CN213164671U

CN213164671U - Processing device for silicon carbide semiconductor

Info

Publication number: CN213164671U
Application number: CN202021582304.0U
Authority: CN
Inventors: 不公告发明人
Original assignee: Shandong Yilaite Silicon Industry Co ltd
Current assignee: Shandong Yilaite Silicon Industry Co ltd
Priority date: 2020-08-03
Filing date: 2020-08-03
Publication date: 2021-05-11
Anticipated expiration: 2030-08-03

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a processing device of a silicon carbide semiconductor, which comprises a frame, wherein the lower end of the frame is rotationally connected with a plurality of guide wheels, a guide plate is fixedly connected with the middle position of the inner bottom end of the frame, a lead screw is rotationally connected inside the guide plate, the right end of the lead screw penetrates through the guide plate, the inner bottom end of the frame is fixedly connected with a reset motor positioned at the right end of the guide plate, the middle part of the lead screw is in threaded connection with a guide block, the guide block is in sliding connection with the guide plate, the guide plate extends out of the upper end of; adsorb semiconductor material through electric vacuum chuck, it is spacing to combine the clamp splice to carry out the centre gripping to semiconductor material again, when being convenient for press from both sides tight spacing semiconductor material, still guaranteed to press from both sides the stability after tight spacing, and adsorb the dust that produces when polishing through the suction hood, reduce the trouble of dust clearance, guaranteed the quality of the environment of polishing.

Description

Processing device for silicon carbide semiconductor

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to a processingequipment of carborundum semiconductor.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.

Present processingequipment of carborundum semiconductor, semiconductor material are when polishing, because press from both sides tight spacing convenient inadequately, and press from both sides tight effect not good, can seriously influence the stability when polishing, and semiconductor material is difficult to adjust the position of polishing about polishing when polishing in addition, influences the polishing performance to the dust that produces when polishing is difficult to the clearance, influences the quality of the environment of polishing.

SUMMERY OF THE UTILITY MODEL

The utility model provides a processingequipment of carborundum semiconductor to it is convenient inadequately to solve the tight spacing clamp that above-mentioned background art provided, and it is not good to press from both sides tight effect, and the dust is difficult to the problem of clearance.

In order to solve the prior art problem, the utility model discloses a processingequipment of carborundum semiconductor, including the frame:

the lower end of the rack is rotatably connected with a plurality of guide wheels, a guide plate is fixedly connected at the middle position of the bottom end of the inner side of the rack, a lead screw is rotatably connected inside the guide plate, the right end of the lead screw penetrates through the guide plate, the bottom end of the inner side of the rack is fixedly connected with a reset motor at the right end of the guide plate, a guide block is in threaded connection with the middle part of the lead screw, the guide block is in sliding connection with the guide plate, the upper end of the guide block extends out of the guide plate, a hydraulic telescopic shaft is fixedly connected with the upper end of the hydraulic telescopic shaft, an electric vacuum chuck is fixedly connected with the upper end of the hydraulic telescopic shaft, an L-shaped support plate is fixedly connected at the left end and the right end of the hydraulic telescopic shaft and is positioned below the electric vacuum chuck, a threaded push rod penetrates through the middle part of the outer side of the L-, just spacing slide of clamp splice lower extreme fixedly connected with, the middle part on the inboard top of frame runs through to be fixed with rotates the motor, just it is connected with the emery wheel to rotate the motor lower extreme rotation, the inboard top of frame just is located rotate the equal fixedly connected with small-size dust catcher in the left and right sides of motor, just the small-size dust catcher lower extreme has met the dust absorption pipe, the dust absorption pipe lower extreme has met the suction hood mutually.

Furthermore, the guide plate upper end is opened has the guide slot, just the guide block slides along the guide slot left and right side.

Further, the electric vacuum chuck is located under the grinding wheel, and the rotating motor is electrically connected with an external power supply.

Furthermore, the small dust collector is communicated with the dust collection pipe, the dust collection pipe is communicated with the dust collection covers, and the two dust collection covers are obliquely distributed at the left end and the right end of the grinding wheel.

Furthermore, the limiting sliding plate is connected with the L-shaped support plate in a sliding mode, a limiting sliding groove is formed in the inner side of the upper end of the L-shaped support plate, and the limiting sliding plate slides left and right along the limiting sliding groove.

Compared with the prior art, the utility model discloses the beneficial effect who realizes:

adsorb semiconductor material through electric vacuum chuck, it is spacing to carry out the centre gripping to semiconductor material to reunite the clamp splice, when being convenient for press from both sides tight spacing semiconductor material, still guaranteed to press from both sides the stability after tight spacing, and the rotation through the lead screw, do benefit to and drive the guide block along the baffle horizontal slip, thereby it controls to drive hydraulic telescoping shaft and vacuum chuck and remove, the position of polishing about consequently being convenient for adjust the semiconductor, improve polishing performance, and adsorb the dust that produces when polishing through the suction hood, reduce the trouble of dust clearance, the quality of the environment of polishing has been guaranteed.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic diagram of a partially enlarged structure a of the present invention.

In FIGS. 1-2: the device comprises a rack 1, a guide wheel 2, a guide plate 3, a screw rod 4, a guide block 5, a reset motor 6, a hydraulic telescopic shaft 7, an electric vacuum chuck 8, an L-shaped support plate 9, a small dust collector 10, a dust collection pipe 11, a rotating motor 12, a grinding wheel 13, a clamping block 14, a threaded push rod 15, a limiting sliding plate 16 and a dust collection cover 17.

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 1 to 2:

a silicon carbide semiconductor processing apparatus includes a frame 1:

the lower end of the frame 1 is rotatably connected with a plurality of guide wheels 2, a guide plate 3 is fixedly connected at the middle position of the inner bottom end of the frame 1, a lead screw 4 is rotatably connected inside the guide plate 3, the right end of the lead screw 4 penetrates through the guide plate 3, a reset motor 6 is fixedly connected at the inner bottom end of the frame 1 and at the right end of the guide plate 3, a guide block 5 is in threaded connection with the middle part of the lead screw 4, the guide block 5 is in sliding connection with the guide plate 3, the guide plate 3 extends out of the upper end of the guide block 5, a hydraulic telescopic shaft 7 is fixedly connected at the upper end of the guide block 5, an electric vacuum chuck 8 is fixedly connected at the upper end of the hydraulic telescopic shaft 7, an L-shaped support plate 9 is fixedly connected at the left end and the right end of the hydraulic telescopic shaft 7 and below the electric vacuum chuck 8, a threaded push rod 15 penetrates through the middle part of the outer side, the tail end of the threaded push rod 15 is rotatably connected with a clamping block 14 on the inner side of the L-shaped support plate 9, the lower end of the clamping block 14 is fixedly connected with a limiting sliding plate 16, a rotating motor 12 is fixedly penetrated in the middle of the top end of the inner side of the rack 1, the lower end of the rotating motor 12 is rotatably connected with a grinding wheel 13, the upper end of the guide plate 3 is provided with a guide groove, the guide block 5 slides left and right along the guide groove, the electric vacuum chuck 8 is positioned right below the grinding wheel 13, and the rotating motor 12 is electrically connected with an external power supply;

specifically, the guide wheel 2 rotates to conveniently drive the rack 1 to move for use, a semiconductor material to be polished is placed on the electric vacuum chuck 8, the electric vacuum chuck 8 adsorbs the semiconductor material, then the threaded push rod 15 is screwed, the threaded push rod 15 drives the clamping blocks 14 to be close to the semiconductor material, so that the two clamping blocks 14 clamp and limit the semiconductor material left and right, the hydraulic telescopic shaft 7 rises, the grinding wheel 13 is in contact with the semiconductor material, and the rotating motor 12 drives the grinding wheel 13 to rotate and polish the semiconductor material, so that the semiconductor material is conveniently clamped and limited, and meanwhile, the stability after the semiconductor material is clamped and limited is also ensured;

further, reset motor 6 drives lead screw 4 and rotates, consequently through the rotation of lead screw 4, does benefit to and drives guide 5 and slide along 3 horizontal sides of baffle to drive about hydraulic telescoping shaft 7 and the electric vacuum chuck 8 and remove, consequently be convenient for adjust the position of polishing about the semiconductor, improve the performance of polishing.

The top end of the inner side of the frame 1 and the left and right sides of the rotating motor 12 are fixedly connected with a small dust collector 10, the lower end of the small dust collector 10 is connected with a dust collection pipe 11, and the lower end of the dust collection pipe 11 is connected with a dust collection cover 17;

further, when the grinding wheel 13 is used for grinding the semiconductor material, the small dust collector 10 is opened, the small dust collector 10 adsorbs dust generated during grinding through the dust suction pipe 11 and the dust suction cover 17, the trouble of dust cleaning is reduced, and the quality of the grinding environment is guaranteed.

The small-sized dust collector 10 is communicated with the dust collection pipe 11, the dust collection pipe 11 is communicated with the dust collection covers 17, and the two dust collection covers 17 are obliquely distributed at the left end and the right end of the grinding wheel 13;

furthermore, the dust hood 17 is inclined, which is beneficial to better dust generation during grinding, and improves the dust absorption effect.

The limiting sliding plate 16 is connected with the L-shaped support plate 9 in a sliding manner, a limiting sliding groove is formed in the inner side of the upper end of the L-shaped support plate 9, and the limiting sliding plate 16 slides left and right along the limiting sliding groove;

furthermore, the limiting sliding plate 16 slides left and right along the limiting sliding groove, so that the clamping block 14 is prevented from rotating when moving left and right, and great abrasion is prevented when the semiconductor material is clamped.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A silicon carbide semiconductor processing apparatus includes a frame (1), characterized in that:

the lower end of the rack (1) is rotatably connected with a plurality of guide wheels (2), a guide plate (3) is fixedly connected to the middle position of the inner bottom end of the rack (1), a lead screw (4) is rotatably connected to the inner portion of the guide plate (3), the right end of the lead screw (4) penetrates through the guide plate (3), a reset motor (6) is fixedly connected to the inner bottom end of the rack (1) and is located at the right end of the guide plate (3), a guide block (5) is in threaded connection with the middle of the lead screw (4), the guide block (5) is in sliding connection with the guide plate (3), the guide plate (3) extends out of the upper end of the guide block (5), a hydraulic telescopic shaft (7) is fixedly connected to the upper end of the guide block (5), an electric vacuum chuck (8) is fixedly connected to the upper end of the hydraulic telescopic shaft (7), L-shaped support plates (9) are fixedly connected to the left end and the, and L type extension board (9) outside middle part runs through there is screw thread push rod (15), screw thread push rod (15) with L type extension board (9) threaded connection, screw thread push rod (15) are terminal and lie in the inboard of L type extension board (9) is rotated and is connected with clamp splice (14), just clamp splice (14) lower extreme fixedly connected with spacing slide (16), the middle part on the inboard top of frame (1) runs through and is fixed with rotation motor (12), just it is connected with emery wheel (13) to rotate motor (12) lower extreme rotation, the inboard top of frame (1) just lies in rotate the equal fixedly connected with small-size dust catcher (10) in both sides about motor (12), just small-size dust catcher (10) lower extreme has met dust absorption pipe (11), dust absorption pipe (11) lower extreme has met suction hood (17) mutually.

2. The silicon carbide semiconductor processing apparatus according to claim 1, wherein: the guide plate (3) is provided with a guide groove at the upper end, and the guide block (5) slides left and right along the guide groove.

3. The silicon carbide semiconductor processing apparatus according to claim 1, wherein: the electric vacuum chuck (8) is positioned under the grinding wheel (13), and the rotating motor (12) is electrically connected with an external power supply.

4. The silicon carbide semiconductor processing apparatus according to claim 1, wherein: the small dust collector (10) is communicated with the dust collection pipe (11), the dust collection pipe (11) is communicated with the dust collection covers (17), and the two dust collection covers (17) are obliquely distributed at the left end and the right end of the grinding wheel (13).

5. The silicon carbide semiconductor processing apparatus according to claim 1, wherein: the limiting sliding plate (16) is connected with the L-shaped support plate (9) in a sliding mode, a limiting sliding groove is formed in the inner side of the upper end of the L-shaped support plate (9), and the limiting sliding plate (16) slides left and right along the limiting sliding groove.