CN213215647U

CN213215647U - Heat dissipation formula is middle base plate for shoes

Info

Publication number: CN213215647U
Application number: CN202022533092.3U
Authority: CN
Inventors: 管益恺
Original assignee: Qingdao Huangjinkai Shoe Material Co ltd
Current assignee: Qingdao Huangjinkai Shoe Material Co ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-05-18
Anticipated expiration: 2030-11-05

Abstract

The utility model discloses a heat dissipation formula well bottom plate for shoes, its technical scheme is: including top gasket part, well bottom plate part and gasket part, the fixed top gasket part that bonds in well bottom plate part upper end, the fixed gasket part that bonds in well bottom plate part lower extreme, well bottom plate part package rubbing board body, be equipped with perpendicular hole on the plate body, it runs through the plate body upper and lower extreme to erect the hole, be equipped with the diamond hole between plate body upper end and the lower extreme, the diamond hole runs through the plate body front and back side, be equipped with four group's thin copper sheet in the diamond hole, the thin copper sheet both ends flush with the diamond hole, thin copper sheet surface covering one deck thin soft glue layer, the fixed bonding in thin soft glue layer one side is on the diamond hole inner wall, the gasket part includes the gasket, and the gasket bottom side is equipped with the bar groove, erects hole and diamond hole evenly distributed on the plate body, the beneficial effects of the: the thin mesh layer, the diamond holes and the vertical holes are connected for ventilation, and the thin copper sheet conducts heat, so that heat dissipation of the centering bottom plate is achieved.

Description

Heat dissipation formula is middle base plate for shoes

Technical Field

The utility model relates to a middle base plate field for shoes, concretely relates to heat dissipation formula middle base plate for shoes.

Background

The sports shoes are a product under the condition that people do exercises, can let people better do exercises, can let the foot be in a relatively comfortable environment at the in-process of motion, so the well base plate of shoes has the elasticity function, and the foot is stepped on not only comfortablely but also can the shock attenuation, and the protection sportsman's knee joint is not injured, still has the protection sportsman's foot health that the heat dissipation function is better, and under the competitive environment of so drastic, a comfortable well base plate product just seems to be particularly important.

The prior art has the following defects: the existing middle bottom plate has poor heat dissipation effect, can not well protect the foot health of athletes, has low elasticity and can not play a good damping role.

Therefore, there is a need for a heat-dissipating midsole for shoes.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model provides a heat dissipation formula is middle base plate for shoes through bonding top gasket part on the middle base plate, is equipped with the thin net layer on the top gasket, sets up perpendicular hole and diamond hole in middle base plate part, lets diamond hole and perpendicular hole the same, at the downthehole thin copper sheet of installation of diamond, thin net layer and perpendicular hole, diamond hole can ventilate, thin copper sheet can heat conduction to solve the radiating problem of middle base plate.

In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a heat dissipation formula insole board for shoes, includes top gasket part, well bottom plate part and gasket part, the fixed top gasket part that bonds in insole board part upper end, the fixed gasket part that bonds in insole board part lower extreme, insole board part package rubbing board body, be equipped with perpendicular hole on the plate body, it runs through the upper and lower end of plate body to erect the hole, be equipped with diamond hole between plate body upper end and the lower extreme, diamond hole runs through the plate body front and back side, be equipped with four group's thin copper sheets in the diamond hole, the thin copper sheet both ends flush with diamond hole, thin copper sheet surface covering one deck thin soft glue layer, the fixed bonding in thin soft glue layer one side is on diamond hole inner wall, the gasket part includes the gasket, the gasket bottom side is equipped with the bar groove.

Preferably, the top gasket part comprises a frame, and a fine mesh layer is fixedly arranged on the inner side of the frame.

Preferably, the vertical holes and the rhombic holes are uniformly distributed on the plate body.

Preferably, the rhombic holes are communicated with the vertical holes.

Preferably, the plate body is made of elastic polymer materials.

Preferably, the shim member further comprises an L-shaped slot.

The utility model has the advantages that: through be equipped with the graticule layer on the plate body, be equipped with perpendicular hole on the plate body, be equipped with the diamond hole between plate body upper end and the lower extreme, be equipped with four groups of thin copper sheets in the diamond hole, do not connect mutually between the copper sheet, the foot can have a decurrent pressure to the plate body when the foot is stepped on the plate body, because the plate body is that elastic polymer material makes, very good elasticity has, let the diamond hole have the ability of deformation, thin copper sheet both ends flush with the diamond hole, thin copper sheet surface covering one deck thin soft glue layer, thin soft glue layer covers thin copper sheet and can prevent that thin copper sheet from rustting, thin soft glue layer has thin and soft function, and do not influence the heat conductivity of thin copper sheet and the elasticity of plate body.

Drawings

FIG. 1 is a schematic view of a heat dissipation type middle sole plate structure for shoes provided by the present invention;

fig. 2 is a schematic structural view of a middle sole component provided by the present invention;

FIG. 3 is a side view of a diamond-shaped heat dissipation hole provided by the present invention;

FIG. 4 is a top view of a bottom pad assembly provided by the present invention;

fig. 5 is a top view of the top gasket part provided by the present invention;

fig. 6 is a schematic view of a gasket member according to example 2 of the present invention.

In the figure: 1 top gasket part, 101 frame, 102 fine mesh layer, 2 middle bottom plate part, 201 plate body, 202 vertical holes, 203 diamond holes, 204 thin soft adhesive layer, 205 thin copper sheet, 3 bottom gasket part, 301 gasket, 302 strip groove and 303L-shaped groove.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example 1:

referring to fig. 1-5, the present invention provides a heat dissipation type shoe midsole, which comprises a top pad member 1, a midsole member 2, and a bottom pad member 3;

furthermore, the upper end of the middle sole plate component 2 is fixedly bonded with the top gasket component 1, the lower end of the middle sole plate component 2 is fixedly bonded with the bottom gasket component 3, the middle sole plate component 2 comprises a plate body 201, vertical holes 202 are arranged on the plate body 201, the vertical holes 202 penetrate through the upper end and the lower end of the plate body 201, diamond-shaped holes 203 are arranged between the upper end and the lower end of the plate body 201, the diamond-shaped holes 203 penetrate through the front side and the rear side of the plate body 201, four groups of thin copper sheets 205 are arranged in the diamond-shaped holes 203, the thin copper sheets 205 are thin and cannot influence the deformation function of the plate body 201, the copper sheets 205 are not connected with each other, when feet step on the plate body 201, the feet can apply downward pressure to the plate body 201, the plate body 201 is made of elastic high polymer material and has excellent elasticity, the connection between the copper sheets 205 is that the elasticity of the plate body 201 is not influenced, the diamond-shaped holes 203 have the deformation, the thin copper sheet 205 is a metal with good heat conduction, so that the thin copper sheet 205 is convenient to conduct heat of the board body 201 out of the air, and heat dissipation can be better achieved, the thin copper sheet 205 is covered with the thin soft rubber layer 204, the thin copper sheet 205 is arranged in the diamond holes 203, the diamond holes 203 penetrate through the board body 201, when the board body 201 meets rainwater, the rainwater can easily enter the diamond holes 203, the thin copper sheet 205 in the diamond holes 203 can be corroded by the rainwater for a long time, the thin soft rubber layer 204 covers the thin copper sheet 205, rusting of the thin copper sheet 205 can be prevented, and the thin soft rubber layer 204 has the functions of thinness and softness, and the heat conduction of the thin copper sheet 205 and the elasticity of the board body 201 are not affected.

Further, the bottom pad member 3 comprises a pad 301, and a strip-shaped groove 302 is formed in the bottom side of the pad 301, and the strip-shaped groove 302 can play a role in skid resistance.

Further, the top gasket part 1 comprises a frame 101, a fine mesh layer 102 is fixedly installed on the inner side of the frame 101, the fine mesh layer 102 has an air-permeable function, the lower end of the fine mesh layer 102 is connected with vertical holes 202 on the plate body 201, the vertical holes 202 are communicated with rhombic holes 203, the vertical holes 202 can bring heat above the fine mesh layer into the rhombic holes 203 through the vertical holes 202, and air flow generated by extrusion on the plate body 201 during movement is exhausted.

Further, the plate body 201 is made of elastic polymer materials, and the elastic polymer bodies generally refer to materials which can be restored to the original shape after external force is removed, so that feet can be more comfortable to step on the elastic polymer bodies, a shock absorption effect can be achieved, and the probability of injury is reduced.

The utility model discloses a use as follows: the fine mesh layer 102 is arranged on the plate body 201, the vertical hole 202 is arranged on the plate body 201, the diamond holes 203 are arranged between the upper end and the lower end of the plate body 201, the diamond holes 203 and the vertical hole 202 can play a role in ventilation and heat dissipation, four groups of thin copper sheets 205 are arranged in the diamond holes 203, the deformation function of the plate body 201 cannot be influenced when the thin copper sheets 205 are thin, the copper sheets 205 are not connected with each other, a foot can have downward pressure on the plate body 201 when the foot steps on the plate body 201, the plate body 201 is made of elastic high polymer materials and has excellent elasticity, the connection between the copper sheets 205 is realized so as not to influence the elasticity of the plate body 201, the diamond holes 203 have the deformation capacity, two ends of the thin copper sheets 205 are flush with the diamond holes 203 so as to expose two ends of the thin copper sheets 205 in, the thin soft rubber layer 204 covers the thin copper sheet 205 to prevent the thin copper sheet 205 from rusting, and the thin soft rubber layer 204 has the functions of thinness and softness, does not influence the heat conductivity of the thin copper sheet 205 and the elasticity of the board body 201, and achieves the effects of elasticity and heat dissipation of the bottom base plate.

Example 2:

referring to fig. 6, the heat dissipation type shoe midsole provided by the present invention comprises a bottom pad member 3;

further, the gasket member 3 further includes an L-shaped groove 303, and the L-shaped groove 303 may play a role in increasing the rubbing force of the gasket member 3.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims

1. The utility model provides a heat dissipation formula insole board for shoes, includes top gasket part (1), insole board part (2) and bottom gasket part (3), its characterized in that: the upper end of the middle bottom plate component (2) is fixedly bonded with a top gasket component (1), the lower end of the middle bottom plate component (2) is fixedly bonded with a bottom gasket component (3), the middle bottom plate component (2) comprises a plate body (201), wherein a vertical hole (202) is arranged on the plate body (201), the vertical holes (202) penetrate through the upper end and the lower end of the plate body (201), rhombic holes (203) are arranged between the upper end and the lower end of the plate body (201), the diamond holes (203) penetrate through the front side and the rear side of the plate body (201), four groups of thin copper sheets (205) are arranged in the diamond holes (203), two ends of the thin copper sheet (205) are flush with the diamond holes (203), a thin soft adhesive layer (204) covers the surface of the thin copper sheet (205), one side of the thin soft adhesive layer (204) is fixedly adhered to the inner wall of the diamond hole (203), the bottom gasket part (3) comprises a gasket (301), and a strip-shaped groove (302) is formed in the bottom side of the gasket (301).

2. The heat dissipating midsole of claim 1, wherein: the top gasket part (1) comprises a frame (101), and a fine mesh layer (102) is fixedly arranged on the inner side of the frame (101).

3. The heat dissipating midsole of claim 1, wherein: the vertical holes (202) and the rhombic holes (203) are uniformly distributed on the plate body (201).

4. The heat dissipating midsole of claim 1, wherein: the rhombic holes (203) are communicated with the vertical holes (202).

5. The heat dissipating midsole of claim 1, wherein: the plate body (201) is made of elastic high polymer materials.

6. The heat dissipating midsole of claim 1, wherein: the base pad member (3) further comprises an L-shaped slot (303).