CN213321377U

CN213321377U - Lower die glue inlet die holder unit

Info

Publication number: CN213321377U
Application number: CN202021455111.9U
Authority: CN
Inventors: 王军; 李锋
Original assignee: Dongguan Enzes Precision Machinery Co ltd
Current assignee: Dongguan Enzes Precision Machinery Co ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-06-01
Anticipated expiration: 2030-07-21

Abstract

The utility model discloses a lower mould advances gluey die holder unit, including the hot plate, be provided with the discharge opening, a heat insulating board and a cold water board are connected gradually to the hot plate bottom, and a penetrating material mechanism runs through the hot plate and communicates with the material mouth of cold water board. According to the utility model discloses a lower mould advances gluey die holder unit, blocks on the heat diffusion to the cold water board of hot plate through the heat insulating board, the cold water that flows in the cold water board can make liquid silica gel be in suitable temperature always, keeps liquid. Penetrate the material mouth intercommunication of material mechanism and cold water board, liquid silica gel penetrates the material mechanism and jets into the mould from the discharge gate of hot plate from the material mouth inflow, and cold water board can keep penetrating the material mechanism temperature and be less than liquid silica gel solidification temperature to prevent that the liquid silica gel in the material is said can not solidify, lead to blockking up the material and say.

Description

Lower die glue inlet die holder unit

Technical Field

The utility model relates to a technical field is made to the mould, in particular to lower mould advances gluey die holder unit.

Background

In the production process of liquid silica gel products, a solid-state compression molding manufacturing process is generally adopted for production, and the steps of material preparation, material cutting and weighing, compression molding, edge trimming and secondary vulcanization molding are required. Liquid silica gel is converted from a solid state to a solid state, and a die holder unit used for solid state compression molding only heats a die to ensure that the liquid silica gel in the die reaches a certain temperature, so that the liquid silica gel is more stably molded. The die holder unit used for solid-state compression molding only has a heating function, cannot keep the liquid state of the liquid silica gel before being injected into the die, and is easy to thermally cure the liquid silica gel in the flow channel to cause the flow channel to be blocked.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who aims at solving at least "the die holder unit that exists among the prior art and can not make liquid silica gel keep liquid before pouring into the mould into, make liquid silica gel solidification in the runner easily, lead to the runner to block up". Therefore, the utility model provides a lower mould advances gluey die holder unit can make liquid silica gel keep the liquid state before getting into the mould, prevents that the runner from blockking up.

According to the utility model discloses a lower mould advances gluey die holder unit, including the hot plate, be provided with the discharge opening, a heat insulating board and a cold water board have been connected gradually to the hot plate bottom, and a penetrating material mechanism runs through the hot plate and with the material mouth intercommunication of cold water board.

According to some embodiments of the utility model, the cold water board is provided with a intercommunication penetrate the mechanism of advancing of material mechanism and equipment runner and glue the mechanism.

According to some embodiments of the present invention, the glue feeding mechanism comprises a glue feeding tube communicated with the material injecting mechanism and a glue feeding base for fixing the position of the glue feeding tube; the glue inlet base is fixedly connected to the cold water plate.

According to some embodiments of the utility model, the cold water board is provided with a plurality of cold water pipelines, the cold water pipeline runs through the cold water board.

According to some embodiments of the utility model, penetrate the material mechanism including penetrating mouth, penetrating mouth cover and penetrating the mouth pad that connect gradually, penetrate the mouth cover cup joint penetrate on the mouth.

According to some embodiments of the present invention, the nozzle is provided with a through material pipe and two connecting holes communicating with the cold water pipe.

According to some embodiments of the utility model, the internal diameter of nozzle cover is greater than the external diameter of nozzle, nozzle cover with when nozzle cup joints, form an inner chamber, the inner chamber with the connecting hole intercommunication, cold water pipeline's water is followed one the connecting hole flows in the inner chamber, and follow another the connecting hole flows out.

According to some embodiments of the utility model, penetrate the mouth pad and be located the hot plate with penetrate between the mouth, and communicate the material pipe with the discharge opening.

According to some embodiments of the utility model, the hot plate is provided with a plurality of heating tube, the heating tube runs through the hot plate.

According to some embodiments of the utility model, still including thermal-insulated seat, thermal-insulated seat cup joint in penetrate the mouth and sheathe in, it is isolated the hot plate with penetrate material mechanism.

According to the utility model discloses a lower mould advances gluey die holder unit of some embodiments has following beneficial effect at least: the heat of the heating plate is prevented from diffusing to the cold water plate through the heat insulation plate, and cold water flowing in the cold water plate can enable the liquid silica gel to be at a proper temperature all the time and keep in a liquid state.

Penetrate the material mechanism with the material mouth intercommunication of cold water board, liquid silica gel flows in from the material mouth penetrate the material mechanism and follow during the mould is penetrated to the discharge gate of hot plate, cold water board can keep penetrate the material mechanism temperature and be less than liquid silica gel curing temperature to prevent that the liquid silica gel in the material way can not solidify, lead to blockking up the material way.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural view of a lower die glue inlet die holder unit according to an embodiment of the present invention;

fig. 2 is a first cross-sectional view of a cold water plate of a lower die glue inlet die holder unit according to an embodiment of the present invention;

fig. 3 is a second cross-sectional view of the cold water plate of the lower mold glue inlet mold base unit according to the embodiment of the present invention;

fig. 4 is a first cross-sectional view of the lower mold glue inlet mold base unit according to the embodiment of the present invention;

FIG. 5 is an enlarged view of portion A of FIG. 4;

fig. 6 is a second cross-sectional view of the lower mold glue inlet mold base unit according to the embodiment of the present invention;

FIG. 7 is an enlarged view of part B of FIG. 6;

fig. 8 is a schematic structural view of a material injection mechanism of the lower die glue inlet die holder unit according to the embodiment of the present invention;

fig. 9 is a cross-sectional view of a heating plate of the lower mold glue inlet mold base unit according to the embodiment of the present invention.

Reference numerals:

a heating plate 100, a discharge hole 101, a heating pipe 102, a heat insulation plate 200,

A cold water plate 300, a cold water pipeline 301, a glue feeding mechanism 310, a glue feeding pipe 311, a glue feeding base 312,

The injection mechanism 400, the injection nozzle 410, the material pipe 411, the connecting hole 412, the injection nozzle sleeve 420, the inner cavity 421, the injection nozzle pad 430 and the heat insulation seat 440.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, top, bottom, etc., is the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

A lower mold glue inlet mold base unit according to an embodiment of the present invention is described below with reference to fig. 1 to 9.

As shown in fig. 1 to 9, including a heating plate 100, a heat insulation plate 200, a cold water plate 300, and a shooting mechanism 400;

the heating plate 100, the heat insulation plate 200 and the cold water plate 300 are sequentially connected to form a sandwich structure to form a die holder, a cavity for accommodating the injection mechanism 400 is formed in the center of the die holder, a discharge hole is formed in the center of the top of the heating plate 100 and is just connected with a material hole of the injection mechanism 400, and liquid silica gel in the injection mechanism 400 can enter a die to be molded through the discharge hole. The inside of the cold water plate 300 is provided with a channel for communicating the material channel of the injection mechanism 400 with the material channel of the device, and the liquid silica gel in the molding device flows into the injection mechanism 400 through the channel of the cold water plate 300.

The insulation board 200 is disposed between the heating plate 100 and the cold water plate 300 to form a partition, which blocks heat of the heating plate 100 from being transferred to the cold water plate 300, so that the cooling effect of the cold water plate 300 is weakened, and simultaneously, the cold water plate 300 can be blocked to reduce the temperature of the heating plate 100, thereby affecting the molding quality of the liquid silica gel in the mold.

In some embodiments of the present invention, as shown in fig. 1, specifically, the cold water plate 300 is provided with a glue feeding mechanism 310 for communicating the material injecting mechanism 400 and the equipment flow channel, the glue feeding mechanism 310 can be placed into the channel of the cold water plate 300, and according to the requirement of actual production, the glue feeding mechanism 310 with different inner diameters can be replaced by the operator, so as to control the flow rate of the liquid silica gel entering the material injecting mechanism 400. The glue feeding mechanism 310 is a detachable component, so that later maintenance of workers is facilitated, a channel of the glue feeding mechanism 310 can be cleaned only by taking the glue feeding mechanism 310 out of the cold water plate 300, and the whole die holder unit does not need to be moved or the cold water plate 300 does not need to be moved.

In some embodiments of the present invention, as shown in fig. 1 and fig. 2, specifically, the glue feeding mechanism 310 includes a glue feeding tube 311 communicated with the material injecting mechanism 400 and a glue feeding base 312 fixed to the position of the glue feeding tube 311; the glue inlet base 312 is fixedly connected to the cold water plate 300, the outer diameter of the glue inlet pipe 311 is equal to the diameter of the channel of the cold water plate 300, and after the glue inlet pipe 311 is installed in the cold water plate 300, the pipe wall is tightly attached to the inner wall of the channel, so that heat can be effectively transferred between the cold water plate 300 and the glue inlet pipe 311, and the temperature of the liquid silica gel in the glue inlet pipe 311 is kept at a non-curing temperature. The rubber inlet base 312 and the rubber inlet pipe 311 are connected in a sealing mode through an oil seal, the joint of the rubber inlet pipe 311 and the material injection mechanism 400 is also provided with an oil seal, the joint of each connecting part is provided with an oil seal for sealing, and liquid silica gel can be prevented from seeping out of the joint to cause pipeline blockage. The glue inlet base 312 is connected with the glue inlet pipe 311 and then placed in the channel of the cold water plate 300, and the glue inlet base 312 is fixedly connected with the cold water plate 300 through screws, so that the glue inlet base 312 is prevented from shaking.

In some embodiments of the present invention, specifically, as shown in fig. 2, the cold water plate 300 is provided with a plurality of cold water pipes 301, the cold water pipes 301 run through the cold water plate 300, two sides of the inlet rubber pipe 311 are respectively provided with three cold water pipes 301 that are one inlet and one outlet, the same side cold water pipes 301 are arranged at equal intervals, the temperature of the cold water plate 300 can be uniform, as shown in fig. 3, the inlet rubber pipe 311 is also provided with two cold water pipes 301 opposite to each other, the cold water pipes 301 are communicated to each other to inject the material mechanism 400, the heat transferred from the heating plate 100 to the feeding mechanism is taken away, and the temperature of the liquid.

It should be understood that the arrangement and number of the cold water pipes 301 in this embodiment are not the only structures, and in other embodiments, the number of the cold water pipes 301 may be increased or decreased, and the cold water pipes 301 can also be arranged in a staggered manner. The utility model discloses various structures and the arrangement to cold water pipeline 301 are not different and are repeated. It is understood that the flexible change of the number and arrangement of the cold water pipes 301 without departing from the basic concept of the present invention should be considered as being within the protection scope defined by the present invention.

In some embodiments of the present invention, as shown in fig. 4-8, specifically, the injection mechanism 400 includes a nozzle 410, a nozzle sleeve 420 and a nozzle pad 430, which are connected in sequence, the nozzle 410 and the nozzle sleeve 420 are sleeved together, the nozzle pad 430 is connected to the top of the nozzle 410, and the nozzle sleeve 420 is sleeved on the nozzle 410, so as to increase the wall thickness, slow down the heat transfer of the heating plate 100 and avoid blocking the channel.

In some embodiments of the present invention, as shown in fig. 2 and fig. 7, specifically, the nozzle 410 is provided with a through material pipe 411 and two connecting holes 412, the connecting hole 412 connects the cold water pipe 301 in fig. 3, the material pipe 411 is located at the middle of the nozzle 410, the bottom of the material pipe 411 is connected to the material inlet pipe 311, the top is connected to the discharge hole, and the liquid silicone can enter the material pipe 411 from the material inlet pipe 311, so as to inject into the mold from the discharge hole.

The utility model discloses an in some embodiments, as shown in fig. 5 and 7, the internal diameter of penetrating mouth cover 420 is greater than the external diameter of penetrating mouth 410, penetrate mouth cover 420 and penetrate when mouth 410 cup joints, form an inner chamber 421, penetrate mouth cover 420 and penetrate mouth 410 top junction and be provided with the oil blanket and seal the processing, connecting hole 412 can communicate with inner chamber 421, cold water pipeline 301's water flows into inner chamber 421 through connecting hole 412, can cool down to penetrating the inside of material mechanism 400, avoid along with the heat transfer of hot plate 100, make the liquid silica gel temperature in material pipe 411 reach solidification temperature, lead to material pipe 411 to block up.

In some embodiments of the present invention, as shown in fig. 5 and 7, the nozzle pad 430 is located between the heating plate 100 and the nozzle 410, and communicates with the material pipe 411 and the discharge hole 101, the nozzle pad 430 is a circular boss gasket, the boss contacts with the nozzle 410, just fills the top of the nozzle sleeve 420 and the nozzle 410 after being sleeved, so that the nozzle sleeve and the heating plate 100 can be tightly attached, and the nozzle pad 430 blocks the temperature transmission between the material pipe 411 and the discharge hole to a certain extent, thereby avoiding the solidification of the liquid silica gel.

In some embodiments of the utility model, as shown in fig. 9, the heating plate 100 is provided with a plurality of heating pipes 102, and the heating pipe 102 runs through the heating plate 100, and the discharge opening 101 both sides respectively are provided with three heating pipes 102 that advance one by one, and homonymy heating pipe 102 is equidistant to be arranged, can guarantee liquid silica gel shaping quality to the mould even heating above the heating plate 100.

It should be understood that the arrangement and number of the heating pipes 102 in the present embodiment are not the only configuration, and in other embodiments, the number of the heating pipes 102 may be increased or decreased, and the heating pipes 102 can also be staggered. The utility model discloses various structures and the arrangement to heating pipeline 102 are not different a repeated description. It is understood that the flexible variation of the number and arrangement of the heating pipes 102 is not limited to the basic concept of the present invention.

In some embodiments of the present invention, as shown in fig. 4-8, the thermal insulating base 440 is sleeved on the nozzle sleeve 420, so as to reduce the temperature transmission between the heating plate 100 and the injection mechanism 400.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A lower die glue inlet die holder unit comprises a heating plate (100) provided with a discharge hole (101); the hot plate is characterized in that the bottom of the hot plate (100) is sequentially connected with a heat insulation plate (200) and a cold water plate (300), and a material injection mechanism (400) penetrates through the hot plate (100) and is communicated with a material opening of the cold water plate (300).

2. The lower mold glue inlet die holder unit according to claim 1, wherein the cold water plate (300) is provided with a glue inlet mechanism (310) communicating the injection mechanism (400) and the equipment runner.

3. The lower die glue inlet die holder unit according to claim 2, wherein the glue inlet mechanism (310) comprises a glue inlet tube (311) communicated with the material injection mechanism (400) and a glue inlet base (312) for fixing the position of the glue inlet tube (311); the glue inlet base (312) is fixedly connected to the cold water plate (300).

4. The lower die glue inlet die holder unit according to claim 1, wherein the cold water plate (300) is provided with a plurality of cold water pipes (301), and the cold water pipes (301) penetrate through the cold water plate (300).

5. The lower die glue feeding die holder unit according to claim 4, wherein the material injection mechanism (400) comprises a nozzle (410), a nozzle sleeve (420) and a nozzle pad (430) which are connected in sequence, and the nozzle sleeve (420) is sleeved on the nozzle (410).

6. The lower die glue inlet die holder unit according to claim 5, wherein the nozzle (410) is provided with a through material pipe (411) and two connecting holes (412) communicating with the cold water pipeline (301).

7. The lower die glue feeding die holder unit according to claim 6, wherein the inner diameter of the nozzle sleeve (420) is larger than the outer diameter of the nozzle (410), when the nozzle sleeve (420) is sleeved with the nozzle (410), an inner cavity (421) is formed, the inner cavity (421) is communicated with the connecting hole (412), and water in the cold water pipeline (301) flows into the inner cavity (421) from one connecting hole (412) and flows out from the other connecting hole (412).

8. The lower mold glue feeding die holder unit of claim 7, wherein said nozzle pad (430) is located between said heating plate (100) and said nozzle (410) and communicates said material pipe (411) and said discharge hole (101).

9. A lower mold inlet die holder unit according to any one of claims 1 to 8, wherein the heating plate (100) is provided with a plurality of heating pipes (102), and the heating pipes (102) penetrate through the heating plate (100).

10. The lower die glue feeding die holder unit according to any one of claims 5 to 8, further comprising a heat insulation seat (440), wherein the heat insulation seat (440) is sleeved on the nozzle sleeve (420) to insulate the heating plate (100) and the injection mechanism (400).