CN213073267U - Surface mount filter - Google Patents
Surface mount filter Download PDFInfo
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- CN213073267U CN213073267U CN202021172988.7U CN202021172988U CN213073267U CN 213073267 U CN213073267 U CN 213073267U CN 202021172988 U CN202021172988 U CN 202021172988U CN 213073267 U CN213073267 U CN 213073267U
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- solder paste
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Abstract
The patch filter of the utility model is provided with a shell, a conduction external member and a tensile external member; the heat dissipation holes are arranged, so that heat in the shell can be transferred out of the shell through the heat dissipation holes, and the shell is prevented from being burnt due to excessive heat accumulation; meanwhile, the conduction assemblies are correspondingly arranged in the avoidance intervals one by one, so that heat on the conduction assemblies in welding can be dissipated to the outside through the heat dissipation holes between the two avoidance intervals in the process of transferring the heat to the other conduction assemblies through the shell, and the filter is further prevented from being burnt due to excessive heat accumulation; the arrangement of the limiting ring and the arrangement of the limiting groove can ensure that the winding wire is always positioned in the limiting groove, prevent the winding wire and the pins from being in a dislocation state in the process of injection molding the shell, and improve the yield; the arrangement of the tensile sleeve and the shell forming gap can increase the connection strength between the shell and the conduction sleeve, so that the conduction sleeve and the shell are prevented from being separated from each other.
Description
Technical Field
The utility model relates to a wave filter field especially relates to a SMD wave filter.
Background
With the rapid development of the wireless communication industry, the filter used for filtering the unwanted signals becomes one of the essential key components in the communication system, for example, in the radio frequency system, the filter can play a role of frequency selection, so that the specified frequency signals can pass through and reflect the unwanted interfering frequency signals, thereby realizing the communication function.
According to different installation modes, the filter can be roughly divided into a direct-insert type filter and a patch type filter, wherein the installation method of the patch type filter is to attach the filter on a circuit board, and then use solder paste to connect pins of the filter with the circuit board, so that the installation of the patch type filter is completed.
However, although the related art of the existing patch filter has been developed more and more, the following disadvantages still exist:
firstly, in the process of welding the patch filter to the circuit board, a large amount of heat on the solder paste is transferred into the filter through the pins, the number of the pins on the filter is generally more, and the interval between two adjacent pins is smaller, so that the heat on the patch filter is gradually accumulated along with the welding of each pin, and the patch filter is easily burnt due to excessive heat accumulation;
secondly, in the process of producing the patch filter, the winding wire on the coil is generally wound with the pin, then the coil and the pin are placed in an injection mold, and a filter shell can be formed on the coil and the pin after the injection molding is finished, however, in the actual production process, the winding wire wound on the pin is easy to slip on the surface of the pin, so that the relative position of the winding wire and the pin is often in a dislocation state when the shell is injected, and further, a defective filter is generated;
in addition, after the housing is injection molded, the connection between the pins and the housing depends on the adhesion force between the glue and the surfaces of the pins, however, in the subsequent processing procedure of the patch filter, the pins need to be bent and flattened, and the pins are easily separated from the housing of the filter.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, provide a SMD wave filter, this SMD wave filter not only can prevent that the wave filter from burning out at welding process long-pending heat, can prevent moreover to skid on the pin around the wiring, can also improve pin and wave filter casing joint strength.
The purpose of the utility model is realized through the following technical scheme:
a patch filter comprising:
the heat dissipation device comprises a shell, a plurality of heat dissipation holes are formed in the shell, and a spacing interval is arranged between every two adjacent heat dissipation holes;
the conduction assembly comprises a plurality of conduction assemblies, each conduction assembly is arranged on the shell body respectively, the conduction assemblies are located in the avoidance intervals in a one-to-one correspondence mode, each conduction assembly comprises a winding post, a flow guide strip and an L-shaped plate, part of the side wall of the winding post protrudes outwards to form two limiting rings, a limiting groove is formed in the winding post and located between the two limiting rings, one end of the flow guide strip is connected with the winding post, the other end of the flow guide strip is connected with the L-shaped plate, and a solder paste flow hole is formed in the L-shaped plate; and
the tensile external member, the tensile external member includes a plurality of subassemblies of drawing, each draw the subassembly one-to-one set up in each on the conduction assembly, each draw the subassembly all including drawing strip and two pull tabs, draw strip and each draw the pull tab set up respectively in on the water conservancy diversion strip, just draw the strip to be located two between the pull tab, each draw the pull tab with draw and all be provided with casing shaping clearance between the strip.
In one embodiment, the L-shaped board is further provided with a solder paste converging groove, a solder paste flow guide channel and a solder paste branch channel, the solder paste flow guide channel is respectively communicated with the solder paste converging groove and the solder paste branch channel, and the solder paste branch channel is communicated with the solder paste flow hole.
In one embodiment, the L-shaped board is provided with a plurality of solder paste flow holes and a plurality of solder paste branch channels, each solder paste flow hole is communicated with each solder paste branch channel in a one-to-one correspondence manner, and each solder paste branch channel is communicated with the solder paste flow guide channel.
In one embodiment, the housing is further provided with a heat dissipation channel.
In one embodiment, the shell is further provided with a fool-proof hole.
In one embodiment, the housing further has a mounting groove formed thereon, the patch filter further includes a plurality of coils, each of the coils is located in the mounting groove, and each of the coils is connected to each of the conductive components in a one-to-one correspondence.
In one embodiment, the winding post, the flow guide strip and the L-shaped plate are of an integrally formed structure.
In one embodiment, a rounded portion is disposed at a connection position of the winding post and the flow guide strip.
In one embodiment, the tensile sleeve includes two drawing strips and four drawing pieces, and each drawing strip and each drawing piece are respectively disposed on the flow guide strip.
In one embodiment, the tensile member is an axisymmetric structure.
Compared with the prior art, the utility model discloses advantage and beneficial effect below having at least:
the patch filter of the utility model is provided with a shell, a conduction external member and a tensile external member; the heat dissipation holes are arranged, so that heat in the shell can be transferred out of the shell through the heat dissipation holes, and the shell is prevented from being burnt due to excessive heat accumulation; meanwhile, the conduction assemblies are correspondingly arranged in the avoidance intervals one by one, so that heat on the conduction assemblies in welding can be dissipated to the outside through the heat dissipation holes between the two avoidance intervals in the process of transferring the heat to the other conduction assemblies through the shell, and the filter is further prevented from being burnt due to excessive heat accumulation; the arrangement of the limiting ring and the arrangement of the limiting groove can ensure that the winding wire is always positioned in the limiting groove, prevent the winding wire and the pins from being in a dislocation state in the process of injection molding the shell, and improve the yield; the arrangement of the tensile sleeve and the shell forming gap can increase the connection strength between the shell and the conduction sleeve, so that the conduction sleeve and the shell are prevented from being separated from each other.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a patch filter according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a conduction sleeve and a tensile sleeve according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of a patch filter according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and fig. 2, the patch filter 10 includes a housing 100, a conductive sleeve 200, and a tensile sleeve 30, wherein the tensile sleeve 30 is disposed on the conductive sleeve 200.
It should be noted that, in the actual production process, a production worker places the conduction kit 200 in a mold, and after the mold is injection-molded, the housing 100 is formed on the tensile kit 30 of the conduction kit 200. Tensile sleeve 30 serves to increase the strength of the connection between conductive sleeve 200 and housing 100; the conductive sleeve 200 functions as a conductor; the housing 100 serves as a shield.
Referring to fig. 1 and fig. 3, the housing 100 is provided with a plurality of heat dissipating holes 110, and a space-avoiding interval 120 is disposed between two adjacent heat dissipating holes 110.
It should be noted that the heat dissipation hole 110 plays a role of heat dissipation, so that heat in the housing 100 can be dissipated to the outside through the heat dissipation hole 110; the avoiding space 120 is disposed between two adjacent heat dissipation holes 110, so that heat can be dissipated to the outside through the heat dissipation holes 110 between two adjacent avoiding spaces 120 in the process of transferring between two adjacent avoiding spaces 120.
Referring to fig. 2 again, the conductive kit 200 includes a plurality of conductive assemblies 210, each conductive assembly 210 is disposed on the housing 100, and each conductive assembly 210 is located in each avoiding space 120 in a one-to-one correspondence manner, each conductive assembly 210 includes a winding post 211, a guide bar 212 and an L-shaped plate 213, a part of the sidewall of the winding post 211 protrudes outward to form two limiting rings 214, a limiting groove 215 is formed on the winding post 211, the limiting groove 215 is located between the two limiting rings 214, one end of the guide bar 212 is connected to the winding post 211, the other end of the guide bar 212 is connected to the L-shaped plate 213, and a solder paste flow hole 216 is formed on the L-shaped plate 213.
It should be noted that each conducting component 210 is used for conducting the patch filter 10 with an external circuit; the winding post 211 is used for winding a lead; the guide bar 212 is used for conducting the winding post 211 and the L-shaped plate 213; the L-shaped plate 213 is used for welding with an external circuit, so that the L-shaped plate 213 is conducted with the external circuit; the retainer ring 214 functions to prevent the wiring from coming out of the retainer groove 215; the stopper groove 215 plays a role of preventing the winding wire from sliding along the winding post 211.
Referring to fig. 2 again, the tensile package 30 includes a plurality of drawing assemblies 300, each drawing assembly 300 is disposed on each conducting assembly 210 in a one-to-one correspondence manner, each drawing assembly 300 includes a drawing strip 310 and two drawing pieces 320, the drawing strip 310 and each drawing piece 320 are disposed on the flow guide strip 212, the drawing strip 310 is located between the two drawing pieces 320, and a housing forming gap 330 is disposed between each drawing piece 320 and the drawing strip 310.
It should be noted that, the drawing assemblies 30 are used to increase the connection strength between the conducting assemblies 210 and the housing in a one-to-one correspondence manner; the pulling strip 310 and the two pulling sheets 320 together play a role in increasing the connection strength of the conductive assembly 210 and the housing 100; the housing forming gap 330 is configured such that the glue can be formed within the housing forming gap 330.
It should be added that, in the process of injection molding the housing 100, the rubber not only coats the pull-out strip 310 and the two pull-out pieces 320, but also flows into the housing forming gap 330; in addition, since the drawing members 300 are disposed on the respective conductive members 210 in a one-to-one correspondence, the connection strength between the respective conductive members 210 and the housing 100 is improved, thereby preventing the conductive members 210 and the housing 100 from being separated from each other.
Referring to fig. 2 again, in one embodiment, the L-shaped board 213 further has a solder paste converging groove 217, a solder paste flow guiding channel 218 and a solder paste branch channel 219, the solder paste flow guiding channel 218 is respectively communicated with the solder paste converging groove 217 and the solder paste branch channel 219, and the solder paste branch channel 219 is communicated with the solder paste flow hole 216.
It should be noted that the solder paste converging slot 21, the 7 solder paste flow guide channel 218 and the solder paste branch channel 219 all play a role in guiding the solder paste to flow; the tin paste converging groove 217 is formed, so that the tin paste falling into the tin paste converging groove 217 can flow into the tin paste guide channel 218 under the guidance of the groove wall of the tin paste converging groove 217, and the tin paste can flow along a preset track; the solder paste flow guide 218 is used for guiding solder paste to the solder paste branch 219; the solder paste bypass 219 serves to guide solder paste into the solder paste flow holes 216, thereby enabling the solder paste to fill the solder paste flow holes 216.
In this embodiment, it can be ensured that the solder paste can accurately flow into the solder paste flow holes 216, so as to ensure that the solder paste can flow into the fit clearance between the L-shaped board 213 and the circuit board through the solder paste flow holes 216, thereby improving the connection strength between the conductive assembly 210 and the circuit board, and finally playing a role in preventing the conductive kit 200 and the circuit board from being separated from each other.
Referring to fig. 2 again, in one embodiment, the L-shaped board 213 has a plurality of solder paste flow holes 216 and a plurality of solder paste branches 219, each solder paste flow hole 216 is in one-to-one communication with each solder paste branch 219, and each solder paste branch 219 is in communication with a solder paste guiding channel 218.
The opening of the plurality of solder paste flow holes 216 and the plurality of solder paste branch channels 219 can further improve the connection strength between the L-shaped board 213 and the circuit board.
Referring to fig. 1 again, in one embodiment, the housing 100 further has a heat dissipation channel 130.
It should be noted that, the heat dissipation channel 130 is provided, so that the heat in the housing 100 can be transmitted to the outside through the heat dissipation hole 110, and can also be dissipated to the outside through the heat dissipation channel 130, thereby further preventing the patch filter 10 from being burned out due to excessive heat accumulation.
Referring to fig. 1 again, in one embodiment, the housing 100 further has a fool-proof hole 140.
It should be noted that the fool-proof hole 140 is formed, so that an installer can quickly identify the mounting direction of the filter when mounting the patch filter 10.
Referring to fig. 3 again, in one embodiment, the housing 100 further has a mounting groove 150, the patch filter 10 further includes a plurality of coils 20, each coil 20 is located in the mounting groove 150, and the coils 20 are connected to the conducting elements 210 in a one-to-one correspondence manner.
It should be noted that the mounting groove 150 is used for mounting each coil 20; the coils 20 are in one-to-one correspondence for conducting with the conductive elements 210.
Referring to fig. 2 again, in one embodiment, the winding post 211, the guide strip 212 and the L-shaped plate 213 are integrally formed.
It should be noted that, the winding post 211, the air guide bar 212 and the L-shaped plate 213 are integrally formed, which can improve the mechanical strength of the conducting assembly 210 and prevent the conducting assembly 210 from being damaged due to an excessive force.
Referring to fig. 2 again, in one embodiment, a rounded portion 2100 is disposed at a connection position of the winding post 211 and the guide bar 212.
The fillet 2100 is provided to prevent the corner of the conductive member 210 from being damaged by stress concentration.
Referring to fig. 2 again, in one embodiment, each drawing assembly 300 includes two drawing bars 310 and four drawing sheets 320, and each drawing bar 310 and each drawing sheet 320 are respectively disposed on the guide bar 212.
It should be noted that the two drawing bars 310 and the four drawing pieces 320 provided in each drawing member 300 can further increase the connection strength between the conductive member 210 and the housing 100.
Specifically, referring again to fig. 2, in one embodiment, each drawing assembly 300 is an axisymmetric structure.
It should be noted that, by providing the drawing member 300 with an axisymmetric structure, it is possible to prevent the local separation between the conductive member 210 and the housing 100 due to the low local connection strength.
Compared with the prior art, the utility model discloses advantage and beneficial effect below having at least:
the patch filter of the utility model is provided with a shell, a conduction external member and a tensile external member; the heat dissipation holes are arranged, so that heat in the shell can be transferred out of the shell through the heat dissipation holes, and the shell is prevented from being burnt due to excessive heat accumulation; meanwhile, the conduction assemblies are correspondingly arranged in the avoidance intervals one by one, so that heat on the conduction assemblies in welding can be dissipated to the outside through the heat dissipation holes between the two avoidance intervals in the process of transferring the heat to the other conduction assemblies through the shell, and the filter is further prevented from being burnt due to excessive heat accumulation; the arrangement of the limiting ring and the arrangement of the limiting groove can ensure that the winding wire is always positioned in the limiting groove, prevent the winding wire and the pins from being in a dislocation state in the process of injection molding the shell, and improve the yield; the arrangement of the tensile sleeve and the shell forming gap can increase the connection strength between the shell and the conduction sleeve, so that the conduction sleeve and the shell are prevented from being separated from each other.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A patch filter, comprising:
the heat dissipation device comprises a shell, a plurality of heat dissipation holes are formed in the shell, and a spacing interval is arranged between every two adjacent heat dissipation holes;
the conduction assembly comprises a plurality of conduction assemblies, each conduction assembly is arranged on the shell body respectively, the conduction assemblies are located in the avoidance intervals in a one-to-one correspondence mode, each conduction assembly comprises a winding post, a flow guide strip and an L-shaped plate, part of the side wall of the winding post protrudes outwards to form two limiting rings, a limiting groove is formed in the winding post and located between the two limiting rings, one end of the flow guide strip is connected with the winding post, the other end of the flow guide strip is connected with the L-shaped plate, and a solder paste flow hole is formed in the L-shaped plate; and
the tensile external member, the tensile external member includes a plurality of subassemblies of drawing, each draw the subassembly one-to-one set up in each on the conduction assembly, each draw the subassembly all including drawing strip and two pull tabs, draw strip and each draw the pull tab set up respectively in on the water conservancy diversion strip, just draw the strip to be located two between the pull tab, each draw the pull tab with draw and all be provided with casing shaping clearance between the strip.
2. The patch filter according to claim 1, wherein the L-shaped board further comprises a solder paste converging channel, a solder paste flow guide channel, and a solder paste branch channel, the solder paste flow guide channel is respectively communicated with the solder paste converging channel and the solder paste branch channel, and the solder paste branch channel is communicated with the solder paste flow hole.
3. The patch filter according to claim 2, wherein the L-shaped board has a plurality of solder paste flow holes and a plurality of solder paste branch channels, each solder paste flow hole is in one-to-one correspondence with each solder paste branch channel, and each solder paste branch channel is in communication with the solder paste flow guide channel.
4. The patch filter according to claim 1, wherein the housing further defines a heat dissipation channel.
5. The patch filter according to claim 1, wherein the housing further comprises a fool-proof hole.
6. The patch filter according to claim 1, wherein the housing further defines a mounting groove, the patch filter further includes a plurality of coils, each of the coils is disposed in the mounting groove, and each of the coils is connected to each of the conductive elements in a one-to-one correspondence.
7. The patch filter according to claim 1, wherein the winding posts, the tie bars, and the L-shaped plate are integrally formed.
8. The patch filter according to claim 1, wherein a rounded portion is provided at a connection position of the winding post and the tie bar.
9. The patch filter according to claim 1, wherein each of the pull-out assemblies includes two pull-out strips and four pull-out pieces, and each of the pull-out strips and each of the pull-out pieces are respectively disposed on the tie bars.
10. The patch filter according to claim 9, wherein each of the pull-out members has an axisymmetric structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021172988.7U CN213073267U (en) | 2020-06-22 | 2020-06-22 | Surface mount filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021172988.7U CN213073267U (en) | 2020-06-22 | 2020-06-22 | Surface mount filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213073267U true CN213073267U (en) | 2021-04-27 |
Family
ID=75568432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021172988.7U Active CN213073267U (en) | 2020-06-22 | 2020-06-22 | Surface mount filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213073267U (en) |
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2020
- 2020-06-22 CN CN202021172988.7U patent/CN213073267U/en active Active
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