CN213122928U

CN213122928U - Anti-impact module, display screen and display terminal

Info

Publication number: CN213122928U
Application number: CN202021206599.1U
Authority: CN
Inventors: 段宝明; 李孟庭
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2021-05-04
Anticipated expiration: 2030-06-24

Abstract

The application relates to the technical field of display, and provides an anti-impact module, a display screen and a display terminal. The anti-impact module comprises a low-modulus layer and a high-modulus layer which are alternately arranged in sequence, and the surfaces of two opposite sides of the anti-impact module are the high-modulus layers; wherein, the low modulus layer is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. The application provides an anti-impact module, with the help of the low modulus layer and the high modulus layer of multilayer alternative setting alternate energy absorption, the stress that produces is strikeed in the gradual attenuation, finally absorbs impact energy completely, promotes shock resistance.

Description

Anti-impact module, display screen and display terminal

Technical Field

The utility model belongs to the technical field of show, especially, relate to a module shocks resistance, a display screen to and a display terminal.

Background

With the development of display technology, the application field of display devices is now very wide, and the performance requirements of display devices are gradually increased. For display products, ball drop and pen drop reliability are important performance indicators for evaluating product quality. According to the traditional OLED, the hard material film layer such as hard glass is arranged on the outermost layer of the display screen, so that impact energy of falling balls and falling pens can be well resisted, and the display TFT layer is effectively protected from cracking. The flexible screen body has the characteristics of being bendable and the like, and people can bend or fold the display device by utilizing the flexibility of the display device, so that the display device is convenient to carry and use. In recent years, foldable screen electronic products are becoming a market hotspot. Foldable electronic products require that the product is whole to have the type of can buckling, so can not use traditional hard screen glass to protect the display module assembly. The display module lacking the protection of the hard glass transmits energy to a display area because the energy cannot be fully absorbed when the display module suffers from falling ball and pen falling impact, so that a display TFT layer is cracked to cause screen failure.

The folding module of the existing flexible display product resists falling ball impact by passively adding a foam or silicon rubber structure for absorbing energy, but the effect is very limited. In addition, the passive energy absorption structure can increase the thickness of the folding module, and the bending characteristic and the appearance form of the product are influenced. At present, the thickness of the display screen of the folding mobile phone is larger than 600um, and the thickness of key materials such as a cover plate, a polaroid and a support film such as an SUS sheet can not meet the requirement that the bending radius is less than 1.5. And along with folding module bend radius's further reduction, folding module thickness must attenuate, and the attenuate means that folding module resists the ability that the falling ball was strikeed and further weakens, and passive form energy-absorbing structure can't satisfy the demand of falling ball and module thickness attenuate simultaneously. In order to meet the product trend of further reducing the bending radius, the thickness reduction of the flexible folding module is a technical trend, but how to keep the anti-falling ball impact effect undamped after the reduction of the folding module is realized, and an effective solution is not seen at present.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide an anti-impact module, contains the display screen of structure of shocking resistance to and a display terminal, aim at solving current flexible folding module and can not compromise the problem that bend radius < 1.5 and anti falling ball impact effect simultaneously.

In order to achieve the purpose of the application, the technical scheme adopted by the application is as follows:

in a first aspect, an embodiment of the present application provides an impact-resistant module, which includes a low-modulus layer and a high-modulus layer that are alternately arranged in sequence, and surfaces of two opposite sides of the impact-resistant module are the high-modulus layers; wherein, the low modulus layer is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer is a modulus layer with the elastic modulus between 156MPa and 4000 MPa.

The anti-impact module comprises a low-modulus layer and a high-modulus layer which are alternately arranged in sequence. In this case, when an impact is applied, the high modulus layer on the surface of the impact resistant module receives an impact signal first, and the impact stress is transmitted along the vertical direction and the horizontal direction of the impact resistant module. Because the high modulus layer has strong rigidity and small deformation caused by impact, partial stress in the horizontal direction can be dispersed and released to the periphery along with the vibration deformation generated by the high modulus layer, and the stress in the vertical direction is continuously transmitted downwards; when the impact stress is transmitted to the lower low modulus layer, the low modulus layer is largely deformed to absorb part of the impact stress, particularly the impact stress in the vertical direction. And meanwhile, high modulus layers are arranged on the surfaces of two opposite sides of the anti-impact module, so that the low modulus layers in the anti-impact module are clamped between the high modulus layers. At the moment, the high modulus layer uniformly releases the large deformation generated by the low modulus layer to the periphery, so that the large deformation accumulation of the low modulus layer is avoided, and the large deformation of the structure adjacent to the dragging impact-resistant module is caused.

The impact-resistant module that this application embodiment provided, with the help of the low modulus layer and the high modulus layer of multilayer alternative setting alternate energy absorption, the stress that the gradual attenuation impact produced, finally with impact energy complete absorption, promote shock resistance. Meanwhile, because the low modulus layer and the high modulus layer are alternately arranged, the rigidity of the high modulus layer is dispersed by the low modulus layers on two sides, and therefore the anti-impact module has good flexibility. The impact-resistant module provided by the embodiment of the application has the advantages that the falling ball impact-resistant height is more than 60 cm; under the condition that the bending radius is 5-1.5, monomer bending can be realized for 20 ten thousand times; under the condition that the bending radius is less than 1.5, 20 ten thousand times of monomer bending can be realized. In the embodiment of the application, the ball drop impact height is tested by referring to the GB15763.2-2005 standard, wherein the ball drop is a steel ball with the diameter of 20mm and the weight of 32.95 g.

In the embodiment of the application, the low modulus layer is a modulus layer with an elastic modulus of 0.4-20 Mpa, and the high modulus layer is a modulus layer with an elastic modulus of 156-4000 Mpa. The high modulus layer with the elastic modulus ranging from 156MPa to 4000MPa can generate vibration deformation after receiving impact stress, and disperse and release the impact stress in a vibration deformation mode; and the low modulus layer with the elastic modulus between 0.4 and 20Mpa can generate large deformation to attenuate impact stress after being impacted. If the elastic modulus of the high modulus layer is too high and is higher than 4000Mpa, the high modulus layer has too high hardness and is difficult to generate vibration deformation to disperse impact energy; if the elastic modulus of the low modulus layer is too low, the film layer is too soft, and the deformation generated by the impact is too large to pull the bonding layer between adjacent interfaces such as the high modulus layer or the high and low modulus layers, so that the low modulus layer is peeled off from the surface of the high modulus layer, and the energy absorption effect of the impact resistant module is affected.

Optionally, the low modulus layer is a modulus layer with an elastic modulus of 0.4 Mpa-20 Mpa, and the high modulus layer is a modulus layer with an elastic modulus of 156 Mpa-2000 Mpa. At this time, the elastic modulus of the high modulus layer is in a proper range, which is more beneficial for the high modulus layer to generate vibration deformation and release impact stress in the horizontal direction.

Optionally, the high modulus layer has an elastic modulus that is more than 100 times the elastic modulus of the low modulus layer. In this case, the high modulus layer is able to release the impact stress in the horizontal direction while constraining the deformation of the low modulus layer to prevent it from undergoing irreversible deformation; and the low modulus layer can absorb impact energy in the vertical direction through proper deformation, and the deformation of the low modulus layer is controlled within a controllable range of the high modulus layer. Therefore, the synergistic attenuation effect of the high-modulus layer and the low-modulus layer on impact energy is obvious, so that the terminal equipment provided with the impact-resistant module in the embodiment of the application can have good impact resistance, particularly good falling ball impact resistance.

Optionally, the high modulus layer has an elastic modulus 100 to 500 times greater than the elastic modulus of the low modulus layer. Under the condition, the elastic modulus of the high-modulus layer and the elastic modulus of the low-modulus layer are matched, so that the excellent impact resistance effect is exerted, and the deformation of the internal structure of the impact resistance module or the peeling between the high-modulus layer and the low-modulus layer is avoided. If the multiple between the elastic modulus of the high modulus layer and the elastic modulus of the low modulus layer exceeds 500 times, either the elastic modulus of the high modulus layer is too large or too large, or the elastic modulus of the low modulus layer is too small or too small, which is not favorable for obtaining excellent impact resistance. When the elastic modulus of the high-modulus layer is too large, the high-modulus layer has too high hardness and is difficult to generate vibration deformation to disperse impact energy; when the elastic modulus of the low modulus layer is too small, the low modulus layer is too soft, and deformation occurring when subjected to impact is too large to pull a bonding layer between adjacent interfaces such as the high modulus layer or the high and low modulus layers, resulting in peeling of the low modulus layer from the surface of the high modulus layer.

Optionally, the high modulus layer has an elastic modulus 100 to 300 times greater than the elastic modulus of the low modulus layer. At this time, the low modulus layer and the high modulus layer are still tightly bonded, and peeling is not easily generated.

In the impact-resistant module, the thickness of the high-modulus layer mainly influences the release of energy generated in the horizontal direction by an impact received by the impact-resistant module, and the thickness of the low-modulus layer mainly absorbs the energy generated in the vertical direction by the impact through deformation, so that the thickness of the low-modulus layer directly influences the absorption of the energy in the vertical direction. Optionally, the thickness of the high modulus layer is less than the thickness of the low modulus layer. In this case, the low modulus layer absorbs impact energy from the vertical direction by a thickness capable of generating large deformation, and the high modulus layer dissipates energy by vibration by setting a thinner thickness. The thickness required for the high modulus layer to achieve shock dissipation is significantly less than the thickness required for the low modulus layer to produce large deformations that absorb impact energy. In addition, since the thickness of the high modulus layer is less than the thickness of the low modulus layer, the volume fraction of the low modulus layer is higher than the volume fraction of the high modulus layer in the impact resistant module, thereby imparting good flexibility to the impact resistant module, thereby enabling its use in flexible terminals.

Optionally, the high modulus layer has a thickness of less than or equal to 25 μm. Under the condition that the thickness of the high-modulus layer is less than or equal to 25 micrometers, the high-modulus layer not only can disperse and release impact energy in the vertical direction to the periphery through vibration deformation, but also has better flexibility, can endow an impact-resistant module with good bending performance, and is further used in terminal products with higher requirements on the bending performance. The minimum thickness to which the high modulus layer can be selected can be set according to the type of specific end product for which it is to be used.

Optionally, the low modulus layer has a thickness greater than or equal to 50 μm. The low modulus layer is capable of significant deformation at a thickness of 50 μm or more and absorbing impact energy by large deformation. The maximum thickness of the low modulus layer that can be selected can be set according to the type of specific end product for which it is used.

Optionally, the high modulus layer has a thickness of less than or equal to 25 μm and the low modulus layer has a thickness of greater than or equal to 50 μm. At the moment, the high-modulus layer vibration energy dissipation and the low-modulus layer deformation energy absorption are mutually cooperated between the low-modulus layer and the high-modulus layer which are alternately arranged in sequence, so that the received impact energy is attenuated layer by layer, and the impact resistance module is endowed with excellent impact resistance on the basis of no irreversible deformation.

Optionally, the thickness of the impact-resistant module is greater than or equal to 100 μm. In this case, the impact module comprises at least one low modulus layer with a thickness of 50 μm or more and two high modulus layers with a thickness of 25 μm or less to form a laminate of high modulus layer-low modulus layer-high modulus layer, the middle low modulus layer is used to generate large deformation absorption energy, the high modulus layers on both sides uniformly release the large deformation of the low modulus layer to the surroundings and restrain the deformation of the low modulus layer, the two layers act cooperatively to absorb the impact energy and reduce the risk of pulling and deforming the adjacent functional layers when used as an impact module for an end product.

In the anti-impact module, the high-modulus layer can be stacked and combined by two or more high-modulus films to form a laminated structure, so that a high-modulus laminated layer is constructed. The high-modulus films of two or more layers in the high-modulus lamination layer can be high-modulus films of the same material or high-modulus films of different materials. Through setting up two-layer or two-layer above high modulus film, progressively release the energy of the horizontal direction that the impact produced, simultaneously, through attenuate individual layer high modulus layer, increase the deformation size that the impact produced on high modulus film, make high modulus film can absorb the impact energy of vertical direction to a certain extent.

Optionally, at least one of the two opposite side surfaces of the impact resistant module is a high modulus laminate. In one embodiment, one of the opposing side surfaces of the impact resistant die set is a high modulus laminate. The high modulus laminate now serves as the first layer for the impact module to experience impact. In one embodiment, the opposing surfaces of the impact resistant die set are high modulus laminates.

Optionally, at least one of two opposite side surfaces of the impact-resistant module is a high-modulus laminate, and the high-modulus laminate sequentially comprises a first high-modulus film and a second high-modulus film along the direction from the surface layer to the middle layer; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film. At this time, the film layer of the impact-resistant module which firstly receives the impact signal is a relatively thin first high-modulus film, the first high-modulus film attenuates part of energy perpendicular to the film direction by generating deformation larger than that of the second high-modulus film, so as to prevent the impact energy transmitted to the lower low-modulus layer (the vertical impact stress felt by the first low-modulus layer is the largest) from being too large, so that the large deformation generated by the low-modulus layer pulls the adjacent interface layer such as the high-modulus layer or the bonding layer between the high-modulus layers, the low-modulus layer is stripped from the surface of the high-modulus layer, the combination between the adjacent high-modulus layer and the low-modulus layer is influenced, and the energy absorption effect of the impact-resistant module is further influenced.

Optionally, in the impact-resistant module, the high modulus layers are all high modulus laminates.

Optionally, in the impact-resistant module, the high-modulus layers are all high-modulus laminates; the high-modulus lamination layers on the two side surfaces sequentially comprise a first high-modulus film and a second high-modulus film along the direction from the surface layer to the middle layer; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film.

Optionally, the thickness of the first high modulus film is 2.5 μm to 7.5 μm, the thickness of the second high modulus film is 5 μm to 15 μm, and the thickness of the first high modulus film is smaller than the thickness of the second high modulus film. In this case, the high modulus layer gradient releases impact energy from the horizontal direction; meanwhile, the first high-modulus film on the outermost layer attenuates a small part of impact energy from the vertical direction, so that the energy absorption effect of the impact-resistant module can be improved, the impact strength received by the adjacent low-modulus layer can be reduced, and the adjacent low-modulus layer is prevented from being peeled from the adjacent high-modulus layer due to overlarge deformation. The thickness through setting up first high modulus film and second high modulus film is in above-mentioned within range, can reduce the number of piles of modulus layer, and the thickness of attenuate shock-resistant module makes it be applicable to more in the terminal product that has high requirement to flexibility or bending performance to exert excellent shock resistance.

On the basis of the above embodiment, the high modulus layers in the impact resistant module are the same or different, and the same or different high modulus layers are each independently selected from a polyimide monolayer, a polyimide laminate, a polymethyl methacrylate monolayer, a polymethyl methacrylate laminate, a polycarbonate monolayer, a polycarbonate laminate, a polyether sulfone monolayer, a polyether sulfone laminate, a polyamide monolayer, a polyamide laminate, a polyethylene terephthalate monolayer, a polyethylene terephthalate laminate, a polyether ether ketone monolayer, a polyether ether ketone laminate, a polyethylene naphthalate monolayer, a polyethylene naphthalate laminate, a polyethylene imine monolayer, a polyethylene imine laminate, a polyurethane monolayer, a polyurethane laminate, a polydimethylsiloxane monolayer, a polydimethylsiloxane laminate, an acrylic monolayer, an acrylic laminate, a polymer monolayer containing ether series, a polymer laminate containing ether series, a single layer of a polyolefin, a laminate layer of a polyolefin, or a composite layer formed of two or more of polyimide, polymethyl methacrylate, polycarbonate, polyether sulfone, polyamide, polyethylene terephthalate, polyether ether ketone, polyethylene naphthalate, polyethylene imine, polyurethane, polydimethylsiloxane, acryl, an ether-containing polymer, and a polyolefin layer.

On the basis of the implementation situation, the low modulus layers in the anti-impact module are the same or different, and the same or different low modulus layers are selected from a foam layer, an optical adhesive layer, a polyurethane layer and a silica gel layer, or a composite material layer formed by two or more than two of foam, optical adhesive, polyurethane and silica gel, or a composite layer formed by two or more than two of the foam layer, the optical adhesive layer, the polyurethane layer and the silica gel layer.

Optionally, the low modulus layer is an optical adhesive layer, a polyurethane layer, a silica gel layer, or a composite material layer formed by two or more of foam, optical adhesive, polyurethane and silica gel, and the low modulus layer and the high modulus layer are combined in a laminated manner. In this case, since the low modulus layer has good viscoelasticity, the low modulus layer and the high modulus layer can be tightly bonded without an additional adhesive layer; and the viscoelastic characteristic of the low-modulus layer has a good sliding effect, so that the strain of the whole module can be attenuated, and the problem of interface peeling when the bending radius is reduced is avoided.

Optionally, the low modulus layer is a foam layer, and a glue layer is arranged between the low modulus layer and the high modulus layer. At this time, the low modulus layer and the high modulus layer are bonded by the glue layer. Optionally, the glue layer is selected from liquid glue or solid glue, such as double-sided glue.

In the anti-impact module, a laminated layer formed by a high-modulus layer and a low-modulus layer which are adjacently arranged is used as a structural unit, and the anti-impact module comprises three or more structural units. When the anti-impact module is provided with three or more than three structural units of the high-modulus layer-low-modulus layer lamination, energy generated by impact can sequentially pass through at least three groups of high-modulus layer-low-modulus layer laminations, the energy can be attenuated layer by layer and finally disappears, and the energy absorption effect of the anti-impact module is obvious.

In addition to the above embodiments, the light transmittance of the high-low modulus layer in the impact-resistant module may be selected. Optionally, the low modulus layer is a transparent low modulus layer and the high modulus layer is a transparent high modulus layer. At this time, the obtained impact-resistant module is a transparent impact-resistant module. Of course, when the end product using the impact-resistant module has no requirement for light transmittance of the impact-resistant module, the selection of the high-modulus layer and the low-modulus layer in the impact-resistant module is not strictly limited, and the layers can be matched arbitrarily.

In a second aspect, an embodiment of the present application provides a display screen, which includes an impact-resistant module. The anti-impact module is the anti-impact module provided by the first aspect.

Set up the anti-impact module that the first aspect provided in the display screen, can be when the display screen suffers the impact, disperse and absorb with the help of the energy that the anti-impact module will strike the production, reduce the impact greatly and show the damage of function to the display screen. In addition, the impact-resistant module is constructed by adopting the low-modulus layer and the high-modulus layer which are alternately arranged in sequence, and the surfaces of two opposite sides of the impact-resistant module are the high-modulus layers; wherein, the low modulus layer is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. On one hand, because the low-modulus layer and the high-modulus layer are alternately arranged, the rigidity of the high-modulus layer is dispersed by the low-modulus layers on two sides, so that compared with a rigid impact-resistant layer, the flexibility of the impact-resistant module provided by the embodiment of the application is obviously increased; on the other hand, the anti-impact module can thin other modules in the display screen by virtue of excellent anti-impact performance, and the anti-impact performance such as anti-falling ball impact performance is not attenuated after thinning, and the bending performance of the thinned display screen is improved. Therefore, the display screen provided with the impact-resistant module has excellent impact resistance and bending performance, and the bending radius of the display screen can meet the requirement of being less than 1.5. According to the display screen provided by the embodiment of the application, the falling ball impact resistance height is more than 60 cm; under the condition that the bending radius is 5-1.5, monomer bending can be realized for 20 ten thousand times; under the condition that the bending radius is less than 1.5, 20 ten thousand times of monomer bending can be realized.

Optionally, the high modulus layer has an elastic modulus 100 to 500 times greater than the elastic modulus of the low modulus layer. If the multiple between the modulus of elasticity of the high modulus layer and the modulus of elasticity of the low modulus layer is too high, either the modulus of elasticity of the high modulus layer is too high or the modulus of elasticity of the low modulus layer is too low. When the elastic modulus of the high-modulus layer is too large, the high-modulus layer has too high hardness and is difficult to generate vibration deformation to disperse impact energy; when the elastic modulus of the low modulus layer is too small, the low modulus layer is too soft, and deformation occurring when subjected to impact is too large to pull a bonding layer between adjacent interfaces such as the high modulus layer or the high and low modulus layers, resulting in peeling of the low modulus layer from the surface of the high modulus layer.

Optionally, the high modulus layer has an elastic modulus 100 to 300 times greater than the elastic modulus of the low modulus layer. At this time, peeling between the low modulus layer and the high modulus layer does not easily occur.

In the impact-resistant module, the thickness of the high-modulus layer mainly influences the release of energy generated in the horizontal direction by an impact received by the impact-resistant module, and the thickness of the low-modulus layer mainly absorbs the energy generated in the vertical direction by the impact through deformation, so that the thickness of the low-modulus layer directly influences the absorption of the energy in the vertical direction. Optionally, the thickness of the high modulus layer is less than the thickness of the low modulus layer. In this case, the low modulus layer absorbs impact energy by a thickness capable of generating large deformation, and the high modulus layer dissipates energy by vibration by setting a thinner thickness. The thickness required for the high modulus layer to achieve shock dissipation is significantly less than the thickness required for the low modulus layer to produce large deformations that absorb impact energy. At the moment, the anti-impact module has excellent anti-impact performance, and the volume ratio of the low-modulus layer is higher than that of the high-modulus layer, so that the anti-impact module is endowed with good flexibility, and the flexibility requirement of the flexible display screen can be met.

Optionally, the high modulus layer has a thickness of less than or equal to 25 μm. Under the condition that the thickness of the high-modulus layer is less than or equal to 25 micrometers, the high-modulus layer not only can disperse and release impact energy in the vertical direction to the periphery through vibration deformation, but also has better flexibility, can endow an impact-resistant module with good bending performance, and is further used in terminal products with higher requirements on the bending performance. Optionally, the high modulus layer has a thickness greater than or equal to 1 μm.

Optionally, the thickness of the low modulus layer is greater than or equal to 50 μm. The low modulus layer is capable of significant deformation at a thickness of 50 μm or more and absorbing impact energy by large deformation. Optionally, the thickness of the low modulus layer is less than or equal to 100 μm.

Optionally, the thickness of the impact-resistant die set is greater than or equal to 100 μm. In this case, the anti-impact module at least comprises a low modulus layer with the thickness of more than or equal to 50 μm and two high modulus layers with the thickness of less than or equal to 25 μm, a laminated structure of the high modulus layer-the low modulus layer-the high modulus layer is formed, the middle low modulus layer is used for generating large deformation absorption energy, the high modulus layers at two sides uniformly release the large deformation of the low modulus layer to the surroundings, and the two layers play a role of cooperatively absorbing the impact energy; meanwhile, the high-modulus layer can restrict the deformation of the low-modulus layer, and the phenomenon that the high-modulus layer (the layer which receives the impact signal firstly in the low-modulus layer) on the upper layer is pulled by the large deformation of the first low-modulus layer (the layer which receives the impact signal firstly in the high-modulus layers on the two sides) to cause the deformation of the high-modulus layer and pull other functional layers or modules which are adjacent to the impact-resistant module in the display screen, such as a touch display module, to cause the deformation of the adjacent functional layers or modules is avoided.

Optionally, the thickness of the impact-resistant die set is 100 μm to 350 μm. In this case, the anti-impact module comprises one or more sets of alternately arranged low modulus layers and high modulus layers to disperse and absorb energy generated by impact, thereby significantly improving the anti-impact performance of the display screen. On the basis, the impact resistance of the display screen is improved, so that other modules in the display screen can be thinned, and the bending performance of the display screen is improved by combining the good flexibility characteristic of the impact resistance module; and the thinned display screen still keeps the impact resistance such as the falling ball impact resistance and is not attenuated. Therefore, the display screen provided with the impact-resistant module has excellent impact resistance and bending performance, and the bending radius of the display screen can meet the requirement of being less than 1.5.

Optionally, the display screen further includes a support film, a touch display module disposed on one surface of the support film, a polarizer disposed on a surface of the touch display module facing away from the support film, and a cover plate disposed on a surface of the polarizer facing away from the touch display module.

The anti-impact module is a transparent anti-impact module, and the anti-impact module can be arranged between the polaroid and the cover plate and also can be arranged between the touch display module and the support film. In one embodiment, the anti-impact module is a transparent anti-impact module, and the anti-impact module is disposed between the polarizer and the cover plate. At the moment, the transparent impact-resistant module is arranged on the light emitting side of the touch display module, so that the display function of the display screen cannot be influenced.

Optionally, the refractive index of the transparent anti-impact module is anisotropic, and the transparent anti-impact module is disposed between the polarizer and the cover plate. In this case, the anti-impact module is disposed above the polarizer, so that the influence of the anti-impact module on the optical performance of the polarizer can be reduced.

When the refractive index of the transparent anti-impact module is isotropic, the transparent anti-impact module has no difference on the optical performance of the polarizer, so that the transparent anti-impact module can be arranged between the polarizer and the cover plate or between the touch display module and the polarizer.

Optionally, the refractive index of the transparent anti-impact module is isotropic, and the transparent anti-impact module is disposed between the touch display module and the polarizer. At this moment, the anti-impact module is directly arranged on the surface of the touch display module for bearing impact, so that the protective layer of the touch display module is thickened, the energy absorption effect can be improved more remarkably, and the effect of thinning the cover plate is achieved.

In another embodiment, the impact-resistant module is a non-transparent impact-resistant module, and the impact-resistant module is disposed between the touch display module and the support film. At this moment, the impact-resistant module is opaque or has poor light transmittance, so that the impact-resistant module is arranged below the touch display module (on the side far away from the light emergent side) to ensure that the display screen can perform a normal display function.

Optionally, at least one of the two opposite side surfaces of the impact resistant module is a high modulus laminate. In one embodiment, one of the opposing side surfaces of the impact resistant module is a high modulus laminate. Optionally, the high modulus laminate serves as a first layer for shock sensing of the shock resistant module and is disposed adjacent to the cover plate. In one embodiment, the opposing surfaces of the impact resistant module are high modulus laminates.

Optionally, the high modulus stack comprises a first high modulus film and a second high modulus film in sequence along the direction from the surface layer to the middle layer; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film. At this moment, when the display screen receives the impact, the relatively thin first high-modulus film in the impact-resistant module firstly receives the impact signal, the first high-modulus film not only releases the impact energy parallel to the film direction through vibration deformation, but also attenuates part of the energy perpendicular to the film direction through generating deformation larger than that of the second high-modulus film, so that the impact energy transmitted to the lower low-modulus layer is prevented from being too large, the large deformation generated by the low-modulus layer pulls the adjacent interface layer, the low-modulus layer and the adjacent high-modulus layer are peeled, and the energy absorption effect of the impact-resistant module is influenced. In addition, can also avoid the deformation that the low modulus layer produced too big, drag upper high modulus layer to further drag in the display screen and the adjacent functional layer of module that shocks resistance leads to it to take place deformation. Therefore, the impact-resistant module is arranged between the touch display module and the support film, and when at least the high-modulus layer adjacent to the touch display module is the high-modulus laminate, and the high-modulus laminate sequentially comprises a first high-modulus film and a second high-modulus film along the direction from the surface layer to the middle layer; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film.

Optionally, the high modulus stack comprises a first high modulus film and a second high modulus film bonded to the surface of the first high modulus film; and the first high modulus film and the second high modulus film have different thicknesses.

Optionally, in the impact-resistant module, the high-modulus layers are all high-modulus laminates; in the high modulus layers on the two side surfaces, the high modulus lamination layer sequentially comprises a first high modulus film and a second high modulus film along the direction from the surface layer to the middle layer; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film.

Optionally, the thickness of the first high modulus film is 2.5 μm to 7.5 μm, the thickness of the second high modulus film is 5 μm to 15 μm, and the thickness of the first high modulus film is smaller than the thickness of the second high modulus film. In this case, the high modulus layer gradient releases impact energy from the horizontal direction; meanwhile, the first high-modulus film on the outermost layer attenuates a small part of impact energy from the vertical direction, so that the energy absorption effect of the impact-resistant module can be improved, the impact strength received by the adjacent low-modulus layer can be reduced, and the adjacent low-modulus layer is prevented from being peeled from the adjacent high-modulus layer due to overlarge deformation. By setting the thicknesses of the first high modulus film and the second high modulus film within the above ranges, the display panel can be given good flexibility and exert excellent impact resistance. On this basis, the display screen can further attenuate the thickness of other modules or structural layers, improves the flexibility of display screen, makes its radius of buckling be less than 1.5 to keep excellent shock resistance.

In one embodiment, one of two opposite side surfaces of the impact-resistant module is a high-modulus laminate, and the high-modulus laminate is arranged on the side, away from the support film, of the impact-resistant module; and the high modulus stack comprises a first high modulus film and a second high modulus film in sequence along the direction from the surface layer to the middle layer. Wherein the first high modulus film and the second high modulus film are polyimide layers with thicknesses of 5 μm and 10 μm, respectively. In this case, the 5 μm and 10 μm polyimide layers release impact energy from the horizontal direction together; meanwhile, the polyimide layer with the thickness of 5 microns on the outermost layer is thin, so that a small part of impact energy from the vertical direction can be attenuated, the energy absorption effect of the impact-resistant module can be improved, the impact strength received by the adjacent low-modulus layer can be reduced, and the adjacent low-modulus layer is prevented from being peeled from the adjacent high-modulus layer due to overlarge deformation. The thickness through setting up first high modulus film and second high modulus film is in above-mentioned within range, can reduce the number of piles of modulus layer, and the thickness of attenuate shock-resistant module makes it be applicable to more in the terminal product that has high requirement to flexibility or bending performance to exert excellent shock resistance.

In one embodiment, the opposite surfaces of the impact resistant module are high modulus laminates; and along the direction that the superficial layer faces the intermediate level, the high modulus stromatolite of the opposite both sides of anti impact module includes first high modulus film and second high modulus film in proper order. Wherein the first high modulus film and the second high modulus film are polyimide layers with thicknesses of 5 μm and 10 μm, respectively. In this case, the lower most (last to experience the impact pressure) high modulus laminate, with the thicker polyimide layer disposed adjacent to the low modulus layer, is thicker than the 5 μm polyimide layer, and has a more effective restraining effect on the deformation caused by the low modulus layer.

In one embodiment, the high modulus layers in the impact resistant module are all high modulus laminates; and the high modulus lamination layers on the two side surfaces sequentially comprise a first high modulus film and a second high modulus film along the direction from the surface layer to the middle layer. Wherein the first high modulus film and the second high modulus film are polyimide layers with thicknesses of 5 μm and 10 μm, respectively.

In the display screen, on the basis of setting up the anti module of shocking of the first aspect, can carry out the attenuate processing to at least one deck in apron, the polaroid rete. Optionally, the thickness of the cover plate is greater than or equal to 13 μm, i.e. the thickness of the cover plate may be as low as 13 μm. In some implementations, the thickness of the cover plate is 13 μm to 80 μm; in some implementations, the thickness of the cover plate is 50 μm to 80 μm. Optionally, the thickness of the polarizer is greater than or equal to 5 μm, i.e., the thickness of the polarizer may be as low as 5 μm. In some embodiments, the polarizer has a thickness of 5 μm to 108 μm; in some embodiments, the polarizer has a thickness of 5 μm to 67 μm; optionally, the thickness of the polarizer is 5 μm to 33 μm. Optionally, an OCA layer is disposed between the polarizer and the touch display module, and the thickness of the OCA layer is greater than or equal to 5 μm, that is, the thickness of the OCA layer can be as low as 5 μm. In some embodiments, the thickness of the OCA layer is 5 μm to 25 μm; in some embodiments, the thickness of the OCA layer is between 5 μm and 15 μm.

This application embodiment can obtain good flexibility through set up the anti-impact module of first aspect in the display screen, realizes the requirement that bend radius is less than 1.5, and the display screen is flexible display screen promptly.

In a third aspect, an embodiment of the present application provides a display terminal, which includes an impact-resistant module. The terminal equipment can be products with display interfaces such as mobile phones, displays, televisions, tablet computers, vehicle-mounted computers, portable computers and wearable equipment, and the specific form of the terminal equipment is not particularly limited in the embodiment of the application; the anti-impact module is the anti-impact module provided by the first aspect.

The display terminal provided by the embodiment of the application comprises a display screen. Optionally, the display terminal includes other modules besides the display screen, such as a back panel and a middle frame.

In a first embodiment, the display screen is the display screen of the second aspect, that is, the impact-resistant module provided by the first aspect is disposed in the display screen.

In the second kind of implementation, display terminal includes display screen and other modules, is provided with the anti module of shocking that the first aspect provided in other modules.

In the third implementation, display terminal includes display screen and other modules, and the display screen is provided with the anti-impact module that the first aspect provided, and also is provided with the anti-impact module that the first aspect provided in other modules.

In a fourth embodiment, the display terminal includes a display screen and other modules, and the impact-resistant module provided by the first aspect is arranged between the display screen and the other adjacent modules. Optionally, the display terminal includes display screen and center, is provided with the anti-impact module that the first aspect provided between display screen and the center.

Optionally, when the display terminal includes a back plate, the back plate may be thinned. Optionally, the thickness of the back plate is greater than or equal to 15 um. Optionally, the thickness of the back plate is 15um-35um, optionally, the thickness of the back plate is 35um-50 um.

Drawings

FIG. 1 is a schematic structural diagram of an impact-resistant module according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of an impact module according to an embodiment of the present disclosure for absorbing impact energy;

FIG. 3 is a schematic structural diagram of an impact resistant module according to an embodiment of the present invention, in which one of the skins is a high modulus laminate;

FIG. 4 is a schematic structural diagram of a high modulus layer in an impact resistant module according to an embodiment of the present disclosure;

FIG. 5 is a structural diagram of an impact resistant module according to an embodiment of the present invention, in which two skins are high modulus laminates;

FIG. 6 is a schematic structural diagram of an impact resistant module according to an embodiment of the present disclosure in which both skins are high modulus laminates;

FIG. 7 is a structural schematic diagram of high modulus layers in an impact resistant module provided by the embodiment of the present application, all of which are high modulus laminates;

FIG. 8 is a structural schematic diagram of the impact resistant module provided in the present application in which the high modulus layers are all high modulus laminates;

FIG. 9 is a schematic structural diagram of an impact resistant module according to an embodiment of the present invention, which includes three layers and one skin layer is a high modulus laminate;

FIG. 10 is a schematic structural diagram of an impact-resistant module provided by an embodiment of the present application, wherein the impact-resistant module comprises three layers and the high-modulus layers are all high-modulus laminates;

FIG. 11 is a schematic diagram of a first structure of a display screen provided in an embodiment of the present application;

FIG. 12 is a schematic diagram of a second structure of a display screen provided in an embodiment of the present application;

FIG. 13 is a schematic diagram of a third structure of a display screen provided in an embodiment of the present application;

FIG. 14 is a CFD graph provided in example 1, comparative example 1 and comparative example 2 of the present application.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the present application, the terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" describes an associative relationship of associated objects, meaning that three relationships may exist, e.g., a and/or B, may mean: a is present alone, A and B are present simultaneously, and B is present alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "and" relationship.

The term "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, "at least one (a), b, or c", or "at least one (a), b, and c", may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, and c may be single or plural, respectively.

As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

The terms "first" and "second" are used for descriptive purposes only and are used for distinguishing purposes such as substances, interfaces, messages, requests and terminals from one another and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. For example, a first film layer may also be referred to as a second film layer, and similarly, a second film layer may also be referred to as a first film layer, without departing from the scope of embodiments herein. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the application and to simplify the description, and are not intended to indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application.

It should be understood that, in various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, some or all of the steps may be executed in parallel or executed sequentially, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

The term "COVER" means a COVER plate; the term "CFD" is an abbreviation for "Compression Force Displacement", which means Compression rebound Force; the term "OCA" is an abbreviation for "optical Clear Adhesive", which means Optically Clear Adhesive; the term "CPOL" is an abbreviation for "Circular polarizer," which refers to a polarizer; the term "OLED" is an abbreviation of "organic light-Emitting Diode", representing an organic light-Emitting Diode; the term "TFT" is an abbreviation of "Thin Film Transistor", and denotes a Thin Film Transistor; the term "PI" is an abbreviation for "Polyimide", which means Polyimide.

Referring to fig. 1, in a first aspect, an impact-resistant module 10 is provided, which includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and both opposite side surfaces of the impact-resistant module are the high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa.

The impact-resistant module 10 provided by the embodiment of the application comprises a low-modulus layer 11 and a high-modulus layer 12 which are alternately arranged in sequence. In this case, as shown in fig. 2, when an impact is applied, the high modulus layer 12 of the surface layer of the impact resistant module 10 receives the impact signal first, and the impact stress is transmitted along the vertical direction and the horizontal direction of the impact resistant module 10. Because the high modulus layer 12 has strong rigidity and small deformation caused by impact, part of stress in the horizontal direction can be dispersed and released to the periphery along with the vibration deformation generated by the high modulus layer 12, and the stress in the vertical direction is continuously transmitted downwards; when the impact stress is transmitted to the lower low modulus layer 11, the low modulus layer 11 is largely deformed to absorb part of the impact stress, particularly the impact stress in the vertical direction. Meanwhile, high modulus layers 12 are respectively arranged on two opposite side surfaces of the anti-impact module 10, so that the low modulus layers 11 in the anti-impact module 10 are respectively clamped between the high modulus layers 12. At this time, the high modulus layer 12 uniformly releases the large deformation generated by the low modulus layer 11 to the periphery, so as to avoid the large deformation accumulation of the low modulus layer 11, which results in the large deformation of the structure adjacent to the pulling impact-resistant module 10.

According to the impact-resistant module 10 provided by the embodiment of the application, the low modulus layers 11 and the high modulus layers 12 which are alternately arranged in multiple layers are used for alternately absorbing energy, the stress generated by impact is gradually attenuated, finally, the impact energy is completely absorbed, the impact-resistant energy is improved, and meanwhile, due to the fact that the low modulus layers 11 and the high modulus layers 12 are alternately arranged, the rigidity of the high modulus layers 12 is dispersed by the low modulus layers 11 on the two sides, and therefore the impact-resistant module 10 has good flexibility. The impact-resistant module provided by the embodiment of the application has the advantages that the falling ball impact-resistant height is more than 60 cm; under the condition that the bending radius is 5-1.5, monomer bending can be realized for 20 ten thousand times; under the condition that the bending radius is less than 1.5, 20 ten thousand times of monomer bending can be realized.

In the embodiment of the present application, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa, and the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000 Mpa. The high modulus layer 12 with the elastic modulus ranging from 156MPa to 4000MPa can generate vibration deformation after receiving impact stress, and disperse and release the impact stress in a vibration deformation mode; the low modulus layer 11 with the elastic modulus between 0.4MPa and 20MPa can generate large deformation to attenuate impact stress after being impacted. If the elastic modulus of the high modulus layer 12 is too high, which is higher than 4000Mpa, the high modulus layer 12 has too high hardness, so that it is difficult to generate vibration deformation to disperse impact energy; if the elastic modulus of the low modulus layer 11 is too low, the film layer is too soft, and the deformation generated by the impact is too large to pull the bonding layer between adjacent interfaces such as the high modulus layer 12 or the high and low modulus layers, which causes the low modulus layer 11 to peel off from the surface of the high modulus layer 12, and affects the energy absorption effect of the impact resistant module 10.

In some embodiments, the low modulus layer 11 may be a low modulus layer having an elastic modulus of 0.4Mpa, 0.8Mpa, 1.0Mpa, 2.0Mpa, 3.0Mpa, 4.0Mpa, 5.0Mpa, 6.0Mpa, 7.0Mpa, 8.0Mpa, 9.0Mpa, 10Mpa, 11Mpa, 12Mpa, 13Mpa, 14Mpa, 15Mpa, 16Mpa, 17Mpa, 18Mpa, 19Mpa, 20 Mpa; in some embodiments, the high modulus layer 12 may be a high modulus layer having an elastic modulus of 156Mpa, 200Mpa, 500Mpa, 800Mpa, 1000Mpa, 1200Mpa, 1400Mpa, 1600Mpa, 1800Mpa, 2000Mpa, 2200Mpa, 2400Mpa, 2600Mpa, 2800Mpa, 3000Mpa, 3200Mpa, 3400Mpa, 3800Mpa, 4000 Mpa.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000 MPa. At this time, the elastic modulus of the high modulus layer 12 is in a proper range, which is more beneficial for the high modulus layer 12 to generate vibration deformation and release impact stress in the horizontal direction.

In some embodiments, the high modulus layer 12 has an elastic modulus that is more than 100 times the elastic modulus of the low modulus layer 11. In this case, the high modulus layer 12 is able to release the impact stress in the horizontal direction while constraining the deformation of the low modulus layer 11, preventing it from being irreversibly deformed; and the low modulus layer 11 can absorb impact energy in the vertical direction through proper deformation, and the deformation of the low modulus layer is controlled within a controllable range of the high modulus layer. Therefore, the synergistic attenuation effect of the high modulus layer 12 and the low modulus layer 11 on impact energy is obvious, so that the terminal equipment provided with the impact resistance module 10 in the embodiment of the application can have good impact resistance, especially drop ball impact resistance, and the drop ball impact resistance height is larger than 60 cm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11. In this case, in the impact-resistant module 10, the synergistic attenuation effect of the high modulus layer 12 and the low modulus layer 11 on the impact energy is significant, so that the terminal device provided with the impact-resistant module 10 according to the embodiment of the present application can have good impact resistance, especially good falling ball impact resistance.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11. In this case, in the anti-impact module 10, the synergistic attenuation effect of the high modulus layer 12 and the low modulus layer 11 on the impact energy is significant, and meanwhile, the high modulus layer 12 restrains the deformation of the low modulus layer 11 to prevent the irreversible deformation, so that the terminal device provided with the anti-impact module 10 according to the embodiment of the present application can have good impact resistance, particularly good anti-falling ball impact performance.

In some embodiments, the high modulus layer 12 has an elastic modulus 100 to 500 times greater than the elastic modulus of the low modulus layer 11. In this case, the elastic modulus of the high modulus layer 12 and the elastic modulus of the low modulus layer 11 are matched, so that the internal structure of the impact resistant module 10 is prevented from being deformed or the high and low modulus layers are prevented from being peeled off while the excellent impact resistance is exerted. If the multiple between the elastic modulus of the high modulus layer 12 and the elastic modulus of the low modulus layer 11 exceeds 500 times, either the elastic modulus of the high modulus layer 12 is too large or too large, or the elastic modulus of the low modulus layer 11 is too small or too small, which is not favorable for obtaining excellent impact resistance. When the elastic modulus of the high modulus layer 12 is too large, the high modulus layer 12 has too high hardness and is difficult to generate vibration deformation to disperse impact energy; when the elastic modulus of the low modulus layer 11 is too small, the low modulus layer is too soft, and deformation caused when an impact is applied is too large to pull a bonding layer between adjacent interfaces such as the high modulus layer 12 or high and low modulus layers, resulting in peeling of the low modulus layer 11 from the surface of the high modulus layer 12.

In some embodiments, the high modulus layer 12 has an elastic modulus that is 100 times, 120 times, 150 times, 180 times, 200 times, 220 times, 250 times, 280 times, 300 times, 320 times, 350 times, 380 times, 400 times, 420 times, 450 times, 480 times, 500 times, etc. specific times the elastic modulus of the low modulus layer 11. In some embodiments, the high modulus layer 12 has an elastic modulus 100 to 300 times greater than the elastic modulus of the low modulus layer 11. At this time, after the impact, the low modulus layer 11 and the high modulus layer 12 are still tightly bonded, and the peeling is not easily generated.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11. In this case, in the impact-resistant module 10, the elastic modulus of the high modulus layer 12 and the elastic modulus of the low modulus layer 11 are more matched, so that the synergistic attenuation effect of the high modulus layer 12 and the low modulus layer 11 on impact energy is obvious, and a terminal device provided with the impact-resistant module 10 according to an embodiment of the present application can have good impact resistance, particularly good falling ball impact resistance.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000 MPa; and the high modulus layer 12 has an elastic modulus 100 to 500 times that of the low modulus layer 11. In this case, in the anti-impact module 10, the elastic modulus of the high modulus layer 12 and the elastic modulus of the low modulus layer 11 are more matched, so that the synergistic attenuation effect of the high modulus layer 12 and the low modulus layer 11 on impact energy is obvious, and meanwhile, the high modulus layer 12 restrains the deformation of the low modulus layer 11 to prevent the irreversible deformation, so that the terminal device provided with the anti-impact module 10 in the embodiment of the present application can have good anti-impact performance, particularly good anti-falling ball impact performance.

In the impact-resistant module 10 provided in the embodiment of the present application, the thickness of the high modulus layer 12 mainly affects the release of energy generated in the horizontal direction by an impact received by the impact-resistant module 10, and the low modulus layer 11 mainly absorbs energy generated in the vertical direction by the impact through deformation, so the thickness of the low modulus layer 11 directly affects the absorption of energy in the vertical direction. In some embodiments, the high modulus layer 12 has a thickness less than the thickness of the low modulus layer 11. In this case, the low modulus layer 11 absorbs impact energy by a thickness capable of generating large deformation, and the high modulus layer 12 dissipates energy by vibration by setting a thin thickness. While the thickness of the high modulus layer 12 for shock dissipation is significantly thinner than the thickness of the low modulus layer 11 for large deformations that absorb impact energy. Furthermore, since the thickness of the high modulus layer 12 is smaller than that of the low modulus layer 11, the low modulus layer 11 accounts for a higher proportion of the impact resistant module 10 than the high modulus layer 12, thereby imparting good flexibility to the impact resistant module 10, enabling it to be used in a flexible terminal.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein the thickness of the high modulus layer 12 is less than the thickness of the low modulus layer 11 and the thickness of the high modulus layer 12 is less than or equal to 25 μm. Under the condition that the thickness of the high modulus layer 12 is less than or equal to 25 micrometers, the high modulus layer not only can disperse and release impact energy in the vertical direction to the periphery through vibration deformation, but also has better flexibility, can endow the impact-resistant module 10 with good bending performance, and is further used in an end product with higher requirements on the bending performance. The minimum thickness that the high modulus layer 12 can be selected to be set depending on the type of specific end product for which it is used.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein the thickness of the high modulus layer 12 is less than the thickness of the low modulus layer 11, and the thickness of the low modulus layer 11 is greater than or equal to 50 μm. In some embodiments, the thickness of the low modulus layer 11 is greater than or equal to 50 μm and less than or equal to 100 μm. The low-modulus layer 11 is capable of generating significant deformation at a thickness of 50 μm or more and absorbing impact energy by large deformation. The maximum thickness of the low modulus layer 11 that can be selected can be set according to the type of specific end product to which it is applied.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein the high modulus layer 12 has a thickness of 25 μm or less and the low modulus layer 11 has a thickness of 50 μm or more. At this time, between the low modulus layer 11 and the high modulus layer 12 which are alternately arranged in sequence, the high modulus layer 12 vibration energy dissipation and the low modulus layer 11 deformation energy absorption are mutually cooperated, the received impact energy is attenuated layer by layer, and the impact resistance module 10 is endowed with excellent impact resistance on the basis of no irreversible deformation.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa and a thickness of more than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 4000MPa and a thickness of less than or equal to 25 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa and a thickness of more than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 2000MPa and a thickness of less than or equal to 25 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of more than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness of less than or equal to 25 μm, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

The impact-resistant module 10 provided by the embodiment of the application at least comprises a low modulus layer 11 and two high modulus layers 12 with different thicknesses, and a laminated structure of the high modulus layer 12, the low modulus layer 11 and the high modulus layer 12 is formed to play a role in cooperatively absorbing impact energy; meanwhile, the high modulus layers 12 are respectively arranged on the two surfaces of the low modulus layer 11 to restrain the deformation of the low modulus layer 11 so as to prevent the low modulus layer from generating excessive deformation. In some embodiments, the high modulus layer 12 has a thickness of less than or equal to 25 μm, the low modulus layer 11 has a thickness of greater than or equal to 50 μm, and the impact resistant module 10 has a thickness of greater than or equal to 100 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

With reference to fig. 3-10, the present embodiment provides an impact module 10 in which the high modulus layer 12 can be formed by laminating two or more high modulus films to form a high modulus laminate 120. The high modulus film in the high modulus stack 120 is laminated to the adjacent low modulus layer 11. The two or more high modulus films in the high modulus stack 120 may be high modulus films of the same material, or high modulus films of different materials. Through setting up two layers or two or more than two layers of high modulus films, progressively release the horizontal direction's that the impact produced energy, simultaneously, through attenuate individual layer high modulus layer 12, increase the deformation size that the impact produced on high modulus film, make high modulus film can absorb the impact energy of vertical direction to a certain extent.

In some embodiments, at least one of the opposing side surfaces of impact resistant module 10 is a high modulus laminate.

In one embodiment, as shown in fig. 3, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, the opposite surfaces of the impact resistant module 10 are both high modulus layers 12, and one of the two surfaces is a high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. It should be understood that the number of layers of the high modulus stack 120 is not limited to two layers.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa and the thickness more than or equal to 50 μm, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa; wherein the high modulus layer 12 has an elastic modulus 100 to 500 times that of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000 MPa; wherein the high modulus layer 12 has an elastic modulus 100 to 500 times that of the low modulus layer 11.

In some embodiments, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and two opposite side surfaces of the impact resistant module 10 are the high modulus layers 12, and one of the two side surfaces is the high modulus laminate 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In the above embodiment, as shown in fig. 4, one of the two opposite side surfaces of the impact-resistant module 10 is a high modulus stack 120, and along the direction from the surface layer to the middle layer, the high modulus stack 120 sequentially includes a first high modulus film 121 and a second high modulus film 122; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122. At this time, the film layer of the impact module 10 which receives the impact signal first is the relatively thin first high modulus film 121, and the first high modulus film 121 attenuates a part of energy perpendicular to the film direction by generating deformation larger than that of the second high modulus film 122, so as to prevent the impact energy transmitted to the lower low modulus layer 11 (the vertical impact stress sensed by the first low modulus layer is the largest) from being too large, so that the large deformation generated by the low modulus layer 11 pulls the adjacent interface layer, such as the high modulus layer 12 or the bonding layer between the high and low modulus layers, causing the low modulus layer 11 to peel off from the surface of the high modulus layer 12, affecting the bonding between the adjacent high modulus layer 12 and the low modulus layer 11, and further affecting the energy absorption effect of the impact module 10.

In one embodiment, as shown in fig. 5, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and both opposite side surfaces of the impact-resistant module 10 are high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. It should be understood that the number of layers of the high modulus stack 120 is not limited to two layers.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa and the thickness more than or equal to 50 μm, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa and the thickness more than or equal to 50 μm, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with an elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In the above embodiment, as shown in fig. 6, the opposite side surfaces of the impact-resistant module are high modulus laminates 120, and along the direction from the surface layer to the middle layer, the high modulus laminate 120 sequentially includes a first high modulus film 121 and a second high modulus film 122; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122. At this time, the film layer of the impact module 10 which receives the impact signal first is the relatively thin first high modulus film 121, and the first high modulus film 121 attenuates a part of energy perpendicular to the film direction by generating deformation larger than that of the second high modulus film 122, so as to prevent the impact energy transmitted to the lower low modulus layer 11 (the vertical impact stress sensed by the first low modulus layer is the largest) from being too large, so that the large deformation generated by the low modulus layer 11 pulls the adjacent interface layer, such as the high modulus layer 12 or the bonding layer between the high and low modulus layers, causing the low modulus layer 11 to peel off from the surface of the high modulus layer 12, affecting the bonding between the adjacent high modulus layer 12 and the low modulus layer 11, and further affecting the energy absorption effect of the impact module 10. And the lower most high modulus laminate 120, with the thicker second high modulus film 122 adjacent to the low modulus layer 11, can better constrain the deformation of the low modulus layer 11.

In some embodiments, as shown in fig. 7, the impact resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, the opposite surfaces of the impact resistant module 10 are both high modulus layers 12, and both high modulus layers 12 are high modulus laminates 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. It should be understood that the number of layers of the high modulus stack 120 is not limited to two layers.

In one embodiment, when the anti-impact module 10 includes a high modulus layer 12, a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the high modulus layers 12 are high modulus laminates 120, that is, the high modulus laminates 120 are on two opposite surfaces of the anti-impact module 10, as shown in fig. 9.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa and the thickness more than or equal to 50 μm, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa and the thickness more than or equal to 50 μm, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa and the thickness less than or equal to 25 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness less than or equal to 25 μm, and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is more than 100 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000MPa, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness greater than or equal to 50 μm, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 4000Mpa and a thickness less than or equal to 25 μm, the thickness of the impact resistant module 10 is greater than or equal to 100 μm, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 2000MPa, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In some embodiments, the impact-resistant module 10 includes a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the opposite surfaces of the impact-resistant module 10 are both the high modulus layers 12, and the high modulus layers 12 are both the high modulus stacks 120; wherein, the low modulus layer 11 is a modulus layer with an elastic modulus between 0.4Mpa and 20Mpa and a thickness of 50 μm or more, the high modulus layer 12 is a modulus layer with an elastic modulus between 156Mpa and 2000Mpa and a thickness of 25 μm or less, the thickness of the impact resistant module 10 is 100 μm or more, and the elastic modulus of the high modulus layer 12 is 100 times to 500 times of the elastic modulus of the low modulus layer 11.

In the above embodiment, as shown in fig. 8, the opposite two side surfaces of the impact-resistant module 10 are high modulus laminates 120, and along the direction from the surface layer to the middle layer, the high modulus laminate 120 sequentially includes a first high modulus film 121 and a second high modulus film 122; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122. At this time, in the high modulus stack 120 of the intermediate layer, the arrangement direction of the first high modulus film 121 and the second high modulus film 122 is not strictly limited.

In some embodiments, as shown in fig. 10, when the impact-resistant module 10 includes a high modulus layer 12, a low modulus layer 11 and a high modulus layer 12 alternately arranged in sequence, and the high modulus layers 12 are high modulus laminates 120, that is, the opposite surfaces of the impact-resistant module 10 are high modulus laminates 120. The high modulus stack 120 comprises, in order along the surface layers towards the middle layer, a first high modulus film 121 and a second high modulus film 122; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

Based on the above embodiments, in some embodiments, the high modulus stack 120 comprises a first high modulus film 121, and a second high modulus film 122 bonded to the surface of the first high modulus film 121; wherein, the thickness of the first high modulus film 121 is 2.5 μm to 7.5 μm, the thickness of the second high modulus film 122 is 5 μm to 15 μm, and the thickness of the first high modulus film 121 is less than the thickness of the second high modulus film 122. In this case, the gradient of the high modulus layer 12 primarily releases impact energy from the horizontal direction while attenuating a small portion of the impact energy from the vertical direction, resulting in a significantly improved resistance of the impact module 10 to impact. The thickness of the first high-modulus film 121 and the second high-modulus film 122 is within the range, the number of layers of the modulus layer can be reduced, the thickness of the impact-resistant module 10 is reduced, the impact-resistant module is more suitable for terminal products with high requirements on flexibility or bending performance, and excellent impact resistance is exerted.

Based on the above implementation, the high modulus layer 12 in the impact resistant module 10 provided in the embodiment of the present application may be the same material as the high modulus layer 12, or different materials of the high modulus layer 12 may be selected. Of course, it should be understood that when the high modulus layers 12 in the impact module 10 are made of different materials, the high modulus layers 12 may be made of different materials, or the high modulus layers 12 may be made of the same material, and the high modulus layers 12 may be made of different materials.

In one embodiment, the same high modulus layer 12 is selected for the high modulus layer 12 in the impact resistant module 10; in another embodiment, different high modulus layers 12 are selected for the high modulus layers 12 in the impact resistant module 10. On the basis of both embodiments, the same or different high modulus layers 12 are each independently selected from the group consisting of a polyimide monolayer, a polyimide stack, a polymethylmethacrylate monolayer, a polymethylmethacrylate stack, a polycarbonate monolayer, a polycarbonate stack, a polyethersulfone monolayer, a polyethersulfone stack, a polyamide monolayer, a polyamide stack, a polyethylene terephthalate monolayer, a polyethylene terephthalate stack, a polyetheretherketone monolayer, a polyetheretherketone stack, a polyethylene naphthalate monolayer, a polyethylene naphthalate stack, a polyethyleneimine monolayer, a polyethylene imine stack, a polyurethane monolayer, a polyurethane stack, a polydimethylsiloxane monolayer, a polydimethylsiloxane stack, an acrylic monolayer, an acrylic stack, a polymer monolayer containing an ether series, a polymer stack containing an ether series, a polyolefin monolayer, a polyolefin stack, or a composite layer formed of two or more of polyimide, polymethyl methacrylate, polycarbonate, polyether sulfone, polyamide, polyethylene terephthalate, polyether ether ketone, polyethylene naphthalate, polyethyleneimine, polyurethane, polydimethylsiloxane, acryl, an ether-containing polymer, and polyolefin, or a composite layer formed of two or more of polyimide layer, polymethyl methacrylate layer, polycarbonate layer, polyether sulfone layer, polyamide layer, polyethylene terephthalate layer, polyether ether ketone layer, polyethylene naphthalate layer, polyethylene imide layer, polyurethane layer, polydimethylsiloxane layer, acryl layer, an ether-containing polymer layer, and a polyolefin layer.

Based on the above implementation, the low modulus layer 11 in the impact resistance module 10 provided in the embodiment of the present application may be the same material of the low modulus layer 11, or different materials of the low modulus layer 11. Of course, it should be understood that when the high modulus layers 12 of different materials are selected for the low modulus layers 11 in the impact module 10, all of the low modulus layers 11 may be made of different materials, or some of the low modulus layers 11 may be made of the same material and some of the low modulus layers 11 may be made of different materials.

In one embodiment, the low modulus layer 11 in the impact resistant module 10 is selected from the same low modulus layer 11; in another embodiment, different low modulus layers 11 are selected for the low modulus layer 11 in the impact resistant mold set 10. On the basis of the two embodiments, the same or different low-modulus layer 11 is selected from a foam layer, an optical cement layer, a polyurethane layer, a silica gel layer, or a composite layer formed of two or more of foam, optical cement, polyurethane and silica gel.

In the present embodiment, the low modulus layer 11 and the high modulus layer 12 may be directly bonded or bonded by a glue layer.

In some embodiments, the low modulus layer 11 is selected from an optical glue layer, a polyurethane layer, a silicone layer, or a composite layer formed of two or more of foam, optical glue, polyurethane, silicone, and the low modulus layer 11 is directly bonded to the high modulus layer 12.

In some embodiments, the low modulus layer 11 is selected from a foam layer, and a glue layer is disposed between the low modulus layer 11 and the high modulus layer 12, through which the low modulus layer 11 and the high modulus layer 12 are bonded.

In the impact-resistant module 10 provided in the above embodiment of the present application, a stacked layer formed by a high modulus layer 12 and a low modulus layer 11 disposed adjacently is used as one structural unit 101, and the impact-resistant module 10 includes three or more structural units 101. When the impact-resistant module 10 is provided with the three or more than three structural units 101 formed by laminating the high-modulus layers 12 and the low-modulus layers 11, energy generated by impact can sequentially pass through at least three laminated layers of the high-modulus layers 12 and the low-modulus layers 11, the energy can be attenuated layer by layer and finally disappears, and the energy absorption effect of the impact-resistant module 10 is obvious.

In addition to the above embodiments, the light transmittance of the high-low modulus layer 11 in the impact module 10 can be selected. In some embodiments, the low modulus layer 11 is a transparent low modulus layer 11 and the high modulus layer 12 is a transparent high modulus layer 12. At this time, the resulting impact-resistant module 10 is a transparent impact-resistant module. At this time, the resulting impact-resistant module 10 is a transparent impact-resistant module. Of course, when the light transmittance of the impact module 10 is not required in the end product using the impact module 10, the selection of the high modulus layer 12 and the low modulus layer 11 in the impact module 10 is not limited and can be arbitrarily matched.

In a second aspect, with reference to fig. 11-13, embodiments of the present application provide a display screen 100 including an impact-resistant module 10. The anti-impact module 10 is the anti-impact module 10 according to the first aspect.

Set up the anti-impact module 10 that the first aspect provided in the display screen, can be when the display screen suffers the impact, disperse and absorb with the help of the energy that anti-impact module 10 will strike the production, reduce the impact to very big degree and show the damage of function to the display screen. In addition, the impact-resistant module 10 is constructed by adopting the low-modulus layers 11 and the high-modulus layers 12 which are alternately arranged in sequence, and the surfaces of two opposite sides of the impact-resistant module 10 are the high-modulus layers 12; wherein, the low modulus layer 11 is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer 12 is a modulus layer with the elastic modulus between 156MPa and 4000 MPa. On one hand, because the low modulus layer 11 and the high modulus layer 12 are alternately arranged, the rigidity of the high modulus layer 12 is dispersed by the low modulus layers 11 on both sides, so that the flexibility of the impact resistant module 10 provided by the embodiment of the application is obviously increased compared with that of a rigid impact resistant layer; on the other hand, the impact-resistant module 10 can thin other modules in the display screen by virtue of excellent impact resistance, and still keep the impact resistance such as falling ball impact resistance after thinning without attenuation; and the bending performance of the thinned display screen is improved. Therefore, the display screen provided with the impact-resistant module 10 has excellent impact resistance and bending performance, and the bending radius of the display screen can meet the requirement of being less than 1.5. The display screen provided by the embodiment of the application has the advantages that the falling ball impact resistance height is more than 60cm (GB15763.2-2005 standard); under the condition that the bending radius is 5-1.5, monomer bending can be realized for 20 ten thousand times; under the condition that the bending radius is less than 1.5, 20 ten thousand times of monomer bending can be realized.

In the display panel 100, the impact-resistant module 10 is implemented as shown in the embodiment provided in the first aspect.

In some embodiments, the low modulus layer 11 is a modulus layer having an elastic modulus between 0.4Mpa and 20Mpa and the high modulus layer 12 is a modulus layer having an elastic modulus between 156Mpa and 2000 Mpa. At this time, the elastic modulus of the high modulus layer is in a proper range, which is more beneficial for the high modulus layer to generate vibration deformation and release impact stress in the horizontal direction.

In some embodiments, the high modulus layer 12 has an elastic modulus that is more than 100 times the elastic modulus of the low modulus layer 11. In this case, the high modulus layer 12 is able to release the impact stress in the horizontal direction while constraining the deformation of the low modulus layer 11, preventing it from being irreversibly deformed; and the low modulus layer 11 can absorb impact energy in the vertical direction through proper deformation, and the deformation of the low modulus layer is controlled within a controllable range of the high modulus layer. Therefore, the high modulus layer 12 and the low modulus layer 11 have an obvious synergistic attenuation effect on impact energy, so that a terminal device provided with the impact-resistant module 10 in the embodiment of the present application can have good impact resistance, especially drop ball impact resistance, and the drop ball impact resistance height is greater than 60cm (GB15763.2-2005 standard).

In some embodiments, the high modulus layer 12 has an elastic modulus 100 to 300 times greater than the elastic modulus of the low modulus layer 11.

In some embodiments, the high modulus layer 12 has a thickness less than the thickness of the low modulus layer 11. In this case, the low modulus layer 11 absorbs impact energy by a thickness capable of generating large deformation, and the high modulus layer 12 dissipates energy by vibration by setting a thin thickness. The thickness of the high modulus layer 12 for dissipating the vibration energy is obviously thinner than the thickness of the low modulus layer 11 for generating large deformation for absorbing the impact energy, and the impact-resistant module 10 not only has excellent impact resistance. In addition, since the thickness of the high modulus layer 12 is smaller than that of the low modulus layer 11, the low modulus layer 11 accounts for a higher proportion than the high modulus layer 12 in the impact resistant module 10, so that the impact resistant module 10 is endowed with good flexibility, and the flexibility requirement of the flexible display screen can be met.

In some embodiments, the high modulus layer 12 has a thickness of less than or equal to 25 μm. In some embodiments, the high modulus layer 12 has a thickness of greater than or equal to 1 μm sufficient to cause vibrational deformation to disperse and release impact energy in the vertical direction to the surroundings. In some embodiments, the high modulus layer 12 has a thickness less than or equal to 25 μm and greater than or equal to 1 μm.

In some embodiments, the thickness of the low modulus layer 11 is greater than or equal to 50 μm. In some embodiments, the thickness of the low modulus layer 11 is less than or equal to 100 μm to reduce the thickness of the display screen 100, thereby improving the user experience; meanwhile, since the high modulus layer 12 plays a role in restraining the deformation of the low modulus layer 11 to a certain extent, the thickness of the low modulus layer 11 is too high, the thickness of the high modulus layer 12 needs to be correspondingly increased to improve the effect of restraining the large deformation of the low modulus layer 11, and the increase of the thickness of the high modulus layer 12 reduces the flexibility of the display screen 100. In some embodiments, the thickness of the low modulus layer 11 is greater than or equal to 50 μm and less than or equal to 100 μm.

In some embodiments, the high modulus layer 12 has a thickness of less than or equal to 25 μm and the low modulus layer 11 has a thickness of greater than or equal to 50 μm. In some embodiments, the high modulus layer 12 has a thickness less than or equal to 25 μm, and greater than or equal to 1 μm; the thickness of the low-modulus layer 11 is 50 μm or more and 100 μm or less.

In some embodiments, the high modulus layer 12 has a thickness of less than or equal to 25 μm, and the low modulus layer 11 has a thickness of greater than or equal to 50 μm; and the thickness of the impact-resistant module 10 is greater than or equal to 100 μm. In this case, the impact-resistant module 10 at least comprises a low modulus layer 11 with a thickness of 50 μm or more and two high modulus layers 12 with a thickness of 25 μm or less to form a laminated structure of high modulus layer 11-low modulus layer 12-high modulus layer 11, the middle low modulus layer 11 is used to generate large deformation absorption energy, the high modulus layers 12 on both sides uniformly release the large deformation of the low modulus layer 11 to the surroundings, and the two layers exert the function of cooperatively absorbing the impact energy; meanwhile, the high modulus layer 12 can restrict the deformation of the low modulus layer 11, so as to prevent the large deformation of the first low modulus layer 11 (the layer of the low modulus layer which receives the impact signal first) from pulling the high modulus layer 12 (the layer of the high modulus layers at both sides which receives the impact signal first) at the upper layer, which leads to the deformation of the high modulus layer 12 and the deformation of other functional layers or modules, such as a touch display module, adjacent to the impact resistant module 10 in the display screen 100, which leads to the deformation of the adjacent functional layers or modules.

In some embodiments, the high modulus layer 12 has a thickness of less than or equal to 25 μm, and the low modulus layer 11 has a thickness of greater than or equal to 50 μm; and the thickness of the impact-resistant module 10 is 100 μm to 350 μm. In this case, the anti-impact module 10 includes one or more sets of alternately arranged low modulus layers 11 and high modulus layers 12 to disperse and absorb energy generated by impact, so as to significantly improve the impact performance of the display screen without significantly increasing the thickness of the display screen. On the basis, other modules in the display screen can be thinned, and the bending performance of the display screen is improved by combining the good flexibility characteristic of the impact-resistant module 10; and the thinned display screen still keeps the impact resistance such as the falling ball impact resistance and is not attenuated. Therefore, the display screen provided with the impact-resistant module 10 has excellent impact resistance and bending performance, and the bending radius of the display screen can meet the requirement of being less than 1.5. In some embodiments, the high modulus layer 12 has a thickness less than or equal to 25 μm, and greater than or equal to 1 μm; the thickness of the low-modulus layer 11 is 50 μm or more and 100 μm or less; the thickness of the impact-resistant mold set 10 is 100 μm to 350 μm.

In the display screen 100, the high modulus layer 12 in the impact resistant module 10 can be stacked and combined by two or more high modulus films to form a stacked structure, so as to construct the high modulus stack 120. The two or more high modulus films in the high modulus stack 120 may be high modulus films of the same material, or high modulus films of different materials. Through setting up two layers or two or more than two layers of high modulus films, progressively release the horizontal direction's that the impact produced energy, simultaneously, through attenuate individual layer high modulus layer 12, increase the deformation size that the impact produced on high modulus film, make high modulus film can absorb the impact energy of vertical direction to a certain extent.

In some embodiments, at least one of the opposing side surfaces of impact resistant module 10 is a high modulus laminate 120. In one embodiment, one of the opposing side surfaces of impact resistant module 10 is a high modulus laminate 120. In one embodiment, the opposing surfaces of the impact resistant module 10 are high modulus laminates 120.

In some embodiments, the high modulus layers 12 are all high modulus stacks 120 in the impact resistant module 10.

In some embodiments, the high modulus stack 120 comprises a first high modulus film 121, and a second high modulus film 122 bonded to a surface of the first high modulus film 121; and the thicknesses of the first high modulus film 121 and the second high modulus film 122 are different.

In the present embodiment, the low modulus layer 11 and the high modulus layer 12 may be directly bonded or bonded by a glue layer. In some embodiments, the low modulus layer 11 is selected from an optical glue layer, a polyurethane layer, a silicone layer, or a composite layer formed of two or more of foam, optical glue, polyurethane, silicone, and the low modulus layer 11 is directly bonded to the high modulus layer 12.

On the basis of the above embodiment, the display screen further includes a support film, a touch display module disposed on one surface of the support film, a polarizer disposed on a surface of the touch display module departing from the support film, and a cover plate disposed on a surface of the polarizer departing from the touch display module. The anti-impact module 10 may be disposed between the polarizer and the cover plate, or disposed between the touch display module and the support film.

In one embodiment, when the anti-impact module 10 is a transparent anti-impact module, the anti-impact module 10 may be disposed between the polarizer and the cover plate, or between the touch display module and the support film.

In some embodiments, as shown in fig. 11, the anti-impact module 10 is a transparent anti-impact module, and the refractive index of the transparent anti-impact module is isotropic, and the anti-impact module 10 is disposed between the polarizer and the touch display module. In this case, the impact resistance module 10 is disposed above the polarizer, and the influence of the impact resistance module 10 on the optical performance of the polarizer may be reduced.

In some embodiments, as shown in FIG. 11, the anti-impact module 10 is a transparent anti-impact module, and the refractive index of the transparent anti-impact module 10 is isotropic, and the anti-impact module 10 is disposed between the polarizer and the cover plate.

In some embodiments, as shown in FIG. 12, the anti-impact module 10 is a transparent anti-impact module, and the refractive index of the transparent anti-impact module 10 is anisotropic, and the anti-impact module 10 is disposed between the polarizer and the cover plate. At this moment, the anti-impact module is directly arranged on the surface of the touch display module for bearing impact, so that the protective layer of the touch display module is thickened, the energy absorption effect can be improved more remarkably, and the effect of thinning the cover plate is achieved.

In some embodiments, the anti-impact module 10 is disposed between the polarizer and the cover plate, and the surface of the anti-impact module 10 adjacent to the polarizer is the high modulus laminate 120. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the anti-impact module 10 is disposed between the polarizer and the cover plate, and the surface of the anti-impact module 10 adjacent to the cover plate is the high modulus laminate 120. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the anti-impact module 10 is disposed between the polarizer and the cover plate, and the high modulus stack 120 is disposed on two opposite surfaces of the anti-impact module 10. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the impact module 10 is disposed between the polarizer and the cover plate, and the high modulus layers 12 in the impact module 10 are all high modulus laminates 120. In some embodiments, the high modulus stack 120 of the opposite side surfaces of the impact resistant module 10 comprises, in order, a first high modulus film 121 and a second high modulus film 122, in the direction from the surface layer of the impact resistant module 10 towards the middle layer; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

Based on the above implementation, in some embodiments, the thickness of the first high modulus film 121 is 2.5 μm to 7.5 μm, and the thickness of the second high modulus film 122 is 5 μm to 15 μm. In this case, the gradient of the high modulus layer 12 primarily releases impact energy from the horizontal direction while attenuating a small portion of the impact energy from the vertical direction, resulting in a significantly improved resistance of the impact module 10 to impact. On this basis, the display screen can improve the flexibility of the display screen by reducing the thickness of other modules or structural layers, so that the bending radius of the display screen is smaller than 1.5, and the excellent shock resistance is kept.

In some embodiments, the first high modulus film 121 and the second high modulus film 122 are polyimide layers with thicknesses of 5 μm and 10 μm, respectively.

In another implementation, as shown in fig. 13, the impact-resistant module 10 is a non-transparent impact-resistant module, and the impact-resistant module 10 is disposed between the touch display module and the support film. At this time, the impact-resistant module 10 is opaque or has poor light transmittance, and therefore is disposed below the touch display module (on the side away from the light-emitting side) to ensure that the display screen 100 performs a normal display function.

In some embodiments, the impact-resistant module 10 is disposed between the touch display module and the support film, and the surface of the impact-resistant module 10 adjacent to the touch display module is the high modulus laminate 120. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the impact-resistant module 10 is disposed between the touch display module and the support film, and the surface of the impact-resistant module 10 adjacent to the support film is the high modulus laminate 120. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the impact-resistant module 10 is disposed between the touch display module and the support film, and the two opposite side surfaces of the impact-resistant module 10 are the high modulus laminates 120. And along the direction from the surface layer of the impact-resistant module 10 to the middle layer, the high modulus stack 120 comprises a first high modulus film 121 and a second high modulus film 122 in sequence; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the impact-resistant module 10 is disposed between the touch display module and the support film, and the high modulus layers 12 in the impact-resistant module 10 are all high modulus laminates 120. In some embodiments, the high modulus stack 120 of the opposite side surfaces of the impact resistant module 10 comprises, in order, a first high modulus film 121 and a second high modulus film 122, in the direction from the surface layer of the impact resistant module 10 towards the middle layer; wherein, the thickness of the first high modulus film 121 is smaller than that of the second high modulus film 122.

In some embodiments, the first high modulus film 121 and the second high modulus film 122 are polyimide layers with thicknesses of 5 μm and 10 μm, respectively. In this case, the 5 μm and 10 μm polyimide layers release impact energy from the horizontal direction together; meanwhile, the polyimide layer with the thickness of 5 microns on the outermost layer is thin, so that a small part of impact energy from the vertical direction can be attenuated, the energy absorption effect of the impact-resistant module can be improved, the impact strength received by the adjacent low-modulus layer can be reduced, and the adjacent low-modulus layer is prevented from being peeled from the adjacent high-modulus layer due to overlarge deformation. The thickness through setting up first high modulus film and second high modulus film is in above-mentioned within range, can reduce the number of piles of modulus layer, and the thickness of attenuate shock-resistant module makes it be applicable to more in the terminal product that has high requirement to flexibility or bending performance to exert excellent shock resistance.

In the display screen that this application embodiment provided, on the basis that sets up the module 10 that shocks resistance of the first aspect, can carry out the attenuate processing to at least one deck in rete such as apron, polaroid, make its thickness be less than the thickness of conventional flexible display screen.

In some embodiments, the cover plate of the display screen is thinned. Optionally, the thickness of the cover plate is greater than or equal to 13 μm, i.e. the thickness of the cover plate may be as low as 13 μm. In some embodiments, the cover plate has a thickness of 13 μm to 80 μm. In some embodiments, the cover plate has a thickness of 50 μm to 80 μm.

In some embodiments, the polarizer of the display screen is thinned. Optionally, the thickness of the polarizer is greater than or equal to 5 μm, i.e., the thickness of the polarizer may be as low as 5 μm. In some embodiments, the polarizer has a thickness of 5 μm to 108 μm; in some embodiments, the polarizer has a thickness of 5 μm to 67 μm; in some embodiments, the polarizer has a thickness of 5 μm to 33 μm.

In some embodiments, an OCA layer is disposed between the polarizer and the touch display module, and the OCA layer is thinned. Alternatively, the thickness of the OCA layer is greater than or equal to 5 μm, i.e. the thickness of the OCA layer may be as low as 5 μm. In some embodiments, the thickness of the OCA layer is 5 μm to 25 μm; in some embodiments, the thickness of the OCA layer is 5 μm to 15 μm.

In some embodiments, the cover plate and the polarizer of the display screen and the OCA layer arranged between the polarizer and the touch display module are thinned. In some embodiments, the cover plate has a thickness of 50 μm to 80 μm, the polarizer has a thickness of 5 μm to 108 μm, and the OCA layer has a thickness of 5 μm to 25 μm. This application embodiment can obtain good flexibility through set up the module 10 that shocks resistance of the first aspect in the display screen, realizes the requirement that bend radius is less than 1.5. Namely, the display screen provided by the embodiment of the application is a flexible display screen.

In a third aspect, an embodiment of the present application provides a display terminal, which includes an impact-resistant module 10. The terminal equipment can be products with display interfaces such as mobile phones, displays, televisions, tablet computers, vehicle-mounted computers, portable computers and wearable equipment, and the specific form of the terminal equipment is not particularly limited in the embodiment of the application; the impact-resistant module 10 is the impact-resistant module 10 provided in the first aspect.

The display terminal provided by the embodiment of the application comprises a display screen. In some embodiments, the display terminal includes other modules besides the display screen, such as a back panel, a middle frame, and the like.

The following description will be given with reference to specific examples.

Example 1

A display screen combines a graph 10 and a graph 12, and comprises a supporting film, a touch display module arranged on one surface of the supporting film, a polaroid arranged on the surface of the touch display module departing from the supporting film, a cover plate arranged on the surface of the polaroid departing from the touch display module, and an impact resistance module 10 arranged between the cover plate and the polaroid. The anti-impact module comprises three high-modulus laminates 120, a low-modulus layer 11 and a high-modulus laminate 120 which are sequentially stacked; wherein, the low modulus layer 11 is foam with the thickness of 100 μm; the two high modulus stacks 120 each comprise a first PI film 121 having a thickness of 5 μm and a second PI film 122 having a thickness of 15 μm disposed in a stack, and the second PI film 122 is disposed adjacent to the low modulus layer 11. Comparative example 1

The utility model provides a display screen, includes and supports the membrane, sets up at the touch-control display module assembly who supports a membrane surface, sets up the polaroid that deviates from the surface that supports the membrane at touch-control display module assembly, sets up the apron that deviates from the surface of touch-control display module assembly at the polaroid to and set up the anti-impact module between apron and polaroid. The difference from example 1 is that the impact resistant mold set is foam having a thickness of 100 μm.

Comparative example 2

The utility model provides a display screen, includes and supports the membrane, sets up at the touch-control display module assembly who supports a membrane surface, sets up the polaroid that deviates from the surface that supports the membrane at touch-control display module assembly, sets up the apron that deviates from the surface of touch-control display module assembly at the polaroid to and set up the anti-impact module between apron and polaroid. The difference from example 1 is that the impact resistant mold set is a silicone rubber having a thickness of 100 μm.

The display panels provided in example 1, comparative example 1 and comparative example 2 were subjected to a compression rebound stress strain curve test in accordance with ASTM D3574, and the test results are shown in fig. 14. As can be seen from fig. 14, compared to comparative example 1 and comparative example 2, the display panel provided in example 1 has a larger elastic modulus in the 20% strain range and a better energy absorption effect; the stress increases more slowly and bends more easily in the 20% -50% strain range. This is because: when a falling ball just begins to impact the buffer module, in the display screen provided in embodiment 1, the impact-resistant module has a low-modulus layer to resist first wave impact of the falling ball, and the graph shows that the material has a large elastic modulus and high hardness under a strain of a dotted curve within 20%, and can resist first wave falling ball impact; in the strain range of 20% -50%, the strain of the material is increased, but the stress is not increased basically, the stage is a process that the low-modulus part of the impact-resistant module absorbs energy again in large deformation, and meanwhile, the bending risk is further reduced and the bending is easier due to the fact that the stress is not increased basically in the bending process. Compared with the single-layer low-modulus impact-resistant module provided by the comparative example 1 and the single-layer low-modulus impact-resistant module provided by the comparative example 2, the energy absorption effect is improved by more than 30%. It should be noted that in the figure, "bright point" refers to a stage where the elastic modulus is relatively high, and the modulus difference between this stage and the following stage is relatively large, so that the bright point is positioned; "level difference absorption" means an interval: after a certain point of strain, the stress increases sharply beyond the saturation strain due to the low modulus layer deformation reaching saturation (so the energy absorption effect of the material before the level difference absorption point is best), and this interval is located as level difference absorption.

Example 2

A display screen, which combines with FIG. 1 (in the figure, the number of the structural units 101 is 1) and FIG. 12, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a high-modulus layer 12, a low-modulus layer 11 and a high-modulus layer 12 which are sequentially stacked; wherein the high modulus layer 12 is selected from a transparent PI layer with a thickness of 10 μm, and the low modulus layer 11 is selected from a transparent silica gel layer with a thickness of 100 μm.

Comparative example 3

A display screen, which combines with FIG. 1 (in the figure, the number of the structural units 101 is 1) and FIG. 11, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the touch display module and the polarizer. The transparent impact-resistant die set in comparative example 3 was the same as in example 2.

Comparative example 4

The utility model provides a display screen, includes and supports the membrane, sets up the touch-control display module assembly at a support membrane surface, sets up the polaroid that deviates from the surface that supports the membrane at touch-control display module assembly, sets up the apron that deviates from the surface of touch-control display module assembly at the polaroid. The difference from embodiment 2 is that the display screen is not provided with an impact resistant module.

The optical properties of the display screens provided in example 2, example 3 and comparative example 4 were tested by: the transmittance and reflectance tests were performed by using a spectrocolorimeter device CES3600, and the values of L, a, and b were extracted from the reflectance test data, and the test results are shown in table 1 below. Wherein R is an abbreviation for "Reflectivity", indicating the Reflectivity; l, a and b represent optical chromatic aberration, and L represents black and white brightness value; the larger the L value is, the brighter the screen is; a represents the red and green degree of the screen, a positive value represents the red bias, a negative value represents the green bias, and a more negative value represents the green bias, so that the screen is more serious in greenness and is not good; b represents the yellow-blue degree of the screen, positive values represent yellow, negative values represent blue, and the more negative values represent severe bluing of the screen, which is a poor performance of electrical properties.

TABLE 1

Table 1 shows that comparing comparative example 3 with comparative example 4, the display provided in example 2 of the present application, R, L and

are small, it can be seen that when the refractive index of the transparent impact-resistant mold set is anisotropic, the optical effect of placing the transparent impact-resistant mold set above the polarizer is small.

Example 3

A display screen, which combines with the structure units 101 shown in FIG. 1 (in the figure, the number of the structure units 101 is 3) and FIG. 12, comprises a support film, a touch display module arranged on one surface of the support film, a polarizer arranged on the surface of the touch display module departing from the support film, a cover plate arranged on the surface of the polarizer departing from the touch display module, and a transparent anti-impact module 10 arranged between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a laminated unit 101 formed by three groups of transparent PI high modulus layers 12 and transparent silica gel low modulus layers 11 which are alternately arranged in sequence, and the surfaces of two opposite sides of the impact-resistant module are both the transparent PI high modulus layers 12; wherein, the thickness of the transparent silica gel low modulus layer 11 is 100 μm, and the thickness of the transparent PI high modulus layer 12 is 15 μm.

Example 4

A display screen, which combines with FIG. 1 (in the figure, the number of the structural units 101 is 1) and FIG. 12, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a transparent PI high modulus layer 12, a silica gel low modulus layer 11 and a transparent PI high modulus layer 12 which are alternately arranged in sequence; wherein, the thickness of silica gel low modulus layer 11 is 150um, and the thickness of transparent PI high modulus layer 11 is 15 um.

Example 5

A display screen, which combines with FIG. 4 (in the figure, the number of the structural units 101 is 3) and FIG. 12, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a laminated unit 101 formed by three groups of TPU low modulus layers 11 and transparent PI high modulus layers 12 which are alternately arranged in sequence, and the two opposite side surfaces of the impact-resistant module 10 are both the transparent PI high modulus layers 12. The transparent PI high modulus layer 12 on the side of the impact resistant module 10 close to the cover plate is a transparent PI stack 120, and the transparent PI stack 120 includes a first transparent PI film 121 and a second transparent PI film 122 along the direction from the cover plate to the support film. The thickness of the TPU low modulus layer 11 is 100 μm, the thickness of the first transparent PI film 121 is 5 μm, and the thickness of the second polyimide film 122 is 8 μm.

Example 6

A display screen, which combines with FIG. 6 (in the figure, the number of the structural units 101 is 3) and FIG. 12, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a laminated unit 101 formed by three groups of foam low modulus layers 11 and transparent PI high modulus layers 12 which are alternately arranged in sequence, and the two opposite side surfaces of the impact-resistant module 10 are both the transparent PI high modulus layers 12. The transparent PI high modulus layers 12 on the opposite side surfaces of the impact resistant module 10 are transparent PI laminated layers 120, and the transparent PI laminated layers 120 include a first transparent PI film 121 and a second transparent PI film 122 along the direction from the surface layer to the middle layer of the impact resistant module. The thickness of the foam low modulus layer 11 is 120 μm, the thickness of the first transparent PI film 121 is 5 μm, and the thickness of the second transparent PI film 122 is 10 μm.

Example 7

A display screen combines figure 6 (in the figure, the number of the structural units 101 is 3) and figure 12, and comprises a support film, a touch display module arranged on one surface of the support film, a polarizer arranged on the surface of the touch display module deviating from the support film, a cover plate arranged on the surface of the polarizer deviating from the touch display module, an OCA layer arranged between the cover plate and the polarizer, and a transparent anti-impact module 10 arranged between the cover plate and the OCA layer. The transparent impact-resistant module 10 comprises a laminated unit 101 formed by three groups of silica gel low-modulus layers 11 and transparent PI high-modulus layers 12 which are alternately arranged in sequence, and the two opposite side surfaces of the impact-resistant module 10 are both the transparent PI high-modulus layers 12. The transparent PI high modulus layers 12 on the two opposite side surfaces of the impact resistant module 10 are transparent PI laminated layers 120, and the transparent PI laminated layers 120 include a first transparent PI film 121 and a second transparent PI film 122 along the direction from the surface layer to the middle layer of the impact resistant module 10. The thickness of the silica gel low modulus layer 11 is 30um, the thickness of the first transparent PI film 121 is 5 μm, and the thickness of the second transparent PI film 122 is 10 μm.

Comparative example 5

The utility model provides a display screen, includes and supports the membrane, sets up the touch-control display module assembly at a support membrane surface, sets up the polaroid that deviates from the surface that supports the membrane at the touch-control display module assembly, sets up the apron that deviates from the surface of touch-control display module assembly at the polaroid to and set up the transparent silica gel buffer layer between apron and polaroid, thickness is 100 mu m.

Example 8

A display screen, which combines with FIG. 1 (in the figure, the number of the structural units 101 is 1) and FIG. 13, includes a support film, a touch display module disposed on one surface of the support film, a polarizer disposed on the surface of the touch display module departing from the support film, a cover plate disposed on the surface of the polarizer departing from the touch display module, and an impact resistant module 10 disposed between the touch display module and the support film. The impact-resistant module 10 comprises a PI high modulus layer 12, a foam low modulus layer 11 and a PI high modulus layer 12 which are alternately arranged in sequence; wherein the thickness of the foam low modulus layer 11 is 100um, and the thickness of the PI high modulus layer 12 is 30 um.

Example 9

A display screen, which combines with FIG. 6 (in the figure, the number of the structural units 101 is 3) and FIG. 13, includes a support film, a touch display module set on one surface of the support film, a polarizer set on the surface of the touch display module departing from the support film, a cover plate set on the surface of the polarizer departing from the touch display module, and a transparent impact resistant module 10 set between the cover plate and the polarizer. The transparent impact-resistant module 10 comprises a high-modulus laminated unit 101 formed by three groups of TPU low-modulus layers 11 and PI high-modulus layers 12 which are alternately arranged in sequence. The PI high modulus layers 12 on the opposite side surfaces of the impact-resistant module 10 are PI laminated layers 120, and the PI laminated layers 120 include a first PI film 121 and a second PI film 122 along the direction from the surface layer to the middle layer of the impact-resistant module 10. The thickness of the TPU low modulus layer 11 is 100um, the thickness of the first PI film 121 is 5 μm, and the thickness of the second PI film 122 is 10 μm.

Comparative example 6

The utility model provides a display screen, includes and supports the membrane, sets up at the touch-control display module assembly who supports a membrane surface, sets up the polaroid that deviates from the surface that supports the membrane at touch-control display module assembly, sets up the apron that deviates from the surface of touch-control display module assembly at the polaroid to and set up the cotton buffer layer of bubble between supporting membrane and touch-control display module assembly, and the layer thickness is between 100 um.

The display screens provided by the embodiments 3-9 and the comparative examples 5 and 6 are subjected to a flexibility test and a falling ball impact resistance test, wherein the flexibility test method refers to the GB15763.2-2005 standard, the falling ball adopts a steel ball with the diameter of 20mm and the weight of 32.95g, the steel ball is collected to fall freely and impact a display module, and the height of a broken bright spot appears in a light emitting layer in the display module. The test results are shown in table 2 below.

TABLE 2

	Height of falling ball impact (cm)	Number of times of bending (thousands of times)
			Example 3	30	20 ten thousand
Example 4	35	20 ten thousand
			Example 5	40	20 ten thousand
Example 6	45	20 ten thousand
			Example 7	40	20 ten thousand
Comparative example 5	45	20 ten thousand times
			Example 8	55	20 ten thousand times
Example 9	60	20 ten thousand times
			Comparative example 6	40	20 ten thousand times

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. The anti-impact module is characterized by comprising a low-modulus layer and a high-modulus layer which are alternately arranged in sequence, wherein the surfaces of two opposite sides of the anti-impact module are the high-modulus layers; wherein, the low modulus layer is a modulus layer with the elastic modulus between 0.4MPa and 20MPa, and the high modulus layer is a modulus layer with the elastic modulus between 156MPa and 4000 MPa.

2. The impact-resistant module of claim 1, wherein the thickness of said high modulus layer is less than the thickness of said low modulus layer.

3. The impact-resistant module of claim 2, wherein the high modulus layer has a thickness of less than or equal to 25 μ ι η; and/or

The low modulus layer has a thickness greater than or equal to 50 μm.

4. The impact-resistant die set of claim 3, wherein the impact-resistant die set has a thickness greater than or equal to 100 μm.

5. An impact-resistant module according to any one of claims 1 to 4, wherein the modulus of elasticity of said high modulus layer is more than 100 times the modulus of elasticity of said low modulus layer.

6. The impact-resistant module of claim 5, wherein the modulus of elasticity of said high modulus layer is from 100 to 500 times the modulus of elasticity of said low modulus layer.

7. An impact-resistant module according to any one of claims 1 to 4, wherein said high modulus layer is a modulus layer having an elastic modulus between 156MPa and 2000 MPa.

8. An impact-resistant moulding set according to any of claims 1 to 4 wherein at least one of the opposing side surfaces of the impact-resistant moulding set is a high modulus laminate; or

In the anti-impact module, the high-modulus layers are all high-modulus laminates.

9. The impact resistant module of claim 8 wherein at least one of the opposing side surfaces of the impact resistant module is a high modulus laminate comprising in order, in the direction of the surface layer toward the middle layer, a first high modulus film and a second high modulus film; wherein the thickness of the first high modulus film is less than the thickness of the second high modulus film.

10. The impact-resistant module of claim 9, wherein said first high modulus film has a thickness of 2.5 to 7.5 μm and said second high modulus film has a thickness of 5 to 15 μm.

11. The impact-resistant molding set according to any one of claims 1 to 4 wherein said high modulus layers in said impact-resistant molding set are the same or different and said high modulus layers which are the same or different are each independently selected from the group consisting of a polyimide monolayer, a polyimide laminate, a polymethylmethacrylate monolayer, a polymethylmethacrylate laminate, a polycarbonate monolayer, a polycarbonate laminate, a polyethersulfone monolayer, a polyethersulfone laminate, a polyamide monolayer, a polyamide laminate, a polyethylene terephthalate monolayer, a polyethylene terephthalate laminate, a polyetheretherketone monolayer, a polyetheretherketone laminate, a polyethylene naphthalate monolayer, a polyethylene naphthalate laminate, a polyethyleneimine monolayer, a polyethyleneimine laminate, a polyurethane monolayer, a polyurethane laminate, a polydimethylsiloxane monolayer, a polydimethylsiloxane laminate, an acrylic monolayer, an acryl laminate, an ether series-containing polymer monolayer, an ether series-containing polymer laminate, a polyolefin monolayer, a polyolefin laminate, or a composite layer formed of two or more layers of a polyimide layer, a polymethyl methacrylate layer, a polycarbonate layer, a polyether sulfone layer, a polyamide layer, a polyethylene terephthalate layer, a polyether ether ketone layer, a polyethylene naphthalate layer, a polyethylene imine layer, a polyurethane layer, a polydimethylsiloxane layer, an acrylic layer, an ether series-containing polymer layer, and a polyolefin layer.

12. The impact-resistant module of any one of claims 1 to 4, wherein the low-modulus layers in the impact-resistant module are the same or different, and the same or different low-modulus layers are selected from a foam layer, an optical cement layer, a polyurethane layer, a silicone layer, or a composite layer formed by two or more of the foam layer, the optical cement layer, the polyurethane layer, and the silicone layer.

13. The impact-resistant module of claim 12, wherein the low-modulus layer is an optical glue layer, a polyurethane layer, a silicone layer, or a composite layer formed of two or more of foam, optical glue, polyurethane, and silicone, the low-modulus layer being laminated to the high-modulus layer; or

The low modulus layer is a foam layer, and a glue layer is arranged between the low modulus layer and the high modulus layer.

14. An impact-resistant module according to any one of claims 1 to 4, characterized in that a stack of a layer of said high modulus layer and a layer of said low modulus layer arranged adjacent to each other is provided as a structural unit, said impact-resistant module comprising three or more of said structural units.

15. An impact-resistant module according to any one of claims 1 to 4, wherein said low-modulus layer is a transparent low-modulus layer and said high-modulus layer is a transparent high-modulus layer.

16. Display screen, characterized in that, includes the anti-impact module of any one of claims 1 to 15.

17. The display screen of claim 16, wherein the impact resistant module has a thickness of 100 μ ι η to 350 μ ι η.

18. The display screen of claim 16, further comprising a support film, a touch display module disposed on a surface of the support film, a polarizer disposed on a surface of the touch display module facing away from the support film, and a cover plate disposed on a surface of the polarizer facing away from the touch display module.

19. The display screen of claim 18, wherein the impact resistant module is a transparent impact resistant module, and the impact resistant module is disposed between the touch display module and the cover plate; or

The anti-impact module is non-transparent and is arranged between the touch display module and the support film.

20. The display screen of claim 19, wherein the transparent impact-resistant module has an anisotropic refractive index, the transparent impact-resistant module being disposed between the polarizer and the cover plate; or

The refractive index of the transparent anti-impact module is isotropic, and the transparent anti-impact module is arranged between the touch display module and the polarizer.

21. The display screen of claim 19, wherein at least one of the opposing side surfaces of the impact resistant module is a high modulus laminate comprising, in order along the surface layers toward the middle layer, a first high modulus film and a second high modulus film; wherein the thickness of the first high modulus film is 2.5-7.5 μm, and the thickness of the second high modulus film is 5-15 μm.

22. The display screen of claim 21, wherein the first and second high modulus films are polyimide layers having a thickness of 5 μ ι η and 10 μ ι η, respectively.

23. A display screen as recited in any one of claims 19-22, wherein the cover plate has a thickness of greater than or equal to 13 μ ι η; and/or

The thickness of the polaroid is greater than or equal to 5 mu m; and/or

An OCA layer is arranged between the polarizer and the touch display module, and the thickness of the OCA layer is larger than or equal to 5 mu m.

24. A display screen in accordance with any one of claims 16 to 22, wherein the display screen is a flexible display screen.

25. Display terminal, characterized in that, includes the anti-shock module of any one of claims 1 to 15.

26. A display terminal according to claim 25, comprising a display screen according to any one of claims 16 to 24.