CN213091012U - Indirect temperature measurement structure utilizing resistivity and temperature coefficient difference between materials - Google Patents
Indirect temperature measurement structure utilizing resistivity and temperature coefficient difference between materials Download PDFInfo
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- CN213091012U CN213091012U CN202021485004.0U CN202021485004U CN213091012U CN 213091012 U CN213091012 U CN 213091012U CN 202021485004 U CN202021485004 U CN 202021485004U CN 213091012 U CN213091012 U CN 213091012U
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Abstract
The utility model discloses an utilize indirect temperature measurement structure of resistivity temperature coefficient difference between material for sampling resistor, including gathering end and heat conduction cover, gather the end and set up in sampling resistor's resistive area and the respective border department of conduction region, the heat conduction cover sets up in resistive area surface, and the centre of heat conduction cover and all around with resistive area contact, all the other parts are built on stilts. The beneficial effects of the utility model include: based on the temperature characteristic of sampling device self material, can gather corresponding electrical parameter through gathering the end, can convert out the difference in temperature through simple calculation between the electrical parameter, rather than directly adopting the sensor measurement, can prevent because the temperature difference that heat-conduction leads to improve the accuracy of temperature measurement.
Description
Technical Field
The utility model relates to a temperature measurement field, in particular to utilize indirect temperature measurement structure of resistivity temperature coefficient difference between material.
Background
Electronic equipment such as electric energy meter when some occasions use, if take place the condition such as wiring abnormity, the temperature rise can be than higher, and traditional temperature detection mode all sets up the temperature sensor probe after punching. For example, the invention with the authorization notice number CN107271068B discloses a temperature detection device for an intelligent electric energy meter connector, which comprises a temperature measurement component, wherein a temperature measurement sensing head is embedded in a tail hole of a metal meter, and the temperature measurement sensing head can be fully contacted with the electric energy meter connector during temperature measurement. However, the method has large limitation, on one hand, the heat transfer between the probe and the material to be detected is different, on the other hand, the parts need to be changed by punching and the like, and the manufacturing method is complicated. Therefore, a scheme with simple measurement mode and more accurate temperature measurement is urgently needed.
The electronic equipment has more metals or alloys, the resistance of a solid material can be represented by adding temperature difference to the resistance value at a certain temperature to multiply the temperature coefficient of resistivity, the temperature coefficient of resistivity of different materials has great difference, and when the temperature changes, the resistance of some materials can change obviously, so that the temperature can be measured by utilizing the characteristic.
SUMMERY OF THE UTILITY MODEL
The great problem of loaded down with trivial details and error of temperature measurement mode to prior art, the utility model provides an utilize indirect temperature measurement structure of resistivity temperature coefficient difference between material through a plurality of collection end collection electrical parameter, can rely on the resistance value to react out the difference in temperature indirectly, has avoided leading to the big problem of temperature sensor measuring error because of heat conduction in-process heat loss.
The technical scheme of the utility model is as follows.
The utility model provides an utilize indirect temperature measurement structure of resistivity temperature coefficient difference between material for sampling resistor, including gathering end and heat conduction cover, gather the end and set up in the respective border department of resistive zone and conductive area of sampling resistor, the heat conduction cover sets up in resistive zone surface, and the centre of heat conduction cover and all around contact with resistive zone, and the rest is built on stilts.
Because the resistivity temperature coefficient difference between the materials is large, the corresponding electrical parameters can be collected through the collection end, and the temperature difference can be converted through calculation among the electrical parameters. The structure provides a physical basis for the temperature measurement mode, and the temperature is not directly measured, so that the temperature uniformity is required to be ensured as much as possible, and the heat conduction cover is used for balancing the local temperature.
Preferably, the thickness of the heat conduction cover is less than or equal to half of the resistance area, and the heat conduction cover is provided with a vent hole. The heat conducting cover is mainly used for balancing the temperature of different areas and reducing the obstruction of self heat dissipation as much as possible.
Preferably, the heat conductive cover extends to the conductive area.
Preferably, the resistive region is manganin and the conductive region is copper.
Preferably, the temperature coefficient of resistivity of the material of the collecting end is smaller than that of the material of the conductive area. Further reducing the detection error of the electrical parameter.
Preferably, the red copper and the manganin are welded through silver solder.
The beneficial effects of the utility model include: based on the temperature characteristic of sampling device self material, can gather corresponding electrical parameter through gathering the end, can convert out the difference in temperature through simple calculation between the electrical parameter, rather than directly adopting the sensor measurement, can prevent because the temperature difference that heat-conduction leads to improve the accuracy of temperature measurement.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an embodiment of the present invention;
the figure includes: 1-conductive area, 2-resistive area, 3-collection end and 4-heat conduction cover.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present invention. It will be understood by those skilled in the art that the present invention may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present invention.
Example (b):
as shown in fig. 1, the indirect temperature measurement structure using the temperature coefficient difference of resistivity between materials is used for a sampling resistor, and includes a collection end 3 and a heat conduction cover 4, wherein the collection end is disposed at the respective boundaries of a resistance region 2 and a conductive region 1 of the sampling resistor, the heat conduction cover is disposed on the surface of the resistance region, the middle and the periphery of the heat conduction cover are in contact with the resistance region, and the rest is overhead. Wherein the resistance region is made of manganin and the conductive region is made of red copper. The red copper and the manganin are welded through silver solder.
Because the resistivity temperature coefficient difference between the materials is large, the corresponding electrical parameters can be collected through the collection end, and the temperature difference can be converted through calculation among the electrical parameters. The structure provides a physical basis for the temperature measurement mode, and the temperature is not directly measured, so that the temperature uniformity is required to be ensured as much as possible, and the heat conduction cover is used for balancing the local temperature.
The thickness of the heat conduction cover is smaller than half of the resistance area, and the heat conduction cover is provided with a vent hole. The heat conducting cover is mainly used for balancing the temperature of different areas and reducing the obstruction of self heat dissipation as much as possible.
The temperature coefficient of resistivity of the material of the acquisition end is smaller than that of the material of the conductive area. Further reducing the detection error of the electrical parameter.
The beneficial effects of this embodiment include: based on the temperature characteristic of sampling device self material, can gather corresponding electrical parameter through gathering the end, can convert out the difference in temperature through simple calculation between the electrical parameter, rather than directly adopting the sensor measurement, can prevent because the temperature difference that heat-conduction leads to improve the accuracy of temperature measurement.
Through the description of the above embodiments, those skilled in the art will understand that, for convenience and simplicity of description, only the division of the above functional modules is used as an example, and in practical applications, the above function distribution may be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the above described functions.
Units described as separate parts may or may not be physically separate, and parts displayed as units may be one physical unit or a plurality of physical units, may be located in one place, or may be distributed to a plurality of different places. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides an utilize indirect temperature measurement structure of resistivity temperature coefficient difference between material for sampling resistor, its characterized in that, including gathering end and heat conduction cover, gather the end and set up in the respective border department of the resistive zone of sampling resistor and conducting area, the heat conduction cover sets up in resistive zone surface, and the middle of heat conduction cover and all around contact with resistive zone, and the rest is built on stilts.
2. The structure of claim 1, wherein the thickness of the heat conducting cover is less than or equal to half of the resistance area, and the heat conducting cover has a vent hole.
3. The structure of claim 1, wherein the heat conducting cover extends to the conductive area.
4. The structure of claim 1 or 2, wherein the resistive region is made of manganin and the conductive region is made of red copper.
5. The structure of claim 1, wherein the temperature coefficient of resistivity of the material of the collecting terminal is smaller than the temperature coefficient of resistivity of the material of the conductive region.
6. The indirect temperature measurement structure using the temperature coefficient of resistivity difference between materials as claimed in claim 4, wherein the red copper and the manganin are welded by silver solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021485004.0U CN213091012U (en) | 2020-07-24 | 2020-07-24 | Indirect temperature measurement structure utilizing resistivity and temperature coefficient difference between materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021485004.0U CN213091012U (en) | 2020-07-24 | 2020-07-24 | Indirect temperature measurement structure utilizing resistivity and temperature coefficient difference between materials |
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| Publication Number | Publication Date |
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| CN213091012U true CN213091012U (en) | 2021-04-30 |
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| CN202021485004.0U Active CN213091012U (en) | 2020-07-24 | 2020-07-24 | Indirect temperature measurement structure utilizing resistivity and temperature coefficient difference between materials |
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2020
- 2020-07-24 CN CN202021485004.0U patent/CN213091012U/en active Active
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