CN213044043U

CN213044043U - Heat radiation structure of software engineering component

Info

Publication number: CN213044043U
Application number: CN202022198895.8U
Authority: CN
Inventors: 程璟辉; 文正银; 吴旭; 袁杰; 卞振
Original assignee: Anhui Xinhua University
Current assignee: Anhui Xinhua University
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2021-04-23
Anticipated expiration: 2030-09-28

Abstract

The utility model discloses a heat radiation structure of software engineering component, including the mainboard, the bottom fixed mounting of mainboard has the water pipe support, and the louvre has been seted up to the inside of mainboard, and the top fixed mounting of mainboard has the fixed column, and the top movable mounting of fixed column has the mounting bracket, and the top fixed mounting of mounting bracket has bellows, and the top fixed mounting of bellows has the mount, and the bottom fixed mounting of mount has rotating electrical machines, and rotating electrical machines's output fixed mounting has rotating fan blade. Through the louvre of seting up on the mainboard, the heat that can be convenient for the production of component is diffused or is passed the louvre and give off from the mainboard lower surface from the mainboard, greatly increased the heat dissipation space of component body, the speed that the heat gived off has been accelerated, the water pipe frame that is the S type installation through the mainboard bottom, can make the coolant liquid can follow the water inlet and flow in, the coolant liquid inside the water pipe frame can be with the effectual heat that absorbs mainboard and component gived off, in order to reach radiating purpose.

Description

Heat radiation structure of software engineering component

Technical Field

The utility model belongs to the technical field of software engineering, concretely relates to heat radiation structure of software engineering component.

Background

The element is a component of a small machine and an instrument, is usually composed of a plurality of parts and can be commonly used in the similar products; it is often referred to as some parts of the industries of electric appliances, radio, instruments, etc., such as capacitors, transistors, hairsprings, springs, etc.; the method mainly comprises the following steps: a sterilizing element, an electronic element, a pneumatic element, a hall element, etc.; the elements are graphs, buttons or a small animation which can be repeatedly taken out and used, the small animation in the elements can be played independently of the active drawing, and each element can be formed by combining a plurality of independent elements.

The element is a necessity for normal operation of the electric appliance, however, in the using process of the electric appliance, the element must generate heat when working, if the heat is not dissipated, the heat can be retained around the element, so that the service life of the element is influenced, and the existing software engineering element has a single heat dissipation structure and low heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation structure of software engineering component to propose a current software engineering component in solving above-mentioned background art in the use, because the component carries out work must can produce the heat, if not dispel the heat, the heat can be detained around the component, thereby influence the life of component, current software engineering component's heat radiation structure is comparatively single, the lower problem of radiating efficiency.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat radiation structure of software engineering component, includes the mainboard, the bottom fixed mounting of mainboard has the water pipe support, the louvre has been seted up to the inside of mainboard, the top fixed mounting of mainboard has the fixed column, the top movable mounting of fixed column has the mounting bracket, the top fixed mounting of mounting bracket has bellows, the top fixed mounting of bellows has the mount, the bottom fixed mounting of mount has rotating electrical machines, rotating electrical machines's output fixed mounting has rotating fan blade.

Preferably, the left and right sides fixed mounting of mainboard has the extension board, one side fixed mounting that the mainboard was kept away from to the extension board has the installation piece, the installation piece has four, four the installation piece is the rectangle symmetry and installs the one side of keeping away from the mainboard at two extension boards.

Preferably, one side of water pipe support is S type fixed mounting in the bottom of mainboard, the one end fixed mounting of water pipe support has the water inlet, the one end fixed mounting that the water inlet was kept away from to the water pipe support has the delivery port.

Preferably, the louvre has a plurality ofly, and is a plurality of the louvre is the inside at the mainboard of equidistance array seting up, the top fixed mounting of mainboard has the component body, the component body has a plurality ofly, and is a plurality of the component body is the top at the mainboard of equidistance array installation.

Preferably, the number of the fixing columns is four, the four fixing columns are fixedly installed at the top of the main board in a rectangular mode, cross screws are movably installed inside the top ends of the fixing columns, and outer ring outer threads matched with inner ring inner threads of the fixing columns are formed in the outer surfaces of the cross screws.

Preferably, the number of the mounting racks is two, the two mounting racks are symmetrically mounted at the bottom of the air box, and two ends of the two mounting racks are movably mounted between the fixing column and the cross screw respectively.

Preferably, the top fixed mounting of bellows has the supporting shoe, the supporting shoe has four, four the top fixed mounting of supporting shoe has the installing frame, the inside fixed mounting of installing frame has the dust guard.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through the louvre of seting up on the mainboard, the heat that can be convenient for the production of component is diffused or is passed the louvre and give off from the mainboard lower surface from the mainboard, greatly increased the heat dissipation space of component body, the speed that the heat gived off has been accelerated, the water pipe frame that is the S type installation through the mainboard bottom, can make the coolant liquid can follow the water inlet and flow in, the coolant liquid inside the water pipe frame can be effectual the heat that absorption mainboard and component gived off, in order to reach radiating purpose, with this can be with the heat diffusion of component or absorb, the radiating efficiency of component has been improved greatly.

2. The rotating motor installed through starting can drive the rotating fan blades to rotate, so that air flow to the main board and the element body can be accelerated, effective heat dissipation can be conducted on the main board and the element body, the air flow can pass through the main board from the inside through the heat dissipation holes formed in the main board, the heat dissipation space of the element body is greatly increased, the heat dissipation rate is accelerated, the dust-proof plate installed at the top can effectively prevent dust from falling to the surface of the main board along with the air flow, and the equipment can be effectively protected.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic bottom view of the present invention;

FIG. 3 is a right side sectional view of the present invention;

fig. 4 is a schematic front sectional structural view of the present invention.

In the figure: 1. a main board; 2. an extension plate; 3. mounting blocks; 4. a water pipe frame; 5. a water inlet; 6. a water outlet; 7. heat dissipation holes; 8. an element body; 9. fixing a column; 10. a cross screw; 11. a mounting frame; 12. An air box; 13. a fixed mount; 14. a rotating electric machine; 15. rotating the fan blades; 16. a support block; 17. installing a frame; 18. a dust guard.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a heat radiation structure of software engineering component, including mainboard 1, the bottom fixed mounting of mainboard 1 has water pipe support 4, louvre 7 has been seted up to mainboard 1's inside, mainboard 1's top fixed mounting has fixed column 9, the top movable mounting of fixed column 9 has mounting bracket 11, the top fixed mounting of mounting bracket 11 has bellows 12, the top fixed mounting of bellows 12 has mount 13, the bottom fixed mounting of mount 13 has rotating electrical machines 14, rotating electrical machines 14's output end fixed mounting has rotating fan blades 15.

In this embodiment, the heat dissipation holes 7 formed on the motherboard 1 are convenient for the heat generated by the components to diffuse from the motherboard 1 or to diffuse from the lower surface of the motherboard 1 through the heat dissipation holes 7, thereby greatly increasing the heat dissipation space of the component body 8 and accelerating the heat dissipation rate, the cooling liquid can flow in from the water inlet 5 through the water pipe frame 4 installed in the S shape at the bottom of the motherboard 1, the cooling liquid in the water pipe frame 4 can effectively absorb the heat dissipated by the motherboard 1 and the components to achieve the purpose of heat dissipation, thereby diffusing or absorbing the heat of the components, greatly improving the heat dissipation efficiency of the components, the rotating fan blades 15 can be driven to rotate by starting the rotating motor 14 installed, thereby accelerating the air flow to the motherboard 1 and the component body 8, thereby effectively dissipating the heat of the motherboard 1 and the component body 8, through the inside louvre 7 of seting up of mainboard 1 can be convenient for the air current from mainboard 1 inside process, greatly increased element body 8's heat dissipation space for the speed that the heat gived off.

Specifically, the left and right sides fixed mounting of mainboard 1 has extension board 2, and one side fixed mounting that mainboard 1 was kept away from to extension board 2 has installation piece 3, and installation piece 3 has four, and four installation pieces 3 are the rectangle symmetry and install the one side of keeping away from mainboard 1 at two extension boards 2.

In this embodiment, four mounting blocks 3 are symmetrically mounted on one side of two extending plates 2 away from main plate 1 in a rectangular manner, so that the device can be conveniently mounted inside a designated device.

Specifically, one side of water pipe frame 4 is S type fixed mounting in the bottom of mainboard 1, and the one end fixed mounting of water pipe frame 4 has water inlet 5, and the one end fixed mounting that water pipe frame 4 kept away from water inlet 5 has delivery port 6.

In this embodiment, one side through water pipe frame 4 is S type fixed mounting in the bottom of mainboard 1, and it flows out from delivery port 6 again to get into from water inlet 5 when the coolant liquid to this can be effectual carries out comprehensive heat dissipation to mainboard 1.

Specifically, louvre 7 has a plurality ofly, and a plurality of louvres 7 are the equidistance array and set up in mainboard 1's inside, and mainboard 1's top fixed mounting has component body 8, and component body 8 has a plurality ofly, and a plurality of component bodies 8 are the equidistance array and install the top at mainboard 1.

In this embodiment, be equidistant array through a plurality of louvres 7 and set up in mainboard 1's inside, the heat that can be convenient for the production of component body 8 from mainboard 1 on the diffusion or pass louvre 7 and distribute from mainboard 1 lower surface, greatly increased component body 8's heat dissipation space for the speed that the heat distributes.

Specifically, there are four fixed columns 9, and four fixed columns 9 are rectangle fixed mounting at the top of mainboard 1, and the inside movable mounting in top of fixed column 9 has cross screw 10, and the outer lane external screw thread with fixed column 9 inner circle internal thread looks adaptation is seted up to cross screw 10's surface.

In this embodiment, be rectangle fixed mounting at the top of mainboard 1 through four fixed columns 9 to this can be effectively and firm support play bellows 12, set up the outer lane external screw thread with fixed column 9 inner circle internal thread looks adaptation through the surface of cross screw 10, with this installation and the fixed of bellows 12 of can being convenient for.

Specifically, there are two mounting brackets 11, and two mounting brackets 11 are symmetrically installed at the bottom of bellows 12, and the both ends of two mounting brackets 11 are respectively movably installed between fixed column 9 and cross screw 10.

In this embodiment, the two ends of the two mounting frames 11 are respectively and movably mounted between the fixing column 9 and the cross screw 10, so that the air box 12 can be effectively fixed and aligned with the main board 1.

Specifically, supporting blocks 16 are fixedly mounted at the top of the air box 12, the number of the supporting blocks 16 is four, mounting frames 17 are fixedly mounted at the tops of the four supporting blocks 16, and dust-proof plates 18 are fixedly mounted inside the mounting frames 17.

In this embodiment, the installation frame 17 is fixedly installed on the top of the four supporting blocks 16, so that the dust-proof plate 18 can be effectively and stably supported, and the dust-proof plate 18 can effectively prevent dust from falling onto the surface of the main board 1 along with the airflow, so that the equipment can be effectively protected.

The utility model discloses a theory of operation and use flow: after the equipment is moved to a designated place, the equipment is installed in the designated equipment for use, in the using process, the heat generated by the element can be conveniently diffused from the main board 1 or can be diffused from the lower surface of the main board 1 by penetrating through the heat dissipation holes 7 formed in the main board 1, the heat dissipation space of the element body 8 is greatly increased, the heat dissipation speed is accelerated, the cooling liquid can flow in from the water inlet 5 through the water pipe frame 4 arranged at the bottom of the main board 1 in an S shape, the cooling liquid in the water pipe frame 4 can effectively absorb the heat dissipated by the main board 1 and the element so as to achieve the purpose of heat dissipation, the heat of the element can be diffused or absorbed, the heat dissipation efficiency of the element is greatly improved, the rotating fan blades 15 can be driven to rotate by starting the installed rotating motor 14, so that the air flow to the main board 1 and the element body 8 can be, with this can carry out effectual heat dissipation to mainboard 1 and component body 8, the louvre 7 of seting up through mainboard 1 inside can be convenient for the air current from mainboard 1 inside process, greatly increased component body 8's heat dissipation space for the speed that the heat gived off.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat radiation structure of software engineering component, includes mainboard (1), its characterized in that: the utility model discloses a wind power generation system, including mainboard (1), fixed mounting has water pipe support (4), louvre (7) have been seted up to the inside of mainboard (1), the top fixed mounting of mainboard (1) has fixed column (9), the top movable mounting of fixed column (9) has mounting bracket (11), the top fixed mounting of mounting bracket (11) has bellows (12), the top fixed mounting of bellows (12) has mount (13), the bottom fixed mounting of mount (13) has rotating electrical machines (14), the output fixed mounting of rotating electrical machines (14) has rotating fan blade (15).

2. The heat dissipation structure of a software engineering component according to claim 1, wherein: the left and right sides fixed mounting of mainboard (1) has extension board (2), one side fixed mounting that mainboard (1) were kept away from in extension board (2) has installation piece (3), installation piece (3) have four, four installation piece (3) are the rectangle symmetry and install the one side of keeping away from mainboard (1) in two extension boards (2).

3. The heat dissipation structure of a software engineering component according to claim 1, wherein: one side of water pipe support (4) is S type fixed mounting in the bottom of mainboard (1), the one end fixed mounting of water pipe support (4) has water inlet (5), the one end fixed mounting that water inlet (5) were kept away from in water pipe support (4) has delivery port (6).

4. The heat dissipation structure of a software engineering component according to claim 1, wherein: louvre (7) have a plurality ofly, a plurality of louvre (7) are the inside that equidistance array was seted up at mainboard (1), the top fixed mounting of mainboard (1) has component body (8), component body (8) have a plurality ofly, and are a plurality of component body (8) are the top at mainboard (1) is installed to equidistance array.

5. The heat dissipation structure of a software engineering component according to claim 1, wherein: the fixing columns (9) are four, the four fixing columns (9) are fixedly installed at the top of the main board (1) in a rectangular mode, cross screws (10) are movably installed inside the top ends of the fixing columns (9), and outer ring outer threads matched with inner ring inner threads of the fixing columns (9) are formed in the outer surfaces of the cross screws (10).

6. The heat dissipation structure of a software engineering component according to claim 1, wherein: the two installation frames (11) are symmetrically installed at the bottom of the air box (12), and the two ends of the two installation frames (11) are movably installed between the fixing column (9) and the cross screw (10) respectively.

7. The heat dissipation structure of a software engineering component according to claim 1, wherein: supporting blocks (16) are fixedly mounted at the tops of the air boxes (12), the number of the supporting blocks (16) is four, a mounting frame (17) is fixedly mounted at the tops of the supporting blocks (16), and a dust-proof plate (18) is fixedly mounted inside the mounting frame (17).