CN213094440U - Microphone assembly and electronic equipment - Google Patents

Abstract

The utility model provides a microphone component, which comprises a front shell, a circuit board and a microphone; the sound groove has been seted up to the preceding shell, the circuit board is fixed in lead to one side of sound groove, the circuit board will lead to the sealed cavity that forms of sound groove, the microphone is fixed in the circuit board is kept away from lead to one side of sound groove just the microphone with circuit board electric connection, lead to the protruding barricade that forms of bottom surface to the direction that is close to the circuit board of sound groove, the barricade accept in the cavity. The utility model also provides an electronic equipment. The utility model provides a microphone subassembly and electronic equipment avoids the air current too big silicon film that causes in the microphone to damage, has improved the life of microphone.

Description

Microphone assembly and electronic equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to a microphone technical field especially relates to a microphone subassembly and electronic equipment.

[ background of the invention ]

At present, microphones mainly include moving coil microphones, capacitive microphones, electrets and emerging silicon microphones, and silicon microphones based on CMOS (Complementary Metal Oxide Semiconductor) technology and MEMS (micro electro Mechanical Systems) technology are smaller in size, suitable for application with high cost performance, and commonly used in electronic devices (such as mobile phones).

In order to eliminate the echo received by the microphone, the microphone needs to be isolated from the internal hands-free speaker cavity, i.e. a closed cavity structure is formed inside the mobile phone and directly leads to the external sound source, and the MEMS microphone detects the sound pressure by using the silicon film. Because the cavity of the microphone is closed, the external air flow directly leads to the silicon film, and when the external air flow is too large, the silicon film is easily damaged, so that the microphone is damaged and loses efficacy.

Accordingly, there is a need to provide a novel microphone assembly and electronic device to overcome the above-mentioned drawbacks.

[ Utility model ] content

The utility model aims at providing a microphone subassembly and electronic equipment can avoid the too big damage that causes the silicon film in the microphone of air current, has improved the life of microphone.

In order to achieve the above object, in a first aspect, the present invention provides a microphone assembly, including a front case, a circuit board, and a microphone; the sound groove has been seted up to the preceding shell, the circuit board is fixed in lead to one side of sound groove, the circuit board will lead to the sealed cavity that forms of sound groove, the microphone is fixed in the circuit board is kept away from lead to one side of sound groove just the microphone with circuit board electric connection, lead to the protruding barricade that forms of bottom surface to the direction that is close to the circuit board of sound groove, the barricade accept in the cavity.

In a preferred embodiment, a packaging part is arranged at one end of the front shell, one end of the circuit board is fixed on the packaging part, and the packaging part is provided with a sound through hole communicated with the cavity.

In a preferred embodiment, the sound holes include a first sound hole and a second sound hole which are communicated with each other, the first sound hole is communicated with the cavity, and the diameter of the second sound hole is gradually increased in a direction away from the first sound hole.

In a preferred embodiment, the packaging part is further provided with a receiving groove communicated with the second sound through hole, and the receiving groove is used for receiving the sealing rubber sleeve.

In a preferred embodiment, a sealing foam is arranged on one side of the circuit board close to the sound through groove.

In a second aspect, the present invention further provides an electronic device, which includes the microphone assembly and the rear cover, wherein the microphone assembly is fixed in the rear cover.

Compared with the prior art, the utility model provides a microphone subassembly and electronic equipment, the circuit board with lead to the sealed cavity that forms of sound recess, and the protruding barricade that forms in bottom surface that leads to the sound recess, when external air current got into the cavity in, the air current can strike on the barricade, the air current speed can reduce by a wide margin after the bounce-back, the slow microphone that gets into of rethread cavity, thereby avoid the air current to cross the damage that causes the silicon film in the microphone greatly, avoid in the operation process or user's use because the damage of atmospheric flows such as special environment to the microphone, the life of microphone has been improved.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a partial structural view of an electronic device provided by the present invention;

FIG. 2 is a cross-sectional view of the electronic device shown in FIG. 1 taken along line A-A';

fig. 3 is a partial structure diagram of a front shell of a microphone assembly provided by the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3 together, the present invention provides a microphone assembly 100 applied in an electronic device 200, wherein the microphone assembly 100 includes a front case 10, a circuit board 20 and a microphone 30.

The front shell 10 is provided with a sound through groove 101, the circuit board 20 is fixed on one side of the sound through groove 101, the circuit board 20 seals the sound through groove 101 to form a cavity 102, specifically, the circuit board 20 is fixed on one side of the front shell 10, a part of the circuit board 20 opposite to the sound through groove 101 is covered on the sound through groove 101, and the circuit board and the sound through groove 101 enclose the cavity 102. The microphone 30 is fixed on a side of the circuit board 20 away from the sound through groove 101, the microphone 30 is electrically connected to the circuit board 20, the bottom surface 11 of the sound through groove 101 protrudes toward the circuit board 20 to form a retaining wall 12, and the retaining wall 12 is accommodated in the cavity 102.

The utility model provides a microphone subassembly 100, circuit board 20 and the sealed cavity 102 that forms of sound recess 101 that leads to, and the protruding barricade 12 that forms of bottom surface 11 that leads to sound recess 101, when external air current got into in the cavity 102, the air current can strike on barricade 12, the air current speed can reduce by a wide margin after the bounce-back, rethread cavity 102 slowly gets into microphone 30, thereby avoid the air current to cross the damage that causes the silicon film in microphone 30 greatly, avoid in the operation process or user's use because the damage of atmospheric flows such as special environment to microphone 30, the service life of microphone 30 has been improved.

It can be understood that the wall 12 is accommodated in the cavity 102, and the wall 12 has a gap from the circuit board 20, i.e. the wall 12 cannot seal the cavity 102, and the wall 12 functions to block the airflow but allows the airflow to pass through. The retaining wall 12 is a protrusion formed on the bottom surface 11 of the sound through groove 101, the protrusion may be perpendicular to the bottom surface 11 or form a certain angle, the shape of the protrusion is not limited, the retaining wall 12 and the front housing 10 are integrated, and the damage of the silicon film in the microphone 30 due to excessive air flow can be avoided without adding additional elements, and the structure is simple.

One end of the front shell 10 is provided with a packaging part 13, one end of the circuit board 20 is fixed on the packaging part 13, and the packaging part 13 is provided with a sound through hole 103 communicated with the cavity 102. Specifically, the sound through hole 103 and the cavity 102 form a sound channel, and the external air flow can enter the microphone 30 through the sound through hole 103 and the cavity 102 in sequence. The microphone 30 is located on one side of the sound track, i.e. on one side of the airflow direction, and the airflow needs to change direction and enter the microphone 30, thereby further preventing the silicon membrane in the microphone 30 from being damaged.

Specifically, the sound hole 103 includes a first sound hole 104 and a second sound hole 105 that are communicated with each other, the first sound hole 104 is communicated with the cavity 102, and the diameter of the second sound hole 105 is gradually increased in a direction away from the first sound hole 104. In this embodiment, the second sound hole 105 includes a straight sidewall 14 and an inclined sidewall 15 opposite to the straight sidewall 14, and the inclined sidewall 15 is inclined in a direction away from the first sound hole 104, so that the diameter of the second sound hole 105 is larger than the diameter of the first sound hole 104, thereby facilitating the external air flow to enter the second sound hole 105. Also, when the diameter of the sound input hole 202 of the electronic device 200 is small (for example, the diameter of the sound input hole 202 is smaller than the maximum diameter of the second sound output hole 105), the sound input hole 202 is disposed at a position close to the inclined sidewall 15, so that the inclined sidewall 15 can block external dust impurities from entering the second sound output hole 105, preventing the microphone assembly 100 from being contaminated.

Further, the packaging portion 13 is further provided with a receiving groove 106 communicating with the second sound hole 105, the receiving groove 106 is used for receiving a sealing rubber sleeve (not shown), it can be understood that, when the microphone assembly 100 is assembled to the electronic device 200, the packaging portion 13 of the front housing 10 needs to be connected with the rear cover 201 of the electronic device 200 in an abutting manner, the sealing rubber sleeve is disposed between the packaging portion 13 and the rear cover 201, so that sound of other components (such as a speaker) assembled by the rear cover 201 can be prevented from entering the sound hole 103 to form a sound channel with the cavity 102, the sound channel of the microphone assembly 100 is isolated from the other components, and noise of the microphone assembly 100 is reduced.

The side of the circuit board 20 close to the sound through groove 101 is provided with the sealing foam 40, the sealing foam 40 can prevent the air flow in the sound channel from entering other elements on the circuit board 20 except the microphone 30, noise is reduced, moreover, the sealing foam 40 is located between the circuit board 20 and the front shell 10, the sealing foam 40 has buffering performance, and the connection sealing performance of the circuit board 20 and the front shell 10 is enhanced.

The microphone 30 is a silicon microphone, which is manufactured based on the MEMS technology, and the main component is an MEMS boost sensor chip, the MEMS sound pressure sensor is a micro capacitor composed of a silicon film and a silicon back plate, the silicon film can sense the change of sound pressure, convert the sound pressure change into a capacitance change, and then convert the capacitance change into an electrical signal by a specific circuit in the circuit board 20, thereby realizing the conversion of sound.

The utility model also provides an electronic equipment 200, including any one of the aforesaid microphone subassembly 100 and hou gai 201, microphone subassembly 100 is fixed in the hou gai 201. Specifically, the rear cover 201 is opened with a sound inlet 202, and the sound inlet 202 is opposite to the second sound inlet 105 of the microphone assembly 100, specifically opposite to the inclined side wall 15. When the diameter of the sound input hole 202 of the electronic device 200 is small (for example, the diameter of the sound input hole 202 is smaller than the maximum diameter of the second sound output hole 105), the sound input hole 202 is disposed close to the inclined sidewall 15, so that the inclined sidewall 15 can prevent external dust impurities from entering the second sound output hole 105, and prevent the microphone assembly 100 from being contaminated. It can be understood that the electronic device can be, but is not limited to, a portable terminal such as a mobile phone, a tablet computer, etc., and all embodiments of the microphone assembly 100 provided by the present invention are applicable to the electronic device 200 provided by the present invention, and all can achieve the same or similar beneficial effects.

To sum up, the utility model provides a microphone subassembly 100 and electronic equipment 200, circuit board 20 and the sealed cavity 102 that forms of sound recess 101 that leads to, and the 11 protruding barricades 12 that form in bottom surface that leads to sound recess 101, when external air current gets into in the cavity 102, the air current can strike on barricade 12, the air current speed can reduce by a wide margin after the bounce-back, rethread cavity 102 slowly gets into microphone 30, thereby avoid the air current to cause the damage of the silicon film in microphone 30 greatly, avoid in the operation process or user's use because the damage of atmospheric flows such as special environment to microphone 30, the service life of microphone 30 has been improved.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (6)

1. A microphone assembly, comprising a front shell, a circuit board and a microphone; the sound groove has been seted up to the preceding shell, the circuit board is fixed in lead to one side of sound groove, the circuit board will lead to the sealed cavity that forms of sound groove, the microphone is fixed in the circuit board is kept away from lead to one side of sound groove just the microphone with circuit board electric connection, lead to the protruding barricade that forms of bottom surface to the direction that is close to the circuit board of sound groove, the barricade accept in the cavity.

2. The microphone assembly as defined by claim 1 wherein one end of the front housing is provided with a packaging portion, one end of the circuit board is fixed on the packaging portion, and the packaging portion is provided with a sound hole communicating with the cavity.

3. The microphone assembly as defined by claim 2 wherein the sound opening includes a first sound opening and a second sound opening that are in communication with each other, the first sound opening being in communication with the cavity, the second sound opening having a diameter that gradually increases in a direction away from the first sound opening.

4. The microphone assembly as defined by claim 3 wherein the package portion further defines a receiving groove communicating with the second sound opening, the receiving groove being adapted to receive a sealing rubber sleeve.

5. The microphone assembly of claim 1 wherein a side of the circuit board adjacent to the sound-through recess is provided with a sealing foam.

6. An electronic device, comprising the microphone assembly as claimed in any one of claims 1 to 5 and a back cover, wherein the microphone assembly is fixed in the back cover.

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