CN213208901U - Warping degree measuring system of printed circuit board - Google Patents
Warping degree measuring system of printed circuit board Download PDFInfo
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- CN213208901U CN213208901U CN202021997163.9U CN202021997163U CN213208901U CN 213208901 U CN213208901 U CN 213208901U CN 202021997163 U CN202021997163 U CN 202021997163U CN 213208901 U CN213208901 U CN 213208901U
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Abstract
The utility model provides a printed circuit board warpage measuring system belongs to circuit board detection technology field, including the level measurement mesa that is used for providing reference plane when PCB board warpage measures, the inductance coil unit that is used for responding to PCB board roughness parameter, the inductance digital conversion unit that is used for inductance value analog-to-digital conversion and the digital signal processor that is used for calculating the warpage; the inductance coil unit comprises a plurality of inductance coils, the inductance coils are attached to the horizontal measurement table board, the inductance digital conversion unit is electrically connected with the inductance coil unit, and the inductance digital conversion unit is electrically connected with the digital signal processor. The utility model provides a printed circuit board warpage measurement system simple structure, easily operation can carry out the efficient to the warpage of PCB board and measure, and the measuring result is reliable and have lower implementation cost concurrently.
Description
Technical Field
The utility model relates to a circuit board detects technical field, especially relates to a printed circuit board angularity measurement system.
Background
With the rapid development of the electronic industry and the wide use of SMT automation plug-in devices and patch devices, the quality requirement for Printed Circuit Boards (PCB) in the industry is higher and higher. The early electronic product market has low requirement on the flatness of the surface of the PCB, and the IPC specification provides that the warping degree of the PCB must be lower than 5%. If the flatness of the PCB board does not meet the standard requirements, the finished product qualification rate of the circuit board is seriously influenced, the subsequent conditions of a large amount of cold solder joints, solder missing and incapability of welding are caused, and the service performance of the electronic product is seriously influenced.
In the field of PCB warpage measurement, a traditional method is to measure the warpage of a PCB by a marble measurement table, and the traditional method adopts the following measures: the PCB is flatly placed on the marble measuring table, four corners of the board are lightly tapped manually to judge whether the circuit board is warped or not, and then specific data of the warping of the board are measured through a plug gauge. The measuring method for judging and quantifying the board warpage by adopting the manual mode has the advantages that firstly, the possibility of missed detection is high; secondly, the data measured by different personnel have differences, and the error is large; thirdly, the efficiency of the measurement is low. In addition, some intelligent PCB warpage measuring equipment exists in the market at present, but the warpage of the printed board is measured almost by adopting a laser CCD displacement sensor and an imaging technology. Although the method has high measurement precision, the corresponding cost is expensive, and the cost control of enterprises is not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model provides a printed circuit board warpage measurement system comes to carry out the efficient to the warpage of PCB board and measures, and system structure is simple, and the measuring result is reliable and have lower implementation cost concurrently.
The utility model discloses the technical scheme who takes does:
the utility model provides a printed circuit board angularity measurement system, include:
the horizontal measurement table top is used for providing a horizontal reference plane for measuring the warpage of the PCB;
the inductance coil unit comprises a plurality of inductance coils, and the inductance coils are attached to the horizontal measuring table top and used for sensing flatness parameters of the PCB;
the inductance digital conversion unit is electrically connected with the inductance coil unit and is used for acquiring inductance digital quantity sensed by the inductance coil;
and the digital signal processor is electrically connected with the inductance digital conversion unit and is used for receiving the real-time inductance digital quantity transmitted by the inductance digital conversion unit, calculating the warping degree parameter and outputting a warping degree result.
The utility model provides a printed circuit board angularity measurement system, preferably, inductance coils unit includes first inductance coil, second inductance coil, third inductance coil, fourth inductance coil and fifth inductance coil; the first inductance coil, the second inductance coil, the third inductance coil and the fourth inductance coil are respectively arranged in the four corner directions of the horizontal measurement table board; the fifth inductance coil is arranged at the center of the horizontal measuring table board.
The utility model provides a printed circuit board angularity measurement system, preferably, inductance digital conversion unit includes first inductance digital converter, second inductance digital converter, third inductance digital converter, fourth inductance digital converter and fifth inductance digital converter; the first inductance digital converter is electrically connected with the first inductance coil; the second inductance digital converter is electrically connected with the second inductance coil; the third inductance digital converter is electrically connected with the third inductance coil; the fourth inductance digital converter is electrically connected with the fourth inductance coil; the fifth inductance digital converter is electrically connected with the fifth inductance coil; the first inductance digitizer, the second inductance digitizer, the third inductance digitizer, the fourth inductance digitizer and the fifth inductance digitizer are electrically connected to the digital signal processor.
The utility model provides a printed circuit board angularity measurement system, preferably, the surface of level measurement mesa is seted up a plurality of fixed slots that are used for spacing inductance coils downwards; one of the inductor coils is fixed in one of the fixing grooves.
The utility model provides a printed circuit board angularity measurement system, preferably, printed circuit board angularity measurement system still includes a display element; the display unit is electrically connected with the digital signal processor; the display unit is used for displaying the warping degree value of each PCB to be tested.
The utility model provides a printed circuit board angularity measurement system, preferably, the display element includes touch display screen and pilot lamp device; the touch display screen and the indicator light device are electrically connected with the digital signal processor.
The utility model provides a printed circuit board angularity measurement system, preferably, the display element still includes the computer, computer and digital signal processor communication connection; the computer is connected with a printer.
The system for measuring the warping degree of the printed circuit board provided by the utility model preferably further comprises an audible and visual alarm; and the audible and visual alarm is electrically connected with the digital signal processor.
The utility model provides a printed circuit board warpage measuring system, preferably, still include a conveyer belt that is used for the automatic transmission PCB board to be measured and a positioning control device that is used for controlling the fixed point of conveyer belt stops; the conveying belt is arranged above the horizontal measuring table top, and the positioning control device is electrically connected with the driving mechanism of the conveying belt and used for controlling the conveying belt to stop at the horizontal measuring table top; and the conveyor belt is provided with a through groove in the vertical direction for avoiding the inductance coil unit.
The technical scheme has the following advantages or beneficial effects:
the utility model provides a printed circuit board warpage measuring system belongs to circuit board detection technology field, including the measuring mesa that is used for providing horizontal reference plane when PCB board warpage measures, the inductance coil unit that is used for responding to PCB board roughness parameter, the inductance digital conversion unit that is used for inductance value analog-to-digital conversion and the digital signal processor that is used for calculating the warpage; the inductance coil unit comprises a plurality of inductance coils, the inductance coils are attached to the horizontal measurement table board, the inductance digital conversion unit is electrically connected with the inductance coil unit, and the inductance digital conversion unit is electrically connected with the digital signal processor. The utility model provides a printed circuit board warpage measurement system simple structure, easily operation can carry out the efficient to the warpage of PCB board and measure, and the measuring result is reliable and have lower implementation cost concurrently.
Drawings
The invention and its features, aspects and advantages will become more apparent from a reading of the following detailed description of non-limiting embodiments with reference to the attached drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not intended to be drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic diagram of a partial structure in a system for measuring warpage in a printed circuit board according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram of an electrical connection relationship of the system for measuring warpage of a printed circuit board according to embodiment 1 of the present invention;
fig. 3 is another schematic diagram of a partial structure in a system for measuring warpage in a printed circuit board according to embodiment 1 of the present invention.
Detailed Description
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship thereof is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. The terms "mounted," "connected," and "connected" should be construed broadly and may include, for example, fixed connections, removable connections, or integral connections; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. When the terms "comprises" and/or "comprising" are used in this specification, as used herein, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof. The appearances of the terms first, second, and third, if any, are used for descriptive purposes only and are not intended to be limiting or imply relative importance.
In the following, the technical solutions in the embodiments of the present invention are clearly and completely described with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1:
in the prior art, when a printed circuit board (hereinafter, referred to as a PCB) is subjected to warpage measurement, two common ways are: firstly, a marble measuring table is combined with a plug gauge for measurement, the implementation mode is complicated, the operation is time-consuming and labor-consuming, the possibility of missed detection is high, and the efficiency is low; secondly, adopt laser CCD displacement sensor cooperation imaging technology to measure, although measurement accuracy is higher, corresponding implementation cost is comparatively expensive, is unfavorable for the saving of cost of enterprises.
To the above-mentioned problem that exists among the prior art, embodiment 1 of the present invention provides a printed circuit board warpage measurement system, understand with reference to fig. 1 and 2, include:
the horizontal measurement table top 1 is used for providing a horizontal reference plane for the warpage measurement of the PCB 6;
the inductance coil unit 2 comprises a plurality of inductance coils, and the inductance coils are attached to the horizontal measuring table board 1 and used for sensing flatness parameters of the PCB 6;
the inductance digital conversion unit 3 is electrically connected with the inductance coil unit 2 and is used for acquiring inductance digital quantity sensed by the inductance coil unit 2;
and the digital signal processor 4 is electrically connected with the inductance digital conversion unit 3 and is used for receiving the real-time inductance digital quantity transmitted by the inductance digital conversion unit 3, calculating a warping degree parameter and outputting a warping degree result.
When the system for measuring the warping degree of the printed circuit board provided by embodiment 1 of the present invention is implemented, an operator can place the PCB 6 to be detected on the horizontal measurement table top 1, and place the PCB 6 to be detected above the inductance coil unit 2, because the horizontal measurement table top 1 is placed horizontally, if the PCB 6 to be detected is not warped, the PCB should be in complete contact with the horizontal measurement table top 1; on the contrary, if the PCB 6 has warpage, a part of the area cannot contact the leveling table 1, and a distance from the inductor is formed. When the distance difference exists between the plurality of inductance coils of the inductance coil unit 2 and the PCB, the difference of the induced inductance is correspondingly caused, that is, when the inductance sensed by each inductance coil has an obvious difference, the inductance difference can be used to further determine whether the PCB 6 meets the requirement of the predetermined warping degree. The inductance coil unit 2 and the inductance digital conversion unit 3 are electrically connected, so that the inductance coil unit 2 can output the inductance analog quantity of each inductance coil relative to the PCB 6 to the inductance digital conversion unit 3 to form the inductance digital quantity. Then, the digital signal processor 4 is electrically connected with the inductance digital conversion unit 3, the digital signal processor 4 can read the inductance digital quantity parameter converted by the inductance digital conversion unit 3 in real time, convert the inductance digital quantity parameter into the warping degree value of the PCB 6 by using a built-in digital signal algorithm, output the warping degree result to an external device, namely realize the warping degree measurement of the PCB by a non-contact inductance sensing technology, convert the measured value into the self-inductance or mutual inductance change of a coil, have no movable contact, are not sensitive to external interference, have simple structure, easy operation and lower implementation cost, and have higher practicability and reliability.
The embodiment of the utility model provides a printed circuit board warpage measurement system, inductance coil's quantity is not limited to specific number in inductance coil unit 2, for example inductance coil unit 2 can include 10 inductance coil, so correspondingly, inductance digital conversion unit 3 as long as can carry out the digital conversion with 10 inductance coil's inductance quantity can, be not limited to specific form and quantity. Digital signal processor 4 can imbed the warpage algorithm in advance, combines the inductance value difference that inductance coil unit 2 sensing comes to convert into the warpage of PCB board 6, and concrete algorithm technical person can further implement on the basis of the utility model discloses a printed circuit board warpage measurement system structure, and this is that technical person in the art can know and understand. As a specific and preferable mode, in example 1, referring to fig. 2, the inductance coil unit 2 includes a first inductance coil 21, a second inductance coil 22, a third inductance coil 23, a fourth inductance coil 24, and a fifth inductance coil 25; the first inductance coil 21, the second inductance coil 22, the third inductance coil 23 and the fourth inductance coil 24 are respectively arranged in four corner directions of the horizontal measurement table board 1; the fifth inductance coil 25 is arranged at the center of the horizontal measuring table top 1. Through arranging these 5 measuring points on horizontal measurement mesa 1, when the PCB board 6 that awaits measuring is placed on inductance coil unit 2, can realize simple efficient board warpage degree and measure, and the angularity measuring method during concrete implementation is: the digital signal processor 4 receives the inductance parameters of the five measurement points transmitted from the inductance-to-digital conversion unit 3, selects the inductance parameter measured by the fifth inductor 25 as a reference value, calculates the difference between the inductance value and the inductance value of the inductors (the first inductor 21, the second inductor 22, the third inductor 23, and the fourth inductor 24) at the other four base points, and converts the difference into the warping degree, respectively, and the calculation formula refers to (1) and (2):
Ldatum-LMeasuring＝ΔL； (1)
ΔL*λ＝H； (2)
Wherein L isDatumThe inductance value parameter (unit: nH) measured by the fifth inductance coil; l isMeasuringThe inductance parameters (unit: nH) measured by the first inductance coil 21, the second inductance coil 22, the third inductance coil 23 and the fourth inductance coil 24 respectively; λ is a predetermined inductance-to-distance conversion coefficient (unit: nH/um); h refers to the calculated warp (in um) for each angle measurement point. After the warping degree of the measuring point of each corner is determined, the warping degrees of the measuring points of the four corners relative to the middle base point are fitted, and the actual warping degree of the PCB is calculated. In order to facilitate understanding by those skilled in the art, in embodiment 1 of the present invention, the method for performing warping degree fitting by using the data measured by the aforementioned five inductance coils specifically includes: when the measured warpage of the measuring points at the four corners is a positive value relative to the middle base point, taking the maximum value of the warpage of the measuring points at the four corners as the final warpage value of the PCB; and when the warpage measured by the measuring points at the four corners has a positive value and a negative value, subtracting the minimum value of the negative value from the maximum value of the positive value of the warpage to calculate the final warpage value of the printed board. Through the utility model discloses printed circuit board angularity measurement system structure that embodiment 1 provided, the high-efficient reliable operation of PCB board angularity can be realized to the five measuring point angularity fitting methods that cooperation embodiment 1 provided.
Preferably, in this embodiment 1, referring to fig. 2, the inductance-to-digital conversion unit 3 includes a first inductance-to-digital converter 31, a second inductance-to-digital converter 32, a third inductance-to-digital converter 33, a fourth inductance-to-digital converter 34, and a fifth inductance-to-digital converter 35; the first inductance-to-digital converter 31 is electrically connected with the first inductance coil 21; the second inductance-to-digital converter 32 is electrically connected to the second inductance coil 22; the third inductance-to-digital converter 33 is electrically connected to the third inductance coil 23; the fourth inductance-to-digital converter 34 is electrically connected to the fourth inductance coil 24; the fifth inductance-to-digital converter 35 is electrically connected to the fifth inductance coil. Through setting up five inductance digital converters (31, 32, 33, 34, 35) respectively, an inductance digital converter electric connection inductance coil, five inductance digital converters all and digital signal processor 4 electric connection, can realize the mutual independence of the inductance value analog-to-digital conversion process of five measuring point positions, mutual noninterference has ensured the reliability of angularity measuring result.
As a preferred embodiment, in order to enhance the fixing reliability and vibration resistance of the inductance coils of the inductance coil unit 2, a plurality of fixing slots (not shown in the figure) for limiting the inductance coils are formed downwards on the surface of the horizontal measuring table top 1; one of the inductor coils is fixed in one of the fixing grooves. Therefore, the inductance coil is arranged in the fixing groove, the reliability of fixing the position of the inductance coil can be improved to a certain degree, the inductance coil is not easy to slide, and the stability and the service life of the inductance coil in long-term work are improved.
More preferably, as can be understood by referring to fig. 3, the system for measuring warpage of a printed circuit board according to embodiment 1 of the present invention further includes a conveyor belt 7 for automatically conveying the PCB 6 to be measured and a positioning control device (not shown in the figure); the conveyor belt 7 is arranged above the horizontal measuring table top 1, and the positioning control device is electrically connected with a driving mechanism of the conveyor belt 7 and used for controlling the conveyor belt 7 to stop at the horizontal measuring table top 1; the conveyor belt 7 is provided with a through groove 8 for avoiding the inductance coil unit 2 in the vertical direction. But through further setting up horizontal transport's conveyer belt 7 on horizontal measurement mesa 1, can be through the transport effect of conveyer belt 7, realize the automatic conveying of the PCB board 6 that awaits measuring, when conveyer belt 7 reaches PCB board 6 and carries out PCB board 6 and detect the time measuring in horizontal measurement mesa 1 department, the short-term dwell of positioning control device accessible time delay program drive conveyer belt 7 for example, and utilize inductance coil unit 2, inductance digital conversion unit 3 and digital signal processor 4 cooperation to realize the real-time warping degree of the PCB board 6 that awaits measuring at the clearance of short-term dwell and measure. Wherein, the positioning control device is not limited to a specific form, for example, when implementing, a calibration center sensor may be disposed near the horizontal measurement table top 1, when the conveyor belt 7 conveys the PCB board 6 to the calibration center of the horizontal measurement table top 1, a sensor signal may be transmitted to the driving control mechanism of the conveyor belt 7, and then the driving control mechanism of the conveyor belt 7 may control the conveyor belt 7 to stop at the inductance coil unit 2, which is based on the technical scheme of the present invention, the present invention can be understood and further implemented, and is not described herein in detail. Through the through groove that conveyer belt 7 seted up in the vertical direction, PCB board 6 that awaits measuring can see through the inductance coils induction connection of the through groove 8 and the several measuring point position of seting up on conveyer belt 7 after the fixed point stops, and several inductance coils can carry out the digital quantity conversion with real-time inductance value output to inductance digital conversion unit 3 to warp degree conversion is carried out through digital signal processor 4, and the conversion method refers to aforementioned embodiment. Therefore, the PCB warpage measuring system with high automation degree is realized, the structure is simple, the implementation is easy, the labor intensity and the operation time for manually placing the PCB 6 on the horizontal measuring table board 1 are saved, the efficiency of detecting the warpage of the PCB in the PCB process flow process is obviously improved, and the yield of products is improved.
The embodiment 1 of the utility model provides a printed circuit board warpage measurement system, digital signal processor 4 read the inductance digital quantity parameter that inductance digital conversion unit 3 converted in real time, utilize the warpage value that built-in digital signal algorithm converts into PCB board 6, to outside device output warpage result can, be not limited to specific output form. As a preferred embodiment, the system comprises a display unit 5; the display unit 5 is electrically connected with the digital signal processor 4; the display unit 5 is used for displaying the warping degree value of each PCB 6 to be tested. Through further setting up display element 5, the on-the-spot operating personnel who needs manual place the PCB board 6 that await measuring on the level survey mesa 1 of being convenient for, perhaps the other operating personnel of conveyer belt 7, look over each PCB board 6's that await measuring warpage numerical value directly perceived. The display unit 5 may include a touch display screen (not shown) and an indicator light device (not shown); touch display screen and pilot lamp device all are the same 4 electric connection of digital signal processor, display element 5 based on this structure, can look over the angularity curve that historical PCB board 6 detected through the touch display screen that sets up at the scene on the one hand, look over the yields of PCB board directly perceived, through the hand touch operation, can realize good mutual level, can also show the warning typeface of NG board or OK edition through the touch display screen on real time, the staff of being convenient for carries out classification to the PCB board of difference, therefore, staff's work efficiency is improved. Furthermore, the arranged indicator light device, such as a red light and a green light, is bright when being implemented, and represents that the warping degree of the PCB is unqualified, and the green light represents that the warping degree of the PCB is qualified, so that the quality level of the PCB to be detected can be reflected by color visual impact, the indication device is more striking, and the phenomenon of misclassification or omission of numerical value display is avoided. More preferably, the embodiment 1 of the present invention provides a system for measuring warpage of printed circuit board, which can further include an audible and visual alarm (not shown in the figure), the audible and visual alarm is the same as the electrical connection of digital signal processor 4, and is used for sending an audible and visual alarm when the PCB board 6 to be measured is not qualified. Therefore, particularly when the method is applied to the continuous PCB production process flow, when the situation that the warp value exceeds the warp threshold value set in the digital signal processor continuously occurs in the PCB, an acousto-optic alarm can be automatically sent out to remind technicians beside a production line to intervene, and the method has a strong acousto-optic prompt effect.
As another preferred implementation manner, in the system for measuring warpage of a printed circuit board provided in embodiment 1 of the present invention, the display unit 5 may further include a computer (not shown in the figure), the computer is in communication connection with the digital signal processor 4, and the computer is connected to a printer, so as to display and store the measurement result on the site of PCB detection; moreover, the computer is in communication connection with the digital signal processor 4, which means that the warping degree measurement calculation result of the digital signal processor 4 can be uploaded to a computer host of the measuring table through a serial port connection line, the warping degree measurement report template in the computer is automatically filled with parameters and displayed through a display, and a warping degree measurement report is output through a connected printer, so that the human-computer interaction level of the warping degree measurement system of the printed circuit board and the intuitiveness of the quality detection result are better enhanced.
In the system for measuring the warping degree of the printed circuit board provided by the utility model, the inductance coil in the inductance coil unit 2 is not limited to a specific shape and structure, as long as the inductance between the inductance coil and the PCB 6 can be sensed; the inductance-to-digital converter of the inductance-to-digital conversion unit 3 is not limited to a specific model and structure as long as it can convert an inductance analog quantity sensed by the inductance coil into an inductance digital quantity. Preferably, in this embodiment 1, an inductance digital converter of the model LDC1000 manufactured by TI corporation is adopted to perform analog-to-digital conversion on the inductance value sensed by the inductance coil, and send the converted inductance value to the main board of the digital signal processor 4 for processing, and the LDC1000 is provided with an SPI interface, and can be conveniently connected to the MCU of the digital signal processor 4. The LDC1000 has simple structure, reliable work and high measurement precision, the precision can reach nH level, the distance between a measured object and an inductance coil can reach um level by corresponding conversion, the zero point is stable, the output power is larger, the inductance digital converter can directly output a detectable digital signal without a complex conversion circuit, and simultaneously, the submicron resolution can be realized in position sensing application through 16-bit resonance impedance and 24-bit inductance value; moreover, can avoid the influence of non-conductive pollutants such as greasy dirt dust based on non-contact sensing technology, can increase of service life, for traditional angularity measurement system's framework scheme in the trade, this system architecture adopts low-cost sensor and conduction target, need not the magnet, can reduce system cost more effectively, and the standard during operation power consumption when implementing is less than 8.5mW, and the power consumption is less than 1.25mW under the standby mode, has realized low-power consumption, little encapsulation, low-cost solution, be favorable to practicing thrift system energy consumption.
Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention, and are not described herein.
The above description is directed to the preferred embodiment of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that devices and structures not described in detail are understood to be implemented in a manner common in the art; the person skilled in the art, without affecting the essence of the invention, may make numerous possible variations and modifications, or may modify the equivalent embodiments, without departing from the technical solution of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments by the technical entity of the present invention all still fall within the protection scope of the technical solution of the present invention, where the technical entity does not depart from the content of the technical solution of the present invention.
Claims (9)
1. A printed circuit board warp measurement system, comprising:
the horizontal measurement table top is used for providing a horizontal reference plane for measuring the warpage of the PCB;
the inductance coil unit comprises a plurality of inductance coils, and the inductance coils are attached to the horizontal measuring table top and used for sensing flatness parameters of the PCB;
the inductance digital conversion unit is electrically connected with the inductance coil unit and is used for acquiring inductance digital quantity sensed by the inductance coil;
and the digital signal processor is electrically connected with the inductance digital conversion unit and is used for receiving the real-time inductance digital quantity transmitted by the inductance digital conversion unit, calculating the warping degree parameter and outputting a warping degree result.
2. The system for measuring warpage of a printed circuit board of claim 1, wherein the inductor unit comprises a first inductor, a second inductor, a third inductor, a fourth inductor and a fifth inductor; the first inductance coil, the second inductance coil, the third inductance coil and the fourth inductance coil are respectively arranged in the four corner directions of the horizontal measurement table board; the fifth inductance coil is arranged at the center of the horizontal measuring table board.
3. The system for measuring warpage of a printed circuit board of claim 2, wherein the inductance-to-digital conversion unit comprises a first inductance-to-digital converter, a second inductance-to-digital converter, a third inductance-to-digital converter, a fourth inductance-to-digital converter and a fifth inductance-to-digital converter; the first inductance digital converter is electrically connected with the first inductance coil; the second inductance digital converter is electrically connected with the second inductance coil; the third inductance digital converter is electrically connected with the third inductance coil; the fourth inductance digital converter is electrically connected with the fourth inductance coil; the fifth inductance digital converter is electrically connected with the fifth inductance coil; the first inductance digitizer, the second inductance digitizer, the third inductance digitizer, the fourth inductance digitizer and the fifth inductance digitizer are electrically connected to the digital signal processor.
4. The system for measuring warpage of a printed circuit board according to claim 1, wherein the surface of the horizontal measuring table is provided with a plurality of fixing grooves for limiting the inductance coil; one of the inductor coils is fixed in one of the fixing grooves.
5. The pcb warp measurement system of claim 1, wherein the pcb warp measurement system further comprises a display unit; the display unit is electrically connected with the digital signal processor; the display unit is used for displaying the warping degree value of each PCB to be tested.
6. The system according to claim 5, wherein the display unit comprises a touch screen and an indicator light device; the touch display screen and the indicator light device are electrically connected with the digital signal processor.
7. The printed circuit board warp measurement system of claim 6, wherein said display unit further comprises a computer, said computer being communicatively coupled to said digital signal processor, said computer being coupled to a printer.
8. The printed circuit board warp measurement system of claim 7, further comprising an audible and visual alarm; and the audible and visual alarm is electrically connected with the digital signal processor.
9. The system for measuring the warpage of a printed circuit board according to any one of claims 1 to 8, further comprising a conveyor belt for automatically conveying the PCB to be measured and a positioning control device for controlling the conveyor belt to stop at a fixed point; the conveying belt is arranged above the horizontal measuring table top, and the positioning control device is electrically connected with the driving mechanism of the conveying belt and used for controlling the conveying belt to stop at the horizontal measuring table top; and the conveyor belt is provided with a through groove in the vertical direction for avoiding the inductance coil unit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021997163.9U CN213208901U (en) | 2020-09-11 | 2020-09-11 | Warping degree measuring system of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021997163.9U CN213208901U (en) | 2020-09-11 | 2020-09-11 | Warping degree measuring system of printed circuit board |
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| CN213208901U true CN213208901U (en) | 2021-05-14 |
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| CN202021997163.9U Active CN213208901U (en) | 2020-09-11 | 2020-09-11 | Warping degree measuring system of printed circuit board |
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