CN213306049U - Compound heat conduction silica gel gasket - Google Patents
Compound heat conduction silica gel gasket Download PDFInfo
- Publication number
- CN213306049U CN213306049U CN202022281154.6U CN202022281154U CN213306049U CN 213306049 U CN213306049 U CN 213306049U CN 202022281154 U CN202022281154 U CN 202022281154U CN 213306049 U CN213306049 U CN 213306049U
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- China
- Prior art keywords
- gasket
- heat conduction
- heat
- strip
- silica gel
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Abstract
The utility model discloses a compound heat conduction silica gel gasket, include: the silica gel gasket body, the silica gel gasket body includes: the gasket comprises a first gasket and a second gasket, wherein the first gasket and the second gasket are overlapped up and down; the first gasket and the second gasket are internally provided with a first heat conduction strip and a second heat conduction strip which are used for conducting heat respectively, when the first gasket and the second gasket are vertically overlapped, the first heat conduction strip and the second heat conduction strip are kept to be attached, and the first heat conduction strip and the second heat conduction strip respectively extend along the length direction of the first gasket and the second gasket; the first heat conduction strip, the second heat conduction strip that set up are the extension form and are the material that does benefit to heat conduction, utilize first heat conduction strip, second heat conduction strip to realize respectively that the heat that first gasket, second gasket self received obtains evenly propagating, and the laminating of mutual contact between first heat conduction strip and the second heat conduction strip to with the heat transfer of second gasket to first gasket, further realization heat conduction heat dissipation.
Description
Technical Field
The utility model relates to a silica gel piece field, in particular to compound heat conduction silica gel gasket.
Background
The heat conductive silica gel is a high-end heat conductive compound, and is not solidified, and the characteristic of no electric conduction can avoid risks such as short circuit of a circuit. The heat-conducting bonding sealing silicone rubber is a single-component, heat-conducting and room-temperature curing organic silicon bonding sealant.
The high-performance elastomer is vulcanized by condensation reaction of water in air to release low molecular weight to cause crosslinking and solidification. Has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance. The high-temperature resistant and high-voltage resistant insulating paint has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, does not swell and has good adhesion to most of metal and non-metal materials.
In the prior art, the heat conductive silica gel is generally used as a gasket for heat dissipation of an electrical component (such as a CPU), but the heat conductive silica gel gasket prepared by the process has a layered structure and has a phenomenon of uneven heat conduction, so we propose a composite heat conductive silica gel gasket to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a compound heat conduction silica gel gasket to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme, a compound heat conduction silica gel gasket, include: the silica gel gasket body, the silica gel gasket body includes: the gasket comprises a first gasket and a second gasket, wherein the first gasket and the second gasket are overlapped up and down;
the first gasket and the second gasket are respectively internally provided with a first heat conduction strip and a second heat conduction strip for conducting heat, the first heat conduction strip and the second heat conduction strip are kept attached when the first gasket and the second gasket are vertically overlapped, and the first heat conduction strip and the second heat conduction strip respectively extend along the length direction of the first gasket and the second gasket.
As an optimization of the above scheme, the second heat conducting strip has an extending portion and a conducting portion, the extending portion is in a strip structure, the conducting portion is located in the middle of the second heat conducting strip, the conducting portion protrudes upwards from the middle of the second heat conducting strip, and the conducting portion is in an annular structure.
As an optimization of the scheme, the lower end of the second gasket is provided with an accommodating groove matched with the extending part of the second heat conducting strip, and the second gasket is provided with a through hole matched with the conducting part of the second heat conducting strip in a penetrating manner; the extending part is filled into the accommodating groove, and the conducting part penetrates through the through hole from top to bottom.
As an optimization of the above scheme, the first heat conducting strip has one attaching portion and two extending portions, and the attaching portion is fixedly connected between the two extending portions.
Preferably, the fitting portion extends in a width direction of the first gasket, and the extending portion extends in a length direction of the first gasket.
As the optimization of the scheme, an arc-shaped groove matched with the conduction part is arranged in the first gasket in a penetrating manner along the width direction, and a transverse groove matched with the extension part is arranged along the length direction;
the arc-shaped groove and the transverse groove are communicated.
As an optimization of the above scheme, the conducting part is inserted into the arc-shaped groove, the extending part is inserted into the transverse groove, and the extending part and the conducting part are contacted and attached to each other.
The utility model discloses a technological effect and advantage:
the utility model discloses a compound heat conduction silica gel gasket, include: the silica gel gasket body, the silica gel gasket body includes: the gasket comprises a first gasket and a second gasket, wherein the first gasket and the second gasket are overlapped up and down; the first gasket and the second gasket are respectively internally provided with a first heat conduction strip and a second heat conduction strip for conducting heat, and the first heat conduction strip and the second heat conduction strip are kept attached when the first gasket and the second gasket are vertically overlapped; the first heat conduction strip, the second heat conduction strip that set up are the extension form and are the material that does benefit to heat conduction, utilize first heat conduction strip, second heat conduction strip to realize respectively that the heat that first gasket, second gasket self received obtains evenly propagating, and the laminating of mutual contact between first heat conduction strip and the second heat conduction strip to with the heat transfer of second gasket to first gasket, further realization heat conduction heat dissipation.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the explosion structure of the present invention.
Fig. 3 is a schematic view of the connection structure of the first heat conducting strip and the second heat conducting strip of the present invention.
In the figure: 1. a silica gel gasket body; 2. a first gasket 2; 3. a second gasket; 4. a first heat conducting strip; 5. a second heat conducting strip; 6. an extension portion; 7. a conduction part; 8. accommodating grooves; 9. a port; 10. a bonding section; 11. an extension portion; 12. an arc-shaped slot; 13. a transverse groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a compound heat conduction silica gel gasket as shown in figures 1-3, include: silica gel gasket body 1, silica gel gasket body 1 includes: the gasket comprises a first gasket 2 and a second gasket 3, wherein the first gasket 2 and the second gasket 3 are overlapped up and down;
first heat conduction strip 4, second heat conduction strip 5 that are used for conducting heat are equipped with respectively in first gasket 2 and the second gasket 3, keep the laminating between first heat conduction strip 4, the second heat conduction strip 5 when first gasket 2 and the second gasket 3 superpose from top to bottom, and first heat conduction strip 4, the second heat conduction strip 5 extend along the length direction of first gasket 2, second gasket 3 respectively.
In order to make the second heat conduction strip 5 conduct heat sufficiently, specifically, the second heat conduction strip 5 has an extension portion 6 and a conduction portion 7, the extension portion 6 is a strip structure, the conduction portion 7 is located in the middle of the second heat conduction strip 5, the conduction portion 7 protrudes upward from the middle of the second heat conduction strip 5, and the conduction portion 7 is an annular structure.
In consideration of the assembly between the second heat conduction strip 5 and the second gasket 3, the lower end of the second gasket 3 is provided with a receiving groove 8 matched with the extension part 6 of the second heat conduction strip 5, and the second gasket 3 is provided with a through hole 9 matched with the conduction part 7 of the second heat conduction strip 5 in a penetrating way; the extension part 6 is filled into the accommodation groove 8, and the conduction part 7 passes through the through hole 9 from top to bottom.
In order to make the first heat conduction strip 4 conduct heat sufficiently, the first heat conduction strip 4 has the attaching portions 10 and the extending portions 11, the number of the attaching portions 10 is one, the number of the extending portions 11 is two, and the attaching portions 10 are fixedly connected between the two extending portions 11.
Furthermore, the attaching portion 10 extends along the width direction of the first gasket 2, the extending portion 11 extends along the length direction of the first gasket 2, an arc-shaped groove 12 matched with the conducting portion 7 is arranged in the first gasket 2 in a penetrating mode along the width direction, and a transverse groove 13 matched with the extending portion 11 is arranged along the length direction; the arc-shaped groove 12 is communicated with the transverse groove 13.
In the present embodiment, the conducting portion 7 is inserted into the arc-shaped groove 12, the extending portion 11 is inserted into the transverse groove 13, and the extending portion 11 and the conducting portion 7 are in contact and attached to each other, that is, the first conducting strip 4 and the second conducting strip 5 conduct each other, so as to realize heat exchange and dissipation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. A composite thermally conductive silicone gasket, comprising: silica gel gasket body (1), its characterized in that:
silica gel gasket body (1) includes: the gasket comprises a first gasket (2) and a second gasket (3), wherein the first gasket (2) and the second gasket (3) are overlapped up and down;
the heat conduction gasket is characterized in that a first heat conduction strip (4) and a second heat conduction strip (5) for conducting heat are arranged in the first gasket (2) and the second gasket (3) respectively, the first heat conduction strip (4) and the second heat conduction strip (5) are attached to each other when the first gasket (2) and the second gasket (3) are overlapped up and down, and the first heat conduction strip (4) and the second heat conduction strip (5) extend along the length direction of the first gasket (2) and the length direction of the second gasket (3) respectively.
2. The compound heat-conducting silica gel gasket according to claim 1, characterized in that:
second heat conduction strip (5) have extension portion (6) and conduction portion (7), extension portion (6) are the strip structure, conduction portion (7) are located the middle part of second heat conduction strip (5), and conduction portion (7) upwards protruding from the middle part of second heat conduction strip (5), and conduction portion (7) are the loop configuration.
3. The compound heat-conducting silica gel gasket according to claim 2, characterized in that:
the lower end of the second gasket (3) is provided with an accommodating groove (8) matched with the extending part (6) of the second heat conducting strip (5), and the second gasket (3) is provided with a through hole (9) matched with the conducting part (7) of the second heat conducting strip (5) in a penetrating manner; the extension part (6) is filled into the accommodating groove (8), and the conduction part (7) penetrates through the through hole (9) from top to bottom.
4. The compound heat-conducting silica gel gasket according to claim 1, characterized in that:
the first heat conduction strip (4) is provided with a fitting part (10) and two extending parts (11), the number of the fitting parts (10) is one, the number of the extending parts (11) is two, and the fitting parts (10) are fixedly connected between the two extending parts (11).
5. The compound heat-conducting silica gel gasket according to claim 4, characterized in that:
the attaching portion (10) extends in the width direction of the first gasket (2), and the extending portion (11) extends in the length direction of the first gasket (2).
6. The compound heat-conducting silica gel gasket according to claim 5, characterized in that:
an arc-shaped groove (12) matched with the conduction part (7) is arranged in the first gasket (2) in a penetrating manner along the width direction, and a transverse groove (13) matched with the extension part (11) is arranged along the length direction;
the arc-shaped groove (12) is communicated with the transverse groove (13).
7. The compound heat-conducting silica gel gasket according to claim 6, characterized in that:
the conducting part (7) is inserted into the arc-shaped groove (12), the extending part (11) is inserted into the transverse groove (13), and the extending part (11) and the conducting part (7) are mutually contacted and attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022281154.6U CN213306049U (en) | 2020-10-14 | 2020-10-14 | Compound heat conduction silica gel gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022281154.6U CN213306049U (en) | 2020-10-14 | 2020-10-14 | Compound heat conduction silica gel gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213306049U true CN213306049U (en) | 2021-05-28 |
Family
ID=76013002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022281154.6U Expired - Fee Related CN213306049U (en) | 2020-10-14 | 2020-10-14 | Compound heat conduction silica gel gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213306049U (en) |
-
2020
- 2020-10-14 CN CN202022281154.6U patent/CN213306049U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210528 Termination date: 20211014 |