CN213035515U - Seal and impression device - Google Patents

Abstract

The utility model discloses a seal and impression device, the glue film of coating on this seal lower surface, no longer coat the glue film with the lower surface of whole seal, but adopt the means of interval packing glue film, the row of being separated by is filled, or the line of being separated by is filled, make the seal at the impression in-process, do not have too much colloid between seal and the basement, the thickness on remaining layer has just been reduced from the beginning of raw and other materials and impression, the resistance that the colloid that the impression process need overcome exists has been reduced, furthermore, great reduction the intermolecular resistance that need overcome when the large tracts of land impression and the resistance of glue itself diffusion on the base plate. Thereby realizing ultra-thin imprinting.

Description

Seal and impression device

[ technical field ] A method for producing a semiconductor device

The utility model relates to an ultraviolet nanometer impression field specifically is a seal and impression device.

[ background of the invention ]

Ultraviolet nanoimprint is widely applied to various fields of pattern transfer, and simple replication of different shapes, sizes and structures is realized. The structure of nanometer level does not need complicated and expensive optical element to realize, becomes novel alternative operation modes of optical components such as TOF, diffuser, lens. Referring to fig. 1, an implementation method of the ultraviolet nanoimprint technology in the prior art is shown, in which an adhesive layer is coated on a working stamp, and then the working stamp coated with the adhesive layer is contacted with a substrate to complete an imprinting process. With the requirement of the market for thinner and thinner overall module thickness, the imprinting method of the hard substrate has a limitation on the thickness of the residual layer, and for wafers of 8 inches and above 8 inches of the existing semiconductor, since the residual layer is imprinted to a certain thickness during imprinting, the intermolecular force of the glue itself and the resistance applied during flowing need to be overcome, especially the viscosity of the existing surface-type glue material is generally over 200mPa · s (23 ℃), and if the imprinting force exceeds a certain value, the surface-type glue material may be damaged or deformed, so that it has become a challenge how to control the thickness of the residual layer within 15 μm under the condition of ensuring the imprinting force within a certain range, and therefore, how to use the imprinting method of the transparent hard substrate to imprint the surface-type glue with ultra-thin thickness on wafers of 8 inches and above 8 inches becomes a key problem to be solved at present.

[ Utility model ] content

An object of the utility model is to overcome above-mentioned prior art's shortcoming, provide a seal and impression device, the device is used for solving under the condition that guarantees that the impression power satisfies the impression requirement, reduces the thickness on remaining layer.

In order to achieve the above purpose, the utility model adopts the following technical scheme to realize:

a stamp is characterized in that a plurality of surface-shaped holes are longitudinally and transversely arranged on the lower surface of the stamp, and the surface-shaped holes are arc surfaces sunken towards the inside of the stamp;

the surface-shaped holes of the rows are filled with colloid at intervals of one row, and the surface-shaped holes of the rows are filled with colloid at intervals of one row;

the colloid filled in the surface-type holes partially overflows.

The utility model discloses a further improvement lies in:

preferably, part of the colloid of the overflow surface type hole is circular or rectangular.

Preferably, the colloid is epoxy resin ultraviolet curing glue.

An imprinting device comprises the stamp and a substrate, wherein the stamp is arranged above the substrate, and the substrate is provided with a residual layer.

Preferably, the thickness of the residual layer is less than 15 μm.

Preferably, the thickness of the residual layer is 3 to 5 μm.

Preferably, the residual layer has an array of facets thereon.

Preferably, the surface shape is a convex arc surface, and the radian of the surface shape is matched with the surface shape hole.

Preferably, the substrate is made of glass.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses a seal, the glue film of coating on this seal lower surface, no longer coat the glue film with the lower surface of whole seal, but adopt the means of interval packing glue film, be separated by and arrange the packing, or be separated by and fill, make the seal at the impression in-process, do not have too much colloid between seal and the basement, just reduced the thickness of remaining the layer from the beginning of raw and other materials and impression, the resistance that the colloid that the impression process need overcome exists has been reduced, furthermore, the resistance that the intermolecular resistance that needs to be overcome and glue itself spread on the base plate when great reduction large tracts of land impression. Thereby realizing ultra-thin imprinting.

Furthermore, the part of the colloid between the outer parts of the surface-shaped holes is rectangular or circular, so that the colloid can be uniformly expanded towards two sides, and the surface-shaped holes of which two sides are not filled with the colloid are compensated.

Furthermore, the colloid is epoxy resin ultraviolet curing glue, and the requirement of ultraviolet curing is met.

Furthermore, the distance between adjacent columns or the distance between adjacent rows is limited, and the filling effect is not influenced due to the fact that the distance of filled colloid is too wide.

The utility model also discloses an impression device, the seal above this impression structure adopts for the layer of remaining that finally forms on the impression structure is the ultra-thin layer of remaining.

[ description of the drawings ]

FIG. 1 is a flow chart of the prior art;

FIG. 2 is a bottom view of the stamp without the gel coating;

FIG. 3 is a diagram of a dispensing process;

FIG. 4 is a bottom view of the stamp coated with glue;

FIG. 5 is a bottom view of a stamp coated with a gel;

FIG. 6 is a diagram of an imprinting process;

FIG. 7 is a view during imprinting;

fig. 8 is a drawing after demolding.

Wherein: 1-a seal; 2-a substrate; 3-colloid; 4-residual layer; 5-surface type holes; 6-face type; 31-inner; 32-outer.

[ detailed description ] embodiments

The present invention will be described in further detail with reference to the accompanying drawings:

in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, both fixed and removable connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a seal and impression device, the utility model provides a wafer to 8 cun and more than 8 cun adopts the mode of dispersing the point and gluing on the characteristic pattern, makes every characteristic pattern correspond one and drips and glue, specific punctiform. And, by precisely controlling the amount of glue and the speed of imprinting and other conditions, after imprinting, a single drop is formed into a single pattern. Under the condition, the imprinting force can be small enough, and the intermolecular resistance which needs to be overcome when large-area imprinting is carried out and the diffusion resistance of glue on the substrate are greatly reduced, so that ultrathin imprinting is realized.

Specifically, the utility model discloses a stamp structure, as shown in fig. 2, the surface-shaped holes 5 on the lower surface of the stamp 1 are in a rectangular array form, that is, the surface-shaped holes 5 are arranged in rows or columns, the distance between two adjacent rows of surface-shaped holes 5 is equal, and the distance between two adjacent columns of surface-shaped holes 5 is equal; referring to fig. 3, the gels 3 are applied one row by one row or one column by one column. Fig. 4 shows the effect of coating in a row, and fig. 5 shows the effect of coating the colloid 3 in a row; the coating gel 3 is preferably round or rectangular on the lower surface of the stamp 1, so that it spreads out uniformly during the stamping process. The distance between two adjacent columns ensures that the unfilled face-shaped holes 5 can be filled with the coated glue during the stamping process, and the distance between two adjacent rows ensures that the unfilled face-shaped holes 5 can be filled with the coated glue in an interlaced manner during the stamping process.

The surface-shaped hole 5 is an arc surface sunken towards the inside of the stamp, so that the surface of the stamp can bear a certain amount of colloid 3.

The specific imprinting process steps are as follows:

the method comprises the following steps: manufacturing a seal 1 on a transparent hard substrate in an imprinting mode;

step two: dispensing surface type glue in every other row or line in the surface type holes 1 on the lower surface of the stamp 1;

step three: referring to fig. 6, 7 and 8, the stamp 1 is turned over and then stamped, the substrate 2 is stamped to a specified ultra-thin thickness by controlling the stamping pressure and speed, and the substrate is exposed and stood

Step four: after the curing is finished, the substrate 2 is demoulded and baked to form a residual layer 4, the surface type 6 is arrayed on the residual layer 4, and the thickness of the residual layer 4 is 3-5 μm.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. The stamp is characterized in that a plurality of surface-shaped holes (5) are arranged on the lower surface of the stamp in a longitudinal and transverse mode, and the surface-shaped holes (5) are arc surfaces sunken towards the inside of the stamp;

the surface-shaped holes (5) of the rows are filled with the colloid (3) at intervals of one row, and the surface-shaped holes (5) of the rows are filled with the colloid (3) at intervals of one row;

the colloid (3) filled in the surface-shaped hole (5) partially overflows.

2. Stamp according to claim 1, characterized in that part of the glue (3) of the surface-shaped hole (5) is circular or rectangular.

3. A stamp according to claim 1, characterized in that the glue (3) is an epoxy resin type uv curable glue.

4. An embossing device, comprising a stamp (1) according to claim 1 and a substrate (2), the stamp (1) being arranged above the substrate (2), the substrate (2) having a residual layer (4).

5. An embossing apparatus as claimed in claim 4, characterized in that the thickness of the residual layer (4) is less than 15 μm.

6. An embossing apparatus as claimed in claim 4, characterized in that the residual layer (4) has a thickness of 3-5 μm.

7. An embossing apparatus as claimed in claim 4, characterized in that said residual layer (4) has an array of profiles (6).

8. An embossing device as claimed in claim 7, characterized in that the profile (6) is a convex arc, the curvature of the profile (6) matching the profile hole (5).

9. An embossing apparatus as claimed in claim 4, characterized in that said substrate (2) is of glass material.

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