CN213302588U - Optical module - Google Patents

Abstract

The application discloses optical module includes: the circuit board is arranged on the lower shell, and the upper shell is connected with the lower shell in a matched mode. The upper shell is fixedly provided with a first pressing plate and a second pressing plate. This application is in the same place circuit board and lower casing coupling through the first clamp plate and the second clamp plate of last casing. The tail of the first pressing plate is provided with a first crimping part, the tail of the second pressing plate is provided with a second crimping part, and the first crimping part and the second crimping part are in interference fit crimping with the circuit board. The head of the first pressing plate is provided with a third pressing part, the head of the second pressing plate is provided with a fourth pressing part, and the third pressing part and the fourth pressing part are in clearance fit with the circuit board respectively. The first crimping part and the second crimping part can absorb the exceeding size of the circuit board through deformation, the third crimping part and the fourth crimping part can absorb the exceeding size of the circuit board through the gap size, and the phenomenon that the whole size of the combined optical module exceeds the specification requirement and the connection of the optical module and an external part is influenced is effectively avoided.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

High-speed optical modules are widely used in communication networks and optical transmission equipment of the communication networks for converting optical signals and electrical signals and making them suitable for long-distance transmission. The optical module comprises an upper shell, a lower shell, a circuit board and an optical transceiver. The upper shell covers the lower shell to form a wrapping cavity with two openings, and the circuit board and the optical transceiver are arranged inside the cavity.

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like. The circuit board is generally a rigid circuit board, which has a relatively rigid material and a certain thickness. In order to fix the circuit board in the cavity and avoid the phenomenon that the electrical property is influenced by the movement in the cavity of the circuit board, the circuit board is fixed between the upper shell and the lower shell by utilizing the pressing piece on the upper shell.

However, because of the instability of the production process, there is a certain deviation in the actual formed dimensions of the circuit board or the upper and lower cases, and if the dimensions of some components are larger than the preset dimensions, the overall dimensions of the optical module exceed the specification requirements during assembly, which affects the connection stability between the optical module and the external components.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to solve the technical problem that the overall size of the optical module exceeds the specification requirement and the connection between the optical module and an external component is influenced.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, which comprises a lower shell, a circuit board and an upper shell,

the circuit board is arranged on the lower shell; the upper shell is matched and connected with the lower shell, and a first pressing plate and a second pressing plate are fixedly arranged on the upper shell;

the tail part of the first pressing plate is provided with a first crimping part, the tail part of the second pressing plate is provided with a second crimping part, and the first crimping part and the second crimping part are in interference fit crimping with the circuit board;

the head of the first pressing plate is provided with a third pressing part, the head of the second pressing plate is provided with a fourth pressing part, and the heights of the third pressing part and the fourth pressing part are lower than those of the first pressing part and the second pressing part; the first crimping part and the second crimping part are easier to deform under stress than the third crimping part and the fourth crimping part.

Optionally, the first crimping part is provided with a first deformation gap for accommodating a deformation amount of the first crimping part; and the second crimping part is provided with a second deformation notch for accommodating the deformation of the second crimping part.

Optionally, the first crimping part and the second crimping part are symmetrically arranged with each other.

Optionally, the interference between the first crimping part, the second crimping part and the circuit board is greater than or equal to 0.1 mm.

Optionally, the upper housing includes a cover plate, and a third side plate and a fourth side plate located at two sides of the cover plate; the first crimping portion comprises a first support arm, a first suspension arm and a first crimping arm; one end of the first supporting arm is vertically connected with the cover plate, and the other end of the first supporting arm is connected with one end of the first suspension arm; the first suspension arm is arranged in parallel with the cover plate, and the other end of the first suspension arm is perpendicular to the first compression joint arm;

the second crimping portion comprises a second support arm, a second suspension arm and a second crimping arm; one end of the second supporting arm is vertically connected with the cover plate, and the other end of the second supporting arm is connected with one end of the second suspension arm; the second suspension arm and the cover plate are arranged in parallel, and the other end of the second suspension arm is perpendicular to the second compression joint arm.

Optionally, the lower housing includes a main plate, and a first side plate and a second side plate located at two sides of the main plate; the first side plate is provided with a first convex groove, the second side plate is provided with a second convex groove, and the second convex groove and the first convex groove are symmetrically arranged; the first pressing plate is arranged in the first convex groove; the second plate is arranged in the second convex groove.

Optionally, a first limiting column is arranged at the tail of the first convex groove, a second limiting column is arranged at the tail of the second convex groove, and the first limiting column and the second limiting column both protrude towards the inner side of the lower shell; a first avoidance hole and a second avoidance hole are respectively formed in two sides of the edge of the circuit board, and the first avoidance hole is connected with the first limiting column in a matched mode; the second avoidance hole is connected with the second limiting column in a matched mode.

Optionally, one side of the circuit board is provided with a first clamping portion and a second clamping portion respectively, an edge of the second clamping portion extends outward relative to the first clamping portion, and the second clamping portion is connected with the first convex groove in a matching manner;

the circuit board opposite side sets up third joint portion and fourth joint portion respectively, the edge of fourth joint portion is relative third joint portion extends to the outside, fourth joint portion with second tongue accordant connection.

Optionally, the upper housing is of an integrally formed structure.

Compared with the prior art, the beneficial effect of this application is:

the application discloses optical module includes: the circuit board is arranged on the lower shell. The upper shell is matched and connected with the lower shell, and the upper shell is fixedly provided with a first pressing plate and a second pressing plate. This application is in the same place circuit board and lower casing coupling through the first clamp plate and the second clamp plate of last casing. The tail part of the first pressing plate is provided with a first crimping part, the tail part of the second pressing plate is provided with a second crimping part, the first crimping part and the second crimping part are in interference fit crimping with the circuit board, the head part of the first pressing plate is provided with a third crimping part, the head part of the second pressing plate is provided with a fourth crimping part, and the heights of the third crimping part and the fourth crimping part are lower than the heights of the first crimping part and the second crimping part; the first crimping part and the second crimping part are easier to deform under stress than the third crimping part and the fourth crimping part. The first crimping part and the second crimping part can absorb the exceeding size of the circuit board through deformation, the third crimping part and the fourth crimping part can absorb the exceeding size of the circuit board through size difference, and the situation that the whole size of the combined optical module exceeds the specification requirement and the connection of the optical module and an external part is influenced is effectively avoided.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a first schematic view of a lower housing structure provided in an embodiment of the present application;

fig. 6 is a schematic view of a lower housing structure according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

FIG. 8 is a first schematic structural diagram of an upper housing according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a second upper housing according to an embodiment of the present application;

fig. 10 is a schematic cross-sectional view illustrating an assembly of an upper housing, a circuit board, and a lower housing according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the exemplary embodiments described herein without inventive step, are intended to be within the scope of the claims appended hereto. In addition, while the disclosure herein has been presented in terms of one or more exemplary examples, it should be appreciated that aspects of the disclosure may be implemented solely as a complete embodiment.

It should be noted that the brief descriptions of the terms in the present application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of the present application. These terms should be understood in their ordinary and customary meaning unless otherwise indicated.

The terms "first," "second," "third," and the like in the description and claims of this application and in the above-described drawings are used for distinguishing between similar or analogous objects or entities and not necessarily for describing a particular sequential or chronological order, unless otherwise indicated. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a product or device that comprises a list of elements is not necessarily limited to those elements explicitly listed, but may include other elements not expressly listed or inherent to such product or device.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.

Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a main circuit board 105, and a cage 106 is provided on a surface of the main circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 300, a lower housing 400, an unlocking member 201, a circuit board 500, and an optical fiber adapter 202.

The upper case 300 is covered on the lower case 400 to form a packing cavity having two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings can be two ends (203, 204) in the same direction, or two openings in different directions; one opening is an electric port 203, and a gold finger of the circuit board extends out of the electric port 203 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 204 for external optical fiber access; the circuit board 500 is located in a package cavity formed by the upper and lower housings.

The assembly mode of combining the upper shell 300 and the lower shell 400 is adopted, so that the circuit board 500, the optical fiber adapter 202 and other devices can be conveniently installed in the shells, and the upper shell 300 and the lower shell 400 form an outermost packaging protection shell of the optical module; the upper housing 300 and the lower housing 400 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking member 201 is located on the outer wall of the package cavity/lower housing 400, and is used to realize the fixed connection between the optical module and the upper computer or release the fixed connection between the optical module and the upper computer.

The unlocking component 201 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 500 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The optical fiber adapter 202 is used for connecting the circuit board with an external optical fiber, and is used for transmitting an optical signal generated by the circuit board to the external optical fiber and transmitting an optical signal input by the external optical fiber to the circuit board. The circuit board 500 connects the electrical devices in the optical module together according to circuit design through circuit wiring to realize electrical functions such as power supply, electrical signal transmission, grounding and the like.

The circuit board 500 is generally a rigid circuit board, which can also perform a bearing function due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The circuit board 500 referred to in this application is a rigid circuit board, which is also a PCB board. In the embodiment of the present application, the circuit board 500 is disposed in a wrapped cavity formed by covering the upper housing 300 and the lower housing 400.

Fig. 5 is a first structural diagram of a lower housing provided in the embodiment of the present application, fig. 6 is a second structural diagram of a lower housing provided in the embodiment of the present application, and fig. 5 and 6 show a basic structure of a lower housing provided in the embodiment of the present application.

As shown in fig. 5 and 6, the lower housing 400 provided in the embodiment of the present application includes a main plate 410, a first side plate 420 and a second side plate 430, where the first side plate 420 is located on one side of the main plate 410 in the length direction, and the second side plate 430 is located on the other side of the main plate 410 in the length direction. The main plate 410, the first side plate 420 and the second side plate 430 are used to form a wrapping cavity in cooperation with the upper housing 300.

Alternatively, recesses may be formed at the light opening at both sides of the lower case 400, and the width of the lower case 400 at the light opening is slightly narrower than that at other portions.

As shown in fig. 5, the first side plate 420 is provided at the middle thereof with a first groove 423 and a first locking groove 424. The provision of the first groove 423 and the first locking groove 424 facilitates the installation of the unlocking member 201. The head of the first side plate 420 is close to the optical port of the optical module, and the tail is far away from the optical port of the optical module. In order to realize the overall aesthetic property of the appearance of the optical module, the combined optical module is of a cuboid structure, and the tail part of the first side plate 420 is provided with a first convex groove 421, so that one side of the assembled optical module is in a smooth combination.

The second side plate 430 is disposed symmetrically to the first side plate 420. Are not repeated in this sense.

As shown in fig. 6, a second tongue 431 is provided at the tail of the second side plate 430, and the second tongue 431 is symmetrically arranged with respect to the first tongue 421.

Fig. 7 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

In the embodiment of the present application, the circuit board 500 is disposed on the main board 410 and is clamped with the lower housing 400. The circuit board 500 is clamped with the lower housing 400, and the overall appearance structure of the circuit board 500 is matched with the lower housing. As shown in fig. 7, a first clamping portion 530 and a second clamping portion 540 are respectively disposed on one side of the circuit board 500. The edge of the second clamping portion 540 extends outward relative to the first clamping portion 530, and the second clamping portion 540 is connected with the first convex groove 421 in a matching manner. The other side of the circuit board is respectively provided with a third clamping portion 550 and a fourth clamping portion 560, the edge of the fourth clamping portion 560 extends outwards relative to the third clamping portion 550, and the fourth clamping portion 560 is connected with the second convex groove 431 in a matching manner.

In order to prevent the circuit board 500 from moving in the horizontal direction of the lower case, the circuit board 500 is further fastened to the lower case 400.

In some embodiments, as shown in fig. 5, a first position-limiting pillar 422 is disposed at the end of the first groove 421, a second position-limiting pillar 432 is disposed at the end of the second groove 431, and both the first position-limiting pillar 422 and the second position-limiting pillar 432 protrude toward the inner side of the lower housing 400. In some embodiments, the first position-limiting column 422 may also be disposed at other positions of the first tongue 421, such as the head or the middle of the first tongue 421. Meanwhile, the first position-limiting column 422 and the second position-limiting column 432 may be symmetrically disposed or asymmetrically disposed.

In some embodiments, the first restraint post 422 and the second restraint post 432 may be screw posts, enabling a screw connection between the upper housing 300 and the lower housing 400. The first limiting column 422 and the second limiting column 432 are respectively arranged at the tail parts of the first convex groove 421 and the second convex groove 431, and are symmetrically arranged, so that the assembly of the upper shell 300 and the lower shell 400 is facilitated.

As shown in fig. 7, a first avoiding hole 510 and a second avoiding hole 520 are respectively formed at both sides of the edge of the circuit board 500. The first avoiding hole 510 is connected with the first limiting column 422 in a matching way; the second avoiding hole 520 is connected to the second limiting post 432 in a fitting manner.

FIG. 8 is a first schematic structural diagram of an upper housing according to an embodiment of the present application; fig. 9 is a schematic structural diagram of an upper housing according to an embodiment of the present application. Fig. 8 and 9 show a basic structure of an upper housing provided in an embodiment of the present application.

As shown in fig. 8 and 9, the upper case 300 provided by the embodiment of the present application includes a cover plate 310, and a third side plate 320 and a fourth side plate 330 located at both sides of the cover plate. The third side plate 320 is located at one side of the cover plate 310 in the length direction, and the fourth side plate is located at the other side of the cover plate 310 in the length direction. The upper case 300 is coupled to the lower case 400 in a covering manner.

In order to further fix the circuit board 500 in the wrapped cavity formed by the upper housing 300 and the lower housing 400, the circuit board 500 is prevented from moving in a direction perpendicular to the main board 410. A first platen 340 and a second platen 350 are disposed between the third side plate 320 and the fourth side plate 330. The first pressing plate 340 and the second pressing plate 350 are fixedly connected with the cover plate 310. The first pressing plate 340 and the second pressing plate 350 are respectively press-fit connected with the circuit board 500.

In some embodiments, the first pressing plate 340 and the second pressing plate 350 may be integrally deformed by bending, such as elastic pieces, springs, and the like. In order to realize the press-fit connection between the first pressing plate 340 and the second pressing plate 350 and the circuit board 500, the first pressing plate 340 and the second pressing plate 350 are in interference fit connection with the circuit board 500. After assembly, the first pressing plate 340 and the second pressing plate 350 have a mutual acting force with the circuit board 500 in a direction perpendicular to the cover plate 310, so that the press-fit connection is realized.

In some embodiments, in order to achieve the stress uniformity of the circuit board 500 and prevent the circuit board 500 from being inclined due to unbalanced stress and affecting the photoelectric performance, the first pressing plate 340 and the second pressing plate 350 are symmetrically disposed and parallel to the length direction of the cover plate 310. In some embodiments, as shown in fig. 8, in the upper housing 300 provided in the embodiments of the present application, the first press plate 340 is provided with a first press-contact portion 341 at a tail portion thereof, the second press plate 350 is provided with a second press-contact portion 351 at a tail portion thereof, and the first press-contact portion 341 and the second press-contact portion 351 are subjected to bending deformation. The head and the tail of the first pressing plate 340 are arranged in the same direction as the head and the tail of the lower shell.

The head of the first pressing plate 340 is provided with a third pressing part 342, the head of the second pressing plate 350 is provided with a fourth pressing part 352, and the first pressing part 341 and the second pressing part 351 are easier to deform under force than the third pressing part 342 and the fourth pressing part 352. The heights of the third and fourth press- contact portions 342 and 352 are slightly lower than the heights of the first and second press- contact portions 341 and 351. That is, the vertical distance between the bottom ends of the third and fourth press- bonding parts 342, 352 and the cover plate 310 is smaller than the vertical distance between the bottom ends of the first and second press- bonding parts 341, 351 and the cover plate 310, so that the third and fourth press- bonding parts 342, 352 can also absorb the thickness tolerance occurring in the manufacturing process of the circuit board 500, and the problem of the thickness tolerance of the whole machine after assembly caused by the problem of the circuit board tolerance is solved.

The interference between the first press-connecting part 341 and the circuit board 500 is greater than or equal to 0.1 mm. The second press contact portion 351 has the same structure as the first press contact portion 341. The design of interference magnitude is favorable to absorbing that the preparation of circuit board 500 can have the thickness tolerance of 0.1mm, solves the whole machine thickness overproof condition that causes because of circuit board 500 tolerance problem after the assembly.

In some embodiments, the first press-contact portion 341 is provided with a first deformation notch 343 for accommodating a deformation amount of the first press-contact portion 341. The second press-fitting part 351 is provided with a second deformation gap 353 for accommodating the deformation of the second press-fitting part 351. When the first press-connecting part 341 is pressed, it deforms toward the first deformation notch 343.

The dimension of the first deformation notch 343 in the length direction of the cover plate 310 is larger than the dimension thereof in the direction perpendicular to the cover plate 310, so that when the first crimp portion 341 is assembled and subjected to a pressing force, deformation occurs in the direction perpendicular to the cover plate 310. To maintain structural stability, the second crimp part 351 is provided as same as the first crimp part 341.

Further, in some embodiments, the first crimp portion 341 includes a first support arm 3411, a first cantilever arm 3412, and a first crimp arm 3413. The first support arm 3411 has one end perpendicularly connected to the cover plate 310 and the other end connected to one end of the first suspension arm 3412. The first suspension arm 3412 is disposed parallel to the cover plate 310, and the other end of the first suspension arm 3412 is disposed perpendicular to the first crimping arm 3413.

The second crimp portion 351 includes a second support arm 3511, a second suspension arm 3512, and a second crimp arm 3513. One end of the second supporting arm 3511 is vertically connected to the cover plate 310, and the other end is connected to one end of the second suspension arm 3512. The second suspension arm 3512 is disposed parallel to the cover plate 310, and the other end of the second suspension arm 3512 is disposed perpendicular to the second crimping arm 3513.

The first crimping arm 3413 and the second crimping arm 3513 are respectively crimped with the circuit board 500, and after being stressed, the first suspension arm 3412 and the second suspension arm 3512 deform to drive the first crimping arm 3413 and the second crimping arm 3513 to move, so that the upper shell and the lower shell cannot be tightly covered after assembly is avoided.

Further, the structural member of the optical module generally adopts a zinc alloy die casting, and the upper housing 300 may be an integrally formed structure. To facilitate die casting, the lengths of the first support arm 3411 and the second support arm 3511 are greater than or equal to 0.8 mm. In the present embodiment, the lengths of the parts of the first crimp part 341 and the second crimp part 351 are defined as the dimension perpendicular to the direction of the cover plate 310, and the widths are defined as the dimension parallel to the length direction of the cover plate 310.

In order to achieve structural stability, the joints between the first support arms 3411 and the cover plate 310 and between the first support arms 3411 and the first suspension arms 3412 are arranged in a rounded corner structure, so that the contact area is increased. The same processing method can be adopted for the corresponding part of the second press-connecting part 351.

The width of the first suspension arm 3412 minus the width of the first support arm 3411 should be greater than or equal to 1mm, so as to ensure that the first suspension arm 3412 is not easily broken.

The crimping of the first and second crimping portions 341 and 351 to the circuit board 500 ensures the assembly of the circuit board 500 in the optical module.

There may be some clearance between the third and fourth press- contact portions 342, 352 and the circuit board 500.

Fig. 10 is a schematic view of a light module vamp according to an embodiment of the present application, in which an assembly section of an upper shell, a circuit board, and a lower shell is clearly shown. As shown in fig. 10, the circuit board 500 is disposed on the main board 410 after assembly. The upper housing 300 is press-fitted and positioned forward and backward of the circuit board 500 by four points. Taking one side as an example, the first pressing part 341 is disposed at the tail of the first pressing plate 340, and the first pressing part 341 is deformable by a force. The head of the first press plate 340 is provided with a third press-fitting portion 342. The first pressing plate 340 is connected to the circuit board 500 in an interference manner, and the third press-connection portion is in clearance fit with the circuit board 500.

The two pressure points at the tail part of the first pressure plate 340 close to the golden finger are designed in a cantilever type, the cantilever pressure points and the circuit board have certain magnitude of interference under the design typical value, the circuit board can be fully pressed, meanwhile, the cantilever is characterized by being capable of bending and deforming under certain stress, and the tolerance of the thickness +/-0.1 mm in the circuit board processing process can be fully absorbed by utilizing the characteristic. The condition that the assembly thickness of the whole machine exceeds the protocol caused by the tolerance problem of the circuit board is solved. The top cover pressure points at the middle position of the circuit board adopt a suspended 0.1mm mode, the size of the optical module cannot be influenced even if the circuit board is positioned at the tolerance upper limit, and meanwhile, the assembly position of the circuit board is completely ensured by two pressure points at the golden finger positions.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (9)

1. A light module, comprising: a lower shell, a circuit board and an upper shell,

the circuit board is arranged on the lower shell; the upper shell is matched and connected with the lower shell, and a first pressing plate and a second pressing plate are fixedly arranged on the upper shell;

the tail part of the first pressing plate is provided with a first crimping part, the tail part of the second pressing plate is provided with a second crimping part, and the first crimping part and the second crimping part are in interference fit crimping with the circuit board;

the head of the first pressing plate is provided with a third pressing part, the head of the second pressing plate is provided with a fourth pressing part, and the heights of the third pressing part and the fourth pressing part are lower than those of the first pressing part and the second pressing part; the first crimping part and the second crimping part are easier to deform under stress than the third crimping part and the fourth crimping part.

2. The optical module according to claim 1, wherein the first press-connection part is provided with a first deformation gap for accommodating a deformation amount of the first press-connection part; and the second crimping part is provided with a second deformation notch for accommodating the deformation of the second crimping part.

3. The optical module according to claim 1, wherein the first and second crimping portions are arranged symmetrically to each other.

4. The optical module according to claim 1, wherein interference between the first and second crimping parts and the circuit board is greater than or equal to 0.1 mm.

5. The optical module according to claim 2, wherein the upper housing includes a cover plate and third and fourth side plates located at both sides of the cover plate;

the first crimping portion comprises a first support arm, a first suspension arm and a first crimping arm; one end of the first supporting arm is vertically connected with the cover plate, and the other end of the first supporting arm is connected with one end of the first suspension arm; the first suspension arm is arranged in parallel with the cover plate, and the other end of the first suspension arm is perpendicular to the first compression joint arm;

the second crimping portion comprises a second support arm, a second suspension arm and a second crimping arm; one end of the second supporting arm is vertically connected with the cover plate, and the other end of the second supporting arm is connected with one end of the second suspension arm; the second suspension arm and the cover plate are arranged in parallel, and the other end of the second suspension arm is perpendicular to the second compression joint arm.

6. The optical module of claim 2, wherein the lower housing includes a main board and first and second side boards located on both sides of the main board; the first side plate is provided with a first convex groove, the second side plate is provided with a second convex groove, and the second convex groove and the first convex groove are symmetrically arranged; the first pressing plate is arranged in the first convex groove; the second pressing plate is arranged in the second convex groove.

7. The optical module according to claim 6, wherein a first limiting post is disposed at a tail of the first tongue, a second limiting post is disposed at a tail of the second tongue, and both the first limiting post and the second limiting post protrude toward an inner side of the lower housing; a first avoidance hole and a second avoidance hole are respectively formed in two sides of the edge of the circuit board, and the first avoidance hole is connected with the first limiting column in a matched mode; the second avoidance hole is connected with the second limiting column in a matched mode.

8. The optical module according to claim 7, wherein a first clamping portion and a second clamping portion are respectively disposed on one side of the circuit board, an edge of the second clamping portion extends outward relative to the first clamping portion, and the second clamping portion is in matching connection with the first convex groove;

the circuit board opposite side sets up third joint portion and fourth joint portion respectively, the edge of fourth joint portion is relative third joint portion extends to the outside, fourth joint portion with second tongue accordant connection.

9. The optical module of claim 1, wherein the upper housing is of an integrally formed construction.

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