CN213122273U - Full-duplex communication module and scanning laser radar - Google Patents
Full-duplex communication module and scanning laser radar Download PDFInfo
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- CN213122273U CN213122273U CN202021571660.2U CN202021571660U CN213122273U CN 213122273 U CN213122273 U CN 213122273U CN 202021571660 U CN202021571660 U CN 202021571660U CN 213122273 U CN213122273 U CN 213122273U
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Abstract
The utility model is suitable for a wireless communication technology field provides a full duplex communication module and scanning laser radar, include: an upper circuit board and a lower circuit board; the lower circuit board comprises a first driving circuit, a first laser chip, a first detector chip and a first receiving circuit; the upper circuit board comprises a second driving circuit, a second laser chip, a second detector chip and a second receiving circuit; the first laser chip is driven by the first driving circuit of the lower circuit board to emit laser to the second detector chip of the upper circuit board, the received laser is converted into an electric signal by the second detector chip of the upper circuit board, and the converted electric signal is sent to the second receiving circuit; the first laser chip and the second detector chip are packaged on the lower circuit board; the structure of the upper circuit board is the same as that of the upper circuit board. The utility model provides a full duplex communication module can reduce whole machine size and reduce the consumption under the prerequisite of proving the reliability.
Description
Technical Field
The utility model belongs to the technical field of wireless communication, especially, relate to a full duplex communication module and scanning laser radar.
Background
With the development of laser ranging systems and laser radar systems, the requirements of the laser ranging systems and the laser radar systems on data communication are higher and higher, and in order to realize bidirectional fast communication, duplex communication modules are generally used in the systems.
The driving circuit of the present duplex communication module has three common structures, the first structure realizes the stability of current by using resistance current limiting, however, the accuracy of the stability of the driving circuit is influenced because the heat generated by the resistance is too much; the second structure uses the combination of a triode and a resistor, and has the defects of much heat generation, poor stability of a driving circuit and low precision; the third structure uses field effect transistors, which are slow. On the other hand, the current duplex communication module is generally packaged by a TO tube shell, and is large in size. Generally, the current duplex communication module has the problems of large power consumption and size and poor precision and stability.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the utility model provides a duplex communication module and scanning laser radar to solve the big problem of duplex communication module size among the prior art.
The utility model discloses a first aspect example of implementation provides a full duplex communication module, include:
a lower circuit board and an upper circuit board;
the lower circuit board includes: the laser comprises a first driving circuit, a first laser chip, a first detector chip and a first receiving circuit; the upper circuit board comprises a second driving circuit, a second laser chip, a second detector chip and a second receiving circuit;
the first laser chip is driven by the first driving circuit of the lower circuit board to emit laser to the second detector chip of the upper circuit board, the second detector chip of the upper circuit board converts the received laser into an electric signal, and the converted electric signal is sent to the second receiving circuit;
the second driving circuit of the upper circuit board drives the second laser chip to emit laser to the first detector chip of the lower circuit board, the first detector chip of the lower circuit board converts the received laser into an electric signal, and the converted electric signal is sent to the first receiving circuit;
the first laser chip and the first detector chip are arranged on the lower circuit board;
and the second laser chip and the second detector chip are packaged on the upper circuit board.
In an embodiment of the present invention, the first driving circuit includes:
a first monitor for monitoring the first laser chip and generating a first monitor signal;
a first control register connected to the first monitor for generating a first current adjustment signal based on the first monitor signal;
and the first high-speed operational amplifier is connected with the first control register and used for acquiring a first external input signal and processing the first external input signal according to the first current adjusting signal to obtain a first driving signal.
In an embodiment of the present invention, the first driving circuit further includes:
and the first equalization effect device is connected with the first high-speed operational amplifier and used for acquiring a first initial external input signal and generating the first external input signal according to the first initial external input signal.
In one embodiment of the present invention, the first monitor includes a first temperature sensor, and the first monitoring signal includes a first temperature signal.
In an embodiment of the present invention, the second driving circuit includes:
a second monitor for monitoring the second laser chip and generating a second monitor signal;
a second control register connected to the second monitor for generating a second current adjustment signal based on the second monitor signal;
and the second high-speed operational amplifier is connected with the second control register and used for acquiring a second external input signal and processing the second external input signal according to the second current adjusting signal to obtain a second driving signal.
In an embodiment of the present invention, the second driving circuit further includes:
and the second equalization effect device is connected with the second high-speed operational amplifier and used for acquiring a second initial external input signal and generating the second external input signal according to the second initial external input signal.
In an embodiment of the present invention, the first receiving circuit includes:
the first primary amplification chip, the first limiting amplifier and the first output circuit;
the input end of the first primary amplification chip is connected with the output end of the first detector chip, and the first primary amplification chip, the first limiting amplifier and the first output circuit are sequentially connected.
In an embodiment of the present invention, the second receiving circuit has the same structure as the first receiving circuit.
In an embodiment of the present invention, a detection wavelength range of the second detector chip is the same as an emission wavelength range of the first laser chip;
the detection wavelength range of the first detector chip is the same as the emission wavelength range of the second laser chip.
A second aspect of the present invention provides a scanning lidar comprising a motor and a full-duplex communication module as described above;
an upper circuit board of the full-duplex communication module is mounted on the motor so that the upper circuit board rotates with the motor.
Compared with the prior art, the embodiment of the utility model beneficial effect who exists is: the embodiment of the utility model provides a duplex communication module includes: an upper circuit board and a lower circuit board; the lower circuit board comprises a first driving circuit, a first laser chip, a first detector chip and a first receiving circuit; the upper circuit board comprises a second driving circuit, a second laser chip, a second detector chip and a second receiving circuit; the first laser chip is driven by the first driving circuit of the lower circuit board to emit laser to the second detector chip of the upper circuit board, the received laser is converted into an electric signal by the second detector chip of the upper circuit board, and the converted electric signal is sent to the second receiving circuit; the first laser chip and the second detector chip are packaged on the lower circuit board; the structure of the upper circuit board is the same as that of the upper circuit board. The utility model provides a full duplex communication module can be satisfying high-speed communication, under the prerequisite of assurance reliability, reduces whole quick-witted size and reduces the consumption.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a full-duplex communication module according to an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a full-duplex communication module according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
The terms "comprises" and "comprising," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, or system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. Furthermore, the terms "first," "second," and "third," etc. are used to distinguish between different objects and are not used to describe a particular order.
In order to explain the technical solution of the present invention, the following description is made by using specific examples.
Referring to fig. 1, a first aspect of the embodiments of the present invention provides a full-duplex communication module 10, including: a lower circuit board 100 and an upper circuit board 200;
the lower circuit board 100 includes: a first driving circuit 110, a first laser chip 120, a first detector chip 130, and a first receiving circuit 140; the upper circuit board 200 includes a second driving circuit 210, a second laser chip 220, a second detector chip 230, and a second receiving circuit 240;
the first driving circuit 110 of the lower circuit board 100 drives the first laser chip 120 to emit laser to the second detector chip 230 of the upper circuit board 200, the second detector chip 230 of the upper circuit board 200 converts the received laser into an electrical signal, and sends the converted electrical signal to the second receiving circuit 240;
the second driving circuit 210 of the upper circuit board 200 drives the second laser chip 220 to emit laser to the first detector chip 130 of the lower circuit board 100, and the first detector chip 130 of the lower circuit board 100 converts the received laser into an electrical signal and sends the converted electrical signal to the first receiving circuit 140;
the first laser chip 120 and the first detector chip 130 are packaged on the lower circuit board 100;
the second laser chip 220 and the second detector chip 230 are packaged on the upper circuit board 200.
In the present embodiment, the lower circuit board 100 and the upper circuit board 200 are only connected for optical communication, and have no mechanical connection and no electrical connection.
In this embodiment, the specific process of inputting an external input signal into the lower circuit board 100, sending the external input signal to the upper circuit board 200 through the lower circuit board 100, and outputting the external input signal is as follows:
a first external input signal is input to the first driving circuit 110 of the lower circuit board 100, and the first driving circuit 110 generates a first driving signal according to the first external input signal and transmits the first driving signal to the first laser chip 120; the first laser chip 120 generates a first laser signal according to the first driving signal, and sends the first laser signal to the second detector chip 230 of the upper circuit board 200, where the first laser signal is an uplink signal. The second detector chip 230 of the upper circuit board 200 converts the received first laser signal into a first receiving signal and sends the first receiving signal to the second receiving circuit 240, and the second receiving circuit 240 generates and outputs a first output signal according to the first receiving signal.
In this embodiment, the first external input signal and the first output signal are both differential voltage signals; the first driving signal and the first receiving signal are both electric signals, and the first laser signal, i.e., the uplink signal, is an optical signal.
In this embodiment, the specific process of inputting an external input signal into the upper circuit board 200, sending the external input signal to the lower circuit board 100 via the upper circuit board 200, and outputting the external input signal again is the same as the above process, specifically:
the second external input signal is input to the second driving circuit 210 of the upper circuit board 200, and the second driving circuit 210 generates a second driving signal according to the second external input signal and sends the second driving signal to the second laser chip 220; the second laser chip 220 generates a second laser signal according to the second driving signal, and sends the second laser signal to the first detector chip 130 of the lower circuit board, where the second laser signal is a downlink signal. The first detector chip 130 of the lower circuit board 100 converts the received second laser signal into a second receiving signal and sends the second receiving signal to the first receiving circuit 140, and the first receiving circuit 140 generates and outputs a second output signal according to the second receiving signal.
In this embodiment, the second external input signal and the second output signal are both differential voltage signals; the second driving signal and the second receiving signal are both electric signals, and the second laser signal, i.e., the downlink signal, is an optical signal.
In this embodiment, the lower circuit board 100 is configured to receive a downlink signal and send an uplink signal, and the upper circuit board 200 is configured to receive an uplink signal and send a downlink signal, and the two signal transmission processes may be performed simultaneously without interfering with each other, so that the full-duplex communication module 10 provided in this embodiment may implement simultaneous bidirectional communication.
In this embodiment, the first laser chip 120, the first detector chip 130, the second laser chip 220, and the second detector chip 230 are all directly packaged on the circuit board, instead of being packaged on the circuit board after being packaged by a TO package, which can significantly reduce the volume of the full-duplex communication module 10.
Referring to fig. 2, in an embodiment of the present invention, the first driving circuit 110 includes:
a first monitor 113 for monitoring the first laser chip 120 and generating a first monitor signal;
a first control register 114 connected to the first monitor 113 for generating a first current adjustment signal according to the first monitor signal;
and a first high-speed operational amplifier 112 connected to the first control register 114, for obtaining the first external input signal, and processing the first external input signal according to the first current adjustment signal to obtain the first driving signal.
In an embodiment of the present invention, the first driving circuit 110 further includes:
and a first equalization effector 111 connected to the first high-speed operational amplifier 112 for acquiring the first initial external input signal and generating the first external input signal according to the first initial external input signal.
In one embodiment of the present invention, the first monitor 113 includes a first temperature sensor and the first monitoring signal includes a first temperature signal.
In this embodiment, the specific process of the first driving circuit 110 generating the first driving signal according to the external input signal is as follows:
the first initial external input signal is input to the first equalization effector 111, the first equalization effector 111 shapes the first initial external output signals with different levels into the same level, performs filtering processing to obtain a first external input signal, and sends the first external input signal to the first high-speed operational amplifier 112. On the other hand, the first monitor 113 monitors the temperature of the first laser chip 120, generates a first temperature signal, and transmits the first temperature signal to the first control register 114. The first control register 114 generates a first current adjusting signal according to the first temperature signal and sends the first current adjusting signal to the first altitude operational amplifier 112; the first current adjusting signal is used for adjusting the current value of the first external input signal. The first high-speed operational amplifier 112 processes the first external input signal according to the first current adjustment signal to obtain a first driving signal.
In an embodiment of the present invention, the second driving circuit 210 includes:
a second monitor 213 for monitoring the second laser chip 220 and generating a second monitor signal;
a second control register 214 connected to the second monitor 213 for generating a second current adjustment signal according to the second monitor signal;
and a second high-speed operational amplifier 212 connected to the second control register 214, for obtaining a second external input signal, and processing the second external input signal according to the second current adjustment signal to obtain a second driving signal.
In an embodiment of the present invention, the second driving circuit 210 further includes:
and a second equalization effector 211 connected to the second high-speed operational amplifier 212 for obtaining a second initial external input signal and generating a second external input signal according to the second initial external input signal.
In the present embodiment, the second monitor 213 includes a second temperature sensor, and the second monitoring signal includes a second temperature signal.
In this embodiment, a process of generating the second driving signal by the second driving circuit 210 according to the external input signal is the same as a process of generating the first driving signal by the first driving circuit 110 according to the external input signal, specifically:
the second initial external input signal is input to the second equalization effector 211, and the second equalization effector 211 shapes the second initial external output signal of different levels to the same level, performs filtering processing to obtain a second external input signal, and sends the second external input signal to the second high-speed operational amplifier 212. On the other hand, the second monitor monitors 213 the temperature of the first laser chip, generates a second temperature signal, and sends the second temperature signal to the second control register 214. The second control register 214 generates a second current adjusting signal according to the second temperature signal and sends the second current adjusting signal to the second altitude operational amplifier 212; the second current adjusting signal is used for adjusting the current value of the second external input signal. The second high-speed operational amplifier 212 processes the second external input signal according to the second current adjustment signal to obtain a second driving signal.
In an embodiment of the present invention, the first receiving circuit 140 includes:
a first primary amplification chip 141, a first limiting amplifier 142, and a first output circuit 143;
the input end of the first primary amplification chip 141 is connected with the output end of the first detector chip 130, and the first primary amplification chip 141, the first limiting amplifier 142 and the first output circuit 143 are sequentially connected.
In this embodiment, the specific process of generating and outputting the second output signal according to the second received signal by the first receiving circuit 140 is as follows:
the first primary amplification chip 141 performs primary amplification on the received signal, the first limiting amplifier 142 performs limiting amplification on the signal subjected to the primary amplification, and the first output circuit 143 outputs the signal subjected to the limiting amplification.
In an embodiment of the present invention, the structure of the second receiving circuit 240 is the same as the structure of the first receiving circuit 140.
In the present embodiment, the second receiving circuit 240 includes a second one-stage amplification chip 241, a second limiting amplifier 242, and a second output circuit 243;
the input end of the second first-stage amplification chip 241 is connected to the output end of the second detector chip 230, and the second first-stage amplification chip 241, the second limiting amplifier 242 and the second output circuit 243 are sequentially connected.
In this embodiment, the specific process of generating and outputting the first output signal according to the first receiving signal by the second receiving circuit 240 is the same as the process of generating and outputting the first output signal according to the second receiving signal by the first receiving circuit 140, specifically:
the second first-stage amplification chip 241 performs first-stage amplification on the received signal, the second limiting amplifier 242 performs limiting amplification on the first-stage amplified signal, and the second output circuit 243 outputs the limiting amplified signal.
In one embodiment of the present invention, the detection wavelength range of the second detector chip 230 is the same as the emission wavelength range of the first laser chip 120;
the detection wavelength range of the first detector chip 130 is the same as the emission wavelength range of the second laser chip 220.
Optionally, the detection wavelength range of the second detector chip 230 and the emission wavelength range of the first laser chip 120 are regarded as a first wavelength range, and the detection wavelength range of the first detector chip 130 and the emission wavelength range of the second laser chip 220 are regarded as a second wavelength range, and in order to prevent the uplink signal and the downlink signal from interfering with each other, a proper chip model is selected to make the first wavelength range and the second wavelength range different.
In the present embodiment, the model of the first laser chip 120, the first detector chip 130, the second laser chip 220, and the second detector chip 230 is selected appropriately, so that the bidirectional data transmission rate of the full-duplex communication module 10 provided by the present embodiment reaches 200M-1G.
A second aspect of the embodiment of the present invention provides a scanning lidar, including a motor and the full-duplex communication module 10;
the upper circuit board 200 of the full duplex communication module 10 is mounted on the motor such that the upper circuit board 200 rotates with the motor.
In this embodiment, the full-duplex communication module may also be applied to a laser ranging system and other complete systems, and is used to implement a short-distance bidirectional communication function.
In the duplex communication module provided by the embodiment of the utility model, the laser chip and the photoelectric detector chip are directly packaged on the circuit board, so that the packaging size can be obviously reduced; a high-speed operational amplifier is used in a driving circuit of the laser chip, so that the power consumption can be reduced on the premise of ensuring the communication speed.
According To the full-duplex communication module provided by the embodiment, the laser chip and the detector chip are directly packaged on the circuit board instead of being packaged by To, so that the packaging size can be obviously reduced; a high-speed operational amplifier is used in a drive circuit for laser paddling, so that the power consumption can be reduced on the premise of ensuring the communication speed.
The above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A full-duplex communication module, comprising:
a lower circuit board and an upper circuit board;
the lower circuit board includes: the laser comprises a first driving circuit, a first laser chip, a first detector chip and a first receiving circuit; the upper circuit board comprises a second driving circuit, a second laser chip, a second detector chip and a second receiving circuit;
the first laser chip is driven by the first driving circuit of the lower circuit board to emit laser to the second detector chip of the upper circuit board, the second detector chip of the upper circuit board converts the received laser into an electric signal, and the converted electric signal is sent to the second receiving circuit;
the second driving circuit of the upper circuit board drives the second laser chip to emit laser to the first detector chip of the lower circuit board, the first detector chip of the lower circuit board converts the received laser into an electric signal, and the converted electric signal is sent to the first receiving circuit;
the first laser chip and the first detector chip are packaged on the lower circuit board;
and the second laser chip and the second detector chip are packaged on the upper circuit board.
2. The full-duplex communications module of claim 1, wherein the first driver circuit comprises:
a first monitor for monitoring the first laser chip and generating a first monitor signal;
a first control register connected to the first monitor for generating a first current adjustment signal based on the first monitor signal;
and the first high-speed operational amplifier is connected with the first control register and used for acquiring a first external input signal and processing the first external input signal according to the first current adjusting signal to obtain a first driving signal.
3. The full-duplex communications module of claim 2, wherein the first driver circuit further comprises:
and the first equalization effect device is connected with the first high-speed operational amplifier and used for acquiring a first initial external input signal and generating the first external input signal according to the first initial external input signal.
4. The full-duplex communications module of claim 2, wherein the first monitor comprises a first temperature sensor and the first monitor signal comprises a first temperature signal.
5. The full-duplex communications module of claim 1, wherein the second driver circuit comprises:
a second monitor for monitoring the second laser chip and generating a second monitor signal;
a second control register connected to the second monitor for generating a second current adjustment signal based on the second monitor signal;
and the second high-speed operational amplifier is connected with the second control register and used for acquiring a second external input signal and processing the second external input signal according to the second current adjusting signal to obtain a second driving signal.
6. The full-duplex communications module of claim 5, wherein the second driver circuit further comprises:
and the second equalization effect device is connected with the second high-speed operational amplifier and used for acquiring a second initial external input signal and generating the second external input signal according to the second initial external input signal.
7. The full-duplex communications module of claim 1, wherein the first receive circuit comprises:
the first primary amplification chip, the first limiting amplifier and the first output circuit;
the input end of the first primary amplification chip is connected with the output end of the first detector chip, and the first primary amplification chip, the first limiting amplifier and the first output circuit are sequentially connected.
8. A full duplex communication module as claimed in any of claims 1 or 7, wherein the second receiving circuit has the same structure as the first receiving circuit.
9. The full-duplex communications module of claim 1, wherein the detection wavelength range of the second detector chip is the same as the emission wavelength range of the first laser chip;
the detection wavelength range of the first detector chip is the same as the emission wavelength range of the second laser chip.
10. A scanning lidar comprising a motor and the full-duplex communication module of any of claims 1 to 9;
an upper circuit board of the full-duplex communication module is mounted on the motor so that the upper circuit board rotates with the motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021571660.2U CN213122273U (en) | 2020-07-31 | 2020-07-31 | Full-duplex communication module and scanning laser radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021571660.2U CN213122273U (en) | 2020-07-31 | 2020-07-31 | Full-duplex communication module and scanning laser radar |
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| Publication Number | Publication Date |
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| CN213122273U true CN213122273U (en) | 2021-05-04 |
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| CN202021571660.2U Active CN213122273U (en) | 2020-07-31 | 2020-07-31 | Full-duplex communication module and scanning laser radar |
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