CN213302291U

CN213302291U - Semiconductor chip fine-tuning test device

Info

Publication number: CN213302291U
Application number: CN202022108503.4U
Authority: CN
Inventors: 刘思瑜
Original assignee: Shenzhen Haixin Weixun Semiconductor Co Ltd
Current assignee: Shenzhen Haixin Weixun Semiconductor Co Ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-05-28
Anticipated expiration: 2030-09-23

Abstract

The utility model discloses a semiconductor chip fine adjustment testing device, which comprises a bottom plate, a side plate, a control box and a detection component, wherein the side plate is fixedly arranged on one side of the bottom plate, the detection component is arranged on one side of the bottom plate away from the side plate, the control box is fixedly arranged on the upper surface of the bottom plate, and the adjustment component with a bidirectional fine adjustment structure is arranged between the bottom plate and the side plate, the utility model improves the driving mode and the transmission structure on the premise of ensuring that the testing bracket can still realize the function of up-down and left-right adjustment, utilizes the characteristics of electrical control high precision to combine a rotating and sliding structure in the transmission structure, controls the up-down movement of the detection component through a vertical fine adjustment component, controls the back-and-forth movement of the detection component through a horizontal fine adjustment component, can independently complete the fine adjustment in two directions, replaces the manual, the adjustment range of fine adjustment control within +/-1 mm is met.

Description

Semiconductor chip fine-tuning test device

Technical Field

The utility model relates to a semiconductor chip tests the field, specifically is a semiconductor chip fine setting testing arrangement.

Background

In the present semiconductor chip test, the test machine need press the chip into the recess of the socket on the PCB test panel, make the contact on the chip link to each other with the stitch of socket, stitch on the socket links to each other with the contact of PCB circuit board, forms the route this moment, then inputs the condition that certain voltage looked over the output on the PCB test panel, different voltage can produce different routes and then have different outputs, the parameter coincidence that output and needs is the yields promptly.

The tester holds the chip by the suction nozzle and puts the chip into the socket, and the tester can only place the chip at a specific position, so that the position of the socket needs to be changed to ensure that the chip can be smoothly placed into the socket. The socket 2 is fixedly connected with the PCB test board and is relatively static, and the PCB test board is fixedly connected with the test support and is relatively static, so that the chip can be accurately pressed into the socket only by adjusting the support and changing the position of the top of the support.

The existing test support can realize the functions of up-down and left-right adjustment, but the existing adjustment mode is usually carried out manually, the position of the top of the support is adjusted by screwing a screw, but the adjustment range needs to be controlled within the precision of +/-1 mm in the actual test, the distance during fine adjustment is smaller, taking an M3 screw as an example, the screw pitch is 0 and 5mm, the fine adjustment can be carried out only by rotating a circle, so that the fine adjustment is lack of effective reference, the adjustment precision is difficult to ensure only by the control of a hand of a person, and the improvement is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a change the regulation mode that traditional rotation screw formula was rotated through two-way fine setting structure for the fine setting can realize guaranteeing the high accuracy of regulation through electrical control, with the problem of proposing in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip fine tuning test device comprises a bottom plate, a side plate, a control box and a detection assembly, wherein the side plate is fixedly installed on one side of the bottom plate, the detection assembly is arranged on one side of the bottom plate, which is far away from the side plate, the control box is fixedly installed on the upper surface of the bottom plate, and an adjusting assembly with a bidirectional fine tuning structure is arranged between the bottom plate and the side plate;

the adjusting component comprises a vertical fine adjustment component, a horizontal fine adjustment component, a first ball head, a connecting rod, a second ball head, a third ball head, a limiting plate and a balance component, wherein the vertical fine adjustment component and the horizontal fine adjustment component are respectively arranged between the bottom plate and the side plate, the connecting rod is inserted into the vertical fine adjustment component and the horizontal fine adjustment component, the first ball head is fixedly installed at one side of the connecting rod close to the input end of the vertical fine adjustment component and the horizontal fine adjustment component, the second ball head is fixedly installed at the center of the connecting rod, the limiting plate is fixedly installed at the center of the upper surface of the bottom plate, the second ball head is rotatably connected to the center of the limiting plate, the third ball head is fixedly installed at one end of the connecting rod far away from the first ball head, the balance component is fixedly installed at one side of the upper surface of the bottom plate close to the third ball, the horizontal fine adjustment assembly controls the detection assembly to move back and forth, fine adjustment in two directions can be completed independently, and the electric structure is adopted for driving, so that sufficient adjustment precision can be ensured.

Preferably, the vertical fine adjustment assembly comprises a first electric push rod, a first chuck, a first slide rail, a first slide block and a first through groove, the inner side of the side plate is rotatably connected with the first electric push rod, the output end of the first electric push rod is fixedly provided with the first chuck, the first electric push rod is electrically connected with the control box, one side of the bottom plate close to the limiting plate is fixedly provided with the first slide rail, the first slide rail is connected with the first slide block in a sliding manner, one side of the first slide rail far away from the first slide block is provided with the first through groove, the connecting rod penetrates through the first through groove to keep the second electric push rod immovable, the connecting rod is pushed to swing by the expansion and contraction of the first electric push rod, the swing of the connecting rod drives the second ball head to rotate in the vertical direction, at the moment, the third ball head is extruded to keep still, so that the first slide block and the connecting part of the first slide block can be driven to slide, namely finishing fine adjustment of the detection assembly in the vertical direction.

Preferably, the horizontal fine adjustment assembly comprises a second electric push rod, a second chuck, a second slide rail, a second slider, a second through groove and a connecting column, the inner side of the side plate is rotatably connected with the second electric push rod, the output end of the second electric push rod is fixedly provided with the second chuck, the second electric push rod is electrically connected with the control box, the second chuck is rotatably connected with the first chuck through a first ball head, one side of the first slider, which is far away from the first slide rail, is fixedly connected with the second slide rail, the second slide rail is slidably connected with the second slider, one side of the second slide rail, which is far away from the second slider, is provided with the second through groove, the connecting rod penetrates through the second through groove, four corners of one side of the second slider, which is far away from the second slide rail, are fixedly provided with the connecting column, and one end of the connecting column, which is far away from the second slider, is, the center of the second sliding block is rotatably connected with the third ball head, the first electric push rod is kept still, the second electric push rod stretches and retracts to push the connecting rod to swing, the third ball head can be driven to rotate in the horizontal direction by the swing of the connecting rod, the second ball head is extruded to be kept static at the moment, the second sliding block and the connecting part of the second sliding block can be driven to slide in the horizontal direction relative to the second sliding rail, and fine adjustment of the detection assembly in the horizontal direction is completed.

Preferably, the balancing assembly comprises a third slide rail, a third slide block, a base, a connecting plate, a sliding column and a spring, the third slide rail is fixedly installed on one side of the upper surface of the bottom plate far away from the side plate, the third slide rail is connected with the third slide block in a sliding manner, the base is symmetrically and fixedly installed on the upper surface of the third slide block, the sliding column is fixedly installed on the upper surface of the base, the connecting plate is fixedly installed on one side of the installation part of the detection assembly far away from the connecting column, the sliding column and the connecting plate are inserted in a sliding manner, the spring is fixedly installed between the lower surface of the connecting plate and the base, as shown in fig. 2, the main action part of the detection assembly is located on the upper half part of the detection assembly, so that the lower half part of the detection assembly needs to be balanced when the position of the detection assembly is finely adjusted, the sliding of the third slide block on the third slide rail can balance fine adjustment, the spring can ensure the retractility in the vertical direction in the balancing component, and the balancing performance of the balancing component is perfected.

Preferably, fastening bolts are symmetrically matched between the first chuck and the second chuck, so that the first chuck and the second chuck can be connected and fastened, and the first ball head is prevented from rotating to loose the connection.

Preferably, the detection assembly comprises a mounting rack, a PCB test board, voltage connectors, sockets, pins and pad heads, the mounting rack is fixedly mounted at one end of the connecting column, which is far away from the second slider, the PCB test board is fixedly mounted on the upper surface of the mounting rack, the sockets are symmetrically and fixedly mounted on two sides of the upper surface of the PCB test board, the pins are fixedly mounted in the sockets, the pad heads are fixedly mounted between the sockets on the PCB test board at equal intervals, the voltage connectors are symmetrically and fixedly mounted on one side of the PCB test board, the voltage connectors are communicated with the pins, when the test is carried out after the test is carried out at the right position, the chip needs to be pressed into the grooves of the sockets on the PCB test board by the test machine, so that the contacts on the chip are connected with the pins of the sockets, the pins on the socket are connected with the contacts of, different voltage can produce different routes and then have different outputs, and the output accords with required parameter promptly as the yields.

Preferably, both sides of the pad head on the upper surface of the PCB test board are provided with rectangular structure grooves with round corners, so that the structural strength of the PCB test board is improved, and the PCB test board can stably receive the chip pressed in by a test machine.

Preferably, a cross fastening strip is fixedly installed in the inner wall of the voltage connector, so that the fastening degree of the voltage input line and the voltage connector is improved.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses guaranteeing that the test support still can realize about and under the function prerequisite of controlling the regulation, improved its drive mode and transmission structure, utilize the characteristics of electrical control high accuracy, combine to rotate and sliding construction in the transmission structure, through reciprocating of vertical fine setting subassembly control detection subassembly, through the back-and-forth movement of horizontal fine setting subassembly control detection subassembly, the fine setting of two directions all can independently be accomplished, replace the staff drive with electric putter, the adjustment precision is greatly improved, satisfy fine setting control at 1 mm's control range.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the adjusting assembly of the present invention;

FIG. 3 is a schematic structural view of the detecting assembly of the present invention;

fig. 4 is an enlarged view of a structure shown in fig. 3.

In the figure: 1. a base plate; 2. a side plate; 3. a control box; 4. an adjustment assembly; 41. a vertical fine tuning assembly; 411. a first electric push rod; 412. a first chuck; 413. a first slide rail; 414. a first slider; 415. a first through groove; 42. a horizontal fine adjustment component; 421. a second electric push rod; 422. a second chuck; 423. a second slide rail; 424. a second slider; 425. a second through groove; 426. connecting columns; 43. a first ball head; 44. a connecting rod; 45. a second ball head; 46. a third ball head; 47. a limiting plate; 48. a balancing component; 481. a third slide rail; 482. a third slider; 483. a base; 484. a connecting plate; 485. a traveler; 486. a spring; 5. a detection component; 51. a mounting frame; 52. a PCB test board; 53. a voltage connection; 54. a socket; 55. a stitch; 56. and (6) padding the head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a semiconductor chip fine tuning test device in the figure includes a bottom plate 1, a side plate 2, a control box 3 and a detection assembly 5, the side plate 2 is fixedly installed on one side of the bottom plate 1, the detection assembly 5 is installed on one side of the bottom plate 1 away from the side plate 2, the control box 3 is fixedly installed on the upper surface of the bottom plate 1, and an adjusting assembly 4 with a bidirectional fine tuning structure is installed between the bottom plate 1 and the side plate 2.

Referring to fig. 2, the adjusting assembly 4 includes a vertical fine-tuning assembly 41, a horizontal fine-tuning assembly 42, a first ball 43, a connecting rod 44, a second ball 45, a third ball 46, a limiting plate 47 and a balancing assembly 48, the vertical fine-tuning assembly 41 and the horizontal fine-tuning assembly 42 are respectively disposed between the bottom plate 1 and the side plate 2, the connecting rod 44 is inserted in the vertical fine-tuning assembly 41 and the horizontal fine-tuning assembly 42, the first ball 43 is fixedly mounted at one side of the connecting rod 44 close to the input ends of the vertical fine-tuning assembly 41 and the horizontal fine-tuning assembly 42, the second ball 45 is fixedly mounted at the center of the connecting rod 44, the limiting plate 47 is fixedly mounted at the center of the upper surface of the bottom plate 1, the second ball 45 is rotatably connected to the center of the limiting plate 47, the third ball 46 is fixedly mounted at one end of the connecting rod 44 far from the first ball 43, and the balancing assembly 48 is fixedly, by combining the rotation structure and the sliding structure, the vertical fine adjustment assembly 41 can control the detection assembly 5 to move up and down, the horizontal fine adjustment assembly 42 can control the detection assembly 5 to move back and forth, fine adjustment in two directions can be independently completed, and the electric structure is adopted for driving, so that sufficient adjustment precision can be ensured.

Referring to fig. 2, the vertical fine-tuning assembly 41 includes a first electric push rod 411, a first chuck 412, a first sliding rail 413, a first slider 414 and a first through slot 415, the inner side of the side plate 2 is rotatably connected with the first electric push rod 411, the first chuck 412 is fixedly mounted on the output end of the first electric push rod 411, the first electric push rod 411 is electrically connected with the control box 3, the first sliding rail 413 is fixedly mounted on one side of the bottom plate 1 close to the limiting plate 47, the first slider 414 is slidably connected in the first sliding rail 413, the first through slot 415 is formed on one side of the first sliding rail 413 away from the first slider 414, the connecting rod 44 penetrates through the first through slot 415, the second electric push rod 421 is kept stationary, the connecting rod 44 is pushed to swing by the extension and contraction of the first electric push rod 411, the swing of the connecting rod 44 drives the second ball 45 to rotate in the vertical direction, the third ball head 46 is pressed to remain stationary, which drives the first sliding block 414 and its connected portion to slide in the vertical direction relative to the first sliding rail 413, thereby completing the fine adjustment of the detecting assembly 5 in the vertical direction.

Referring to fig. 2, the horizontal fine adjustment assembly 42 includes a second electric push rod 421, a second collet 422, a second slide rail 423, a second slider 424, a second through groove 425 and a connecting post 426, the inner side of the side plate 2 is rotatably connected with the second electric push rod 421, the output end of the second electric push rod 421 is fixedly provided with the second collet 422, the second electric push rod 421 is electrically connected with the control box 3, the second collet 422 is rotatably connected with the first collet 412 through a first ball 43, one side of the first slider 414 away from the first slide rail 413 is fixedly connected with the second slide rail 423, the second slide rail 423 is slidably connected with the second slider 424, one side of the second slide rail 423 away from the second slider 424 is provided with the second through groove 425, the connecting rod 44 penetrates through the second through groove 425, four corners of the second slider 424 away from the second slide rail 423 are fixedly provided with the connecting post 426, and the one end that the spliced pole 426 kept away from second slider 424 and the installation site fixed connection of determine module 5, second slider 424 center department rotates with third bulb 46 to be connected, keeps first electric putter 411 motionless, utilizes the flexible connecting rod 44 that can promote of second electric putter 421 to take place the swing, and the swing of connecting rod 44 can order about third bulb 46 to take place to rotate on the horizontal direction, and second bulb 45 receives the extrusion and keeps static this moment, will order about second slider 424 and relative second slide rail 423 of the position that links to each other and slide on the horizontal direction like this, accomplish the fine setting to determine module 5 horizontal direction promptly.

Referring to fig. 2, the balancing assembly 48 includes a third sliding rail 481, a third sliding block 482, a base 483, a connecting plate 484, a sliding column 485 and a spring 486, the third sliding rail 481 is fixedly installed on one side of the upper surface of the bottom plate 1 away from the side plate 2, the third sliding block 482 is slidably connected in the third sliding rail 481, the base 483 is symmetrically and fixedly installed on the upper surface of the third sliding block 482, the sliding column 485 is fixedly installed on the upper surface of the base 483, the connecting plate 484 is fixedly installed on one side of the installation position of the detecting assembly 5 away from the connecting post 426, the sliding column 485 and the connecting plate 484 are slidably inserted, the spring 486 is fixedly installed between the lower surface of the connecting plate 484 and the base 483, as shown in fig. 2, the main action position of the detecting assembly 5 is located on the upper half portion thereof, so that the lower half portion of the detecting assembly 5 needs to be balanced when fine-adjusting, the sliding of the third slider 482 on the third sliding rail 481 can balance the fine adjustment in the horizontal direction, the sliding of the sliding column 485 relative to the connecting plate 484 can balance the fine adjustment in the vertical direction, and the spring 486 can ensure the retractility in the vertical direction in the balancing assembly 48, thereby perfecting the balancing performance of the balancing assembly 48.

Referring to fig. 2, fastening bolts are symmetrically engaged between the first chuck 412 and the second chuck 422, so as to ensure the connection between the first chuck 412 and the second chuck 422, and prevent the first ball head 43 from rotating and loosening the connection.

Referring to fig. 3, the detecting assembly 5 includes a mounting frame 51, a PCB testing board 52, voltage connectors 53, sockets 54, pins 55 and pads 56, the mounting frame 51 is fixedly mounted at one end of the connecting post 426 away from the second slider 424, the PCB testing board 52 is fixedly mounted on the upper surface of the mounting frame 51, the sockets 54 are symmetrically and fixedly mounted on two sides of the upper surface of the PCB testing board 52, the pins 55 are fixedly mounted in the sockets 54, the pads 56 are fixedly mounted on the sockets 54 on the PCB testing board 52 at equal intervals, the voltage connectors 53 are symmetrically and fixedly mounted on one side of the PCB testing board 52, the voltage connectors 53 are communicated with the pins 55, when testing is performed after aligning the positions, the testing machine needs to press the chip into the groove of the socket 54 on the PCB testing board 52, so that the contacts on the chip are connected with the pins 55 of the socket 54, the pins 55 on the socket 54 are connected with, at this moment, a path is formed, then a certain voltage is input on the PCB test board 52 to check the output condition, different paths can be generated by different voltages, and then different outputs are provided, and the output is qualified as a good product according with the required parameters.

Referring to fig. 3, rounded rectangular structural grooves are formed on both sides of the pad head 56 on the upper surface of the PCB test board 52, so as to improve the structural strength of the PCB test board 52 and ensure that the PCB test board can stably receive the chips pressed in by the tester.

Referring to fig. 4, a cross fastening strip is fixedly installed in the inner wall of the voltage connector 53 to improve the fastening degree of the voltage input line and the voltage connector 53.

In the scheme, the use principle of the semiconductor chip fine tuning test device is as follows; firstly, the detection assembly 5 is finely adjusted by combining a rotating structure and a sliding structure, in the vertical fine adjustment, the second electric push rod 421 is kept still, the connecting rod 44 is pushed to swing by the expansion and contraction of the first electric push rod 411, the second ball head 45 is driven to rotate in the vertical direction by the swing of the connecting rod 44, at the moment, the third ball head 46 is extruded to keep still, the first slider 414 and the connecting part thereof are driven to slide in the vertical direction relative to the first slide rail 413, namely, the fine adjustment of the detection assembly 5 in the vertical direction is completed, in the horizontal fine adjustment, the first electric push rod 411 is kept still, the connecting rod 44 is pushed to swing by the expansion and contraction of the second electric push rod 421, the connecting rod 44 swings the third ball head 46 is driven to rotate in the horizontal direction, at the moment, the second ball head 45 is extruded to keep still, the second slider 424 and the connecting part thereof are driven to slide in the horizontal direction relative to the second slide rail 423, namely, the fine adjustment of the detecting component 5 in the horizontal direction is completed, the fine adjustment in both directions can be independently completed, the feeding amount of the first electric push rod 411 and the second electric push rod 421 is controlled by the control box 3, the control box 3 is similar to the existing frequency conversion control cabinet, in addition, as shown in fig. 2, the main action part of the detecting component 5 is positioned at the upper half part thereof, therefore, the balance of the lower half part of the detecting component 5 is needed when the fine adjustment of the position is performed, the sliding of the third slider 482 on the third sliding rail 481 can balance the fine adjustment in the horizontal direction, the sliding of the sliding column 485 relative to the connecting plate 484 can balance the fine adjustment in the vertical direction, the spring 486 can ensure the retractility in the vertical direction in the balancing component 48, the balance performance of the balancing component 48 is perfected, the test is performed after the fine adjustment is completed, the test machine needs to press the chip into the groove of, make contact on the chip and the stitch 55 of socket 54 link to each other, stitch 55 on the socket 54 links to each other with the contact of PCB circuit board, forms the route this moment, then inputs the certain voltage on PCB test panel 52 and looks over the condition of output, and different voltage can produce different routes and then have different outputs, and the output accords with the parameter that needs promptly as the yields.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip fine tuning test device is characterized in that: the device comprises a bottom plate (1), a side plate (2), a control box (3) and a detection assembly (5), wherein the side plate (2) is fixedly installed on one side of the bottom plate (1), the detection assembly (5) is arranged on one side, far away from the side plate (2), of the bottom plate (1), the control box (3) is fixedly installed on the upper surface of the bottom plate (1), and an adjusting assembly (4) with a bidirectional fine adjustment structure is arranged between the bottom plate (1) and the side plate (2);

the adjusting component (4) comprises a vertical fine-tuning component (41), a horizontal fine-tuning component (42), a first ball head (43), a connecting rod (44), a second ball head (45), a third ball head (46), a limiting plate (47) and a balancing component (48), wherein the vertical fine-tuning component (41) and the horizontal fine-tuning component (42) are respectively arranged between the bottom plate (1) and the side plate (2), the connecting rod (44) is inserted in the vertical fine-tuning component (41) and the horizontal fine-tuning component (42), the first ball head (43) is fixedly installed on one side, close to the input end of the vertical fine-tuning component (41) and the input end of the horizontal fine-tuning component (42), of the connecting rod (44), the second ball head (45) is fixedly installed at the center of the connecting rod (44), the limiting plate (47) is fixedly installed at the center of the upper surface of the bottom plate (1), and the second ball head, one end, far away from first bulb (43), of connecting rod (44) is fixedly mounted with third bulb (46), and bottom plate (1) upper surface is close to third bulb (46) one side fixed mounting has balanced subassembly (48).

2. The semiconductor chip trimming test device according to claim 1, wherein: vertical fine setting subassembly (41) includes first electric putter (411), first chuck (412), first slide rail (413), first slider (414) and first logical groove (415), the inboard rotation of curb plate (2) is connected with first electric putter (411), and fixed mounting has first chuck (412) on the output of first electric putter (411), first electric putter (411) and control box (3) electric connection, one side fixed mounting that bottom plate (1) is close to limiting plate (47) has first slide rail (413), and sliding connection has first slider (414) in first slide rail (413), first logical groove (415) have been seted up to one side that first slider (414) were kept away from in first slide rail (413), and connecting rod (44) alternate through first logical groove (415).

3. The semiconductor chip trimming test device according to claim 2, wherein: the horizontal fine adjustment assembly (42) comprises a second electric push rod (421), a second chuck (422), a second sliding rail (423), a second sliding block (424), a second through groove (425) and a connecting column (426), the inner side of the side plate (2) is rotatably connected with the second electric push rod (421), the output end of the second electric push rod (421) is fixedly provided with the second chuck (422), the second electric push rod (421) is electrically connected with the control box (3), the second chuck (422) is rotatably connected with the first chuck (412) through a first ball head (43), one side of the first sliding block (414) far away from the first sliding rail (413) is fixedly connected with the second sliding rail (423), the second sliding block (424) is slidably connected in the second sliding rail (423), one side of the second sliding rail (423) far away from the second sliding block (424) is provided with the second through groove (425), and connecting rod (44) alternate through second logical groove (425), equal fixed mounting in the four corners department of second slider (424) one side of keeping away from second slide rail (423) has spliced pole (426), and spliced pole (426) keep away from the one end of second slider (424) and the installation position fixed connection of determine module (5), second slider (424) center department rotates with third bulb (46) and is connected.

4. The semiconductor chip trimming test device according to claim 1, wherein: balance assembly (48) include third slide rail (481), third slider (482), base (483), connecting plate (484), traveller (485) and spring (486), one side fixed mounting that curb plate (2) were kept away from to bottom plate (1) upper surface has third slide rail (481), and sliding connection has third slider (482) in third slide rail (481), fixed mounting has base (483) on third slider (482) surface symmetry, fixed mounting has traveller (485) on the upper surface of base (483), one side fixed mounting that the spliced pole (426) was kept away from to the installation position of detection assembly (5) has connecting plate (484), traveller (485) and connecting plate (484) slip interlude, fixed mounting has spring (486) between the lower surface of connecting plate (484) and base (483).

5. The semiconductor chip trimming test device according to claim 3, wherein: fastening bolts are symmetrically matched between the first clamping head (412) and the second clamping head (422).

6. The semiconductor chip trimming test device according to claim 3, wherein: detection subassembly (5) survey test panel (52), voltage joint (53), socket (54), stitch (55) and fill up head (56) including mounting bracket (51), PCB, the one end fixed mounting that second slider (424) was kept away from in spliced pole (426) has mounting bracket (51), the last fixed surface of mounting bracket (51) installs that PCB surveys test panel (52), and PCB surveys the bilateral symmetry ground fixed mounting of test panel (52) upper surface and has socket (54), fixed mounting has stitch (55) in socket (54), PCB surveys test panel (52) and goes up equidistance fixed mounting between socket (54) and has fill up head (56), and PCB surveys test panel (52) one side symmetry ground fixed mounting and have voltage joint (53), voltage joint (53) are linked together with stitch (55).

7. The semiconductor chip trimming test device according to claim 6, wherein: the PCB test board (52) is characterized in that two sides of the pad head (56) on the upper surface of the PCB test board are provided with round-angle rectangular structural grooves.

8. The semiconductor chip trimming test device according to claim 7, wherein: and a cross fastening strip is fixedly arranged in the inner wall of the voltage connector (53).