CN213280453U - Heat dissipation device for sensor node network - Google Patents
Heat dissipation device for sensor node network Download PDFInfo
- Publication number
- CN213280453U CN213280453U CN202021881470.0U CN202021881470U CN213280453U CN 213280453 U CN213280453 U CN 213280453U CN 202021881470 U CN202021881470 U CN 202021881470U CN 213280453 U CN213280453 U CN 213280453U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- upper cover
- electromagnet
- sliding rail
- sensor node
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 62
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000004519 grease Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical group [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat abstractor for sensor node network relates to sensor heat dissipation technical field, has solved the poor problem of sensor node equipment heat dissipation among the prior art, and its technical essential is: the electromagnetic heating device comprises a shell, wherein an upper cover is fixedly connected to an opening of the shell, a slide rail groove is formed in the upper cover, a slide rail is arranged in the slide rail groove and is connected with the upper cover in a sliding mode, a pressure spring is arranged at one end of the slide rail, an electromagnet is arranged at one end, away from the pressure spring, of the upper cover, a permanent magnet is arranged at one end, close to the electromagnet, of the slide rail, a plurality of groups of heat dissipation plates are hinged to the upper cover, a connecting rod is hinged to one surface, close to the; the electronic components mounted in the shell are connected to the upper cover through the silicone pad; the utility model discloses a wobbling heating panel improves the radiating efficiency on upper cover surface, simultaneously, connects electronic component and upper cover through the silicone grease pad, has increased electronic component's radiating effect.
Description
Technical Field
The utility model relates to a sensor heat dissipation technical field especially relates to a heat abstractor for sensor node network.
Background
The sensor network is a distributed intelligent network system which is formed by a plurality of tiny sensor nodes which are deployed in an action area and have wireless communication and computing capabilities in a self-organizing way and can autonomously complete specified tasks according to the environment.
The sensor node is a basic functional unit of a wireless sensor network, and the basic constituent modules of the sensor node are as follows: a sensing unit, a processing unit, a communication unit and a power supply part; the sensor node is a micro embedded device, and is required to be low in price and low in power consumption, and the limitations inevitably result in weak processor capacity and small memory capacity of the sensor node.
In order to complete various tasks, a sensor node needs to complete various tasks such as acquisition and conversion of monitoring data, management and processing of data, response of task requests of sink nodes, node control and the like, and a passive heat dissipation mode is generally adopted for heat dissipation due to volume limitation of the sensor node in the prior art, so that the heat dissipation efficiency of the heat dissipation mode is poor, the sensor node is easy to work at a high temperature for a long time, and the service life of the sensor node is easy to reduce.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to above-mentioned defect, a heat abstractor for sensor node network is provided to solve the poor problem of sensor node equipment heat dissipation among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat dissipation device for a sensor node network comprises a shell, wherein an opening is formed in the top of the shell, an upper cover is fixedly connected to the opening of the shell, a sliding rail groove is formed in the upper cover, a sliding rail is arranged in the sliding rail groove and is in sliding connection with the upper cover, a pressure spring is arranged at one end of the sliding rail, one end, away from the sliding rail, of the pressure spring is connected to the upper cover, an electromagnet is arranged at one end, away from the pressure spring, of the upper cover, a permanent magnet is arranged at one end, close to the electromagnet, of the sliding rail, a permanent magnet and one end, repellent to the electromagnet, of the electromagnet are hinged to the upper cover, a plurality of groups of heat dissipation plates are hinged; the electronic components mounted in the housing are connected to the upper cover through the silicone pad.
As a further scheme of the utility model, the upper cover is equipped with the electromagnet groove in the one end of slide rail groove, and the electromagnet groove is square groove, and on electromagnet fixed connection to electromagnet groove, the both sides of upper cover still were equipped with the fin mounting bar, be equipped with the hinge post on the fin mounting bar, the hinge post is cylindrical structure, and the heating panel is dull and stereotyped, and the both sides of heating panel are equipped with the hinge hole, and the hinge post is established in the hinge hole.
As a further scheme of the utility model, the both sides of slide rail still are equipped with the spout that runs through along the axis of slide rail, the spout is square groove, still is equipped with the slider on the inner wall in slide rail groove, the slider is equipped with the multiunit, and the slider equipartition is on the slide rail groove, and the slider is established in the spout.
As a further proposal, the heat dissipation plate is further provided with a first support lug, the slide rail is provided with a second support lug, the two ends of the connecting rod are provided with pin holes, and the connecting rod is connected with the first support lug and the second support lug through pins.
As a further scheme of the utility model, the one side equipartition that the upper cover was kept away from to the shell has the multiunit fin, the shell still is equipped with the silicone grease pad, and the laminating of silicone grease pad is on the PCB board of installation in the shell.
As a further aspect of the present invention, the one end fixedly connected with mounting panel of shell is kept away from to the fin, mounting panel fixed connection is to the fin.
To sum up, compared with the prior art, the utility model has the following beneficial effects:
1. the utility model discloses a wobbling heating panel improves the radiating efficiency on upper cover surface, simultaneously, connects electronic component and upper cover through the silicone grease pad, has increased electronic component's radiating effect.
2. The utility model discloses still increase the radiating efficiency of shell through the fin, further improvement electronic component's radiating efficiency has improved the passive heat radiating area of shell.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for a sensor node network.
Fig. 2 is a partial enlarged view at I in fig. 1.
Fig. 3 is a schematic structural diagram of an upper cover in a heat dissipation device for a sensor node network.
Fig. 4 is a schematic structural diagram of a heat sink plate in the heat sink device for the sensor node network.
Fig. 5 is a schematic structural diagram of a slide rail in a heat dissipation device for a sensor node network.
Reference numerals: the PCB heat dissipation device comprises a shell, 11 PCB supporting columns, 2 upper covers, 21 sliding rail grooves, 22 sliding blocks, 23 electromagnet grooves, 24 heat dissipation plate mounting bars, 25 hinge columns, 3 heat dissipation plates, 31 first supporting lugs, 4 sliding rails, 41 second supporting lugs, 42 sliding grooves, 5 connecting rods, 6 electromagnets, 7 pressure springs, 8 heat dissipation plates and 9 mounting plates.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
As shown in fig. 1 to 3, a heat dissipation device for a sensor node network includes a housing 1, an opening is formed in the top of the housing 1, an upper cover 2 is fixedly connected to the opening of the housing 1, a slide rail groove 21 is formed in the upper cover 2, a slide rail 4 is arranged in the slide rail groove 21, the slide rail 4 is slidably connected to the upper cover 2, a pressure spring 7 is arranged at one end of the slide rail 4, one end of the pressure spring 7, which is far away from the slide rail 4, is connected to the upper cover 2, an electromagnet 6 is arranged at one end of the upper cover 2, which is far away from the pressure spring 7, a permanent magnet is arranged at one end of the slide rail 4, which is close to the electromagnet 6, one end of the permanent magnet, which is repellent to the electromagnet 6, a plurality of groups of heat dissipation plates 3 are hinged to the upper cover 2, a; electronic components mounted in the housing 1 are connected to the upper cover 2 through a silicone pad;
when the shell 1 works, the electromagnet 6 intermittently supplies power, so that the electromagnet 6 intermittently pushes the sliding rail 4 to compress the pressure spring 7, the pressure spring 7 recovers when the electromagnet 6 stops supplying power and pushes the sliding rail 4 to move towards the electromagnet 6, the sliding rail 4 slides in the upper cover 2 in a reciprocating manner, the sliding rail 4 drives the connecting rod 5 to drive the heat dissipation plate 3 to swing in the process of sliding in the upper cover 2 in the reciprocating manner, and the heat dissipation plate 3 drives air on the surface of the upper cover 2 to flow and accelerate in the swinging process, so that the surface heat dissipation efficiency of the upper cover 2 is improved, and the heat dissipation efficiency of the electronic element is improved;
the shell 1 is made of heat conducting materials, PCB supporting columns 11 are arranged in the shell 1, the PCB supporting columns 11 are made of insulating materials, in some examples, the PCB supporting columns 11 are silica gel columns, a PCB in the shell 1 is fixedly connected to the PCB supporting columns 11 through screws, and the PCB supporting columns 11 are fixedly connected to the bottom surface of the shell 1 through screws;
in some examples, the upper cover 2 is fixedly attached to the housing 1 by screws;
as shown in fig. 3, an electromagnet groove 23 is formed at one end of the slide rail groove 21 of the upper cover 2, the electromagnet groove 23 is a square groove, the electromagnet 6 is fixedly connected to the electromagnet groove 23, in some examples, the electromagnet 6 is fixedly connected to the electromagnet groove 23 by screws, heat sink mounting bars 24 are further arranged on two sides of the upper cover 2, hinge columns 25 are arranged on the heat sink mounting bars 24, the hinge columns 25 are cylindrical structures, the heat sink 3 is a flat plate, hinge holes are formed on two sides of the heat sink 3, the hinge columns 25 are arranged in the hinge holes, and when the heat sink 3 swings, the heat sink 3 swings around the hinge columns 25;
as shown in fig. 4 and 5, the heat dissipation plate 3 is further provided with a first lug 31, the slide rail 4 is provided with a second lug 41, two ends of the connecting rod 5 are provided with pin holes, the connecting rod 5 is connected with the first lug 31 and the second lug 41 through pins, when the slide rail 4 slides, the slide rail 4 drives the connecting rod 5 to move, the connecting rod 5 drives the first lug 31 to move, the heat dissipation plate 3 is hinged on the upper cover 2, the first lug 31 drives the heat dissipation plate 3 to swing on the upper cover 2, and when the heat dissipation plate 3 swings, air near the heat dissipation plate 3 is shaken, so that the air flow rate on the surface of the upper cover 2 is accelerated, and the heat dissipation efficiency of the upper cover 2 is improved;
further, in order to prevent the sliding rail 4 from being separated from the upper cover 2, sliding grooves 42 penetrating along the axis of the sliding rail 4 are further formed in the two sides of the sliding rail 4, the sliding grooves 42 are square grooves, sliding blocks 22 are further arranged on the inner wall of the sliding rail groove 21, multiple groups of sliding blocks 22 are arranged on the sliding blocks 22, the sliding blocks 22 are uniformly distributed on the sliding rail groove 21, the sliding blocks 22 are arranged in the sliding grooves 42, and the sliding blocks 22 play a role in limiting the sliding rail 4; when the electromagnet 6 is powered on, a magnetic field is generated on the electromagnet 6, one end, close to the sliding rail 4, of an iron core of the electromagnet 6 is mutually exclusive with a permanent magnet on the sliding rail 4, so that the sliding rail 4 moves towards a direction far away from the electromagnet 6, the sliding block 22 slides in the sliding groove 42 in the moving process of the sliding rail 4, the sliding block 22 can limit the sliding rail 4 to move along a straight line, the sliding rail 4 compresses the pressure spring 7, the sliding rail 4 pushes the heat dissipation plate 3 to swing through the connecting rod 5 in the moving process, the heat dissipation plate 3 swings towards a direction close to the upper cover 2, when the electromagnet 6 stops supplying power, the pressure spring 7 restores to the original state and pushes the sliding rail 4 to move towards the direction of the electromagnet 6, meanwhile, the permanent magnet on the sliding rail 4 adsorbs the iron core of the electromagnet 6, so that the sliding rail 4 moves towards the direction of the electromagnet, the heat dissipation plate 3 is forced to swing in the direction away from the upper cover 2, and when the electromagnet 6 supplies power continuously and intermittently, the heat dissipation plate 3 can swing continuously;
further, in order to increase the moving distance of the slide rail 4, the permanent magnet is a rubidium magnet.
As another embodiment of the present invention, in order to improve the heat dissipation efficiency of the back of the PCB board in the housing 1, a plurality of sets of heat dissipation fins 8 are uniformly distributed on one surface of the housing 1 away from the upper cover 2, a mounting plate 9 is fixedly connected to one end of the heat dissipation fin 8 away from the housing 1, the heat dissipation fin 8 is a heat conductive material, in some examples, the heat dissipation fin 8 and the mounting plate 9 are both aluminum plates, the heat dissipation fin 8 is fixedly connected to the housing 1 by welding, and the mounting plate 9 is fixedly connected to the heat dissipation fin 8 by welding; the shell 1 is also provided with a silicone grease pad which is attached to a PCB (printed circuit board) arranged in the shell 1;
the radiating fins 8 can increase the radiating area of the shell 1, and because the back of the PCB has small heat productivity, the passive radiating with large area can effectively reduce the temperature of the PCB, and the purpose of energy conservation can be achieved.
To sum up, the utility model discloses a theory of operation is:
when the electromagnet 6 is powered on, a magnetic field is generated on the electromagnet 6, one end, close to the sliding rail 4, of an iron core of the electromagnet 6 is mutually exclusive with a permanent magnet on the sliding rail 4, so that the sliding rail 4 moves towards a direction far away from the electromagnet 6, the sliding block 22 slides in the sliding groove 42 in the moving process of the sliding rail 4, the sliding block 22 can limit the sliding rail 4 to move along a straight line, the sliding rail 4 compresses the pressure spring 7, the sliding rail 4 pushes the heat dissipation plate 3 to swing through the connecting rod 5 in the moving process, the heat dissipation plate 3 swings towards a direction close to the upper cover 2, when the electromagnet 6 stops supplying power, the pressure spring 7 restores to the original state and pushes the sliding rail 4 to move towards the direction of the electromagnet 6, meanwhile, the permanent magnet on the sliding rail 4 adsorbs the iron core of the electromagnet 6, so that the sliding rail 4 moves towards the direction of the electromagnet, the heat dissipation plate 3 is forced to swing in the direction away from the upper cover 2, and when the electromagnet 6 supplies power continuously and intermittently, the heat dissipation plate 3 can swing continuously;
the radiating fins 8 can increase the radiating area of the shell 1, and because the back of the PCB has small heat productivity, the passive radiating with large area can effectively reduce the temperature of the PCB, and the purpose of energy conservation can be achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A heat dissipation device for a sensor node network comprises a shell (1), wherein an opening is formed in the top of the shell (1), an upper cover (2) is fixedly connected to the opening of the shell (1), and the heat dissipation device is characterized in that a sliding rail groove (21) is formed in the upper cover (2), a sliding rail (4) is arranged in the sliding rail groove (21), the sliding rail (4) is in sliding connection with the upper cover (2), a pressure spring (7) is arranged at one end of the sliding rail (4), one end, far away from the sliding rail (4), of the pressure spring (7) is connected to the upper cover (2), an electromagnet (6) is arranged at one end, far away from the pressure spring (7), of the upper cover (2), a permanent magnet is arranged at one end, close to the electromagnet (6), of the permanent magnet and one pole, far away from the electromagnet (6), a plurality of heat dissipation plates (3) are hinged to the upper cover (2), and a connecting rod (5) is hinged to, one surface of the connecting rod (5) far away from the heat dissipation plate (3) is hinged to the sliding rail (4); the electronic components mounted in the housing (1) are connected to the upper cover (2) through silicone pads.
2. The heat dissipation device for the sensor node network according to claim 1, wherein the upper cover (2) is provided with an electromagnet groove (23) at one end of the slide rail groove (21), the electromagnet groove (23) is a square groove, the electromagnet (6) is fixedly connected to the electromagnet groove (23), heat dissipation plate mounting bars (24) are further provided on two sides of the upper cover (2), hinge columns (25) are provided on the heat dissipation plate mounting bars (24), the hinge columns (25) are cylindrical structures, the heat dissipation plate (3) is a flat plate, hinge holes are provided on two sides of the heat dissipation plate (3), and the hinge columns (25) are provided in the hinge holes.
3. The heat dissipation device for the sensor node network according to claim 2, wherein sliding grooves (42) penetrating along the axis of the sliding rail (4) are further formed in two sides of the sliding rail (4), the sliding grooves (42) are square grooves, sliding blocks (22) are further arranged on the inner wall of the sliding rail groove (21), a plurality of groups of the sliding blocks (22) are arranged, the sliding blocks (22) are uniformly distributed on the sliding rail groove (21), and the sliding blocks (22) are arranged in the sliding grooves (42).
4. The heat dissipation device for the sensor node network according to claim 1, wherein the heat dissipation plate (3) is further provided with a first lug (31), the slide rail (4) is provided with a second lug (41), two ends of the connection rod (5) are provided with pin holes, and the connection rod (5) is connected with the first lug (31) and the second lug (41) through pins.
5. The heat dissipation device for the sensor node network according to any one of claims 1 to 4, wherein a plurality of groups of heat dissipation fins (8) are uniformly distributed on one surface of the housing (1) far away from the upper cover (2), and the housing (1) is further provided with a silicone pad attached to a PCB (printed circuit board) installed in the housing (1).
6. The heat sink for a sensor node network according to claim 5, wherein a mounting plate (9) is fixedly connected to an end of the heat sink (8) remote from the housing (1), the mounting plate (9) being fixedly connected to the heat sink (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021881470.0U CN213280453U (en) | 2020-09-02 | 2020-09-02 | Heat dissipation device for sensor node network |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021881470.0U CN213280453U (en) | 2020-09-02 | 2020-09-02 | Heat dissipation device for sensor node network |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213280453U true CN213280453U (en) | 2021-05-25 |
Family
ID=75938105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021881470.0U Active CN213280453U (en) | 2020-09-02 | 2020-09-02 | Heat dissipation device for sensor node network |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213280453U (en) |
-
2020
- 2020-09-02 CN CN202021881470.0U patent/CN213280453U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201821591U (en) | Radiator shell and communication terminal device | |
| CN213280453U (en) | Heat dissipation device for sensor node network | |
| CN211019667U (en) | Air-cooled heat dissipation placing frame for storage server | |
| CN214756935U (en) | Intelligent control power-saving terminal of 5G base station based on Internet of things technology and embedded application technology | |
| CN213876399U (en) | Ice maker control system capable of realizing remote control function | |
| CN204029538U (en) | Structure on a kind of many core transformers plate | |
| CN215345461U (en) | Long service life is not fragile intelligent thing networking controller | |
| CN216451732U (en) | Internet of things equipment controller | |
| CN215735268U (en) | Intelligent internet-of-things controller with good anti-interference stability | |
| CN212752831U (en) | Compact electric control structure | |
| CN216017361U (en) | Intelligent control system of Internet of things | |
| CN219140722U (en) | High canopy lamp of high-efficient heat dissipation LED | |
| CN219873505U (en) | Chip heat radiation structure | |
| CN214541884U (en) | Transformer capable of automatically performing power-off protection | |
| CN218771735U (en) | Environment-friendly energy-saving power module | |
| CN216217853U (en) | Intelligent internet-of-things controller with high multifunctional sensitivity | |
| CN210671104U (en) | Energy-efficient industrial ethernet switch | |
| CN218920239U (en) | Explosion-proof shell of frequency converter | |
| CN212970521U (en) | Intelligent low-power consumption wireless data transmission device | |
| CN213029088U (en) | Heat radiation structure of analog radio station host | |
| CN210486941U (en) | Miniature allowance monitoring wireless sensor | |
| CN204463986U (en) | A kind of novel transformer plate | |
| CN210154133U (en) | Geothermal superconducting heat exchange device suitable for air source heat pump normal temperature water supply | |
| CN215187149U (en) | WiFi module with Internet of things function | |
| CN210808070U (en) | Nano coating radiating fin structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240527 Address after: No. 10, Gate 3, 9th Floor, Courtyard 32 Xiaoying West Road, Haidian District, Beijing, 100089 Patentee after: Ren Mingyong Country or region after: China Address before: 230088 West of Building 13, No. 767 Yulan Avenue, Hefei High-tech Zone, Anhui Province Patentee before: HEFEI SHENGWEN INFORMATION TECHNOLOGY Co.,Ltd. Country or region before: China |