CN213024308U

CN213024308U - Novel intelligent computer CPU refrigeration water-cooling head

Info

Publication number: CN213024308U
Application number: CN202022497078.2U
Authority: CN
Inventors: 何兵
Original assignee: Jiangmen Qianyan Cooling Technology Co ltd
Current assignee: Jiangmen Qianyan Cooling Technology Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-04-20
Anticipated expiration: 2030-11-03

Abstract

The utility model discloses a novel intelligent computer CPU refrigeration water cooling head, which comprises a main body, the device adopts a semiconductor refrigeration piece with a built-in temperature sensor in the main body as a heat conduction bottom plate, under the condition of continuous refrigeration, the temperature of a heat dissipation surface can be raised, and then the heat emitted by the heat dissipation surface is taken away by the flowing liquid, so that the device can simultaneously realize refrigeration and heat dissipation, and in the aspect of refrigeration, a control panel is arranged to automatically control the device, thus the temperature difference set by a program in the control panel can not generate condensed water, so the semiconductor refrigeration piece can be directly applied to the surface of an electronic chip, in the aspect of heat dissipation, an overheating automatic power-off device is arranged in the control panel, the phenomenon that the semiconductor can not dissipate heat under the condition of water flow non-circulation, and the semiconductor refrigeration piece is burnt at high temperature is avoided, in addition, the control panel adopts the mode that a liquid crystal display panel, therefore, the control panel has smaller volume and stronger function and can be installed at a smaller position.

Description

Novel intelligent computer CPU refrigeration water-cooling head

Technical Field

The utility model relates to a water-cooling head field, concretely relates to novel intelligent computer CPU refrigeration water-cooling head.

Background

At present, all CPU water cooling heads on the market are made of a copper plate, and due to the heat absorption characteristic of the copper plate, the temperature on the surface of the CPU is led out by the copper plate, and a sealing system is formed by the upper cover consisting of a sealing ring, so that water flow passes through the surface of the copper plate, the heat of the CPU is taken away, and the effect of cooling and heat dissipation is achieved. Including the liquid cooling scheme currently applied to the industrial aspect, the water cooling head (heat absorption head) is formed by the principle.

Its advantages are low cost, simple structure and high effect to cool the chip. In the case of a CPU or other chip surface, such as a temperature rise, serious consequences will occur, and the bottleneck of such a structure is not breakable.

The traditional semiconductor refrigeration piece is only provided with positive and negative electric wires and is matched with a traditional control box for use, the temperature required to be refrigerated is manually set on the control box, then the refrigeration piece starts to work, the set temperature is reached, and then the power is cut off. The radiating surface adopts fin-shaped radiating fins and fans for passive radiating. The control box used by the whole system is generally composed of a single chip microcomputer, so that the system is large in size, is generally installed separately from a semiconductor and is connected with the semiconductor through a cable. The structure and the collocation have the advantages of low cost and convenient purchase. The disadvantage is that the semiconductor refrigerating chip itself can not detect the temperature of the refrigerating surface, but the control box sends out an instruction to power on or off. In addition, the temperature of the control box is artificially set, and if the working environment temperature of the refrigerating sheet changes, condensed water is generated because the temperature set by the control box is greatly different from the environment temperature. In this case, the condensate water is continuously generated, which may cause serious damage to the electronic components. In addition, the heat dissipation surface of the traditional semiconductor is not subjected to temperature detection, only depends on the fin-shaped heat dissipation sheet and the fan for passive heat dissipation, and if the fan is stopped due to failure, the temperature of the heat dissipation surface continuously rises, so that the semiconductor cooling sheet is burnt, and loss is caused.

Therefore, an intelligent CPU water cooling head which can simultaneously perform refrigeration and heat dissipation, can be directly applied to the surface of an electronic element, does not need to occupy more space and can avoid generating condensed water is urgently needed.

SUMMERY OF THE UTILITY MODEL

In order to solve the existing problems, the utility model provides a novel intelligent computer CPU refrigeration water-cooling head.

The utility model discloses a realize through following technical scheme:

a novel intelligent computer CPU refrigeration water cooling head comprises a main body, wherein an upper cover plate is arranged on one side of the main body, a bolt is screwed on the upper cover plate, a water inlet installation port and a water outlet installation port are respectively arranged on the upper cover plate, a first through groove is arranged on the upper cover plate and is arranged between the water inlet installation port and the water outlet installation port, a first wire guide groove and a second wire guide groove are arranged on one side wall of the top end of the main body, the first wire guide groove and the second wire guide groove are perpendicular to each other and are communicated with each other, the second wire guide groove is a through groove, a concave groove is arranged in the main body and divides the main body into three areas, one side of the concave groove is a water inlet area, the other side of the concave groove is a water outlet area, two first sealing grooves are arranged on the top surfaces of the water inlet area and the water outlet area, and a first sealing groove is embedded in each first sealing ring, four mounting blocks are uniformly arranged at four corners of the inner wall of the concave groove, the four mounting blocks are integrally formed with the concave groove through casting, threaded holes are formed in the four mounting blocks, a control panel is arranged at the same side of the four mounting blocks, bolts are screwed on the control panel, a mounting hole is fixedly formed in the center of the inner bottom surface of the concave groove, a first temperature control inductor is fixedly embedded in the mounting hole, one end of the first temperature control inductor with a detection head penetrates out of the mounting hole, a semiconductor refrigeration piece is arranged in the main body and consists of a refrigeration surface, a heat dissipation surface and a semiconductor refrigeration piece main body, a lower cover plate is arranged at the bottom end of the refrigeration surface, the bolts are screwed at the four corners of the lower cover plate respectively, a second sealing groove is formed in the bottom surface of the main body, a second sealing ring is embedded in the second sealing groove, and two wiring grooves are symmetrically formed in one side of the second sealing, two trough are the L type, and two trough communicate with each other with the second wire casing respectively, and two trough settings are in the main part, apron outer wall four corners department fixed mounting respectively has the fastener down, apron and fastener pass through casting integrated into one piece down, be provided with the second on the apron down and lead to the groove, semiconductor refrigeration piece main part comprises panel, silica gel sealing frame, refrigeration picture layer and second temperature control inductor under by ceramic top panel, pottery, silica gel sealing frame sets up between panel under ceramic top panel and pottery, the laminating is provided with the refrigeration picture layer in the silica gel sealing frame, the inboard embedding has second temperature control inductor under the pottery, first temperature control inductor detects first department and sets up with the laminating of cooling surface.

Preferably, the control panel adopts an integrated circuit control panel with a processor and containing a liquid crystal screen.

Preferably, the refrigeration layer is composed of P/N particles.

Preferably, the second temperature control sensor is a patch type temperature sensor.

Compared with the prior art, the beneficial effects of the utility model are that: the device adopts the semiconductor refrigeration piece with a built-in temperature sensor in the main body as the heat conduction bottom plate, under the condition of continuous refrigeration, the temperature of the heat dissipation surface can rise, then the heat emitted by the heat dissipation surface is taken away by the flowing liquid, so that the device can simultaneously realize two aspects of refrigeration and heat dissipation, and in the aspect of refrigeration, a control panel is arranged to automatically control the device, thus the temperature difference set by a program in the control panel can not generate condensed water, so the semiconductor refrigeration piece can be directly applied to the surface of an electronic chip, in the aspect of heat dissipation, an overheating automatic power-off device is arranged in the control panel to avoid that the semiconductor refrigeration piece can not dissipate heat under the condition of not circulating water flow, thereby the semiconductor refrigeration piece is burnt at high temperature, in addition, the control panel adopts the mode of adding a liquid crystal display panel to a circuit board, so the control panel has smaller, can be installed in a smaller location.

Drawings

FIG. 1 is a block diagram of the structure of the present invention;

FIG. 2 is a left side view of the structural upper cover plate of the present invention;

fig. 3 is a left side view of the structural body of the present invention;

fig. 4 is a right side view of the structural body of the present invention;

FIG. 5 is a right side view of the lower deck of the structure of the present invention;

fig. 6 is a structural diagram of the semiconductor refrigeration sheet of the present invention.

In the figure: the water cooling structure comprises a main body 1, an upper cover plate 2, a water inlet mounting port 3, a water outlet mounting port 4, a first through groove 5, a first sealing groove 6, a first sealing ring 7, a concave groove 8, a mounting block 9, a control panel 10, a first temperature control inductor 11, a mounting hole 12, a threaded hole 13, a semiconductor refrigeration sheet 14, a second sealing groove 15, a second sealing ring 16, a lower cover plate 17, a clamping piece 18, a second temperature control inductor 19, a second through groove 20, a water inlet area 21, a water outlet area 22, a ceramic upper panel 23, a ceramic lower panel 24, a silica gel sealing frame 25, a refrigeration graphic layer 26, a first wire guide groove 27, a refrigeration surface 28, a second wire guide groove 29, a wire distribution groove 30 and a heat dissipation surface 31.

Detailed Description

The invention will be described in further detail with reference to the following detailed description and accompanying drawings:

as shown in fig. 1, 2, 3, 4, 5 and 6, a novel intelligent computer CPU refrigeration water cooling head comprises a main body 1, wherein an upper cover plate 2 is arranged on one side of the main body 1, a bolt is screwed on the upper cover plate 2, a water inlet installation port 3 and a water outlet installation port 4 are respectively arranged on the upper cover plate 2, a first through groove 5 is arranged on the upper cover plate 2, the first through groove 5 is arranged between the water inlet installation port 3 and the water outlet installation port 4, a first wire guide groove 27 and a second wire guide groove 29 are arranged on one side wall of the top end of the main body 1, the first wire guide groove 27 and the second wire guide groove 29 are arranged in a mutually perpendicular manner, the first wire guide groove 27 is communicated with the second wire guide groove 29, the second wire guide groove 29 is a through groove, a concave groove 8 is arranged in the main body 1, the concave groove 8 divides the main body 1 into three areas, one side of which is a water inlet area 21, the other side is a water outlet area 22, two first sealing grooves 6 are arranged on the top surfaces of the water inlet area 21 and the water outlet area 22, a first sealing ring 7 is embedded in each first sealing groove 6, four mounting blocks 9 are uniformly arranged at four corners of the inner wall of the concave groove 8, the four mounting blocks 9 are integrally formed with the concave groove 8 through casting, threaded holes 13 are formed in the four mounting blocks 9, a control panel 10 is arranged at the same side of the four mounting blocks 9, bolts are screwed on the control panel 10, a mounting hole 12 is fixedly arranged at the center of the inner bottom surface of the concave groove 8, a first temperature control inductor 11 is fixedly embedded in the mounting hole 12, one end of the first temperature control inductor 11 with a detection head penetrates out of the mounting hole 12, a semiconductor refrigeration piece 14 is arranged in the main body 1, and the semiconductor refrigeration piece 14 is composed of a refrigeration surface 28, a heat dissipation surface 31 and a semiconductor refrigeration piece 14, the bottom of the refrigeration surface 28 is provided with a lower cover plate 17, four corners of the lower cover plate 17 are respectively screwed with bolts, a second sealing groove 15 is arranged on the bottom surface of the main body 1, a second sealing ring 16 is embedded in the second sealing groove 15, two wiring grooves 30 are symmetrically arranged on one side of the second sealing groove 15, the two wiring grooves 30 are L-shaped, the two wiring grooves 30 are respectively communicated with a second wiring groove 29, the two wiring grooves 30 are arranged on the main body 1, four corners of the outer wall of the lower cover plate 17 are respectively and fixedly provided with clamping pieces 18, the lower cover plate 17 and the clamping pieces 18 are integrally formed by casting, the lower cover plate 17 is provided with a second wiring groove 20, the main body of the semiconductor refrigeration piece 14 is composed of a ceramic upper panel 23, a ceramic lower panel 24, a silica gel sealing frame 25, a refrigeration layer 26 and a second temperature control inductor 19, the silica gel sealing frame 25 is arranged between the ceramic upper panel 23 and the ceramic lower panel 24, the laminating is provided with refrigeration picture layer 26 in the silica gel sealing frame 25, the embedding has second temperature-sensing ware 19 in the panel 24 under the pottery, first temperature-sensing ware 11 detects first department and the laminating setting of cooling surface 31.

The control panel 10 is an integrated circuit control panel with a processor and containing a liquid crystal screen.

The refrigeration layer 26 is composed of P/N particles.

The second temperature control sensor 19 is a patch type temperature sensor.

The working principle is as follows: when the device is installed and used, firstly, referring to the attached drawing 1, after the device is installed according to the attached drawing 1, the water inlet installation port 3 is connected with an external water inlet pipe, the water outlet installation port 4 is connected with an external water outlet pipe, so that the device can normally work, the two first sealing rings 7 and the second sealing ring 16 can well ensure the sealing of the device, so that water enters the water inlet area 21 along the water inlet installation port 3, then flows into the water outlet area 22 through the installation hole 12 and the heat dissipation surface 31, and then is discharged through the water outlet installation port 4 to form a complete cycle, the heat dissipation surface 31 of the semi-refrigeration semiconductor sheet 14 is subjected to heat dissipation, meanwhile, the refrigeration surface 28 is attached to the surface of an electronic element needing heat dissipation by adopting the semiconductor sheet 14 as a heat conduction bottom plate, the heat dissipation surface 31 faces the upper cover plate 2 containing the first sealing ring 7, and make coolant liquid and cooling surface 31 laminate, under the refrigerated condition of continuation, the temperature of cooling surface 31 can rise, then by the coolant liquid that flows through, take away the heat that cooling surface 31 sent for this device can accomplish simultaneously and refrigerate, two aspects of the heat dissipation.

The refrigerating surface 28 of the semiconductor refrigerating sheet 14 is internally provided with a second temperature control sensor 19 for detecting the refrigerating temperature, the temperature of the refrigerating surface 28 can be transmitted to the control panel 10 in real time, the control panel 10 is internally provided with a program, and meanwhile, a third temperature sensor is arranged indoors and is connected with the control panel 10 through a circuit, so that the control panel 10 can automatically set a certain value for the temperature difference between the room temperature and the refrigerating surface 28, and can automatically adjust the temperature of the refrigerating surface 28 according to the change of the room temperature (assuming that the room temperature is 30 ℃, the temperature of the refrigerating surface 28 is required to be kept lower than the room temperature by 4 ℃ in the program, then the control panel can send a command to power off the semiconductor refrigerating sheet 14 when the temperature of the refrigerating surface 28 is 26 ℃, if the room temperature rises to 35 ℃, the program can automatically send a command to control the temperature of the refrigerating surface 28 to be higher than 31 ℃), which has the advantages that the refrigerating temperature of the refrigerating surface 28 of the semiconductor refrigerating sheet 14 can be automatically controlled by the control panel, the temperature difference programmed in the control panel 10 will not produce condensed water, so the semiconductor cooling plate 14 can be directly applied to the surface of the electronic chip.

The cooling surface of the semiconductor refrigeration piece 14 is provided with a first temperature control sensor 11 on the surface, the highest limit temperature of the first temperature control sensor 11 is set in the control panel 10, when the maximum limit temperature is exceeded, an instruction is sent out from the control panel to power off the semiconductor refrigeration piece 14 so as to avoid burning, and in addition, the control panel 10 adopts a mode of adding a circuit board to a liquid crystal display, so that the control panel has smaller volume and stronger function and can be installed at a smaller position.

The cooling surface 31 length and the width of semiconductor refrigeration piece 14 are greater than refrigeration face 28 length and width, so can be better make second lead slot 20 can block, it is fixed with it to utilize down apron 17, and set up two trough 30, can make the induction connecting wire of second temperature control inductor 19 and the power cord of semiconductor refrigeration piece 14 pass second lead slot 29 simultaneously, then be connected with control panel 10, first temperature control inductor 11 is connected with control panel 10 through the circuit, third temperature control inductor that sets up in indoor then stretches into in main part 1 via first lead slot 27 and is connected with control panel 10, thereby guarantee the normal use of device.

And the product of this kind of structure does not exist at present in the market, and this device can be applied to the computer chip heat dissipation, and the LED chip heat dissipation, intelligent machine equips the chip heat dissipation, and the heat dissipation scope is very extensive.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a novel intelligent computer CPU refrigeration water-cooling head, includes main part (1), main part (1) one side is provided with upper cover plate (2), the spiro union has the bolt on upper cover plate (2), be provided with respectively on upper cover plate (2) into water installing port (3) and play water installing port (4), its characterized in that: the water inlet and outlet sealing structure is characterized in that a first through groove (5) is formed in the upper cover plate (2), the first through groove (5) is arranged between the water inlet mounting port (3) and the water outlet mounting port (4), a first guide groove (27) and a second guide groove (29) are formed in one side wall of the top end of the main body (1), the first guide groove (27) and the second guide groove (29) are perpendicular to each other and communicated with each other, the second guide groove (29) is a through groove, a concave groove (8) is formed in the main body (1), the main body (1) is divided into three areas by the concave groove (8), one side of the main body is a water inlet area (21), the other side of the main body is a water outlet area (22), two first sealing grooves (6) are formed in the top surfaces of the water inlet area (21) and the water outlet area (22), a first sealing ring (7) is embedded into each first sealing groove (6), four installation blocks (9) are uniformly arranged at four corners of the inner wall of the concave groove (8), the four installation blocks (9) are integrally formed with the concave groove (8) through casting, threaded holes (13) are formed in the four installation blocks (9), a control panel (10) is arranged on one side, which is the same with the four installation blocks (9), a bolt is screwed on the control panel (10), a mounting hole (12) is fixedly formed in the center of the inner bottom surface of the concave groove (8), a first temperature control inductor (11) is fixedly embedded in the mounting hole (12), one end, provided with a detection head, of the first temperature control inductor (11) penetrates out of the mounting hole (12), a semiconductor refrigeration piece (14) is arranged in the main body (1), the semiconductor refrigeration piece (14) is composed of a refrigeration surface (28), a heat dissipation surface (31) and a semiconductor refrigeration piece (14) main body, and a lower cover plate (17) is arranged at the bottom end of the refrigeration surface (28), the bolt is screwed at the four corners of the lower cover plate (17) respectively, a second sealing groove (15) is arranged on the bottom surface of the main body (1), a second sealing ring (16) is embedded in the second sealing groove (15), two wiring grooves (30) are symmetrically arranged on one side of the second sealing groove (15), the two wiring grooves (30) are L-shaped, the two wiring grooves (30) are respectively communicated with a second wiring groove (29), the two wiring grooves (30) are arranged on the main body (1), clamping pieces (18) are fixedly arranged at the four corners of the outer wall of the lower cover plate (17) respectively, the lower cover plate (17) and the clamping pieces (18) are integrally formed through casting, a second through groove (20) is arranged on the lower cover plate (17), and the main body of the semiconductor refrigerating piece (14) is composed of a ceramic upper panel (23), a ceramic lower panel (24), a silica gel sealing frame (25), a refrigerating layer (26) and a second temperature control inductor (19), silica gel sealing frame (25) set up between panel (24) under ceramic top panel (23) and pottery, the laminating is provided with refrigeration picture layer (26) in silica gel sealing frame (25), the embedding has second control by temperature change inductor (19) in panel (24) under the pottery, first control by temperature change inductor (11) detect head department and cooling surface (31) laminating setting.

2. The novel intelligent computer CPU refrigeration water-cooling head as claimed in claim 1, wherein: the control panel (10) adopts an integrated circuit control panel with a processor and a liquid crystal screen.

3. The novel intelligent computer CPU refrigeration water-cooling head as claimed in claim 1, wherein: the refrigeration layer (26) is composed of P/N particles.

4. The novel intelligent computer CPU refrigeration water-cooling head as claimed in claim 1, wherein: and the second temperature control sensor (19) adopts a patch type temperature sensor.