CN213020393U

CN213020393U - Refrigerating device based on thermoelectric refrigerating film

Info

Publication number: CN213020393U
Application number: CN202021983744.7U
Authority: CN
Inventors: 周斌; 刘佳; 程劲兰
Original assignee: Changhong Meiling Co Ltd
Current assignee: Changhong Meiling Co Ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2021-04-20
Anticipated expiration: 2030-09-11

Abstract

The utility model discloses a refrigerating plant based on thermoelectric refrigeration membrane relates to refrigeration plant technical field. The utility model comprises a condenser and a refrigerating device; the refrigerating device comprises a radiating fin, a semiconductor refrigerating film, a heat conducting pipe and a thinning film; the heat conduction pipe comprises a heat conduction plate cold wall and a heat conduction plate hot wall; the condenser is provided with a radiating fin; the outer side surface of the radiating fin is fixedly connected with the cold wall of the heat conducting plate on one side of the heat conducting pipe; a semiconductor refrigeration film is coated between the outer side surface of the radiating fin and the cold wall of the heat conducting plate; the inner side surface of the hot wall of the heat conducting plate is coated with a thinning membrane; the heat transfer pipe is filled with flowing refrigerant. The utility model discloses a refrigerating plant has good refrigeration effect, improves the speed that the heat was taken away by refrigerating plant on the condenser of refrigerator to reduce the temperature of refrigerant in the condenser, improve the radiating effect of condenser.

Description

Refrigerating device based on thermoelectric refrigerating film

Technical Field

The utility model belongs to the technical field of refrigeration plant, especially, relate to a refrigerating plant based on thermoelectric refrigeration membrane.

Background

The refrigeration principle of the refrigerator is that a refrigerant is sucked by a compressor in a gaseous state, is compressed into high-temperature and high-pressure vapor, enters a condenser through an exhaust pipe, dissipates heat into outside air, is condensed into high-pressure liquid, enters a capillary tube through a filter, is intercepted and depressurized, and enters an evaporator to be vaporized. The refrigerant liquid absorbs external heat and is vaporized into dry saturated steam, so that the temperature in the refrigerator is reduced, and the refrigerant is changed into low-pressure superheated steam and is sucked back by the compressor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a refrigerating plant based on thermoelectric refrigeration membrane has good refrigeration effect through refrigerating plant, improves the speed that the heat was taken away by refrigerating plant on the condenser of refrigerator to reduce the temperature of refrigerant in the condenser, improve the radiating effect of condenser.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a refrigerating device based on a thermoelectric refrigerating film, which comprises a condenser and a refrigerating device which are used on a refrigerator; the refrigerating device comprises a radiating fin, a semiconductor refrigerating film, a heat conducting pipe for radiating and a hydrophobic film; the heat conduction pipe comprises a heat conduction plate cold wall and a heat conduction plate hot wall; the heat-conducting plate hot wall is also commonly called a hot cavity; the condenser is provided with a radiating fin; the outer side surface of the radiating fin is fixedly connected with the cold wall of the heat conducting plate on one side of the heat conducting pipe; a semiconductor refrigeration film is coated between the outer side surface of the radiating fin and the cold wall of the heat conducting plate; the inner side surface of the hot wall of the heat conducting plate is coated with a hydrophobic film; the heat conduction pipe is filled with flowing refrigerant.

Furthermore, the heat conduction pipe is made of metal; the metal material comprises at least one of aluminum, copper, iron and stainless steel; among them, a heat pipe made of aluminum is preferably used.

Further, the refrigerant is one of isobutane and propane, wherein purified water can be adopted, but the effect of the purified water is poor.

Furthermore, a radiating pipe is arranged on the outer side surface of the hot wall of the heat conducting plate; the heat radiation pipe is filled with flowing refrigerant; the refrigerant acts to absorb heat and to carry away heat from the hot wall of the heat-conducting plate, so as to increase the rate at which heat is carried away by the refrigeration unit at the condenser of the refrigerator.

Furthermore, the inlet of the radiating pipe is fixedly connected with the water distribution hole of the water distribution disc.

Under the action of the driving force of the temperature difference between the two sides, refrigerant molecules inside the hot cavity penetrate through the hydrophobic membrane and enter an air gap with a certain gap, and the refrigerant molecules in the air gap are diffused to the position near the cold wall of the heat conducting plate and are liquefied into liquid drops when meeting cold; because the content of refrigerant molecules between the hydrophobic membrane and the heat cavity is lower under low temperature and low flow, the saturated vapor pressure is reduced, and the number of refrigerant molecules penetrating through the hydrophobic membrane is less; the flow velocity of the refrigerant on the outer side of the heat cavity is slow under the influence of low flow, so that the residence time of the refrigerant on the outer wall of the heat cavity is long, the temperature of the refrigerant on the outer wall of the heat cavity is further reduced, and the membrane flux of the hydrophobic membrane is reduced on the basis of the two reasons; under the conditions of higher refrigerant flow and temperature on the right side of the thermal cavity, refrigerant molecules on the left side of the thermal cavity are increased, the number of the refrigerant molecules penetrating through the hydrophobic membrane is increased, and under the condition of higher flow, the flow velocity in the right side of the thermal cavity is increased, so that the average temperature of the thermal cavity is always kept at a higher level; the refrigerant with higher flow velocity is shunted by the shunt holes of the shunt disk and then quickly washes the outer wall of the thermal cavity, thereby reducing the temperature polarization and concentration polarization phenomena of the membrane surface of the hydrophobic membrane and further playing a role in increasing the membrane flux; namely, the refrigerating device is used as the cold end of the membrane distillation, and a good refrigerating effect can be achieved.

The utility model discloses following beneficial effect has:

the utility model discloses a refrigerating plant is connected with condenser and compressor through the pipeline, under the both sides difference in temperature drive power effect, during refrigerant molecule entered into the air gap that has certain clearance through hydrophobic membrane in the hot chamber, refrigerant molecule diffusion met cold liquefaction for the liquid drop near the heat-conducting plate cold wall in the air gap to refrigerating plant can play good refrigeration effect as the membrane distillation cold junction.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a refrigerating device based on a thermoelectric refrigerating film according to the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

1-refrigerating device, 2-radiating fin, 3-semiconductor refrigerating film, 4-heat conducting pipe, 5-hydrophobic film, 6-refrigerant, 7-radiating pipe, 401-heat conducting plate cold wall and 402-heat conducting plate hot wall.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "open hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1, the present invention relates to a refrigerating device based on a thermoelectric refrigerating film, which comprises a condenser and a refrigerating device 1 used on a refrigerator; the refrigerating device 1 comprises a radiating fin 2, a semiconductor refrigerating film 3, a heat conducting pipe 4 for radiating heat and a hydrophobic film 5; heat pipe 4 includes a heat-conducting plate cold wall 401 and a heat-conducting plate hot wall 402; the thermal plate hot wall 402 is also commonly referred to as a hot chamber; the condenser is provided with radiating fins 2; the outer side surface of the radiating fin 2 is fixedly connected with a heat-conducting plate cold wall 401 at one side of the heat-conducting pipe 4; a semiconductor refrigeration film 3 is coated between the outer side surface of the radiating fin 2 and the heat conducting plate cold wall 401; the inner side surface of the heat-conducting plate hot wall 402 is coated with a hydrophobic film 5; heat transfer pipe 4 is filled with flowing refrigerant 6.

Preferably, the heat conduction pipe 4 is made of metal; the metal material comprises at least one of aluminum, copper, iron and stainless steel; among them, the heat transfer pipe 4 made of aluminum is preferably used.

Preferably, the refrigerant 6 is one of isobutane and propane, wherein purified water may also be used, but the effect of purified water is poor.

Preferably, the heat-conducting plate hot wall 402 is provided with a radiating pipe 7 on the outer side; the radiating pipe 7 is filled with flowing refrigerant 6; the function of the refrigerant 6 is to absorb heat and to carry away the heat from the hot wall 402 of the plate, so as to have the effect of increasing the rate at which the heat is carried away by the cooling device 1 at the condenser of the refrigerator.

Preferably, the inlet of the radiating pipe 7 is fixedly connected with the water diversion hole of the water diversion disk.

Under the action of the driving force of the temperature difference between the two sides, molecules of the refrigerant 6 inside the hot cavity penetrate through the hydrophobic membrane 5 and enter an air gap with a certain gap, and the molecules of the refrigerant 6 in the air gap are diffused to the position near the cold wall 401 of the heat conducting plate and are liquefied into liquid drops when meeting cold; because the content of the refrigerant 6 molecules between the hydrophobic membrane 5 and the heat cavity is lower under low temperature and low flow, the saturated vapor pressure is reduced, and the number of the refrigerant 6 molecules penetrating through the hydrophobic membrane 5 is less; the flow velocity of the refrigerant on the outer side of the heat cavity is slow under the influence of low flow, so that the residence time of the refrigerant on the outer wall of the heat cavity is long, the temperature of the refrigerant on the outer wall of the heat cavity is further reduced, and the membrane flux of the hydrophobic membrane 5 is reduced on the basis of the two reasons; under the conditions of higher refrigerant flow and temperature on the right side of the thermal cavity, the number of refrigerant 6 molecules on the inner side of the thermal cavity is increased, the number of refrigerant 6 molecules penetrating through the hydrophobic membrane 5 is increased, and under the condition of higher flow, the flow velocity in the right side of the thermal cavity is increased, so that the average temperature of the thermal cavity is always kept at a higher level; the refrigerant 6 with higher flow velocity is shunted by the shunt holes of the shunt disk and then quickly washes the outer wall of the thermal cavity, thereby reducing the temperature polarization and concentration polarization phenomena of the membrane surface of the hydrophobic membrane 5 and further playing a role in increasing the membrane flux; namely, the refrigerating device is used as the cold end of the membrane distillation, so that a good refrigerating effect can be achieved; wherein the outside of the thermal chamber is the right side of the thermal chamber in fig. 1; the inside of the thermal chamber is the left side of the thermal chamber in fig. 1.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A thermoelectric refrigeration film based refrigeration device comprises a condenser used on a refrigerator; the method is characterized in that: also comprises a refrigerating device (1);

the refrigerating device (1) comprises a radiating fin (2), a semiconductor refrigerating film (3), a heat conducting pipe (4) for radiating heat and a hydrophobic film (5); the heat conduction pipe (4) comprises a heat conduction plate cold wall (401) and a heat conduction plate hot wall (402);

the condenser is provided with radiating fins (2); the outer side surface of the radiating fin (2) is fixedly connected with a heat conducting plate cold wall (401) on one side of the heat conducting pipe (4); a semiconductor refrigeration film (3) is coated between the outer side surface of the radiating fin (2) and the heat conducting plate cold wall (401); the inner side surface of the heat-conducting plate hot wall (402) is coated with a hydrophobic membrane (5); the heat transfer pipe (4) is filled with a flowing refrigerant (6).

2. A thermoelectric cooling film based refrigeration device according to claim 1, characterized in that said heat conducting pipes (4) are made of metal; the metal material comprises at least one of aluminum, copper, iron and stainless steel.

3. A thermoelectric cooling membrane based refrigeration device according to claim 1, characterized in that said refrigerant (6) is one of isobutane and propane.

4. A thermoelectric cooling film based refrigerating device as recited in claim 1, wherein said heat conducting plate hot wall (402) is provided with a heat dissipating pipe (7) at its outer side; and the heat radiating pipe (7) is filled with flowing refrigerant (6).

5. A thermoelectric cooling film based refrigerating device as recited in claim 4, characterized in that the inlet of said radiating pipe (7) is fixedly connected with the water diversion hole of the water diversion disc.