CN213278013U - Gluing mold for manufacturing diode - Google Patents

Abstract

The utility model discloses a gluing mould for manufacturing diodes, which comprises a mould main body, wherein a plurality of fixed grooves are equidistantly arranged on the upper surface of the mould main body, the bottom surface of each fixed groove is provided with an ejection device, two sides of each fixed groove are provided with a chute, a supporting plate is movably arranged in each fixed groove, two sides of each supporting plate are fixedly provided with a supporting column, a motor is fixedly arranged on the upper surface of each supporting column, a lead screw is fixedly arranged at the central position of an output shaft of the motor, a sleeve plate is sleeved on the surface of the lead screw, an L-shaped rod is fixedly arranged at the central position of the lower surface of the sleeve plate, a pressing plate is fixedly arranged at the central position of one side of the L-shaped rod, and the gluing mould for manufacturing diodes can fix the diodes in the gluing work of the diodes by arranging the mounting grooves, the, therefore, the phenomenon that the diode is glued with errors caused by the movement of the diode in the gluing process is avoided.

Description

Gluing mold for manufacturing diode

Technical Field

The utility model relates to a diode technical field especially relates to a rubberizing mould for manufacturing diode.

Background

The diode is an electronic device made of semiconductor materials, has unidirectional conductivity, and is continuously innovated in electronic technology and continuously increased in usage amount along with the development of society and the improvement of science and technology;

the existing diode is not provided with a good fixing device for the diode in the manufacturing and gluing process, the diode moves in the gluing process, so that gluing position deviation can be caused, and the diode is not easy to take out after gluing is finished.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a glue applying mould for manufacturing a diode, which can produce the technical effects of fixing the diode and conveniently taking out the diode.

In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a make rubberizing mould for diode, includes the mould main part, a plurality of fixed slots are seted up to mould main part upper surface equidistance, the fixed slot bottom surface is provided with ejecting device, the spout has all been seted up to the fixed slot both sides, movable mounting has the backup pad in the fixed slot, the equal fixed mounting support column in backup pad both sides, fixed surface installs the motor on the support column, the central point of motor output shaft puts fixed mounting lead screw, the lagging has been cup jointed on the lead screw surface, lagging lower surface central point puts fixed mounting L type pole, L type pole one side central point puts the fixed mounting clamp plate.

Preferably, the ejection device comprises an electric telescopic rod, the electric telescopic rod is fixedly installed at the center of the bottom surface of the fixed groove, and a supporting plate is fixedly installed at the center of one end of the electric telescopic rod.

Preferably, a limiting block is fixedly arranged at the center of one end of the screw rod.

Preferably, the sponge cushion is fixedly arranged on one side of the pressing plate close to each other.

Preferably, one side of the sleeve plate is provided with a threaded hole matched with the screw rod in size.

Preferably, the lower surface of the pressure plate is communicated with the upper surface of the support plate.

Preferably, the size of the supporting plate is matched with that of the fixing groove.

Preferably, the size of the supporting column is matched with the size of the sliding groove.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. the diode can be fixed in the diode gluing work by arranging the mounting groove, the sliding groove, the supporting plate, the supporting column, the motor, the screw rod, the sleeve plate, the L-shaped rod and the pressing plate, so that the diode gluing error caused by diode movement in the gluing process is avoided;

2. through setting up electric telescopic handle, backup pad and mounting groove, can accomplish rubberizing work back to the diode, ejecting in following the mounting groove with the backup pad to take out the diode fast easily.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the fixing groove and the sliding groove of the present invention;

fig. 3 is a schematic view of the installation of the ejection device, the support column and the motor structure of the present invention;

FIG. 4 is a schematic view of the installation of the L-shaped rod and the pressing plate structure of the present invention;

FIG. 5 is a schematic structural view of the motor, the sleeve plate, the lead screw and the limiting block of the present invention;

wherein: 1. a mold body; 2. fixing grooves; 3. a chute; 4. an electric telescopic rod; 5. a support plate; 6. a support pillar; 7. a motor; 8. a screw rod; 9. sheathing; 10. an L-shaped rod; 11. pressing a plate; 12. a limiting block; 13. a sponge cushion; 14. a threaded bore.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in FIGS. 1-4, the utility model provides a gluing mold for manufacturing diodes, which comprises a mold body 1, wherein a plurality of fixing grooves 2 are equidistantly arranged on the upper surface of the mold body 1, the bottom surfaces of the fixing grooves 2 are provided with ejection devices for ejecting a support plate 5, sliding grooves 3 are respectively arranged on both sides of the fixing grooves 2, the support plate 5 is movably arranged in the fixing groove 2 and is used for placing diodes, support columns 6 are fixedly arranged on both sides of the support plate 5 and are used for installing a support motor 7, the motor 7 is fixedly arranged on the upper surface of the support column 6 and is used for driving a screw rod 8 to rotate, the screw rod 8 is fixedly arranged at the central position of an output shaft of the motor 7 and is used for driving a sleeve plate 9 to move on the surface of the screw rod 8, the sleeve plate 9 is sleeved on the surface of the screw rod 8 and is used for installing an L-shaped rod 10 in a supporting way, the L, used for pressing and fixing the diode;

the diode is firstly placed on the upper surface of the supporting plate 5, the motor 7 is started to drive the screw rod 8 to rotate, the screw rod 8 drives the sleeve plate 9 to move on the surface along the screw rod 8, the sleeve plate 9 drives the L-shaped rod 10 to move, the L-shaped rod 10 drives the pressing plate 11 to move, and therefore the pressing plate 11 is pressed and fixed on the diode, gluing work is facilitated, and deviation caused by movement of the diode in the gluing process is avoided.

In another embodiment, as shown in fig. 2, the utility model discloses that the ejection device comprises an electric telescopic rod 4 for driving a support plate 5 to move, the electric telescopic rod 4 is fixedly installed at the center of the bottom surface of the fixing groove 2, the support plate 5 is fixedly installed at the center of one end of the electric telescopic rod 4, and the support plate 5 is used for placing the diode;

after gluing work is finished, the electric telescopic rod 4 is started to drive the supporting plate 5 to move upwards, so that the diode is driven to move upwards, and the diode is conveniently taken out from the fixing groove 2.

In another embodiment, as shown in fig. 4, the utility model discloses that a central position of one end of the screw rod 8 is fixedly provided with a limit block 12 for preventing the sleeve plate 9 from separating from the screw rod 8 when moving;

through setting up stopper 12, can prevent that the lagging 9 from breaking away from lead screw 8 when loving lead screw 8 surface activity to guaranteed that the device carries out normal fixed work.

In another embodiment, as shown in fig. 4, the present invention discloses that the pressing plate 11 is close to one side of the fixed sponge mat 13, which can play a role of buffering and protecting when pressing the fixed diode, so as to prevent the diode from being crushed.

In another embodiment, as shown in fig. 5, the utility model discloses a threaded hole 14 with the adaptation of the size of lead screw 8 is seted up to lagging 9 one side, makes things convenient for lead screw 8 to drive lagging 9 and move about on the lead screw 8 surface to the diode is fixed at last.

In another embodiment, as shown in fig. 3 and 4, the present invention discloses that the lower surface of the pressing plate 11 is communicated with the upper surface of the supporting plate 5, so that the diode can be fixed by the pressing plate 11 when the diode is placed on the upper surface of the supporting plate 5.

In another embodiment, as shown in fig. 2 and 3, the utility model discloses a, the size of backup pad 5 and 2 big or small adaptations of fixed slot make things convenient for backup pad 5 to move about in fixed slot 2 to make things convenient for electric telescopic handle 4 to drive backup pad 5 activity play fixed slot 2, guarantee to take out the diode easily at last.

In another embodiment, as shown in fig. 2 and 3, the present invention discloses that the size of the supporting column 6 is adapted to the size of the sliding chute 3, so as to ensure that the supporting column 6 can move in the sliding chute 3.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (8)

1. The utility model provides a make rubberizing mould for diode, includes mould main part (1), its characterized in that: a plurality of fixed slots (2) are seted up to mould main part (1) upper surface equidistance, fixed slot (2) bottom surface is provided with ejecting device, spout (3) have all been seted up to fixed slot (2) both sides, fixed slot (2) interior movable mounting has backup pad (5), the equal fixed mounting support column (6) in backup pad (5) both sides, fixed surface installs motor (7) on support column (6), the central point of motor (7) output shaft puts fixed mounting lead screw (8), sleeve plate (9) have been cup jointed on lead screw (8) surface, sleeve plate (9) lower surface central point puts fixed mounting L shaped rod (10), L shaped rod (10) one side central point puts fixed mounting clamp plate (11).

2. The gluing mold for manufacturing diode of claim 1, wherein: the ejection device comprises an electric telescopic rod (4), the electric telescopic rod (4) is fixedly installed at the center of the bottom surface of the fixing groove (2), and a supporting plate (5) is fixedly installed at the center of one end of the electric telescopic rod (4).

3. The gluing mold for manufacturing diode of claim 1, wherein: and a limiting block (12) is fixedly arranged at the center of one end of the screw rod (8).

4. The gluing mold for manufacturing diode of claim 1, wherein: and sponge cushions (13) are fixedly arranged on the sides, close to each other, of the pressing plates (11).

5. The gluing mold for manufacturing diode of claim 1, wherein: one side of the sleeve plate (9) is provided with a threaded hole (14) matched with the screw rod (8) in size.

6. The gluing mold for manufacturing diode of claim 1, wherein: the lower surface of the pressing plate (11) is communicated with the upper surface of the supporting plate (5).

7. The gluing mold for manufacturing diode of claim 1, wherein: the size of the supporting plate (5) is matched with that of the fixing groove (2).

8. The gluing mold for manufacturing diode of claim 1, wherein: the size of the supporting column (6) is matched with that of the sliding groove (3).

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