CN213304121U - Diode, circuit board and air conditioner - Google Patents
Diode, circuit board and air conditioner Download PDFInfo
- Publication number
- CN213304121U CN213304121U CN202022515970.9U CN202022515970U CN213304121U CN 213304121 U CN213304121 U CN 213304121U CN 202022515970 U CN202022515970 U CN 202022515970U CN 213304121 U CN213304121 U CN 213304121U
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- Prior art keywords
- diode
- support
- circuit board
- coating
- protrusion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a diode to and have its circuit board and air conditioner, the diode includes support and coating, and wherein, the support is including encapsulation section and pin section, the encapsulation section is provided with at least one bellying, the coating parcel the encapsulation section. The coating and the bellying of diode combine, have enlarged the bonding area between coating and the support to improve the cohesion between support and the coating, effectively guarantee the support at the intraformational stability of coating, avoid inserting at the machine in-process lead wire fracture and lead to the diode to damage.
Description
Technical Field
The utility model relates to the field of semiconductor technology, in particular to diode, circuit board and air conditioner.
Background
The support of the plug-in diode consists of a positive electrode and a negative electrode, wherein the bonding area of the coating layer and the support is limited, and the failure of lead breakage is easily generated after stress is applied in the process of plugging. Specifically, during the cutting of the excess portions of the pins of the diode support after the machine insertion, the support is pulled longitudinally and sways within the cladding, which results in the breakage of the leads connected between the two supports and thus the diode.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a diode can avoid the diode to insert the in-process at the machine and damage.
A circuit board and an air conditioner with the diode are also provided.
According to the utility model discloses a diode of first aspect embodiment, including support and coating, wherein, the support includes encapsulation section and pin section, the encapsulation section is provided with at least one bellying, the coating parcel the encapsulation section.
According to the utility model discloses diode has following beneficial effect at least: the coating combines with the bellying, has enlarged the bonding area between coating and the support to improve the cohesion between support and the coating, effectively guarantee the support at the intraformational stability of coating, avoid inserting at the machine in-process lead wire fracture and lead to the diode to damage.
According to some embodiments of the invention, at least one side of the protruding portion is provided with a plurality of grooves, a plurality of the groove intervals are arranged, so that the edge of the protruding portion forms a saw-toothed shape.
According to some embodiments of the invention, the width of the protrusion is D1, the depth of the groove is L1, wherein D1> 4L; the width of each groove is L2, and the shortest distance between every two adjacent grooves is L3, wherein L2 is L3.
According to some embodiments of the invention, the protrusion is provided with a perforation.
According to some embodiments of the invention, the width of the protrusion is D1, the diameter of the perforation is M1, wherein D1 is equal to or greater than 3M 1.
According to some embodiments of the invention, the tip of the boss is provided with and is curved sunken position.
According to some embodiments of the utility model, the bellying is provided with a plurality ofly, a plurality of the setting of staggering of bellying.
According to some embodiments of the invention, the support is provided with 2, one of which is provided with a wafer, the other of which is connected with the wafer through a lead wire.
According to some embodiments of the invention, the coating comprises an epoxy resin.
According to the utility model discloses a circuit board of second aspect embodiment is provided with the utility model discloses a diode of first aspect embodiment, the diode welding is in on the circuit board.
According to the utility model discloses circuit board has following beneficial effect at least: the coating combines with the bellying, has enlarged the bonding area between coating and the support to improve the cohesion between support and the coating, effectively guarantee the support at the intraformational stability of coating, avoid inserting at the machine in-process lead wire fracture and lead to the diode to damage.
According to some embodiments of the utility model, the circuit board is provided with the pad, the support is worn to locate the pad and with pad welded fastening.
According to the utility model discloses an air conditioner of third aspect embodiment, include the circuit board of the second aspect embodiment of the utility model.
According to the utility model discloses air conditioner has following beneficial effect at least: the coating combines with the bellying, has enlarged the bonding area between coating and the support to improve the cohesion between support and the coating, effectively guarantee the support at the intraformational stability of coating, avoid inserting at the machine in-process lead wire fracture and lead to the diode to damage.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention will be further described with reference to the following drawings and examples, in which:
fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an embodiment of a diode according to an embodiment of the present invention;
fig. 3 is a schematic diagram of another embodiment of a diode according to an embodiment of the present invention;
fig. 4 is a schematic view of a bracket according to an embodiment of the present invention;
fig. 5 is an enlarged view of a portion a of fig. 4.
Reference numerals
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
In the embodiment of the present invention, in the air conditioner, the circuit board 200 is installed in the air conditioner, wherein, with reference to fig. 1, it can be understood that the diode 100 and the resistor 300 are installed on the circuit board 200, the resistor 300 and the diode 100 cooperate with other electronic components to form a working circuit, and in actual production, the diode 100 needs to be inserted into the circuit board 200 for installation, referring to fig. 2, the diode 100 of the embodiment of the present invention includes a coating layer 120 and a support 110, wherein, referring to fig. 4, the support 110 includes an encapsulation section 111 and a pin section 112, the encapsulation section 111 is wrapped by the coating layer 120, and the encapsulation section 111 is provided with at least one protruding portion 113.
In actual processing, the diode 100 in the embodiment needs to be inserted into the circuit board 200, and unnecessary portions in the pin segment 112 need to be cut, in the cutting process, the whole support 110 is clamped by the protruding portion 113 and the covering layer 120, so that the bonding force is improved, specifically, the covering layer 120 and the protruding portion 113 wrapping the encapsulation segment 111 are bonded, so that the bonding area between the covering layer 120 and the support 110 is greatly enlarged, and thus the bonding force between the support 110 and the covering layer 120 is improved, when the support 110 is interfered by an external force, the improved bonding force can greatly reduce the pulling effect of the external force on the support 110, and simultaneously reduce the swing of the support 110 in the covering layer 120, thereby effectively ensuring the stability of the support 110 in the covering layer 120, and the support 110 is stable in the covering layer 120.
Specifically, referring to fig. 2, in the diode 100, the support 110 includes a first support and a second support, the package segment 111 of the first support is provided with a wafer 130, and the wafer 130 and the second support are connected by a lead 140, wherein one of the first support and the second support is used for connecting a cathode and the other is used for connecting an anode. When the bonding strength between the support 110 and the cladding layer 120 is increased, the occurrence of relative misalignment between the first support and the second support can be prevented, so that the lead 140 between the first support and the second support is prevented from being broken, and the diode 100 is prevented from being damaged.
The diode 100 includes a light emitting diode 100, a voltage regulator tube, etc., taking the light emitting diode 100 as an example, in the processing of the light emitting diode 100, the cladding layer 120 is generally formed by an injection molding process and wraps the exterior of the encapsulation section 111 of the bracket 110, the encapsulation section 111 of the bracket 110 and the cladding layer 120 are combined, the encapsulation section 111 is embedded in the cladding layer 120, when an external force is applied, the bracket 110 is fixed between the encapsulation section 111 of the bracket 110 and the cladding layer 120 by a friction force generated between the bonding surfaces of the two, so as to prevent the bracket 110 from being pulled by the external force and being separated from the cladding layer 120, after the protrusion 113 is added on the bracket 110, a slot matching with the protrusion 113 is formed inside the cladding layer 120 after the injection molding, the shape of the slot is consistent with the shape of the protrusion 113, the protrusion 113 is clamped into the slot to form a clamping, compared with the structure being fixed only by a friction force, the binding mode formed by the clamping between the convex part 113 and the clamping groove can further improve the binding degree between the coating layer 120 and the bracket 110, and in addition, the binding effect generated by friction is better because the attaching area between the bracket 110 and the coating layer 120 is improved.
Referring to fig. 2, it can be understood that a pad 210 is disposed on the circuit board 200, during the process of inserting the diode 100, the bracket 110 of the diode 100 is inserted into the pad 210, and the pin segment 112 of the bracket 110 and the pad 210 are fixed by welding, and after the fixing by welding, an excess portion of the pin segment 112 of the bracket 110 needs to be cut.
It is understood that, referring to fig. 5, at least one side of the protrusion 113 is provided with a plurality of grooves 1131, and the plurality of grooves 1131 are spaced apart to form the side of the protrusion 113 in a zigzag shape. Cladding 120 is after processing, can form the joint structure that the cockscomb structure that matches with the cockscomb structure of the side of bellying 113, its joint structure and the side of the bellying 113 of cockscomb structure can form the joint, make the structure between bellying 113 and the cladding 120 inseparabler, further improve the compactness between support 110 and the cladding 120, make the combination between support 110 and the cladding 120 more firm, guarantee that the structure of whole diode 100's inside is not destroyed when support 110 receives the pulling.
It will be appreciated that, referring to fig. 5, the sides refer to the opposite sides and ends of the protrusion 113, and it should be noted that the protrusion 113 is generally small in volume, so that the ends of the protrusion 113 are not suitable for machining, and referring to fig. 3, the opposite sides of the protrusion 113 are provided with grooves 1131, so that the sides of the opposite sides of the protrusion 113 are serrated and fit with the cladding 120.
It will be appreciated that the diode 100 is a relatively small part, and in order to increase the overall strength of the support 110 in the diode 100, the width of the protrusion 113 is D1, and the depth of the groove 1131 is L1, where D1> 4L; the width of each groove 1131 is L2, and the shortest distance between two adjacent grooves 1131 is L3, where L2 is L3. Specifically, the grooves 1131 are disposed on the two opposite sides of the protruding portion 113, so that the shortest distance between the grooves 1131 on the two sides is greater than or equal to half of the width of the protruding portion 113, thereby improving the strength of the entire protruding portion 113, avoiding the breakage of the protruding portion 113 during the processing, and avoiding the breakage of the protruding portion 113 due to stress when the diode 100 is actually mounted. The width of recess 1131 equals the shortest distance between two adjacent recesses 1131, and a plurality of recesses 1131 equidistance on same side promptly set up, makes whole bellying 113's structure more balanced, when installing diode 100, if bellying 113 receives pressure, the bellying 113's of more balanced structure enables whole bellying 113's atress more balanced, improves whole diode 100's intensity.
It is understood that the boss 113 is provided with the penetration holes 1132 in order to further improve the coupling degree between the bracket 110 and the cover 120. In the injection molding process, the cladding 120 is condensed in the through hole 1132 to form a pin, the pin is inserted into the through hole 1132 and clamped with the through hole 1132, the through hole 1132 is matched with the pin, so that the boss 113 is fixed in the cladding 120, specifically, the position of the boss 113 before the injection molding of the cladding 120 will be fixed in the position after the cooling molding of the cladding 120, and then the integral molding structure between the boss 113 and the packaging section 111 is matched, thereby effectively ensuring the whole support 110 and the cladding 120 to be more attached, avoiding the breakage of the lead 140 in the process of insertion, and avoiding the damage of the diode 100.
It can be understood that, in order to increase the overall strength of the support 110 in the diode 100, the width of the protrusion 113 is D1, and the diameter of the through hole 1132 is M1, wherein D1 ≧ 3M 1. Specifically, the diameter of the through hole 1132 is made to occupy 1/3 or less of the width of the whole boss 113, the hollowed-out part of the boss 113 can be made smaller, the situation that the hollowed-out part in the boss 113 is too much to cause the structure of the whole boss 113 to become fragile is avoided, the strength of the boss 113 is ensured, and the fracture is avoided, it needs to be mentioned that in order to balance the strength of the whole boss 113, the center of the through hole 1132 is located at the midpoint of the line segment in the boss 113 along the width direction, so that the bilateral symmetry of the boss 113 is ensured, the structure of the whole boss 113 is more balanced, the strength of the boss 113 is improved, and the support 110 and the coating 120 can be more attached through the boss 113.
It will be appreciated that, since the volume of the protruding portion 113 is generally small, the end of the protruding portion 113 is not suitable for machining, and in order to further improve the fit between the integral bracket 110 and the covering layer 120, the end of the protruding portion 113 is provided with an arc-shaped recess 1133. Specifically, after injection molding, the cover 120 forms a protrusion, which matches the shape of the recess 1133 and is embedded into the recess 1133, so that the protrusion 113 and the cover 120 are tightly attached to each other. Specifically, the protrusions and the depressions 1133 are mutually constrained, and when the support 110 is under pressure, the interaction between the protrusions and the depressions 1133 can effectively fix the protrusions 113, so as to fix the entire support 110, and specifically, avoid the breakage of the lead 140 caused by the misalignment between the first support and the second support.
It can be understood that, referring to fig. 5, the support 110 in the diode 100 includes a package section 111 and a pin section 112, the package section 111 is provided with a protrusion 113, the protrusion 113 is rectangular, two opposite sides of the protrusion 113 are provided with a plurality of grooves 1131, the grooves 1131 are spaced apart to form a saw-tooth shape on the sides of the protrusion 113, and the protrusion 113 is provided with a through hole 1132. The width of the protrusion 113 is greater than 4 times the depth of the groove 1131, the grooves 1131 on the same side are equidistantly arranged, the width of the protrusion 113 is equal to three times the diameter of the through hole 1132, and the center of the through hole 1132 is located at the midpoint of the line segment in the width direction in the protrusion 113. This boss 113's structure can combine with cladding 120 in order to improve the cohesion between whole support 110 and cladding 120, can also make whole boss 113's structure more stable, specifically speaking, make perforation 1132 be in whole boss 113's center department, and only occupy the region that 1/3 does not reach, make whole boss 113 symmetry and intensity stable, simultaneously, the depth of the recess 1131 of both sides occupies the width region that does not reach 1/2 altogether, make the inside structural strength of boss 113 keep stable, avoid boss 113 to break when support 110 receives the pulling.
Further, in order to avoid interference, the shortest distance between the two holders 110 is smaller than the shortest distance between the protrusions 113 on the two holders 110, and the distance between the protrusions 113 on the holders 110 and the outer side surface of the cover 120.
It is understood that the plurality of protrusions 113 are provided, and the plurality of protrusions 113 are staggered. The convex parts 113 on the same support 110 are arranged in a staggered mode, so that the support 110 can be clamped with the coating layer 120 from a plurality of positions, the combination degree between the support 110 and the coating layer 120 is improved, the support 110 is stable when the pin section 112 is cut, and the lead 140 in the coating layer 120 is prevented from being broken. It should be mentioned that, referring to fig. 3, on the same bracket 110, every two of the plurality of protrusions 113 may also be oppositely disposed on two sides of the bracket 110.
It is understood that the above-mentioned coating layer 120 includes epoxy resin, which has excellent physical mechanical and electrical insulation properties and adhesion properties with various materials, and is suitable for use in insulating and packaging semiconductor components such as the diode 100 according to the embodiment of the present invention.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (11)
1. A diode, comprising:
the packaging structure comprises a bracket, a plurality of supporting pieces and a plurality of sealing pieces, wherein the bracket comprises a packaging section and a pin section, the packaging section is provided with at least one bulge, at least one side edge of the bulge is provided with a plurality of grooves, and the grooves are arranged at intervals so that the side edge of the bulge forms a saw-tooth shape; and
and the coating layer wraps the packaging section.
2. The diode of claim 1, wherein the width of the protrusion is D1, the depth of the groove is L1, wherein D1> 4L; the width of each groove is L2, and the shortest distance between every two adjacent grooves is L3, wherein L2 is L3.
3. The diode of claim 1, wherein the boss is provided with a perforation.
4. The diode of claim 3, wherein the protrusion has a width of D1, and the perforation has a diameter of M1, wherein D1 is 3M 1.
5. The diode of claim 1, wherein the end of the protruding portion is provided with an arc-shaped recessed portion.
6. The diode of claim 1, wherein the plurality of bosses are provided, and the plurality of bosses are staggered.
7. The diode of claim 1, wherein said support is provided with 2, 2 of said supports, one of which is provided with a wafer and the other of which is connected to said wafer by a lead.
8. The diode of claim 1, wherein the cladding layer comprises an epoxy.
9. Circuit board, characterized in that a diode according to any of claims 1 to 8 is provided, which diode is soldered on the circuit board.
10. The circuit board according to claim 9, wherein the circuit board is provided with a pad, and the bracket is inserted through the pad and is soldered to the pad.
11. An air conditioner characterized by comprising the circuit board of any one of claims 9 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022515970.9U CN213304121U (en) | 2020-11-04 | 2020-11-04 | Diode, circuit board and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022515970.9U CN213304121U (en) | 2020-11-04 | 2020-11-04 | Diode, circuit board and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213304121U true CN213304121U (en) | 2021-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022515970.9U Active CN213304121U (en) | 2020-11-04 | 2020-11-04 | Diode, circuit board and air conditioner |
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| Country | Link |
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| CN (1) | CN213304121U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023098266A1 (en) * | 2021-11-30 | 2023-06-08 | 广州金升阳科技有限公司 | Pin structure of module power supply, and module power supply |
-
2020
- 2020-11-04 CN CN202022515970.9U patent/CN213304121U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023098266A1 (en) * | 2021-11-30 | 2023-06-08 | 广州金升阳科技有限公司 | Pin structure of module power supply, and module power supply |
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