CN213046992U

CN213046992U - Ultrasonic equipment

Info

Publication number: CN213046992U
Application number: CN202021222610.3U
Authority: CN
Inventors: 刘启中; 吴丹; 董永刚
Original assignee: Shenzhen Zhongke Lepu Medical Technology Co ltd
Current assignee: Shenzhen Zhongke Lepu Medical Technology Co ltd
Priority date: 2020-06-28
Filing date: 2020-06-28
Publication date: 2021-04-27
Anticipated expiration: 2030-06-28

Abstract

The utility model provides an ultrasonic device, include: the probe comprises a first socket and a shell with a containing cavity, wherein the first socket is contained in the containing cavity of the shell; the host comprises a case and a mainboard arranged in the case, wherein the mainboard comprises a conductive layer for grounding, the mainboard is provided with at least one second socket and a grounding connecting piece which is in one-to-one correspondence with the second socket, the second socket is used for being spliced with the first socket, and the outer surfaces of the first socket and the second socket are respectively conductors; the ground connector is in direct or indirect contact with the conductive layer and the outer surface of the second socket respectively; the ground connection member is in direct or indirect contact with an outer surface of the corresponding first socket, thereby achieving electrical conduction between the outer surface of the first socket and the conductive layer, and between the outer surface of the second socket and the conductive layer. The imaging of the ultrasonic equipment is less interfered by the outside world.

Description

Ultrasonic equipment

Technical Field

The utility model relates to the technical field of medical equipment, concretely relates to ultrasonic equipment.

Background

An ultrasound device typically includes a probe, a host, a control panel, and a display device. Wherein the connection of the probe and the host is an important part of the realization of the whole powerful system.

The probe belongs to external parts and comprises a sound head, a cable and a probe socket which are used for contacting with a human body, and the probe socket is connected with a main board in a host machine usually by selecting a group of sockets matched with a male head/female head for direct connection. For example, the probe socket is a male socket, and a female socket is selected as a socket connected with the probe socket on the mainboard. In addition to the electrical connection of the socket, the problem of grounding must be considered when the probe is connected with the host, the charge on the probe needs to be guided to the host for grounding, and at present, the grounding structure when the probe is connected with the host is mainly realized by a small pin angle in the socket when the male seat and the female seat are plugged. Through a lot of clinical experiments, the part that the mainboard in probe socket and the host computer is connected, namely the position of public seat and female seat grafting, ground connection more abundant more, the image effect of ultrasonic imaging just is better. Therefore, the connection position of the probe socket and the main board is not grounded by only a small pin angle of the socket at the connection position, and the expected image quality is difficult to achieve. How to realize more abundant ground connections just becomes the problem that needs to solve for present promotion image quality on the basis of the mainboard connection structure in current probe socket and the host computer.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides an ultrasonic equipment, and the probe of this ultrasonic equipment and the partial ground connection of mainboard connection in the host computer are abundant, and the at utmost has reduced the image interference because of the bad lead to of ground connection.

According to a first aspect, there is provided in an embodiment an ultrasound apparatus comprising:

the probe comprises a first socket and a shell with a containing cavity, wherein the first socket is contained in the containing cavity of the shell;

the host comprises a case and a mainboard arranged in the case, wherein the mainboard comprises a conductive layer for grounding, the mainboard is provided with at least one second socket and a grounding connecting piece which is in one-to-one correspondence with the second socket, the second socket is used for being spliced with the first socket, and the outer surfaces of the first socket and the second socket are respectively conductors;

the ground connector is in direct or indirect contact with the conductive layer and the outer surface of the second socket respectively;

when the second socket is plugged with the corresponding first socket, the grounding connecting piece is directly or indirectly contacted with the outer surface of the corresponding first socket, so that the outer surface of the first socket is electrically communicated with the conductive layer, and the outer surface of the second socket is electrically communicated with the conductive layer.

Furthermore, the grounding connecting piece is provided with a first contact part, a second contact part and a third contact part which are sequentially arranged along the direction away from the mainboard;

the first contact part is in direct or indirect contact with the conductive layer to realize electric conduction;

the second contact part is in direct or indirect contact with the outer surface of the corresponding second socket to realize electric conduction;

when the second socket is plugged with the corresponding first socket, the third contact part is directly or indirectly contacted with the outer surface of the corresponding first socket to realize electric conduction.

Further, the conductive layer is a copper layer, the conductive layer has at least one bare copper area exposed on the surface of the motherboard, the at least one bare copper area is respectively in one-to-one correspondence with the at least one second socket, and each bare copper area is close to the corresponding second socket;

the first contact portion includes a contact plate parallel to a surface of the main board, and a surface of one side of the contact plate is in contact with a bare copper area adjacent to a corresponding second socket.

Further, the contact plate is in threaded connection with the main board.

Furthermore, a first elastic conductive piece is arranged on the second contact part;

the first elastic conductive piece is positioned between the grounding connecting piece and the second socket and clamped by the second socket and the grounding connecting piece.

Further, the first elastic conductive member is of an arch structure, and the protrusion of the first elastic conductive member

The portion faces the second socket in a direction parallel to the main board.

Further, the outer wall of the shell is insulated, and the cavity wall of the accommodating cavity is a conductor;

at least part of the outer surface of the first socket is in contact with the cavity wall to form electric conduction;

when the second socket is plugged with the corresponding first socket, the third contact part is accommodated in the accommodating cavity and is in contact with the cavity wall, so that the third contact part is electrically communicated with the first socket.

Further, a second elastic conductive piece is arranged on the third contact part;

and the second elastic conductive piece is positioned on one side of the grounding connecting piece far away from the second socket, and when the second socket is plugged with the corresponding first socket, the second elastic conductive piece is clamped by the grounding connecting piece and the cavity wall of the accommodating cavity.

Further, the second elastic conductive member is of an arch structure, and the protrusion of the second elastic conductive member

The portion is remote from the second socket in a direction parallel to the motherboard.

Furthermore, the grounding connecting piece surrounds the corresponding second socket to form a frame-shaped structure;

and the grounding connecting piece is provided with a first contact part, a second contact part and a third contact part at the part corresponding to each side surface of the second socket.

The utility model discloses an ultrasonic equipment, except grafting between the second socket on first socket in the probe and the mainboard in the mainboard, still set up the ground connection connecting piece on the mainboard, the ground connection connecting piece is connected with the surface of first socket, the surface of second socket and the conducting layer electricity of ground connection in the mainboard simultaneously for first socket and second socket ground connection are more abundant, thereby promote the image quality that ultrasonic equipment acquireed in order to accord with anticipated image effect.

Drawings

FIG. 1 is a schematic longitudinal cross-sectional view of a connection between a probe and a main board according to an embodiment;

FIG. 2 is an exploded view of a ground connector and a motherboard according to an embodiment;

FIG. 3 is a schematic structural diagram of a connection between a probe and a motherboard according to an embodiment;

fig. 4 is an exploded view of a connection between the probe and the main board according to an embodiment.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

One of the first socket and the second socket described in the present application is a male socket, and the other socket is a female socket.

The main Board described in the present application is a Printed Circuit Board (Printed Circuit Board), and generally includes a substrate layer, a conductive layer (usually a copper layer), and an ink layer (usually green) covering the copper layer.

Referring to fig. 1-4, the present embodiment provides an ultrasound apparatus, which includes a probe, a host, and other necessary cables.

The probe comprises a first socket 10, a housing 50 with a receiving cavity 51 and a sound head (not shown in the figure) connected to the housing by a cable. The outer surface of the first socket 10 is a conductor, for example, the conductor is made of aluminum alloy, which has excellent electrical conductivity. The housing cavity 51 of the housing 50 is used to house the first socket 10, the PCBA board inside the probe, the cable, and the like, and the first socket 10 can be fixed in the housing cavity 51 by fixing screws. The outer surface of the housing 50 is insulated, for example, by powder spraying, and the inner surface of the housing 50, i.e., the wall of the accommodating chamber 51, is a conductor, for example, an aluminum alloy material with excellent electrical conductivity. The outer surface of the first socket 10 fixed in the receiving chamber 51 is in direct contact with the wall of the receiving chamber 51.

The host comprises a chassis (not shown in the figures) and a main board 30 disposed in the chassis, wherein the main board 30 is provided with at least one second socket 20 for plugging with the first socket 10, for example, the second socket 20 can be welded or pressed on the main board 30, and one main board 30 can be connected with a plurality of probes through at least one second socket 20. The outer surface of the second socket 20 is made of a conductor, for example, the conductor is made of aluminum alloy, which has excellent electrical conductivity, and the second socket 20 has a few pins dedicated for grounding.

The main board 30 is further provided with ground connectors 40 corresponding to the second sockets 20 one by one, and the structure of one ground connector 40 is taken as an example for specific description.

The ground connector 40 includes four side walls, which are sequentially connected around the corresponding second socket 20 to form a frame structure, for example, in fig. 1-2, each side wall of the ground connector 40 is sequentially provided with a first contact portion 40a, a second contact portion 40b, and a third contact portion 40c along a direction away from the main board 30 (from the lower direction to the upper direction in fig. 1-4), the number of the contact portions may be different according to the size of each side wall, and although the number of the contact portions may be different, it is preferable that each side wall has the first contact portion 40a, the second contact portion 40b, and the third contact portion 40 c.

The first contact portion 40a is in direct contact with a grounded conductive layer in the main board 30, which refers to a metal layer, typically a copper layer, in the main board 30 for electrical conduction. In this embodiment, the conductive layer has a bare copper area 31 (i.e. an area of the conductive layer not covered by the ink layer) exposed on the surface of the motherboard 30 corresponding to the grounding connection member 40. The first contact portion 40a includes a contact plate 40d parallel to the surface of the main board 30, the surface of one side of the contact plate 40d contacts the bare copper area 31 close to the corresponding second socket 20, and since the four side walls of the ground connector 40 have the first contact portion 40a, the bare copper area 31 corresponding to the second socket 20 also surrounds the second socket 20. In addition to the electrical conduction, the contact plate 40d has a screw hole, and the contact plate 40d can be fixed to the main board 30 by a screw 32, thereby realizing the installation of the ground connection member 40.

In other embodiments, the first contact portion 40a may have other structures, and the electrical conduction may be achieved by indirect contact between a conductor and a conductive layer, for example, a spring is mounted on the first contact portion 40a, and the spring is in contact with the bare copper area 31 of the conductive layer.

The second contact portion 40b contacts the outer surface of the second socket 20 through the first elastic conductive member 41. The first elastic conductive member 41 is disposed at an inner side of the ground connection member 40, i.e., a side facing the second socket 20. The first elastic conductive member 41 is clamped by the second socket 20 and the grounding connecting member 40, and the requirement of good contact between the first elastic conductive member 41 and the second socket 20 can be achieved through the characteristic of extrusion deformation of the first elastic conductive member.

A typical structure of the first elastic conductive member 41 is an arch structure, a protruding portion of the arch structure faces the second socket 20 in a direction parallel to the main board 30, and both end portions of the arch first elastic conductive member 41 are respectively engaged with open slots provided on the ground connection member 40, thereby achieving fixation of the first elastic conductive member 41.

In other embodiments, the second contact portion 40b may also be in direct contact with the outer surface of the second socket 20.

The third contact portion 40c is in contact with the inner surface of the housing 50, i.e., the wall of the receiving chamber 51, via the second resilient conductive member 42, thereby achieving electrical conduction of the ground connection member 40 to the first socket 10. The second elastic conductive member 42 is disposed outside the ground connection member 40, and the housing 50 covers the third contact portion 40c when the second socket 20 is inserted into the corresponding first socket 10. The second elastic conductive member 42 is clamped by the grounding connection member 40 and the housing 50, and the requirement of good contact between the second elastic conductive member 42 and the housing 50 can be achieved by the characteristic of extrusion deformation of the second elastic conductive member.

A typical structure of the second elastic conductive member 42 is an arch structure, a protruding portion of the arch structure faces the outside of the ground connection member 40 in a direction parallel to the main board 30, and both end portions of the arch second elastic conductive member 42 are respectively engaged with open slots provided on the ground connection member 40, thereby fixing the second elastic conductive member 42.

In some embodiments, the second resilient conductive member 42 may also be disposed inside the ground connector 40, and the second resilient conductive member 42 is clamped by the first receptacle 10 and the ground connector 40 when the second receptacle 20 is plugged into the corresponding first receptacle 10.

In some embodiments, the third contact portion 40c may also be in direct contact with the first socket 10 when the second socket 20 is plugged with the corresponding first socket 10.

The ultrasonic apparatus described above, wherein the electric charges of the first socket 10 are guided to the conductive layer through the inner wall of the housing 50, the second elastic conductive member 42 and the grounding connection member 40 and grounded, while the electric charges of the second socket 20 are guided to the conductive layer through the first elastic conductive member 41 and the grounding connection member 40 and grounded.

As shown in fig. 3-4, the host further includes a first cover plate 60a and a second cover plate 60b, the first cover plate 60a and the second cover plate 60b enclose a cavity main board 30 for electromagnetic shielding to be located in the cavity, and the second socket 20 and the ground connector 40 respectively extend through the first cover plate 60a to the outside of the cavity.

The utility model discloses an ultrasonic equipment, except grafting between the second socket on first socket in the probe and the mainboard in the mainboard, still set up the ground connection connecting piece on the mainboard, the ground connection connecting piece is connected with the surface of first socket, the surface of second socket and the conducting layer electricity of ground connection in the mainboard simultaneously for first socket and second socket ground connection are more abundant, thereby promote the image quality that ultrasonic equipment acquireed in order to accord with anticipated image effect. Except for the connection between the probe and the host, other devices or scenes which need to be grounded when the male socket and the female socket are connected can be used for the grounding connecting piece.

It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.

Claims

1. An ultrasound device, comprising:

2. The ultrasonic apparatus according to claim 1, wherein the ground connection member has a first contact portion, a second contact portion, and a third contact portion which are arranged in this order in a direction away from the main board;

3. The ultrasound apparatus according to claim 2, wherein the conductive layer is a copper layer, the conductive layer has at least one bare copper area exposed on the surface of the motherboard, the at least one bare copper area is in one-to-one correspondence with the at least one second socket, and each bare copper area is close to the corresponding second socket;

4. The ultrasound device of claim 3, wherein the contact plate is threadably connected to the main plate.

5. The ultrasonic apparatus of claim 2, wherein the second contact portion is provided with a first resilient conductive member;

6. The ultrasound device of claim 5, wherein the first resilient conductive member is of an arcuate configuration with a protruding portion of the first resilient conductive member facing the second socket in a direction parallel to the motherboard.

7. The ultrasound apparatus according to claim 2, wherein the outer wall of the housing is insulated, and the wall of the accommodating chamber is a conductor;

8. The ultrasonic apparatus of claim 7, wherein a second resilient conductive member is disposed on the third contact portion;

9. The ultrasound device of claim 8, wherein the second resilient conductive member is of an arcuate configuration, and wherein the protruding portion of the second resilient conductive member is spaced from the second socket in a direction parallel to the motherboard.

10. The ultrasound device of claim 2, wherein the ground connector forms a frame-like structure around the corresponding second receptacle;