CN213146982U

CN213146982U - PTC semiconductor heating device with heat recovery function

Info

Publication number: CN213146982U
Application number: CN202022060704.1U
Authority: CN
Inventors: 陈益光
Original assignee: Chengdu Anlt Thermal Technology Co ltd; China Energy Saving Building Energy Saving Co Ltd Henan Branch
Current assignee: Chengdu Anlt Thermal Technology Co ltd; China Energy Saving Building Energy Saving Co Ltd Henan Branch
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2021-05-07
Anticipated expiration: 2030-09-18

Abstract

The utility model discloses a take heat recovery PTC semiconductor heating device belongs to heating device technical field, the pressure water heater comprises a water inlet pipe, the heating pipe is evenly installed at the top of inlet tube, and the top of heating pipe evenly installs the drain pipe, the outside of heating pipe is provided with the protection storehouse, and the inside in protection storehouse is provided with the hot plate, the inboard of hot plate and the inner wall laminating of heating pipe, be provided with the heat insulating board on the inner wall in protection storehouse, the outside in protection storehouse is provided with the backward flow storehouse, and the first backward flow pipe is all installed at the top in the backward flow storehouse outside. The utility model discloses the setting in outside backward flow storehouse of protection storehouse, cooperation first back flow pipe, first check valve, second back flow, second check valve use, can flow into the inside in backward flow storehouse with the water source at the in-process of intaking, take away the outside unnecessary heat in protection storehouse, to heat recovery to preheat the water source, improved the effect of heating.

Description

PTC semiconductor heating device with heat recovery function

Technical Field

The utility model relates to a PTC semiconductor heating device especially relates to a take heat recovery PTC semiconductor heating device, belongs to heating device technical field.

Background

The heating equipment device is a core component of the hot water supply system, and the selection of the heating equipment is a key for determining whether the hot water supply system can meet the use requirement of a user and ensuring the long-term normal operation of the system;

but current PTC semiconductor heating device is at the in-process that uses, though itself has the insulating layer, still there is heat waste still, leads to the outside of device to have higher temperature, causes the scald easily to the people, and traditional heating device water directly flows through from the inside of heating pipe, and the mobility of liquid is relatively poor, influences the heating effect, consequently, the utility model provides a take heat recovery PTC semiconductor heating device in order to solve the problem that exists among the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a take heat recovery PTC semiconductor heating device to solve the problem that can't carry out heat recovery and heating effect is poor among the prior art.

The purpose of the utility model can be achieved by adopting the following technical scheme:

the utility model provides a take heat recovery PTC semiconductor heating device, includes the inlet tube, the heating pipe is evenly installed at the top of inlet tube, and the top of heating pipe evenly installs the drain pipe, the outside of heating pipe is provided with the protection storehouse, and the inside in protection storehouse is provided with the hot plate, the inboard of hot plate and the inner wall laminating of heating pipe, be provided with the heat insulating board on the inner wall in protection storehouse, the outside in protection storehouse is provided with the backward flow storehouse, and all installs first back flow pipe at the top in the backward flow storehouse outside, first check valve is all installed to the bottom of first back flow pipe, the second back flow is all installed to the bottom in backward flow storehouse, and all installs the second check valve on the second back flow, the bottom of first back flow pipe and second back flow all switches on with the.

Preferably: the inside in backward flow storehouse is provided with helical blade, and helical blade's inboard and protection storehouse fixed connection, helical blade's the outside and the inner wall fixed connection in backward flow storehouse.

Preferably: annular plates are uniformly fixed on the inner side wall of the heating pipe, a partition plate is arranged between the two groups of annular plates, and the end part of the partition plate is fixedly connected with the backflow bin.

Preferably: the inner diameter of the annular plate is smaller than the width of the partition plate.

Preferably: the outside of inlet tube and drain pipe all is provided with the heat preservation.

Preferably: the heating pipe is provided with five groups, and the distance between adjacent heating pipes is the same.

The utility model has the advantages that:

the utility model provides a pair of take heat recovery PTC semiconductor heating device, the setting in the outside backward flow storehouse of protection storehouse, cooperate first backward flow pipe, first check valve, the second backward flow, the second check valve uses, can be at the in-process of intaking, flow into the inside in backward flow storehouse with the water source, take away the outside unnecessary heat in protection storehouse, to heat recovery, and preheat the water source, the effect of heating has been improved, the setting of the annular plate and the baffle that the inside interval of heating pipe set up, can be when rivers are inside through the heating pipe to continuously reposition of redundant personnel and converge the water source, accelerate water at the inside flow rate of heating storehouse, the effect of heating has been increased then, the practicality is higher.

Drawings

Fig. 1 is a front sectional view of the present invention;

FIG. 2 is a partial structural view of the heating pipe of the present invention;

fig. 3 is a schematic front view of the present invention.

In the figure: 1. a water inlet pipe; 2. heating a tube; 3. a drain pipe; 4. a protection bin; 5. heating plates; 6. a heat insulation plate; 7. a reflux bin; 8. a first return pipe; 9. a first check valve; 10. a second return pipe; 11. a second one-way valve; 12. a helical blade; 13. an annular plate; 14. a separator.

Detailed Description

In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention will be described in further detail with reference to the following embodiments and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1 to 3, the present embodiment provides a semiconductor heating device with heat recovery PTC, which comprises a water inlet pipe 1, heating pipes 2 uniformly installed on the top of the water inlet pipe 1, and the top of the heating pipe 2 is evenly provided with a drain pipe 3, the outer side of the heating pipe 2 is provided with a protection bin 4, a heating plate 5 is arranged in the protection bin 4, the inner side of the heating plate 5 is attached to the inner wall of the heating pipe 2, a heat insulation plate 6 is arranged on the inner wall of the protection bin 4, a backflow bin 7 is arranged on the outer side of the protection bin 4, and the top of the outer side of the return bin 7 is provided with a first return pipe 8, the bottom of the first return pipe 8 is provided with a first one-way valve 9, the bottom of the return bin 7 is provided with a second return pipe 10, and the second return pipe 10 is installed with a second one-way valve 11, and the bottoms of the first return pipe 8 and the second return pipe 10 are communicated with the water inlet pipe 1.

In this embodiment, as shown in fig. 2, the spiral blade 12 is disposed inside the backflow bin 7, the inner side of the spiral blade 12 is fixedly connected to the protection bin 4, the outer side of the spiral blade 12 is fixedly connected to the inner wall of the backflow bin 7, and the spiral blade 12 is used for guiding flow, so that the heat recovery effect is improved.

In this embodiment, as shown in fig. 2, annular plates 13 are uniformly fixed on the inner side wall of the heating pipe 2, a partition plate 14 is arranged between two sets of annular plates 13, the end of the partition plate 14 is fixedly connected with the backflow bin 7, main flow is performed by using the annular plates 13 and the partition plate 14, the flow direction of water flow is changed, the flow rate of the water flow is increased, and the heating effect is improved.

In the present embodiment, as shown in fig. 2, the inner diameter of the annular plate 13 is smaller than the width of the partition 14, improving the choke flow effect.

In this embodiment, as shown in fig. 1, the outer sides of the water inlet pipe 1 and the water outlet pipe 3 are both provided with heat insulating layers to reduce heat dissipation.

In the embodiment, as shown in fig. 1, five groups of heating pipes 2 are arranged, and the distances between adjacent heating pipes 2 are the same, so that the heating efficiency of the device is improved.

As shown in fig. 1 to 3, the present embodiment provides a semiconductor heating device with heat recovery PTC, which operates as follows:

step 1: when the device is used, a power supply is switched on, cold water is introduced from the water inlet pipe 1, enters the heating pipe 2 and is heated through the heating plate 5, heat is diffused from the inside of the protection bin 4 to the inside of the backflow bin 7 in the heating process, meanwhile, the cold water enters from the top of the backflow bin 7, flows into the water inlet pipe 1 again from the second backflow pipe 10 through the diversion of the spiral blade 12, and the cold water is preheated by using waste heat;

step 2: when water flows through the heating pipe 2, the annular plate 13 and the partition plate 14 change the inflow direction of water, increase the flow rate of water and accelerate the heating of water.

The above description is only a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art can replace or change the technical solution and the concept of the present invention within the scope of the present invention.

Claims

1. A PTC semiconductor heating device with heat recovery is characterized in that: the water heater comprises a water inlet pipe (1), wherein heating pipes (2) are uniformly installed at the top of the water inlet pipe (1), drain pipes (3) are uniformly installed at the top of the heating pipes (2), a protection bin (4) is arranged on the outer side of the heating pipes (2), a heating plate (5) is arranged inside the protection bin (4), the inner side of the heating plate (5) is attached to the inner wall of the heating pipes (2), a heat insulation plate (6) is arranged on the inner wall of the protection bin (4), a backflow bin (7) is arranged on the outer side of the protection bin (4), first backflow pipes (8) are installed at the top of the outer side of the backflow bin (7), first check valves (9) are installed at the bottom of the first backflow pipes (8), second backflow pipes (10) are installed at the bottom of the backflow bin (7), and second check valves (11) are installed on the second backflow pipes (10, the bottoms of the first return pipe (8) and the second return pipe (10) are communicated with the water inlet pipe (1).

2. A semiconductor heating device with heat recovery PTC as claimed in claim 1, wherein: the inside in backward flow storehouse (7) is provided with helical blade (12), and the inboard and the protection storehouse (4) fixed connection of helical blade (12), the outside and the inner wall fixed connection in backward flow storehouse (7) of helical blade (12).

3. A semiconductor heating device with heat recovery PTC as claimed in claim 1, wherein: annular plates (13) are uniformly fixed on the inner side wall of the heating pipe (2), a partition plate (14) is arranged between the two groups of annular plates (13), and the end part of the partition plate (14) is fixedly connected with the backflow bin (7).

4. A semiconductor heating device with heat recovery PTC as claimed in claim 3, wherein: the inner diameter of the annular plate (13) is smaller than the width of the partition plate (14).

5. A semiconductor heating device with heat recovery PTC as claimed in claim 1, wherein: the outer sides of the water inlet pipe (1) and the water outlet pipe (3) are both provided with heat insulation layers.

6. A semiconductor heating device with heat recovery PTC as claimed in claim 1, wherein: the heating pipes (2) are provided with five groups, and the distances between the adjacent heating pipes (2) are the same.