CN213321016U - Quick cutting device of monocrystalline silicon piece - Google Patents
Quick cutting device of monocrystalline silicon piece Download PDFInfo
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- CN213321016U CN213321016U CN202021783592.6U CN202021783592U CN213321016U CN 213321016 U CN213321016 U CN 213321016U CN 202021783592 U CN202021783592 U CN 202021783592U CN 213321016 U CN213321016 U CN 213321016U
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Abstract
The utility model discloses a quick cutting device for monocrystalline silicon wafers, which comprises a base, wherein a supporting column is fixedly connected with the top of one end of the base, the supporting column is provided with an installation cavity and a rotating cavity, a threaded rod is rotatably connected in the rotating cavity, the top end of the threaded rod penetrates through the rotating cavity and is rotationally connected with the inner wall of the mounting cavity, a first gear is fixedly sleeved on the side wall of the threaded rod in the mounting cavity, a second gear which is meshed with the first gear is arranged on the first gear, a rotating rod is fixedly connected with one side of the second gear, the one end that the second gear was kept away from to the bull stick runs through the installation cavity and outwards extends, fixedly connected with mounting panel on one side outer wall of support column, the utility model discloses a stability when centre gripping fixed establishment's setting can effectively monocrystalline silicon piece cutting need not artifical handheld fixed, work efficiency, and the security obtains promoting.
Description
Technical Field
The utility model relates to a relevant goods field of monocrystalline silicon specifically is a quick cutting device of monocrystalline silicon piece.
Background
With the development of the present society, single crystal silicon is widely applied, and semiconductors manufactured by using single crystal silicon are required in many high-tech products, which is determined by the properties of single crystal silicon, and are good semiconductor materials because of different properties in different directions, and cutting is an important process to be molded and used in the production process of single crystal silicon.
However, the existing monocrystalline silicon wafer cutting device is poor in stability during cutting, and is usually manually held for operation and fixation to avoid position deviation, so that the mode is low in efficiency, large in physical expenditure and low in safety.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a quick cutting device of monocrystalline silicon piece to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a monocrystalline silicon piece rapid cutting device comprises a base, wherein a supporting column is fixedly connected to the top of one end of the base, an installation cavity and a rotating cavity are arranged on the supporting column, a threaded rod is rotatably connected in the rotating cavity, the top end of the threaded rod penetrates through the rotating cavity and is rotatably connected with the inner wall of the installation cavity, a first gear is fixedly sleeved on the side wall of the threaded rod in the installation cavity, a second gear which is meshed with the first gear is arranged on the first gear, a rotating rod is fixedly connected to one side of the second gear, one end, far away from the second gear, of the rotating rod penetrates through the installation cavity and extends outwards, an installation plate is fixedly connected to the outer wall of one side of the supporting column, a motor is fixedly connected to the bottom of the installation plate, a cutting knife is fixedly connected to the output end of the motor, a supporting plate is sleeved on the side wall of the threaded rod, one side of support column is equipped with the sliding opening that corresponds with the backup pad, the one end top fixedly connected with locating plate of backup pad, be equipped with the slot on the locating plate, the one end top fixedly connected with bracing piece of locating plate is kept away from to the backup pad, the movable plate has been cup jointed in the slip on the bracing piece, the one end below of movable plate is equipped with the arc clamp plate, through a plurality of spring fixed connection between arc clamp plate and the movable plate, fixedly connected with spring telescopic link between the other end of movable plate and the base.
Preferably, the top of the supporting rod is fixedly connected with a limiting block.
Preferably, one end of the rotating rod extending is fixedly connected with a handle.
Preferably, a plurality of support legs are fixedly connected to the bottom of the base.
Preferably, the bottom of the arc-shaped pressing plate is fixedly connected with a rubber plate.
Preferably, the motor is a servo motor.
Compared with the prior art, the beneficial effects of the utility model are that:
the quick cutting device for the monocrystalline silicon wafers firstly pulls the movable plate to slide on the supporting rod, then the monocrystalline silicon rod is inserted into the slot on the positioning plate, the movable plate is loosened after the insertion is finished, at the moment, the movable plate automatically rebounds under the rebounding force of the spring telescopic rod so that the arc-shaped pressing plate is abutted against the monocrystalline silicon rod to be fixed, the arrangement of the plurality of springs can effectively increase the fixed buffering force, then the motor at the bottom of the mounting plate is started to work to drive the cutting knife to rotate, the rotating rod is rotated to drive the second gear to be meshed with the first gear to rotate, at the moment, the first gear drives the threaded rod to rotate, the supporting plate arranged on the device moves along with the movement when the threaded rod rotates so as to move the monocrystalline silicon rod upwards to realize the cutting, the utility model can effectively improve the stability of the, and the safety is improved.
Drawings
FIG. 1 is a schematic structural view of a rapid cutting device for monocrystalline silicon wafers according to the present invention;
fig. 2 is a schematic view of an arc-shaped pressing plate of the rapid cutting device for monocrystalline silicon wafers according to the present invention.
In the figure: 1-base, 2-support column, 3-threaded rod, 4-first gear, 5-second gear, 6-rotating rod, 7-mounting plate, 8-motor, 9-cutting knife, 10-support plate, 11-positioning plate, 12-support rod, 13-moving plate, 14-arc-shaped pressing plate, 15-spring, 16-spring telescopic rod, 17-limiting block, 18-handle, 19-supporting foot and 20-rubber plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, the present invention provides an embodiment: a quick cutting device for monocrystalline silicon wafers comprises a base 1, wherein a supporting column 2 is fixedly connected to the top of one end of the base 1, a mounting cavity and a rotating cavity are arranged on the supporting column 2, a threaded rod 3 is rotatably connected in the rotating cavity, the top end of the threaded rod 3 penetrates through the rotating cavity and is rotatably connected with the inner wall of the mounting cavity, a first gear 4 is fixedly sleeved on the side wall of the threaded rod 3 in the mounting cavity, a second gear 5 which is meshed with the first gear 4 is arranged on the first gear 4, a rotating rod 6 is fixedly connected to one side of the second gear 5, one end, far away from the second gear 5, of the rotating rod 6 penetrates through the mounting cavity and extends outwards, a mounting plate 7 is fixedly connected to the outer wall of one side of the supporting column 2, a motor 8 is fixedly connected to the bottom of the mounting plate 7, a cutting knife 9 is fixedly connected to the output end of the motor 8, a, one side of support column 2 is equipped with the mouth that slides that corresponds with backup pad 10, the one end top fixedly connected with locating plate 11 of backup pad 10, be equipped with the slot on the locating plate 11, backup pad 10 keeps away from the one end top fixedly connected with bracing piece 12 of locating plate 11, the movable plate 13 has been cup jointed in the slip on bracing piece 12, the one end below of movable plate 13 is equipped with arc clamp plate 14, through a plurality of springs 15 fixed connection between arc clamp plate 14 and the movable plate 13, fixedly connected with spring telescopic link 16 between the other end of movable plate 13 and the base 1.
In the utility model, the top of the support rod 12 is fixedly connected with a limit block 17 to prevent the movable plate 13 from falling off; a handle 18 is fixedly connected to one extending end of the rotating rod 6, so that the rotating rod 6 can be rotated conveniently; the bottom of the base 1 is fixedly connected with a plurality of support legs 19; the bottom of the arc-shaped pressing plate 14 is fixedly connected with a rubber plate 20, so that the contact friction force with the surface of the single crystal silicon rod is reduced; the motor 8 is a servo motor.
The working principle is as follows: pulling movable plate 13 slides on bracing piece 12, then insert the single crystal silicon rod in the slot on locating plate 11, loosen movable plate 13 after inserting finishing, thereby movable plate 13 makes arc clamp plate 14 offset the single crystal silicon rod realization fixed under spring telescopic rod 16's resilience force automatic resilience this moment, the setting of a plurality of springs 15 can effectively increase fixed buffer power, it is rotatory that the motor 8 work that starts 7 bottoms of mounting panel drives cutting knife 9 afterwards, it rotates to drive first gear 4 of 5 meshing of second gear 5 through rotating the bull stick 6 when the cutting, first gear 4 will drive threaded rod 3 and rotate this moment, thereby the backup pad 10 of installing when threaded rod 3 rotates follows the removal and shifts up the single crystal silicon rod and realizes the cutting.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A quick cutting device for monocrystalline silicon wafers comprises a base (1) and is characterized in that: the one end top fixedly connected with support column (2) of base (1), be equipped with the installation cavity on support column (2) and rotate the chamber, it is connected with threaded rod (3) to rotate the intracavity rotation, the top of threaded rod (3) runs through and rotates the chamber and is connected with the inner wall rotation of installation cavity, threaded rod (3) are fixed the cover on the lateral wall that is located the installation cavity and are connected with first gear (4), be equipped with engaged with second gear (5) on first gear (4), one side fixedly connected with bull stick (6) of second gear (5), the one end that second gear (5) were kept away from in bull stick (6) runs through the installation cavity and outwards extends, fixedly connected with mounting panel (7) on one side outer wall of support column (2), the bottom fixedly connected with motor (8) of mounting panel (7), the output fixedly connected with cutting knife (9) of motor (8), a supporting plate (10) is sleeved on the side wall of the threaded rod (3) in the rotating cavity in a threaded manner, one end of the supporting plate (10) penetrates through the rotating cavity and extends outwards first, one side of the supporting column (2) is provided with a sliding opening corresponding to the supporting plate (10), the top of one end of the supporting plate (10) is fixedly connected with a positioning plate (11), the positioning plate (11) is provided with a slot, the top of one end of the supporting plate (10) far away from the positioning plate (11) is fixedly connected with a supporting rod (12), a moving plate (13) is sleeved on the support rod (12) in a sliding manner, an arc-shaped pressing plate (14) is arranged below one end of the moving plate (13), the arc-shaped pressing plate (14) is fixedly connected with the moving plate (13) through a plurality of springs (15), and a spring telescopic rod (16) is fixedly connected between the other end of the moving plate (13) and the base (1).
2. The quick cutting device for the monocrystalline silicon piece according to claim 1, wherein: the top of the supporting rod (12) is fixedly connected with a limiting block (17).
3. The quick cutting device for the monocrystalline silicon piece according to claim 1, wherein: one end of the rotating rod (6) extending is fixedly connected with a handle (18).
4. The quick cutting device for the monocrystalline silicon piece according to claim 1, wherein: the bottom of the base (1) is fixedly connected with a plurality of support legs (19).
5. The quick cutting device for the monocrystalline silicon piece according to claim 1, wherein: the bottom of the arc-shaped pressing plate (14) is fixedly connected with a rubber plate (20).
6. The quick cutting device for the monocrystalline silicon piece according to claim 1, wherein: the motor (8) is a servo motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021783592.6U CN213321016U (en) | 2020-08-24 | 2020-08-24 | Quick cutting device of monocrystalline silicon piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021783592.6U CN213321016U (en) | 2020-08-24 | 2020-08-24 | Quick cutting device of monocrystalline silicon piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213321016U true CN213321016U (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021783592.6U Active CN213321016U (en) | 2020-08-24 | 2020-08-24 | Quick cutting device of monocrystalline silicon piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213321016U (en) |
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2020
- 2020-08-24 CN CN202021783592.6U patent/CN213321016U/en active Active
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