CN213126842U

CN213126842U - MOS (metal oxide semiconductor) tube mounting structure of motor controller

Info

Publication number: CN213126842U
Application number: CN202021582066.3U
Authority: CN
Inventors: 刘汉国; 王庆港; 何冉冉
Original assignee: Anhui Chenji New Energy Technology Co ltd
Current assignee: Anhui Chenji New Energy Technology Co ltd
Priority date: 2020-08-03
Filing date: 2020-08-03
Publication date: 2021-05-04
Anticipated expiration: 2030-08-03

Abstract

A motor controller MOS transistor mounting structure comprising: the MOS transistor comprises an upper shell, a lower shell, an inner circuit board and an MOS transistor element; the improved MOS tube component comprises an upper shell and a lower shell, wherein the upper shell and the lower shell are fixed through screws to form a closed cavity, an inner circuit board is installed inside the cavity, a pin part of an MOS tube component is fixed on the inner circuit board, the included angle between the substrate part of the MOS tube component and the pin part of the MOS tube component is 120 degrees, an installation groove is formed in the lower shell, the substrate part of the MOS tube component is located inside the installation groove, a limiting groove is formed in the lower shell on one side of the installation groove, a metal pressing sheet is installed in the limiting groove, the end of the metal pressing sheet is pressed against the part of the substrate of the MOS tube component, a heat conduction fin is fixed on the inner side wall of the upper shell, an insertion block is arranged at the lower end of the heat conduction fin, a positioning hole. The occupied space of the inner circuit board is reduced.

Description

MOS (metal oxide semiconductor) tube mounting structure of motor controller

Technical Field

The utility model relates to a machine controller field, concretely relates to machine controller MOS manages mounting structure.

Background

The motor controller is an integrated circuit which controls the motor to work according to the set direction, speed, angle and response time through active work. In the electric vehicle, the motor controller is used for converting the electric energy stored in the power battery into the electric energy required by the driving motor according to instructions of gears, an accelerator, a brake and the like so as to control the running states of the electric vehicle such as starting operation, advancing and retreating speed, climbing force and the like, or assisting the electric vehicle to brake and storing part of brake energy into the power battery. It is one of the key components of an electric vehicle. The motor controller has integrated circuit elements, including MOS FET, for controlling the current in the output loop by means of the electric field effect of the input loop, and the circuit elements are relatively long and thus have increased circuit board space.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome can cause the great problem of occupation space when traditional machine controller MOS field effect transistor installs, the purpose provides a machine controller MOS manages mounting structure.

The utility model discloses the technical problem that will solve adopts following technical scheme to realize:

a motor controller MOS transistor mounting structure comprising:

the MOS transistor comprises an upper shell, a lower shell, an inner circuit board and an MOS transistor element;

the improved MOS tube component comprises an upper shell and a lower shell, wherein the upper shell and the lower shell are fixed through screws to form a closed cavity, an inner circuit board is installed inside the cavity, a pin part of an MOS tube component is fixed on the inner circuit board, the included angle between the substrate part of the MOS tube component and the pin part of the MOS tube component is 120 degrees, an installation groove is formed in the lower shell, the substrate part of the MOS tube component is located inside the installation groove, a limiting groove is formed in the lower shell on one side of the installation groove, a metal pressing sheet is installed in the limiting groove, the end of the metal pressing sheet is pressed against the part of the substrate of the MOS tube component, a heat conduction fin is fixed on the inner side wall of the upper shell, an insertion block is arranged at the lower end of the heat conduction fin, a positioning hole.

Furthermore, one side of the mounting groove is provided with an inclined plane parallel to the substrate part of the MOS tube element, and a buffer rubber pad is arranged between the substrate of the MOS tube element and the inclined plane.

Furthermore, a supporting pad is arranged between the lower shell and the inner circuit board, and the pin part of the MOS tube element penetrates through the supporting pad.

Furthermore, the bottom of the lower shell is provided with a radiating fin.

Furthermore, the side edges of the upper shell and the lower shell are provided with sealing rubber rings.

The utility model has the advantages that:

the utility model discloses simple structure, be 120 degrees through the substrate part with MOS pipe element and the pin part contained angle of MOS pipe element, insert the substrate part of MOS pipe element to the mounting groove on the casing down in the installation, reduce the installation interval between inner circuit board and lower casing, reduce the occupation space of inner circuit board, and utilize the metal preforming to restrict the substrate part of MOS pipe element, prevent that MOS pipe element from rocking, the produced heat of MOS pipe element can be conducted to heat conduction fin through the metal preforming, the radiating effect of MOS pipe element is improved.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is an enlarged view of the portion A of FIG. 1;

in the figure: 1. an upper housing; 2. a lower housing; 3. an inner circuit board; 4. an MOS transistor element; 12. mounting grooves; 13. a limiting groove; 14. metal tabletting; 15. a heat conductive fin; 16. inserting a block; 17. positioning holes; 21. a cushion rubber pad; 22. a support pad; 23. a heat sink; 24. and sealing the rubber ring.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.

Example 1

As shown in fig. 1 and 2; a motor controller MOS transistor mounting structure comprising:

the device comprises an upper shell 1, a lower shell 2, an inner circuit board 3 and an MOS tube element 4;

go up casing 1 and lower casing 2 and pass through the fixed confined cavity that forms of screw, interior circuit board 3 is installed inside this cavity, the pin part of MOS pipe component 4 is fixed on interior circuit board 3, the substrate part of MOS pipe component 4 and the pin part contained angle of MOS pipe component 4 are 120 degrees, casing 2 is inside to be equipped with mounting groove 12 down, the substrate part of MOS pipe component 4 is located inside mounting groove 12, be equipped with spacing groove 13 on the lower casing 2 of mounting groove 12 one side, install metal preforming 14 in the spacing groove 13, metal preforming 14 end presses on the substrate part of MOS pipe component 4, be fixed with heat conduction fin 15 on the upper casing 1 inside wall, heat conduction fin 15 lower extreme is equipped with inserted block 16, metal preforming 14 is located the inside one end of inserted block 16 and is equipped with locating hole 17, utilize inserted block 16 to insert locating hole 17, restrict metal preforming 14, prevent that metal preforming 14 is not hard up, inserted block 16 is located inside locating hole 17. Through the substrate part contained angle with MOS pipe element 4 and MOS pipe element 4's pin portion 120 degrees, insert MOS pipe element 4's substrate part to mounting groove 12 on casing 2 down in the installation, reduce the installation interval between inner circuit board 3 and casing 2 down, reduce inner circuit board 3's occupation space, and utilize metal preforming 14 to restrict MOS pipe element 4's substrate part, prevent that MOS pipe element 4 from rocking, the produced heat of MOS pipe element 4 can be through on metal preforming 14 conduction to heat conduction fin 15, improve MOS pipe element 4's radiating effect.

Example 2

On the basis of the embodiment 1, as shown in fig. 1 and fig. 2; an inclined surface parallel to the substrate of the MOS transistor device 4 is provided on one side of the mounting groove 12, and a cushion rubber 21 is provided between the substrate of the MOS transistor device 4 and the inclined surface. The two buffer rubber pads 21 can support the substrate of the MOS tube element 4, reduce the vibration of the MOS tube element 4 and protect the MOS tube element 4.

A supporting pad 22 is arranged between the lower shell 2 and the inner circuit board 3, and the pin part of the MOS transistor element 4 passes through the supporting pad 22. The inner circuit board 3 is supported by the supporting pad 22, and the pins of the MOS transistor device 4 penetrate through the supporting pad 22, so as to improve the integrity between the MOS transistor device 4 and the inner circuit board 3.

The bottom of the lower shell 2 is provided with a heat sink 23. The upper shell 1 and the lower shell 2 are made of aluminum alloy, and heat dissipation on the inner circuit board 3 is facilitated.

Sealing rubber rings 24 are arranged at the side edges of the upper shell 1 and the lower shell 2. Prevent that the sealed space between upper housing 1 and lower housing 2 from intaking, increase the leakproofness.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A motor controller MOS manages mounting structure which characterized in that includes:

2. The motor controller MOS transistor mounting structure of claim 1, wherein a side of the mounting groove is provided with an inclined surface parallel to a substrate portion of the MOS transistor element, and a buffer rubber pad is provided between the substrate of the MOS transistor element and the inclined surface.

3. The motor controller MOS transistor mounting structure of claim 1, wherein a support pad is provided between the lower case and the inner circuit board, and the pin portion of the MOS transistor element passes through the support pad.

4. The motor controller MOS transistor mounting structure of claim 1, wherein a heat sink is provided at a bottom of the lower case.

5. The MOS transistor mounting structure of claim 1, wherein the upper housing and the lower housing have sealing rubber rings at the side edges.