CN213198331U - Monochrome hollow solar silicon wafer cutting lining plate cutting device - Google Patents
Monochrome hollow solar silicon wafer cutting lining plate cutting device Download PDFInfo
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- CN213198331U CN213198331U CN202020867680.8U CN202020867680U CN213198331U CN 213198331 U CN213198331 U CN 213198331U CN 202020867680 U CN202020867680 U CN 202020867680U CN 213198331 U CN213198331 U CN 213198331U
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Abstract
The utility model discloses a monochromatic hollow solar silicon wafer cutting lining plate cutting device, which comprises a workbench and supporting legs, the dust collecting device of the utility model consists of a fixed disc, supporting rods, a dust collecting box and an embedding frame, the embedding frame is supported by fixing the fixed disc bolts on the four supporting rods at the lower end of the workbench, the cutting position of the embedding frame and the upper workbench are positioned on the same vertical central line, then the dust collecting box is embedded in the embedding frame, the cutting lining plate generates dust which falls from the cutting groove of the workbench during the working, the falling dust is intercepted and collected by dust collection, so that the dust can not fall on the ground, the beneficial effects are that the dust collecting device is arranged at the lower end of the workbench, the dust falling from the workbench during the cutting is collected by the dust collecting box, the ground is kept clean, the worker does not need to clean the ground after working, and can remove the dust when the dust collecting box is full, and then the glass is inlaid in the inlaid frame again for reuse.
Description
Technical Field
The utility model belongs to the technical field of solar energy silicon wafer is relevant, concretely relates to monochromatic cavity solar energy silicon wafer cutting welt cutting device.
Background
Elemental silicon is a gray, brittle, tetravalent, nonmetallic chemical element. The earth crust composition is composed of 27.8% elemental silicon, second only to the oxygen content, which is a relatively rich element in nature. The silicon element is found in quartz, agate, flint and ordinary beach stones. Silicon wafers, also known as wafers, are processed from silicon ingots, and millions of transistors can be etched on the silicon wafers by a special process, and are widely used in the manufacture of integrated circuits. And cutting the monochromatic hollow solar silicon wafer cutting lining plate by using a cutting device.
The prior art has the following problems: carry out cutting work to monochromatic cavity solar energy silicon wafer cutting welt through cutting device, place the welt on the workstation, move through the ground cutting mechanism of removal support frame and carry out work, but the dust that the cutting produced can be along with the workstation and the groove drops subaerially, needs the manual work to clear up after making work accomplish, and is very troublesome.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a monochromatic cavity solar energy silicon wafer cutting welt cutting device to propose in solving above-mentioned background art and carry out cutting work to monochromatic cavity solar energy silicon wafer cutting welt through cutting device, place the welt on the workstation, remove through the earth cutting mechanism of removal support frame and carry out work, nevertheless the dust that the cutting produced can be along with the workstation and the groove drops subaerially, needs the manual work to clear up after making work completion, very troublesome problem.
In order to achieve the above object, the utility model provides a following technical scheme:
a monochromatic hollow solar silicon wafer cutting lining plate cutting device comprises a workbench and supporting legs, a movable support frame is fixed at the middle part of the upper end of the workbench through a bolt, the left side of the movable support frame is connected with a moving mechanism, the lower end of the moving mechanism is fixed with a cutting mechanism through a support frame bolt, the upper side of the right end of the moving support frame is connected with a servo motor through a rotating shaft, a cutting adjusting mechanism is fixed on the right side bolt at the front end of the workbench, supporting legs are fixed on the left side bolt and the right side bolt at the lower end of the workbench, a dust collecting device is fixed at the middle part of the lower end of the workbench between the two supporting legs through bolts, the dust collecting device comprises a fixed disc, a supporting rod, a dust collecting box and an embedding frame, wherein the supporting rod is welded at the four corners of the upper end of the embedding frame, the upper end welding of bracing piece has the fixed disk, inlay the middle part of frame and inlay and have the dust collection box.
Preferably, the cutting adjustment mechanism includes adjusting bolt, movable plate, shifting chute and regulating plate, the upper end middle part of regulating plate is provided with the shifting chute, the upper end of regulating plate is provided with the movable plate, the upper end middle part threaded connection of movable plate has adjusting bolt.
Preferably, the cutting mechanism comprises a driving motor and a cutting blade, and the cutting blade is connected to the right end of the driving motor in a rotating manner.
Preferably, a threaded rod is arranged in the supporting beam of the movable supporting frame and is in threaded connection with the moving mechanism.
Preferably, the bracing piece is provided with four, and four the bracing piece passes through upper end welded fixed disk bolt fastening and will inlay the frame support at the workstation.
Preferably, the moving plate penetrates through a moving groove of the adjusting plate through threads of the adjusting bolt to be connected, the adjusting bolt is unscrewed to enable the moving plate to move back and forth on the adjusting plate through the moving groove, and the cutting size of the lining plate placed on the workbench is adjusted.
Preferably, the dust collecting box is embedded in the embedding frame and positioned on the same vertical central line with the cutting position of the upper workbench, and dust falling from cutting is collected.
Preferably, the upper end surface of workstation is provided with three cutting groove, and cutting mechanism cuts the welt of placing on the workstation through cutting groove.
Compared with the prior art, the utility model provides a monochromatic cavity solar energy silicon wafer cutting welt cutting device possesses following beneficial effect:
1. the utility model discloses dust collecting device comprises fixed disk, bracing piece, dust collection box and inlays the frame, inlays the frame and supports through four bracing piece joint, through with the lower extreme of fixed disk bolt fastening on four bracing pieces at the workstation, with top workstation cutting position department on same vertical center line, inlay the dust collection box again and inlay in inlaying the frame, the during operation cutting welt produces the dust and falls from the cutting groove whereabouts of workstation, collects the dust interception of whereabouts through album dirt, makes it can not drop subaerial.
2. The utility model discloses dust collecting device beneficial effect is to place the welt on the workstation, move through the ground cutting mechanism of removal support frame and carry out work, but the dust that the cutting produced can be along with the workstation and the groove drops subaerially, make and need the manual work to clear up after the work is accomplished, through installing dust collecting device at the lower extreme of workstation, the dust that drops in the workstation during messenger's cutting is collected through the dust collection box, make its ground keep clean, the staff does not need to clean ground after working, and can get rid of after the dust collection box is full and fall the dust, inlay used repeatedly in inlaying the frame again.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:
FIG. 1 is a schematic structural view of a monochromatic hollow solar silicon wafer cutting lining plate cutting device provided by the present invention;
FIG. 2 is a schematic structural view of a dust collecting device in the cutting device of the monochromatic hollow solar silicon wafer cutting lining plate of the present invention;
FIG. 3 is a schematic structural view of a cutting adjustment mechanism in the cutting device for a monochromatic hollow solar silicon wafer cutting lining plate provided by the present invention;
FIG. 4 is a schematic structural view of a cutting mechanism in the cutting device for a monochromatic hollow solar silicon wafer cutting lining plate provided by the present invention;
in the figure: 1. a moving mechanism; 2. a servo motor; 3. a work table; 4. a cutting adjustment mechanism; 5. a dust collecting device; 6. supporting legs; 7. moving the support frame; 8. a cutting mechanism; 41. adjusting the bolt; 42. moving the plate; 43. a moving groove; 44. an adjusting plate; 51. fixing the disc; 52. a support bar; 53. a dust collecting box; 54. embedding a frame; 81. a drive motor; 82. and (4) cutting the blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
a monochromatic hollow solar silicon wafer cutting liner plate cutting device comprises a workbench 3 and supporting legs 6, the upper end surface of the workbench 3 is provided with three cutting grooves, a cutting mechanism 8 cuts a liner plate placed on the workbench 3 through the cutting grooves, wherein the cutting mechanism 8 cuts off the liner plate when cutting through the cutting grooves, a movable supporting frame 7 is fixed on the middle part of the upper end of the workbench 3 through a bolt, a threaded rod is arranged in a supporting beam of the movable supporting frame 7 and is in threaded connection with a moving mechanism 1, a servo motor 2 starts to be electrified, the threaded rod in the movable supporting frame 7 is meshed with the moving mechanism 1 through the threaded rod through a gear belt, the moving mechanism 1 drives the cutting mechanism 8 to move rightwards to be in contact with the liner plate for cutting, the left side of the movable supporting frame 7 is connected with the moving mechanism 1, the lower end of the moving mechanism 1 is fixed with the cutting mechanism 8 through, the cutting mechanism 8 comprises a driving motor 81 and a cutting blade 82, and the cutting blade 82 is connected to the right end of the driving motor 81 through a rotating shaft, wherein the cutting mechanism 8 is contacted with the lining board to cut.
A monochromatic hollow solar silicon wafer cutting lining plate cutting device comprises a servo motor 2 connected with a rotating shaft on the upper side of the right end of a movable support frame 7, a cutting adjusting mechanism 4 is fixed on the right side of the front end of a workbench 3 through a bolt, the cutting adjusting mechanism 4 comprises an adjusting bolt 41, a moving plate 42, a moving groove 43 and an adjusting plate 44, the moving groove 43 is arranged in the middle of the upper end of the adjusting plate 44, the moving plate 42 is arranged at the upper end of the adjusting plate 44, the moving plate 42 penetrates through the moving groove 43 of the adjusting plate 44 through the adjusting bolt 41 for connection, the moving plate 42 moves back and forth on the adjusting plate 44 through the moving groove 43 by loosening the adjusting bolt 41 to adjust the cutting size of a lining plate placed on the workbench 3, the adjusting bolt 41 is grabbed by bare hands to rotate the bolt, then the moving plate 42 is grabbed by force, the moving plate 42 drives the lining plate to move back, the middle part of the upper end of the moving plate 42 is in threaded connection with an adjusting bolt 41, wherein one end of the lining plate is propped against the cutting adjusting mechanism 4 to adjust the cutting size.
A monochromatic hollow solar silicon wafer cutting liner plate cutting device comprises supporting legs 6 fixed on the left and right sides of the lower end of a workbench 3 through bolts, a dust collecting device 5 fixed between the two supporting legs 6 in the middle of the lower end of the workbench 3 through bolts, the dust collecting device 5 comprises a fixing disc 51, supporting bars 52, a dust collecting box 53 and an embedding frame 54, the supporting bars 52 are welded at the four corners of the upper end of the embedding frame 54, the four supporting bars 52 are four, the four supporting bars 52 are fixed on the workbench 3 through the bolts of the fixing disc 51 welded at the upper end to support the embedding frame 54, the dust collecting box 53 is embedded in the embedding frame 54 to collect dust falling from cutting, the fixing disc 51 is welded at the upper end of the supporting bars 52, the dust collecting box 53 is embedded in the middle of the embedding frame 54 and is positioned on the same vertical center line with the cutting position of the workbench 3 above to collect the, wherein the cutting liner plate generates dust falling from the cutting groove of the workbench 3 during working, and the falling dust is intercepted and collected by dust collection, so that the dust cannot fall on the ground.
The utility model discloses a theory of operation and use flow: after the utility model is installed, the cutting device cuts the monochrome hollow solar silicon wafer cutting lining plate, the workbench 3 is supported and placed through two supporting legs 6, the cutting lining plate is placed on the workbench 3, the cutting size of the lining plate is adjusted through the cutting adjusting mechanism 4, two adjusting plates 44 are bolted on the workbench 3, the adjusting bolts 41 are grasped by bare hands to rotate the adjusting bolts, the moving plate 42 is grasped to enable force, the moving plate 42 drives the lining plate to move back and forth on the adjusting plate 44 through the adjusting bolts 41 embedded in the moving groove 43 to adjust the cutting size, the adjusting bolts 41 are screwed down and fixed again, the cutting mechanism 8 starts to work, the driving motor 81 with the model of JF-60XX drives the cutting blade 82 to rotate at high speed through a rotating shaft, the moving mechanism 1 drives the cutting mechanism 8 to move and cut, the moving mechanism 1 connects and inlays the cutting mechanism 8 on the moving support frame 7 through a connecting frame, a servo motor 2 with the model of IHSV57-30-14-36-01-T-33 is electrified, a threaded rod inside a movable support frame 7 is meshed with a moving mechanism 1 through a threaded rod through a gear belt, the moving mechanism 1 drives a cutting mechanism 8 to move rightwards to contact with a lining plate for cutting, dust generated by cutting is collected through a dust collecting device 5, an embedding frame 54 is connected and supported through four supporting rods 52, fixing plates 51 on the four supporting rods 52 are fixed at the lower end of a workbench 3 through bolts and are positioned on the same vertical central line with the cutting position of the upper workbench 3, a dust collecting box 53 is embedded in the embedding frame 54, the dust generated by cutting the lining plate falls from a cutting groove of the workbench 3 during working, and the falling dust is collected through dust collection to be prevented from falling on the ground.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a monochromatic cavity solar energy silicon wafer cutting liner cutting device, includes workstation (3) and supporting legs (6), its characterized in that: the upper end middle part bolt fastening of workstation (3) has removal support frame (7), the left side of removal support frame (7) is connected with moving mechanism (1), the lower extreme of moving mechanism (1) has cutting mechanism (8) through support frame bolt fastening, the right-hand member upside pivot of removal support frame (7) is connected with servo motor (2), the front end right side bolt fastening of workstation (3) has cutting adjustment mechanism (4), the lower extreme left and right sides bolt fastening of workstation (3) has supporting legs (6), the lower extreme middle part of workstation (3) is located two the bolt fastening has dust collecting device (5) between supporting legs (6), dust collecting device (5) include fixed disk (51), bracing piece (52), dust collection box (53) and inlay frame (54), the welding of the upper end four corners department of inlaying frame (54) has bracing piece (52), the upper end of the supporting rod (52) is welded with a fixed disc (51), and the middle part of the embedding frame (54) is embedded with a dust collection box (53).
2. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: cutting adjustment mechanism (4) include adjusting bolt (41), moving plate (42), shifting chute (43) and regulating plate (44), the upper end middle part of regulating plate (44) is provided with shifting chute (43), the upper end of regulating plate (44) is provided with moving plate (42), the upper end middle part threaded connection of moving plate (42) has adjusting bolt (41).
3. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: the cutting mechanism (8) comprises a driving motor (81) and a cutting blade (82), and the right end of the driving motor (81) is connected with the cutting blade (82) in a rotating mode.
4. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: a supporting beam of the movable supporting frame (7) is provided with a threaded rod, and the threaded rod is in threaded connection with the movable mechanism (1).
5. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: the supporting rods (52) are four, and the supporting rods (52) are fixed on the workbench (3) through fixing plates (51) welded at the upper ends through bolts to support the embedded frame (54).
6. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 2, characterized in that: the moving plate (42) penetrates through a moving groove (43) of the adjusting plate (44) through threads of the adjusting bolt (41) to be connected, the adjusting bolt (41) is unscrewed to enable the moving plate (42) to move back and forth on the adjusting plate (44) through the moving groove (43), and the cutting size of the lining plate placed on the workbench (3) is adjusted.
7. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: the dust collection box (53) is embedded in the embedding frame (54) and is positioned on the same vertical central line with the cutting position of the upper workbench (3), and dust falling off from cutting is collected.
8. The monochromatic hollow solar silicon wafer cutting liner plate cutting device as claimed in claim 1, wherein: the upper end surface of workstation (3) is provided with three cutting groove, and cutting mechanism (8) are cut the welt of placing on workstation (3) through cutting the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867680.8U CN213198331U (en) | 2020-05-21 | 2020-05-21 | Monochrome hollow solar silicon wafer cutting lining plate cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867680.8U CN213198331U (en) | 2020-05-21 | 2020-05-21 | Monochrome hollow solar silicon wafer cutting lining plate cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213198331U true CN213198331U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020867680.8U Active CN213198331U (en) | 2020-05-21 | 2020-05-21 | Monochrome hollow solar silicon wafer cutting lining plate cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213198331U (en) |
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2020
- 2020-05-21 CN CN202020867680.8U patent/CN213198331U/en active Active
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