CN213085748U

CN213085748U - PCB board electroplating wastewater treatment device

Info

Publication number: CN213085748U
Application number: CN202021776518.1U
Authority: CN
Inventors: 吴天月; 葛来香
Original assignee: Derek Environmental Technology Jiangsu Co ltd
Current assignee: Derek Environmental Technology Jiangsu Co ltd
Priority date: 2020-08-21
Filing date: 2020-08-21
Publication date: 2021-04-30
Anticipated expiration: 2030-08-21

Abstract

The utility model belongs to the technical field of wastewater treatment, in particular to a PCB electroplating wastewater treatment device, which comprises a device body, one side of the bottom end of the device body is provided with a water inlet pipe, one end of the water inlet pipe is positioned inside the device body, a solenoid valve is arranged on the water inlet pipe, a collecting device is arranged inside the device body and is fixedly connected with the device body, a water level sensor and a heating rod are arranged on the inner wall of the device body, the heating rod is positioned at the bottom of the device body, the water level sensor is positioned below the collecting device, one side of the device body is provided with a liquid storage tank, a water outlet pipe is arranged inside the collecting device, the utility model is provided with a baffle which is matched with a collecting tank, and the water drops condensed by evaporated water vapor enter the collecting tank along the inclined baffle, the ability of the device to quickly collect the evaporated water is achieved.

Description

PCB board electroplating wastewater treatment device

Technical Field

The utility model belongs to the technical field of waste water treatment, concretely relates to PCB board electroplating wastewater treatment device.

Background

With the development of science and technology, people's life changes with the place covered, and in order to obtain a better ecological environment, the problem of wastewater treatment needs to be more and more emphasized, at present, the wastewater treatment method comprises a physical method and a chemical method, and the physical method is an adsorption method; chemical methods such as oxidation, electrolysis, photocatalysis, etc.; with the development of science and technology, a large amount of water-insoluble particulate matters and water-soluble chemical pollutants are contained in the wastewater, if the wastewater is directly discharged to the outside, the environment is polluted, the human health is influenced, the wastewater treatment efficiency of the conventional wastewater treatment device is low, the metal collection is inconvenient, and the treatment effect is poor, so that the PCB electroplating wastewater treatment device is designed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PCB board electroplating wastewater treatment device to it is low to provide current wastewater treatment device treatment wastewater efficiency in solving above-mentioned background art, and the metal is collected inconveniently, problem that the treatment effect is poor.

In order to achieve the above object, the utility model provides a following technical scheme: a PCB electroplating wastewater treatment device comprises a device body, wherein a water inlet pipe is arranged on one side of the bottom end of the device body, one end of the water inlet pipe is positioned in the device body, the water inlet pipe is provided with an electromagnetic valve, the collecting device is arranged in the device body and is fixedly connected with the device body, the inner wall of the device body is provided with a water level sensor and a heating rod, the heating rod is positioned at the bottom of the device body, the water level sensor is positioned below the collecting device, one side of the device body is provided with a liquid storage tank, a water outlet pipe is arranged in the collecting device, one end of the water outlet pipe is provided with a filter, the filter is positioned above the liquid storage tank, the collecting device is internally provided with a cooling device, one end of the cooling device is positioned in the liquid storage tank, and a control panel is arranged outside the device body.

Preferably, the collecting device comprises a baffle and a collecting tank, the baffle is located at the top inside the device body, one end of the water outlet pipe is located at the bottom of the baffle, the baffle is fixedly connected with the water outlet pipe, the collecting tank is located on the water outlet pipe, the collecting tank is located below the baffle, and the collecting tank is fixedly connected with the water outlet pipe.

Preferably, the water outlet pipe is provided with a through hole, and the through hole is positioned at the bottom inside the collecting tank.

Preferably, cooling device includes water pump and coil pipe, the coil pipe is located the inside of baffle, the water pump is located the inside of liquid storage tank, through connecting pipe circulation connection in proper order between water pump, coil pipe and the liquid storage tank.

Preferably, the device body is provided with a fixing piece, the fixing piece is positioned above the through hole, and the fixing piece is fixedly connected with the device body.

Preferably, the water outlet pipe is located inside the fixing part and fixedly connected with the fixing part.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses set up the baffle of mutually supporting with the collecting vat, through setting up the baffle slope, let the water droplet that the steam after the evaporation condenses into get into the collecting vat along the baffle of slope in, realized the ability of device quick collection evaporating water.

(2) The utility model discloses set up the mounting that is located the through-hole top, through fixing the outlet pipe in the top of through-hole, let the water logging in the outlet pipe not have the through-hole and form water sealed formula structure, let the vapor in the device body can only pass through liquefaction water and just can pass through the through-hole and discharge.

(3) The utility model discloses set up the coil pipe that spirals in the baffle, got up through the liquid flow of water pump in with the coil pipe to take away the heat in the steam of gathering on the baffle, let the quick liquefaction of vapor, improved the holistic purification process of device.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an external view of the present invention;

fig. 3 is a top view of the present invention;

fig. 4 is a circuit block diagram of the present invention;

in the figure: 1-the device body; 2-a control panel; 3-an electromagnetic valve; 4-water inlet pipe; 5-heating rod; 6-a cooling device; 7-a fixing member; 8-a filter; 9-water outlet pipe; 10-a liquid storage tank; 11-a water level sensor; 12-a baffle plate; 13-a coil pipe; 14-a collecting device; 15-a through hole; 16-a holding tank; 17-water pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a PCB board electroplating effluent treatment plant, including device body 1, inlet tube 4 is installed to one side of device body 1 bottom, the one end of inlet tube 4 is located the inside of device body 1, be provided with solenoid valve 3 on the inlet tube 4, the inside collection device 14 that is provided with of device body 1, collection device 14 and device body 1 fixed connection, be provided with level sensor 11 and heating rod 5 on the inner wall of device body 1, heating rod 5 is located the bottom of device body 1, level sensor 11 is located the below of collection device 14, one side of device body 1 is provided with liquid storage tank 10, the internally mounted of collection device 14 has outlet pipe 9, filter 8 is installed to the one end of outlet pipe 9, filter 8 is located the top of liquid storage tank 10, the internally mounted of collection device 14 has cooling device 6, the one end of cooling device 6 is located the inside of liquid storage tank 10, the outside of device body 1 is provided with control panel.

Further, the collecting device 14 comprises a baffle 12 and a collecting tank 16, the baffle 12 is located at the top inside the device body 1, one end of the water outlet pipe 9 is located at the bottom of the baffle 12, the baffle 12 is fixedly connected with the water outlet pipe 9, the collecting tank 16 is located on the water outlet pipe 9, the collecting tank 16 is located below the baffle 12, the collecting tank 16 is fixedly connected with the water outlet pipe 9, the baffle 12 is obliquely arranged, water drops formed by condensation of evaporated water vapor enter the collecting tank 16 along the oblique baffle 12, and the capacity of the device for rapidly collecting evaporated water is achieved.

Specifically, the water outlet pipe 9 is provided with a through hole 15, and the through hole 15 is located at the bottom inside the collecting tank 16.

It is worth mentioning that the cooling device 6 comprises a water pump 17 and a coil 13, the coil 13 is located inside the baffle 12, the water pump 17 is located inside the liquid storage tank 10, the water pump 17, the coil 13 and the liquid storage tank 10 are sequentially and circularly connected through a connecting pipe, and the liquid in the coil 13 flows through the water pump 17, so that heat in the steam accumulated on the baffle 12 is taken away, and the steam is rapidly liquefied.

Further, install mounting 7 on the device body 1, mounting 7 is located the top of through-hole 15, and mounting 7 and device body 1 fixed connection let the water submerge through-hole 15 formation water-sealed structure in outlet pipe 9 through fixing outlet pipe 9 in the top of through-hole 15, let the vapor in the device body 1 can only discharge through-hole 15 through liquefaction into water.

Furthermore, the water outlet pipe 9 is positioned inside the fixing part 7, and the water outlet pipe 9 is fixedly connected with the fixing part 7.

In summary, the electromagnetic valve 3, the heating rod 5, the water level sensor 11 and the water pump 17 are all electrically connected to the control panel.

The electromagnetic valve 3 is an anti-corrosion electromagnetic valve, the water level sensor 11 is a high-temperature-resistant anti-corrosion water level sensor, and the water pump 17 is a low-speed submersible pump.

The utility model discloses a theory of operation and use flow: the utility model discloses when using, when waste water is less than level sensor 11 in device body 1, waste water passes through the inside of the 3 entering device bodies of solenoid valve on the inlet tube 4, heating rod 5 starts to heat waste water, the vapor in the waste liquid rises to baffle 12 department liquefaction, get into in collecting vat 16 along baffle 12, through-hole 15, outlet pipe 9 and filter 8 get into in the liquid storage tank 10, coil pipe 13 in the baffle 12 gets up the hydrologic cycle in the liquid storage tank 10 under the effect of water pump 17 and connecting pipe, take away the heat of baffle 12 department, let vapor meet cold acceleration liquefaction, arrange the height that exceeds through-hole 15 in outlet pipe 9's one end through mounting 7, thereby let the water logging in the outlet pipe 9 not have through-hole 15 to form the water seal, let vapor can only discharge through the liquefaction, filter 8 filters remaining heavy metal material in the distilled water.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB board electroplating wastewater treatment device, includes device body (1), its characterized in that: the device is characterized in that a water inlet pipe (4) is installed on one side of the bottom end of the device body (1), one end of the water inlet pipe (4) is located inside the device body (1), a solenoid valve (3) is arranged on the water inlet pipe (4), a collecting device (14) is arranged inside the device body (1), the collecting device (14) is fixedly connected with the device body (1), a water level sensor (11) and a heating rod (5) are arranged on the inner wall of the device body (1), the heating rod (5) is located at the bottom of the device body (1), the water level sensor (11) is located below the collecting device (14), a liquid storage tank (10) is arranged on one side of the device body (1), a water outlet pipe (9) is installed inside the collecting device (14), a filter (8) is installed at one end of the water outlet pipe (9), and the filter (8) is located above the liquid storage tank (10), the device is characterized in that a cooling device (6) is installed inside the collecting device (14), one end of the cooling device (6) is located inside the liquid storage tank (10), and a control panel (2) is arranged outside the device body (1).

2. The PCB electroplating wastewater treatment device according to claim 1, wherein: the collecting device (14) comprises a baffle (12) and a collecting tank (16), the baffle (12) is located at the top of the interior of the device body (1), one end of the water outlet pipe (9) is located at the bottom of the baffle (12), the baffle (12) is fixedly connected with the water outlet pipe (9), the collecting tank (16) is located on the water outlet pipe (9), the collecting tank (16) is located below the baffle (12), and the collecting tank (16) is fixedly connected with the water outlet pipe (9).

3. The PCB electroplating wastewater treatment device according to claim 2, wherein: the water outlet pipe (9) is provided with a through hole (15), and the through hole (15) is positioned at the bottom inside the collecting tank (16).

4. The PCB electroplating wastewater treatment device according to claim 2, wherein: cooling device (6) include water pump (17) and coil pipe (13), coil pipe (13) are located the inside of baffle (12), water pump (17) are located the inside of liquid storage tank (10), through connecting pipe cyclic connection in proper order between water pump (17), coil pipe (13) and liquid storage tank (10).

5. The PCB electroplating wastewater treatment device according to claim 3, wherein: the device is characterized in that a fixing piece (7) is installed on the device body (1), the fixing piece (7) is located above the through hole (15), and the fixing piece (7) is fixedly connected with the device body (1).

6. The PCB electroplating wastewater treatment device according to claim 5, wherein: the water outlet pipe (9) is located inside the fixing part (7), and the water outlet pipe (9) is fixedly connected with the fixing part (7).