CN213240802U - Double-side exposure machine - Google Patents
Double-side exposure machine Download PDFInfo
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- CN213240802U CN213240802U CN202022097634.7U CN202022097634U CN213240802U CN 213240802 U CN213240802 U CN 213240802U CN 202022097634 U CN202022097634 U CN 202022097634U CN 213240802 U CN213240802 U CN 213240802U
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Abstract
The utility model discloses a two-sided exposure machine relates to thyristor production facility, has solved the technical problem to silicon chip single face exposure work efficiency low, and pollute the silicon chip easily. The device comprises a machine body, wherein two oppositely arranged mounting seats are arranged in the machine body, two mounting brackets are arranged between the mounting seats, and the mounting brackets are movably mounted on the mounting seats through a first driving assembly; the mounting bracket is provided with a photoetching plate positioning bracket which is movably mounted on the mounting bracket through a second driving assembly; a silicon wafer positioning bracket is arranged between the two mounting brackets and is fixedly arranged between the two mounting seats; the machine body above the mounting bracket is provided with an upper exposure lamp, and the machine body below the mounting bracket is provided with a lower exposure lamp. The utility model discloses can expose two faces of silicon chip simultaneously, great improvement work efficiency, also avoided the silicon chip to receive the problem of pollution easily simultaneously.
Description
Technical Field
The utility model relates to a thyristor production facility, more specifically say, it relates to a two-sided exposure machine.
Background
Thyristors may also be referred to as silicon controlled rectifiers. It is a high-power switch type semiconductor device, can work under the condition of high voltage and large current, and its working process can be controlled, and can be extensively used in the electronic circuits of controllable rectification, AC voltage regulation, contactless electronic switch, inversion and frequency conversion, etc.. The thyristor mainly takes a silicon wafer as a base material, and the photoresist on the silicon wafer is hardened according to the pattern on the photoetching plate by an exposure process in the production process to form a protective layer. However, most of the existing exposure machines can only expose a single surface of a silicon wafer, and when another surface of the silicon wafer is exposed, the silicon wafer needs to be turned over, aligned again and exposed again. The mode is low in working efficiency, and the silicon wafer is easily polluted in the process of overturning the silicon wafer.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is not enough to prior art, provide a two-sided exposure machine, solved to the problem that silicon chip single face exposure work efficiency is low, and pollute the silicon chip easily.
The technical scheme of the utility model lies in: a double-sided exposure machine comprises a machine body, wherein two oppositely arranged mounting seats are arranged in the machine body, two mounting brackets are arranged between the two mounting seats up and down, and the mounting brackets are movably mounted on the mounting seats through a first driving assembly; a photoetching plate positioning support is arranged on the mounting support, the photoetching plate positioning support is movably mounted on the mounting support through a second driving assembly, and the running direction of the first driving assembly is vertical to the moving direction of the second driving assembly; a silicon wafer positioning bracket is arranged between the two mounting brackets and fixedly mounted between the two mounting seats; a window shade is arranged between the mounting bracket and the machine body; the machine body above the mounting bracket is provided with an upper exposure lamp, and the machine body below the mounting bracket is provided with a lower exposure lamp.
In a further improvement, the first driving assembly comprises a bearing seat, a stepping motor, a screw rod and a guide rod; the screw rod is arranged at the driving end of the stepping motor, and the tail end of the screw rod is rotatably arranged in the bearing block; one side of the mounting bracket is provided with a threaded sleeve, and the threaded sleeve is in threaded connection with the screw rod; and a sliding sleeve is arranged on the other side of the mounting bracket and is in sliding connection with the guide rod.
Further, the thread sleeve is square; the mounting seat is provided with a sliding groove matched with the threaded sleeve, and the threaded sleeve is slidably mounted in the sliding groove.
Furthermore, the second driving assembly comprises two linear sliding rails; the two linear slide rails are arranged on the mounting bracket and are perpendicular to the screw rod, and the photoetching plate positioning bracket is arranged on a slide block of the linear slide rails.
Furthermore, the window shade is a black folding curtain.
Furthermore, the upper exposure lamp and the lower exposure lamp are both installed on the inner wall of the machine body through the lifting assembly.
Furthermore, the lifting assembly comprises an electric push rod and a supporting seat for mounting the exposure lamp; the inner wall of the machine body is provided with a T-shaped guide groove, the supporting seat is installed in the T-shaped guide groove in a sliding mode through a sliding rail, the electric push rod is installed on the machine body, and the driving end of the electric push rod is connected with the supporting seat.
Advantageous effects
The utility model has the advantages that: the machine body is divided into an upper part and a lower part by the mounting bracket, the silicon wafer positioning bracket, the photoetching plate positioning bracket and the shading curtain, so that the upper surface and the lower surface of the silicon wafer can be simultaneously exposed when the exposure machine exposes the silicon wafer, and the problems of low single-side exposure work efficiency of the silicon wafer and easy pollution to the silicon wafer are solved.
Drawings
FIG. 1 is a schematic side sectional view of the present invention;
fig. 2 is a schematic view of the internal overlooking structure of the present invention.
Wherein: 1-machine body, 2-mounting seat, 3-mounting bracket, 4-photoetching plate positioning bracket, 5-silicon wafer positioning bracket, 6-upper exposure lamp, 7-lower exposure lamp, 8-bearing seat, 9-stepping motor, 10-screw rod, 11-guide rod, 12-thread sleeve, 13-sliding sleeve, 14-sliding groove, 15-linear sliding rail, 16-electric push rod, 17-supporting seat, 18-sliding rail and 19-T type guide groove.
Detailed Description
The present invention will be further described with reference to the following examples, which are not intended to limit the scope of the present invention, but are intended to be covered by the appended claims in any way.
Referring to fig. 1-2, the present invention relates to a double-side exposure machine, which comprises a machine body 1. Two oppositely arranged mounting seats 2 are mounted in the machine body 1, two mounting supports 3 which are arranged from top to bottom are arranged between the mounting seats 2, and the mounting supports 3 are movably mounted on the mounting seats 2 through first driving components. Specifically, the first driving assembly comprises a bearing seat 8, a stepping motor 9 and a screw rod 10. The bearing seat 8 is arranged at one end of the mounting seat 2, the stepping motor 9 is arranged at the other end of the mounting seat 2, the screw rod 10 is arranged at the driving end of the stepping motor 9, and the tail end of the screw rod 10 is rotatably arranged in the bearing seat 8; one side of the mounting bracket 3 is provided with a threaded sleeve 12, and the threaded sleeve 12 is in threaded connection with the screw rod 10; the other side of the mounting bracket 3 is provided with a sliding sleeve 13, and the sliding sleeve 13 is connected with the guide rod 11 in a sliding manner. When the stepping motor 9 drives the screw rod 10 to rotate, the threaded sleeve 12 moves along the axis direction of the screw rod 10, so that the mounting bracket 3 can move left and right, and the photoetching plate mounted on the mounting bracket 3 moves left and right.
Preferably, the threaded sleeve 12 is square; the mounting seat 2 is provided with a sliding groove 14 matched with the threaded sleeve 12, and the threaded sleeve 12 is slidably mounted in the sliding groove 14. In the moving process of the mounting bracket 3, the threaded sleeve 12 is positioned through the sliding groove 14, so that the mounting bracket 3 can move along the axis direction of the screw rod 10 more stably, and the phenomenon of displacement of a photoetching plate caused by mechanical vibration is avoided.
The mounting bracket 3 is provided with a photoetching plate positioning bracket 4, a photoetching plate is arranged in the photoetching plate positioning bracket 4, the photoetching plate positioning bracket 4 is movably mounted on the mounting bracket 3 through a second driving assembly, and the running direction of the first driving assembly is vertical to the running direction of the second driving assembly. Specifically, the second driving assembly includes two linear slides 15. Two linear slide rails 15 are installed on the installation support 3, the linear slide rails 15 are perpendicular to the screw rod 10, and the photoetching plate positioning support 4 is installed on a slide block of the linear slide rails 15. Namely, one side of the positioning support 4 of the photolithography mask is connected with the slide block of one linear slide rail 15, and the other side is connected with the slide block of the other linear slide rail 15. When the slide block on the linear slide rail 15 moves, the photolithography mask positioning bracket 4 is driven to realize the back and forth movement of the photolithography mask positioning bracket 4.
In this embodiment, the photolithography plate positioning bracket 4 located at the upper part of the machine body 1 is located below the mounting bracket, and the photolithography plate positioning bracket 4 located at the lower part of the machine body 1 is located above the mounting bracket, so that the photolithography plate can be as close as possible to the silicon wafer. In addition, a positioning groove for positioning the photolithography plate is formed in the photolithography plate positioning bracket 4.
A silicon wafer positioning bracket 5 is arranged between the two mounting brackets 3, and the silicon wafer positioning bracket 5 is fixedly arranged between the two mounting seats 2. The silicon wafer positioning bracket 5 is used for mounting a silicon wafer to be exposed. A shading curtain is arranged between the mounting bracket 3 and the machine body 1, an upper exposure lamp 6 is arranged on the machine body 1 above the mounting bracket 3, and a lower exposure lamp 7 is arranged on the machine body 1 below the mounting bracket 3. The shading curtain is used for separating the upper part and the lower part of the machine body 1, and light generated by the upper exposure lamp 6 and light generated by the lower exposure lamp 7 are prevented from influencing each other when the silicon wafer is exposed. In addition, a positioning groove for positioning the silicon wafer is formed in the silicon wafer positioning bracket 5.
Preferably, the window blind is a black pleated blind.
The upper and lower exposure lamps 6 and 7 of the present embodiment are installed on the inner wall of the machine body 1 by a lifting assembly. Specifically, the lifting assembly comprises an electric push rod 16 and a supporting seat 17 for mounting the exposure lamp. A T-shaped guide groove 19 is formed in the inner wall of the machine body 1, and the supporting seat 17 is slidably mounted in the T-shaped guide groove 19 through a sliding rail 18 so as to improve the stability of the exposure lamp in the moving process. The electric push rod 16 is arranged on the machine body 1, and the driving end of the electric push rod 16 is connected with the supporting seat 17. The support base 17 is driven by the electric push rod 16, and the exposure lamp is raised or lowered.
The utility model discloses a theory of operation is: when in use, firstly, a silicon wafer to be exposed is arranged in the silicon wafer positioning bracket 5; then the mounting bracket 3 is driven to move left and right in the machine body 1 by the stepping motor 9, and the photoetching plate positioning bracket 4 is driven to move back and forth by the linear slide rail 15 so as to adjust the position of the photoetching plate and ensure that the pattern on the photoetching plate corresponds to the position of the silicon wafer. And then starting an exposure lamp to simultaneously expose the upper surface and the lower surface of the silicon wafer. When the exposure illumination needs to be adjusted, the height of the exposure lamp can be adjusted through the electric push rod 16 so as to change the exposure illumination.
The above is only the preferred embodiment of the present invention, and it should be noted that for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which will not affect the utility model and the utility of the patent.
Claims (7)
1. A double-sided exposure machine comprises a machine body (1), and is characterized in that two oppositely arranged installation bases (2) are installed in the machine body (1), two installation supports (3) which are arranged up and down are arranged between the two installation bases (2), and the installation supports (3) are movably installed on the installation bases (2) through a first driving assembly; a photoetching plate positioning support (4) is arranged on the mounting support (3), the photoetching plate positioning support (4) is movably mounted on the mounting support (3) through a second driving assembly, and the running direction of the first driving assembly is vertical to the moving direction of the second driving assembly; a silicon wafer positioning bracket (5) is arranged between the two mounting brackets (3), and the silicon wafer positioning bracket (5) is fixedly arranged between the two mounting seats (2); a shading curtain is arranged between the mounting bracket (3) and the machine body (1); an upper exposure lamp (6) is arranged on the machine body (1) above the mounting bracket (3), and a lower exposure lamp (7) is arranged on the machine body (1) below the mounting bracket (3).
2. A double-sided exposure machine according to claim 1, wherein the first drive assembly comprises a bearing block (8), a stepping motor (9), a lead screw (10) and a guide bar (11); the bearing seat (8) is installed at one end of the installation seat (2), the stepping motor (9) is installed at the other end of the installation seat (2), the screw rod (10) is installed at the driving end of the stepping motor (9), and the tail end of the screw rod (10) is rotatably installed in the bearing seat (8); one side of the mounting bracket (3) is provided with a threaded sleeve (12), and the threaded sleeve (12) is in threaded connection with the screw rod (10); and a sliding sleeve (13) is installed on the other side of the mounting bracket (3), and the sliding sleeve (13) is connected with the guide rod (11) in a sliding manner.
3. A double-sided exposure machine according to claim 2, wherein the thread bush (12) is square-shaped; the mounting seat (2) is provided with a sliding groove (14) matched with the threaded sleeve (12), and the threaded sleeve (12) is slidably mounted in the sliding groove (14).
4. A double-sided exposure machine according to claim 2, wherein the second drive assembly comprises two linear slides (15); the two linear sliding rails (15) are arranged on the mounting support (3), the linear sliding rails (15) are perpendicular to the screw rod (10), and the photoetching plate positioning support (4) is arranged on a sliding block of the linear sliding rails (15).
5. A double-sided exposure machine according to claim 1, wherein the shade is a black folding shade.
6. A double-sided exposure machine according to claim 1, wherein the upper exposure lamp (6) and the lower exposure lamp (7) are mounted on the inner wall of the machine body (1) by means of a lifting assembly.
7. A double-sided exposure machine according to claim 6, wherein the lifting assembly comprises an electric push rod (16) and a support base (17) for mounting an exposure lamp; the novel electric power tool is characterized in that a T-shaped guide groove (19) is formed in the inner wall of the machine body (1), the supporting seat (17) is installed in the T-shaped guide groove (19) in a sliding mode through a sliding rail (18), the electric push rod (16) is installed on the machine body (1), and the driving end of the electric push rod (16) is connected with the supporting seat (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022097634.7U CN213240802U (en) | 2020-09-23 | 2020-09-23 | Double-side exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022097634.7U CN213240802U (en) | 2020-09-23 | 2020-09-23 | Double-side exposure machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213240802U true CN213240802U (en) | 2021-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022097634.7U Active CN213240802U (en) | 2020-09-23 | 2020-09-23 | Double-side exposure machine |
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| CN (1) | CN213240802U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488712A (en) * | 2022-02-18 | 2022-05-13 | 广东科视光学技术股份有限公司 | Full-automatic high-speed exposure equipment and method for circuit board |
-
2020
- 2020-09-23 CN CN202022097634.7U patent/CN213240802U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488712A (en) * | 2022-02-18 | 2022-05-13 | 广东科视光学技术股份有限公司 | Full-automatic high-speed exposure equipment and method for circuit board |
| CN114488712B (en) * | 2022-02-18 | 2022-08-30 | 广东科视光学技术股份有限公司 | Full-automatic high-speed exposure equipment and method for circuit board |
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