202022198051U CN 213327901 U CN213327901 U CN 213327901U
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Abstract
The utility model discloses an electroplating production is with high temperature resistant plating bath, including the plating bath body, be equipped with main inlet tube and main outlet pipe on the plating bath body, it has a plurality of recesses to open a hole on the plating bath body, be equipped with heat dissipation mechanism in the recess, heat dissipation mechanism includes the shell, the inside cavity of shell sets up, be equipped with baffle and lower baffle in the shell, it is equipped with a plurality of heat conduction sticks to go up between baffle and the lower baffle, the heat conduction stick link up the shell and insert and locate on the plating bath body, be equipped with the slider down between baffle and the shell, open a hole has a plurality of second holes on the slider, be connected with the telescopic link between slider and the shell, the cover is equipped with the spring on the telescopic link. The utility model discloses an increase a heat abstractor to the plating bath, make the plating bath distribute away by the transmission easily at the heat that the during operation produced, the difficult condition that the heat piles up in the plating bath that appears to the life of plating bath has been increased.
Description
Technical Field
The utility model belongs to the technical field of high temperature resistant plating bath, concretely relates to electroplating production is with high temperature resistant plating bath.
Background
The plating bath is the most basic equipment in electroplating equipment, the main function is to install solution, the use mode of the plating bath is that the production line is arranged linearly according to the process flow of manual operation, and the plating seed is also arranged separately according to the site space according to local conditions, if the production line is a mechanical automatic production line, the plating bath is basically arranged according to the process flow, and the materials of the plating bath are as follows: the plating bath is composed of various materials such as a titanium plating bath, a PP material, a PVC material, a PVDF material, a glass fiber reinforced plastic tank material, a stainless steel tank material, a granite material, a polytetrafluoroethylene material and the like.
In the lithium battery shell electroplating production process, some mechanisms in the electroplating bath can generate higher heat in the reaction process, and the heat can influence the service life of the electroplating bath, but the existing electroplating bath is lack of a heat dissipation device, so that the heat generated in the reaction process is not easy to discharge, is easy to accumulate in the electroplating bath, can cause certain damage to the electroplating bath, and further can reduce the service life of the electroplating bath.
Therefore, in order to solve the above technical problems, it is necessary to provide a high temperature resistant plating bath for electroplating production.
Disclosure of Invention
An object of the utility model is to provide an electroplating production is with high temperature resistant plating bath to solve prior art plating bath and lack a heat abstractor, lead to the difficult discharge of heat in the plating bath, thereby reduce plating bath life's problem.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
the utility model provides an electroplate production with high temperature resistant plating bath, includes the plating bath body, be equipped with main inlet tube and main outlet pipe on the plating bath body, it has a plurality of recesses to cut a hole on the plating bath body, be equipped with heat dissipation mechanism in the recess, heat dissipation mechanism includes the shell, the inside cavity of shell sets up, be equipped with baffle and lower baffle in the shell, go up the baffle and be equipped with a plurality of heat conduction sticks down between the baffle, the heat conduction stick link up the shell and insert and locate on the plating bath body, be equipped with the slider down between baffle and the shell, be connected with the telescopic link between slider and the shell, the cover is equipped with the spring on the telescopic link, one side that the heat conduction stick was kept.
Further, be connected with inferior inlet tube on the main inlet tube for in cooling water dispersion that comes is carried to main inlet tube a plurality of connecting pipes that go up, thereby for providing rivers in the heat dissipation mechanism, be connected with inferior outlet pipe on the main outlet pipe, in transporting the rivers that the water-collecting plate was collected to main outlet pipe in concentrating, be convenient for carry out reuse after the cooling, make water resource can recycle, be difficult for causing the wasting of resources.
Further, go up the baffle and all cut the first hole that has a plurality of evenly distributed down on the baffle, go up in first hole on the baffle can make connecting pipe spun rivers flow to the sponge, play the cooling effect to the heat conduction stick to the realization is to the heat dissipation of plating bath body, first hole can make rivers continue to flow downwards in the water-collecting plate on the lower baffle, thereby makes rivers can flow, is convenient for take away the heat, increases the radiating effect.
Furthermore, a plurality of second holes are drilled in the sliding block, the sliding block can be pushed after the expansion ball expands, so that the second holes are driven to move, and when the second holes move to the position below the upper connecting pipe, water in the secondary water inlet pipe can flow downwards.
Furthermore, an expansion ball is filled between one end, close to the main water outlet pipe, of the sliding block and the shell, and the expansion ball expands when the temperature in the shell is high by utilizing the characteristic of the expansion ball, so that the sliding block is pushed to move, and the second hole is made to move to the lower portion of the upper connecting pipe.
Further, be connected with the connecting pipe between inferior inlet tube and the shell, make rivers in the inferior inlet tube can flow to the shell in to absorb the heat, realize radiating effect, be connected with down the connecting pipe between inferior outlet tube and the shell, the connecting pipe link up the water-collecting plate setting down, makes the higher rivers of temperature can be carried away to the in-process of carrying can take away the heat, thereby plays radiating effect.
Compared with the prior art, the utility model has the advantages of it is following:
the utility model discloses an increase a heat abstractor to the plating bath, make the plating bath distribute away by the transmission easily at the heat that the during operation produced, the difficult condition that the heat piles up in the plating bath that appears to the life of plating bath has been increased.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a perspective view of a high temperature resistant plating bath for use in electroplating production according to one embodiment of the present disclosure;
FIG. 2 is a sectional front view of a high temperature resistant plating bath for use in electroplating production according to one embodiment of the present application;
fig. 3 is a schematic structural diagram at a in fig. 2 according to an embodiment of the present disclosure.
In the figure: 1. the water-cooling type electroplating bath comprises an electroplating bath body, 101 main water inlet pipes, 102 main water outlet pipes, 103 secondary water inlet pipes, 104 secondary water outlet pipes, 2 heat dissipation mechanisms, 201 shells, 202 upper partition plates, 203 lower partition plates, 204 first holes, 205 heat conducting rods, 206 sliding blocks, 207 second holes, 208 expansion balls, 209 expansion rods, 210 springs, 211 water collecting plates, 212 upper connecting pipes and 213 lower connecting pipes.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
The utility model discloses a high temperature resistant plating bath for electroplating production of workpieces, as shown in figures 1-3, comprising a plating bath body 1, wherein the plating bath body 1 is provided with a main water inlet pipe 101 and a main water outlet pipe 102, the main water inlet pipe 101 and the main water outlet pipe 102 are connected with a delivery pipe, the delivery pipe is connected with a water pump, the main water inlet pipe 101 is connected with a secondary water inlet pipe 103 for dispersing cooling water delivered by the main water inlet pipe 101 into a plurality of upper connecting pipes 212 so as to provide water flow for the heat dissipation mechanism 2, the main water outlet pipe 102 is connected with a secondary water outlet pipe 104 for intensively transporting the water flow collected by a water collection plate 211 into the main water outlet pipe 102, so as to be reused after cooling, thus the water resource can be recycled and the resource waste is not easy to cause, a plurality of first holes 204 which are uniformly distributed are drilled on an upper baffle 202 and a lower baffle 203, the first holes 204 on the upper baffle 202 can make the, the heat conducting rods 205 are cooled, so that heat dissipation of the electroplating bath body 1 is realized, the first holes 204 on the lower partition plate 203 can enable water flow to continuously flow downwards into the water collecting plate 211, so that the water flow can flow, heat can be taken away conveniently, the heat dissipation effect is improved, a plurality of grooves are formed in the electroplating bath body 1, the heat dissipation mechanism 2 is arranged in each groove, heat in the electroplating bath body 1 can be quickly transferred through corresponding arrangement of the heat dissipation mechanism 2, the heat is not easy to accumulate in the electroplating bath body 1, the service life of the electroplating bath body 1 is influenced, the heat dissipation mechanism 2 comprises a shell 201, the shell 201 is hollow, the upper partition plate 202 and the lower partition plate 203 are arranged in the shell 201, the upper partition plate 202 is used for supporting sliding blocks 206 and expansion balls 208, the sliding blocks 206 can slide on the upper partition plate 202, so that the on and off of the water flow are controlled, the plurality of heat conducting rods 205 are arranged between the upper, the heat conducting rod 205 penetrates through the shell 201 and is inserted into the electroplating bath body 1, heat in the electroplating bath body 1 is transferred to the shell 201, and is taken away through water flow, so that the heat dissipation effect on the electroplating bath body 1 is achieved, the sliding block 206 is arranged between the lower partition plate 203 and the shell 201, the second hole 207 is driven to move through the movement of the sliding block 206, and whether the water flow in the secondary water inlet pipe 103 can enter the shell 201 is controlled.
Referring to fig. 1-3, a plurality of second holes 207 are drilled in the sliding block 206, when the expansion ball 208 expands, the sliding block 206 is pushed to drive the second holes 207 to move, when the second holes 207 move below the upper connection pipe 212, the water in the secondary inlet pipe 103 can flow downward, the expansion ball 208 is filled between the end of the sliding block 206 close to the main outlet pipe 102 and the housing 201, the expansion ball 208 is made of a memory alloy ball, so that when the temperature of the expansion ball 208 increases, the expansion ball 208 expands rapidly, and when the temperature of the expansion ball 208 decreases, the expansion ball 208 can retract to the original size, by utilizing the characteristic of the expansion ball 208, when the temperature in the housing 201 increases, the expansion ball 208 expands to push the sliding block 206 to move, so that the second holes 207 move below the upper connection pipe 212, and when the temperature in the housing 201 decreases, the expansion ball 208 contracts, so that the second holes 207 move below the upper connection pipe 212, make in rivers are difficult for getting into shell 201, be connected with telescopic link 209 between slider 206 and the shell 201, the cover is equipped with spring 210 on the telescopic link 209, when making inflation ball 208 reduce, spring 210 can promote slider 206 and remove, thereby shift out second hole 207 and go up connecting pipe 212 below, one side that heat conduction stick 205 was kept away from to lower baffle 203 is equipped with water-collecting plate 211, be connected with connecting pipe 212 between inferior inlet tube 103 and the shell 201, make rivers in inferior inlet tube 103 can flow to in the shell 201, thereby absorb the heat, realize radiating effect, be connected with lower connecting pipe 213 between inferior outlet pipe 104 and the shell 201, lower connecting pipe 213 link up water-collecting plate 211 and set up, make the higher rivers of temperature can be carried away, and the in-process of carrying can take away the heat, thereby play radiating effect.
When the electroplating bath is used specifically, when the electroplating bath body 1 starts to work, the water pump connected with the main water inlet pipe 101 also starts to work, the water pump pumps water out and conveys the water into the secondary water inlet pipe 103, the secondary water inlet pipe 103 disperses the water to the plurality of upper connecting pipes 212, when the heat in the electroplating bath body 1 reaches a certain degree, the heat conducting rod 205 transfers the heat into the shell 201, so the temperature in the shell 201 rises, the expansion balls 208 gradually grow while the temperature rises, the expansion balls 208 grow to push the sliding blocks 206 to move towards one side of the telescopic rods 209, the sliding blocks 206 move with the second holes 207, when the second holes 207 move to the lower part of the upper connecting pipes 212, at the moment, the water in the upper connecting pipes 212 flows downwards through the second holes 207, the water flows downwards through the first holes 204 on the upper partition plate 202, the water flows to moisten the sponge, and the moist sponge transfers the heat of the heat conducting rod 205 out, when the sponge is wetted, the water flow continues to flow downwards, enters the secondary water outlet pipe 104 through the water collection plate 211, finally flows into the water tank for cooling, and is convenient to reuse, when the temperature in the shell 201 drops to a certain degree, the expansion ball 208 is reduced to the original position, at this time, the spring 210 pushes the sliding block 206 to move towards the expansion ball 208, the second hole 207 moves along with the expansion ball, and when the second hole 207 moves out of the lower part of the upper connecting pipe 212, the water flow in the upper connecting pipe 212 is not easy to flow downwards.
According to the technical scheme provided by the utility model, the utility model discloses following beneficial effect has:
the utility model discloses an increase a heat abstractor to the plating bath, make the plating bath distribute away by the transmission easily at the heat that the during operation produced, the difficult condition that the heat piles up in the plating bath that appears to the life of plating bath has been increased.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The high-temperature-resistant electroplating bath for electroplating production comprises an electroplating bath body (1) and is characterized in that a main water inlet pipe (101) and a main water outlet pipe (102) are arranged on the electroplating bath body (1), a plurality of grooves are formed in the electroplating bath body (1), a heat dissipation mechanism (2) is arranged in each groove, each heat dissipation mechanism (2) comprises a shell (201), the shell (201) is hollow, an upper partition plate (202) and a lower partition plate (203) are arranged in each shell (201), a plurality of heat conduction rods (205) are arranged between the upper partition plate (202) and the lower partition plate (203), the heat conduction rods (205) penetrate through the shells (201) and are inserted into the electroplating bath body (1), a sliding block (206) is arranged between the lower partition plate (203) and the shells (201), an expansion link (209) is connected between the sliding block (206) and the shells (201), and a spring (210) is sleeved on the expansion link (209), and a water collecting plate (211) is arranged on one side of the lower partition plate (203) far away from the heat conducting rod (205).
2. The high-temperature-resistant electroplating bath for electroplating production according to claim 1, wherein a secondary water inlet pipe (103) is connected to the main water inlet pipe (101), and a secondary water outlet pipe (104) is connected to the main water outlet pipe (102).
3. The high-temperature resistant electroplating bath for electroplating production according to claim 1, wherein a plurality of first holes (204) are uniformly distributed on the upper partition plate (202) and the lower partition plate (203).
4. The high-temperature-resistant electroplating bath for electroplating production according to claim 1, wherein the slide (206) is provided with a plurality of second holes (207).
5. The high-temperature-resistant electroplating bath for electroplating production according to claim 1, wherein an expansion ball (208) is filled between one end of the sliding block (206) close to the main water outlet pipe (102) and the shell (201).
6. The high-temperature-resistant electroplating bath for electroplating production according to claim 2, wherein an upper connecting pipe (212) is connected between the secondary water inlet pipe (103) and the shell (201), a lower connecting pipe (213) is connected between the secondary water outlet pipe (104) and the shell (201), and the lower connecting pipe (213) penetrates through the water collecting plate (211).
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CN202022198051.3U CN213327901U (en) | 2020-09-30 | 2020-09-30 | High-temperature-resistant electroplating bath for electroplating production |
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CN202022198051.3U CN213327901U (en) | 2020-09-30 | 2020-09-30 | High-temperature-resistant electroplating bath for electroplating production |
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