CN213004708U - Device for deburring of crystal silicon wafer - Google Patents

Device for deburring of crystal silicon wafer Download PDF

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Publication number
CN213004708U
CN213004708U CN202021573667.8U CN202021573667U CN213004708U CN 213004708 U CN213004708 U CN 213004708U CN 202021573667 U CN202021573667 U CN 202021573667U CN 213004708 U CN213004708 U CN 213004708U
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fixedly connected
water
pipe
deburring
delivery pipe
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CN202021573667.8U
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王姜愉
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Hangzhou Tushi Technology Co ltd
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Hangzhou Tushi Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A20/00Water conservation; Efficient water supply; Efficient water use
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The utility model provides a device for deburring of crystalline silicon wafers, which belongs to the technical field of solar photovoltaic, and comprises a working cabin, wherein a fixed plate is arranged in the working cabin, the upper surface of the fixed plate is fixedly connected with a first water delivery pipe and a second water delivery pipe, one end of the first water delivery pipe is fixedly connected with a first high-pressure spray nozzle, one end of the second water delivery pipe is fixedly connected with a second high-pressure spray nozzle, one side of the inner wall of the working cabin is fixedly connected with a support arm and a water distribution pipe from top to bottom in sequence, a workpiece can be fixed on a working table through the arrangement of the first clamp plate, the second clamp plate, a support, the support arm and a screw rod, the position of the support is adjusted and fixed through the rotation of the screw rod, water reaches certain pressure through the pressurization of a high-pressure water pump, is sprayed out through the high-pressure spray nozzle to deburr the, therefore, the problems that the deburring effect is poor and the machine can damage the crystal silicon wafer in the prior art are solved.

Description

Device for deburring of crystal silicon wafer
Technical Field
The utility model belongs to the technical field of the solar photovoltaic, concretely relates to a device for burring of crystal silicon piece.
Background
Currently, crystalline silicon materials (including polysilicon and monocrystalline silicon) are the most prominent photovoltaic materials, have a market share of 90% or more, and are still the mainstream materials of solar cells for a long period of time in the future. The production technology of polysilicon materials has long been known to form technical blockages and monopolies in the market in 10 factories of 7 companies in 3 countries such as U.S. a, d, and d. The demand for polycrystalline silicon mainly comes from semiconductors and solar cells. According to different purity requirements, the method is divided into an electronic grade and a solar grade. The solar grade polycrystalline silicon used for the photovoltaic solar cell is about 55 percent, the solar grade polycrystalline silicon is 45 percent, along with the rapid development of the photovoltaic industry, the growth rate of the demand of the solar cell for the polycrystalline silicon is higher than that of the semiconductor polycrystalline silicon, and the demand of the solar grade polycrystalline silicon is expected to exceed that of the electronic grade polycrystalline silicon by 2008. The total yield of solar cells worldwide in 1994 is only 69MW, while in 2004 nearly 1200MW, increasing 17-fold in the short 10 years. Experts predict that the solar photovoltaic industry will exceed nuclear power to become one of the most important basic energy sources in the first half of the twenty-first century.
When the solar cell panel is manufactured, the crystal silicon wafer can be cut, burrs are generated on the periphery of the silicon wafer in the process, and therefore the machine with the function of deburring is provided.
Disclosure of Invention
An object of the utility model is to provide a device for crystal silicon chip burring aims at solving among the prior art that the burring effect is not good and the machine can cause the problem of damage to crystal silicon chip.
In order to achieve the above object, the utility model provides a following technical scheme: a device for deburring a crystal silicon wafer comprises a working cabin, wherein a fixed plate is arranged inside the working cabin, the upper surface of the fixed plate is fixedly connected with a first water delivery pipe and a second water delivery pipe from left to right in sequence, one end of the first water delivery pipe is fixedly connected with a first high-pressure spray nozzle, one end of the second water delivery pipe is fixedly connected with a second high-pressure spray nozzle, one side of the inner wall of the working cabin is fixedly connected with a support arm and a water distribution pipe from top to bottom in sequence, the upper surface of the support arm is in threaded connection with a screw rod, one side of the support arm is inserted with a support, one side of the support arm is fixedly connected with a center fixing ring, the inner wall of the center fixing ring is inserted with a rolling shaft, one end of the rolling shaft is fixedly connected with a first clamping plate, the bottom of one side of the support arm is inserted with a center fixing pipe, and, the utility model discloses a power cabin, including center fixed pipe, one end fixedly connected with second splint, the other end fixedly connected with gear wheel of transmission shaft, two delivery ports of distributive pipe carry out fixed connection with the bottom of first raceway, the bottom of second raceway respectively, one side fixedly connected with power compartment of work cabin, the inside of power compartment is from last to first backup pad and the second backup pad of fixedly connected with down in proper order, the positive fixedly connected with switch of power compartment.
In order to make this a device for crystal silicon chip burring reach the work piece that can deal with different sizes and do not damage the effect of work piece, as the utility model relates to an it is preferred, the spray angle of first high pressure nozzle and second high pressure nozzle is adjustable, the material of first splint and second splint is soft on the side.
In order to make this a device for crystal silicon piece burring reach the work piece of polishing that can be comprehensive even, as the utility model relates to an it is preferred, the last fixed surface of first backup pad is connected with the motor, the output fixedly connected with pinion of motor, mesh between the surface of gear wheel and the surface of pinion and connect.
In order to make this a device for crystal silicon chip burring reach the effect that water has sufficient pressure, as the utility model relates to an it is preferred, the last fixed surface of second backup pad is connected with high pressure water pump, the last fixed surface of high pressure water pump output end is connected with the aqueduct, the back fixedly connected with inlet tube of high pressure water pump output end, carry out fixed connection between the one end of aqueduct and the water inlet of distributive pipe.
In order to make this a device for crystal silicon chip burring reach the effect of protection staff's personal safety, as the utility model relates to an it is preferred, the opening part swing joint of work cabin has the guard gate.
In order to make this a device for burring of crystal silicon piece reach the effect of drainage, as the utility model relates to an it is preferred, the one corner fixedly connected with drain pipe of fixed plate upper surface.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the device for deburring the crystal silicon wafer can fix a workpiece on a workbench through the arrangement of the first clamping plate, the second clamping plate, the bracket, the support arm and the screw rod, the position of the bracket is adjusted and fixed through the rotation of the screw rod, so as to deal with workpieces with different thicknesses, water reaches certain pressure after being pressurized by the high-pressure water pump and is sprayed out by the high-pressure spray head, the edge of the workpiece is deburred, the workpiece can rotate through the mutual matching of the motor, the gear and the transmission shaft, thereby achieving better deburring effect, through the arrangement of the central fixed ring and the central fixed pipe, the first clamping plate and the second clamping plate can be ensured to be on the same horizontal line, and the phenomenon that in the rotating process, because the dislocation of the clamping plate causes damage to the workpiece, the problems that the deburring effect is poor and the machine can damage the crystal silicon wafer in the prior art are solved.
2. This a device for crystal silicon chip burring through setting up the guard gate, can prevent because the work piece not press from both sides the danger of tightly and the departure, can keep out the water that spills moreover to the problem that the machine caused danger to the staff has been solved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of an axial measurement structure of the present invention;
fig. 2 is a schematic front view of the cross-sectional structure of the present invention;
FIG. 3 is a schematic view of an axial measurement structure of the middle clamp and the injection body of the present invention;
fig. 4 is a schematic diagram of a right-side view cross-sectional structure of the present invention.
In the figure: 1. a drain pipe; 2. a fixing plate; 3. a working cabin; 4. a first water delivery pipe; 5. a support; 6. a protective door; 7. a central fixed ring; 8. a roll axis; 9. a first splint; 10. a screw; 11. a support arm; 12. a power compartment; 13. a bull gear; 14. a drive shaft; 15. a central fixed tube; 16. a motor; 17. a pinion gear; 18. a first support plate; 19. a water conduit; 20. a high pressure water pump; 21. a second support plate; 22. a second water delivery pipe; 23. a second high pressure showerhead; 24. a second splint; 25. a water diversion pipe; 26. a first high pressure showerhead; 27. a switch; 28. and (4) a water inlet pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides the following technical solutions: a device for deburring a crystal silicon wafer comprises a working cabin 3, a fixing plate 2 is arranged inside the working cabin 3, the upper surface of the fixing plate 2 is fixedly connected with a first water delivery pipe 4 and a second water delivery pipe 22 from left to right in sequence, one end of the first water delivery pipe 4 is fixedly connected with a first high-pressure spray nozzle 26, one end of the second water delivery pipe 22 is fixedly connected with a second high-pressure spray nozzle 23, one side of the inner wall of the working cabin 3 is fixedly connected with a support arm 11 and a water diversion pipe 25 from top to bottom in sequence, the upper surface of the support arm 11 is in threaded connection with a screw rod 10, one side of the support arm 11 is inserted with a support 5, one side of the support 5 is fixedly connected with a central fixing ring 7, the inner wall of the central fixing ring 7 is inserted with a rolling shaft 8, one end of the rolling shaft 8 is fixedly connected with a first clamping plate 9, the bottom of one side of the support arm 11 is inserted, the inner wall of center fixed tube 15 is pegged graft and is had transmission shaft 14, the one end fixedly connected with second splint 24 of transmission shaft 14, the other end fixedly connected with gear wheel 13 of transmission shaft 14, two delivery ports of distributive pipe 25 carry out fixed connection with the bottom of first raceway 4, the bottom of second raceway 22 respectively, one side fixedly connected with power module 12 of work module 3, the inside of power module 12 is from last to lower first backup pad 18 and the second backup pad 21 of fixedly connected with in proper order, the front fixedly connected with switch 27 of power module 12.
In the embodiment of the present invention, the first clamping plate 9, the second clamping plate 24, the bracket 5, the support arm 11 and the screw 10 are arranged to fix the workpiece on the worktable, the position of the bracket 5 is adjusted and fixed by the rotation of the screw 10, so as to deal with workpieces with different thicknesses, water is pressurized by the high-pressure water pump 20 to reach certain pressure and is sprayed out by the high-pressure spray head, the edges of the workpiece are deburred, by the cooperation of the motor 16, gears and drive shaft 14, the workpiece can be rotated to achieve better deburring effect, and through the arrangement of the central fixing ring 7 and the central fixing tube 15, it is possible to ensure that the first jaw 9 and the second jaw 24 are on the same horizontal line, preventing, during rotation, because the dislocation of the clamping plate causes damage to the workpiece, the problems that the deburring effect is poor and the machine can damage the crystal silicon wafer in the prior art are solved.
Specifically, the injection angles of the first high-pressure nozzle 26 and the second high-pressure nozzle 23 are adjustable, and the first clamping plate 9 and the second clamping plate 24 are made of soft materials.
In this embodiment: the angle of the high-pressure spray head can be adjusted, the effect of coping with workpieces of different sizes is achieved, the clamping plate is made of soft materials, and the effect of protecting the surface of the workpiece from damage can be achieved.
Specifically, the motor 16 is fixedly connected to the upper surface of the first support plate 18, the pinion 17 is fixedly connected to the output end of the motor 16, and the outer surface of the large gear 13 and the outer surface of the pinion 17 are engaged.
In this embodiment: the provision of the motor 16 provides power for rotation of the workpiece.
Specifically, the upper surface of the second support plate 21 is fixedly connected with a high-pressure water pump 20, the upper surface of the output end of the high-pressure water pump 20 is fixedly connected with a water guide pipe 19, the back surface of the output end of the high-pressure water pump 20 is fixedly connected with a water inlet pipe 28, and one end of the water guide pipe 19 is fixedly connected with the water inlet of the water distribution pipe 25.
In this embodiment: through the arrangement of the high-pressure water pump 20, enough pressure can be provided for water, so that the deburring effect on the workpiece can be achieved.
Specifically, a protective door 6 is movably connected to an opening of the working cabin 3.
In this embodiment: through setting up guard gate 6, can prevent because the work piece not press from both sides the danger that tightly and fly off, can keep out the water that spills moreover, reach the effect of protection staff safety.
Specifically, a drain pipe 1 is fixedly connected to one corner of the upper surface of the fixing plate 2.
In this embodiment: through the arrangement of the drain pipe 1, the effect of draining the sewage in the cabin is achieved.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
The utility model discloses a theory of operation and use flow: when the device for deburring the crystalline silicon wafer is used, a workpiece can be fixed on a workbench through the arrangement of the first clamping plate 9, the second clamping plate 24, the bracket 5, the support arm 11 and the screw 10, the position of the bracket 5 is adjusted and fixed through the rotation of the screw 10, so as to deal with workpieces with different thicknesses, water is pressurized by the high-pressure water pump 20 to reach certain pressure and is sprayed out by the high-pressure spray head, the edges of the workpiece are deburred, by the cooperation of the motor 16, gears and drive shaft 14, the workpiece can be rotated to achieve better deburring effect, and through the arrangement of the central fixing ring 7 and the central fixing tube 15, it is possible to ensure that the first jaw 9 and the second jaw 24 are on the same horizontal line, preventing, during rotation, because the dislocation of the clamping plate causes damage to the workpiece, the problems that the deburring effect is poor and the machine can damage the crystal silicon wafer in the prior art are solved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. An apparatus for deburring a crystalline silicon wafer, comprising a work chamber (3), characterized in that: the working cabin is characterized in that a fixing plate (2) is arranged inside the working cabin (3), the upper surface of the fixing plate (2) is sequentially and fixedly connected with a first water delivery pipe (4) and a second water delivery pipe (22) from left to right, one end of the first water delivery pipe (4) is fixedly connected with a first high-pressure spray nozzle (26), one end of the second water delivery pipe (22) is fixedly connected with a second high-pressure spray nozzle (23), one side of the inner wall of the working cabin (3) is sequentially and fixedly connected with a support arm (11) and a water distribution pipe (25) from top to bottom, the upper surface of the support arm (11) is in threaded connection with a screw rod (10), one side of the support arm (11) is inserted with a support (5), one side of the support (5) is fixedly connected with a central fixing ring (7), the inner wall of the central fixing ring (7) is inserted with a rolling shaft (8), and one, a central fixing pipe (15) is inserted at the bottom of one side of the support arm (11), the central line of the central fixing pipe (15) and the central line of the central fixing ring (7) are on the same horizontal line, a transmission shaft (14) is inserted into the inner wall of the central fixed pipe (15), one end of the transmission shaft (14) is fixedly connected with a second clamping plate (24), the other end of the transmission shaft (14) is fixedly connected with a big gear (13), two water outlets of the water distribution pipe (25) are respectively and fixedly connected with the bottom end of the first water delivery pipe (4) and the bottom end of the second water delivery pipe (22), one side fixed connection of work cabin (3) has the piggyback pod (12), the inside of piggyback pod (12) is from last to first backup pad (18) and the second backup pad (21) of fixedly connected with down in proper order, the positive fixedly connected with switch (27) of piggyback pod (12).
2. The apparatus for deburring of crystalline silicon wafers as set forth in claim 1, wherein: the spraying angles of the first high-pressure spray head (26) and the second high-pressure spray head (23) can be adjusted, and the first clamping plate (9) and the second clamping plate (24) are soft.
3. The apparatus for deburring of crystalline silicon wafers as set forth in claim 1, wherein: the last fixed surface of first backup pad (18) is connected with motor (16), the output fixedly connected with pinion (17) of motor (16), carry out the meshing between the surface of gear wheel (13) and the surface of pinion (17) and be connected.
4. The apparatus for deburring of crystalline silicon wafers as set forth in claim 1, wherein: the water distributor is characterized in that a high-pressure water pump (20) is fixedly connected to the upper surface of the second supporting plate (21), a water guide pipe (19) is fixedly connected to the upper surface of the output end of the high-pressure water pump (20), a water inlet pipe (28) is fixedly connected to the back of the output end of the high-pressure water pump (20), and one end of the water guide pipe (19) is fixedly connected with a water inlet of the water distribution pipe (25).
5. The apparatus for deburring of crystalline silicon wafers as set forth in claim 1, wherein: the opening of the working cabin (3) is movably connected with a protective door (6).
6. The apparatus for deburring of crystalline silicon wafers as set forth in claim 1, wherein: one corner of the upper surface of the fixing plate (2) is fixedly connected with a drain pipe (1).
CN202021573667.8U 2020-08-03 2020-08-03 Device for deburring of crystal silicon wafer Active CN213004708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021573667.8U CN213004708U (en) 2020-08-03 2020-08-03 Device for deburring of crystal silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021573667.8U CN213004708U (en) 2020-08-03 2020-08-03 Device for deburring of crystal silicon wafer

Publications (1)

Publication Number Publication Date
CN213004708U true CN213004708U (en) 2021-04-20

Family

ID=75461093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021573667.8U Active CN213004708U (en) 2020-08-03 2020-08-03 Device for deburring of crystal silicon wafer

Country Status (1)

Country Link
CN (1) CN213004708U (en)

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