CN213094585U

CN213094585U - IC chip placing jig

Info

Publication number: CN213094585U
Application number: CN202021842134.5U
Authority: CN
Inventors: 向菊
Original assignee: Shenzhen Yifeng Technology Co ltd
Current assignee: Shenzhen Yifeng Technology Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-04-30
Anticipated expiration: 2030-08-28

Abstract

The utility model belongs to the technical field of the tool, a IC chip places tool is provided, comprising a base plate, sliding connection has first sliding plate and second sliding plate on the bottom plate, first sliding plate and second sliding plate set up relatively, the top of first sliding plate and second sliding plate is fixed mounting respectively has first limiting plate and second limiting plate, be provided with a plurality of IC chips between first sliding plate and the second sliding plate and place the station, place the position that the station corresponds with the IC chip on first limiting plate and the second limiting plate and set up a plurality of breachs with IC chip pin looks adaptation, the one end of first sliding plate and second sliding plate is fixed mounting respectively has first baffle and second baffle, first baffle and second baffle set up relatively. The utility model discloses a tool is placed to IC chip guarantees to wait to snatch placing position accuracy of IC chip, helps improving the accuracy that the position was put in the subsides of IC chip on PCB.

Description

IC chip placing jig

Technical Field

The utility model relates to a tool technical field, concretely relates to IC chip places tool.

Background

SMT (surface mount technology) is a new generation of electronic assembly technology developed from hybrid integrated circuit technology, and is characterized by using component surface mount technology and reflow soldering technology, and is a new generation of assembly technology in electronic product manufacturing. SMT production line main equipment has: printing machines, chip mounters (upper surface electronic components), reflow soldering, plug-ins, wave ovens, and test packaging.

In the working link of the chip mounter, the IC chip is required to be placed on the jig, the chip mounter grabs and pastes the IC chip on the jig on the PCB according to the program design, however, whether the placement position of the IC chip on the jig is accurate or not directly results in the accuracy of the grabbing position, if the grabbing position is not accurate, the sticking position deviation of the IC chip is also caused, the polarity of the element is wrong, and one of the main factors of missing sticking and multiple sticking occurs, so that the accuracy of the placement position of the IC chip on the jig is ensured.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model provides a pair of IC chip places tool guarantees to wait to snatch placing position accuracy of IC chip, helps improving the accuracy that the position was put in the subsides of IC chip on PCB.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a tool is placed to IC chip, comprising a base plate, sliding connection has first sliding plate and second sliding plate on the bottom plate, first sliding plate and second sliding plate set up relatively, the top of first sliding plate and second sliding plate is fixed mounting respectively has first limiting plate and second limiting plate, be provided with a plurality of IC chip between first sliding plate and the second sliding plate and place the station, a plurality of breachs with IC chip pin looks adaptation are seted up with the position that the station corresponds is placed to the IC chip on first limiting plate and the second limiting plate, the one end of first sliding plate and second sliding plate is fixed mounting respectively has first baffle and second baffle, first baffle and second baffle set up relatively.

Further, the first limiting plate is hinged to a movable plate, the movable plate is fixedly arranged at the positions of the two adjacent stations and provided with a connecting rod, and a position separation block is fixedly arranged on the connecting rod.

Furthermore, both sides of the position separation block are provided with grooves.

Furthermore, one side wall of the gap on the first limiting plate, which is far away from the second limiting plate, is flush with the inner side surface of the first sliding plate and one side surface of the movable plate, which is close to the position separation block, respectively; and one side wall of the notch on the second limiting plate, which is far away from the first limiting plate, is flush with the inner side surface of the second sliding plate.

Further, one end, far away from the connecting rod, of the position separation block is wedge-shaped.

Furthermore, four threaded holes are formed in the edge of the bottom plate, and the four threaded holes are respectively located at four right angles of the bottom plate.

According to the above technical scheme, the beneficial effects of the utility model are that: the first sliding plate and the second sliding plate are arranged on the bottom plate, so that the distance between the first sliding plate and the second sliding plate can be conveniently adjusted, and different sizes of IC chips can be adapted; through arranging a plurality of IC chips in a plurality of stations between first sliding plate and the second sliding plate, and make the chip pin of IC chip and the inside wall sliding contact of first sliding plate and second sliding plate, wherein, it is corresponding with the position of breach to wait to snatch the chip pin that IC chip and first baffle and second baffle contact and wait to snatch the IC chip, thereby realize waiting to snatch the injecing of chip position, it snatchs the subassembly and snatchs the IC chip to be convenient for the IC chip, the degree of accuracy that the subassembly snatchs is improved, help improving the accuracy that the position was put in the subsides of IC chip on PCB.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic structural diagram of the present invention.

Reference numerals:

1-a bottom plate; 2-a first sliding plate; 3-a second sliding plate; 4-placing a station;

11-a threaded hole; 21-a first limiting plate; 22-a notch; 23-a movable plate; 24-a connecting rod; 25-position separation block; 26-a first baffle; 31-a second limiting plate; 32-a second baffle;

251-groove.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

Referring to fig. 1, the IC chip placing jig provided by this embodiment includes a bottom plate 1, a first sliding plate 2 and a second sliding plate 3 are slidably connected to the bottom plate 1, the first sliding plate 2 and the second sliding plate 3 are oppositely disposed, a first limiting plate 21 and a second limiting plate 31 are respectively fixedly mounted on top ends of the first sliding plate 2 and the second sliding plate 3, a plurality of IC chip placing stations 4 are disposed between the first sliding plate 2 and the second sliding plate 3, a plurality of notches 22 adapted to pins of an IC chip are disposed on positions of the first limiting plate 21 and the second limiting plate 31 corresponding to the IC chip placing stations 4, a first baffle 26 and a second baffle 32 are respectively fixedly mounted on one ends of the first sliding plate 2 and the second sliding plate 3, the first baffle 26 and the second baffle 32 are oppositely disposed, the first sliding plate 2 and the second sliding plate 3 can be connected to the bottom plate 1 by a sliding chute and a sliding block or a sliding rail and a sliding block, due to the action of the friction force and the fastening force between the sliding chute and the sliding block or between the sliding rail and the sliding block, the relative positions of the first sliding plate 2 and the second sliding plate 3 and the bottom plate 1 can be kept unchanged without the action of external force; a plurality of IC chips may be manually placed into a plurality of stations between the first slide plate 2 and the second slide plate 3 by an IC chip pushing mechanism or manually.

In practical use, the first sliding plate 2 and the second sliding plate 3 are arranged on the bottom plate 1, so that the distance between the first sliding plate 2 and the second sliding plate 3 can be adjusted conveniently to adapt to different sizes of IC chips; through arranging a plurality of IC chips in a plurality of stations between first sliding plate 2 and second sliding plate 3 to make the chip pin of IC chip and the inside wall sliding contact of first sliding plate 2 and second sliding plate 3, wherein, the chip pin that waits to snatch the IC chip and contact with first baffle 26 and second baffle 32 and wait to snatch the IC chip corresponds with the position of breach 22, thereby realize waiting to snatch the limited of chip position, be convenient for the IC chip snatchs the subassembly and snatchs the IC chip, improve the degree of accuracy that snatchs the subassembly and snatch, help improving the accuracy that the IC chip pasted the position on PCB.

In the embodiment, the first limiting plate 21 is hinged to the movable plate 23, the positions of the movable plate 23 at two adjacent stations are fixedly provided with the connecting rod 24, and the connecting rod 24 is fixedly provided with the position separating block 25.

In practical use, the movable plate 23 is rotated to drive the connecting rod 24 and the position separating block 25 on the connecting rod 24 to rotate around the top end of the first limiting plate 21, when the IC chip to be grabbed needs to be further subjected to position limitation, the movable plate 23 is rotated, so that one end, away from the connecting rod 24, of the position separating block 25 is placed between the first sliding plate 2 and the second sliding plate 3, in the process, one side of the position separating block 25 is in contact with the IC chip to be grabbed, and position limitation is respectively performed on two sides of the IC chip to be grabbed.

In this embodiment, the two sides of the position separating block 25 are both provided with grooves 251, and meanwhile, a gap is left between the first baffle 26 and the second baffle 32, so that two grippers of the gripping assembly are respectively placed in the grooves 251 and the gap, which is convenient for gripping the body of the IC chip.

In this embodiment, a side wall of the notch 22 of the first limiting plate 21, which is away from the second limiting plate 31, is flush with the inner side surface of the first sliding plate 2 and a side surface of the movable plate 23, which is close to the position separating block 25, so as to prevent the notch 22 of the first limiting plate 21 from blocking the pins of the IC chip when the grabbing assembly grabs the IC chip; one lateral wall of the gap 22 on the second limiting plate 31, which is far away from the first limiting plate 21, is flush with the inner side surface of the second sliding plate 3, so that when the grabbing assembly grabs the IC chip, the gap 22 on the second limiting plate 31 blocks the pins of the IC chip.

In this embodiment, the end of the position separating block 25 away from the connecting bar 24 is wedge-shaped, so that it is convenient to enter from the gap between the plurality of IC chips, and fix the position of the IC chip to be grasped.

In this embodiment, four threaded holes 11 are opened on the edge of the bottom plate 1, and the four threaded holes 11 are respectively located at four right-angle positions of the bottom plate 1, so that the bottom plate 1 can be conveniently fixed by fixing bolts.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. The utility model provides a tool is placed to IC chip which characterized in that: the novel packaging box is characterized by comprising a base plate (1), a first sliding plate (2) and a second sliding plate (3) are connected to the base plate (1) in a sliding mode, the first sliding plate (2) and the second sliding plate (3) are arranged oppositely, a first limiting plate (21) and a second limiting plate (31) are fixedly mounted on the top ends of the first sliding plate (2) and the second sliding plate (3) respectively, a plurality of IC chip placing stations (4) are arranged between the first sliding plate (2) and the second sliding plate (3), a plurality of notches (22) matched with IC chip pins are formed in positions corresponding to the IC chip placing stations (4) on the first limiting plate (21) and the second limiting plate (31), a first baffle plate (26) and a second baffle plate (32) are fixedly mounted at one end of the first sliding plate (2) and one end of the second sliding plate (3) respectively, and the first baffle plate (26) and the second baffle plate (32) are arranged oppositely.

2. The IC chip placing jig according to claim 1, wherein: articulated fly leaf (23) on first limiting plate (21), the position fixed mounting that fly leaf (23) are located two adjacent stations has connecting rod (24), and fixed mounting has position separation piece (25) on connecting rod (24).

3. The IC chip placing jig according to claim 2, wherein: grooves (251) are formed in the two sides of the position separating block (25).

4. The IC chip placing jig according to claim 2, wherein: one side wall of the notch (22) on the first limiting plate (21) far away from the second limiting plate (31) is flush with the inner side surface of the first sliding plate (2) and one side surface of the movable plate (23) close to the position separation block (25) respectively; one side wall of the notch (22) on the second limiting plate (31), which is far away from the first limiting plate (21), is flush with the inner side surface of the second sliding plate (3).

5. The IC chip placing jig according to claim 2, wherein: one end of the position separation block (25) far away from the connecting rod (24) is wedge-shaped.

6. The IC chip placing jig according to claim 1, wherein: four threaded holes (11) are formed in the edge of the bottom plate (1), and the four threaded holes (11) are respectively located at four right angles of the bottom plate (1).