CN212991084U - Cooling device for high-power semiconductor device - Google Patents
Cooling device for high-power semiconductor device Download PDFInfo
- Publication number
- CN212991084U CN212991084U CN202021712433.7U CN202021712433U CN212991084U CN 212991084 U CN212991084 U CN 212991084U CN 202021712433 U CN202021712433 U CN 202021712433U CN 212991084 U CN212991084 U CN 212991084U
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- Prior art keywords
- cooling
- pipe
- power semiconductor
- semiconductor device
- fixed
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- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 title claims abstract description 81
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 239000007921 spray Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a cooling device for a high-power semiconductor device, which relates to the technical field of cooling devices and comprises a cooling pipe, wherein a plurality of heat conduction rings which are uniformly distributed are fixed in the cooling pipe, hollow balls are fixed in the heat conduction rings, a plurality of through holes are formed in the surfaces of the hollow balls, and the through holes extend into the hollow balls; an air pipe is arranged above the cooling pipe, a plurality of air spray heads communicated with the air pipe are welded on the upper side of the air pipe, the right end of the air pipe is a closed end, and an air inlet pipe communicated with the air pipe is fixed at the left end of the air pipe; the beneficial effects of the utility model reside in that: the water in the cooling pipe can fully absorb the heat on the high-power semiconductor device, so that the heat absorption maximization of the water is achieved, the heat of the high-power semiconductor device can be dissipated by using the wind, and the high-power semiconductor device can be cooled by using the water in the cooling pipe, so that the cooling effect of the high-power semiconductor device is better.
Description
Technical Field
The utility model belongs to the technical field of the cooling device technique and specifically relates to a cooling device for high-power semiconductor device is related to.
Background
Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like. For the purpose of distinction from integrated circuits, they are sometimes also referred to as discrete devices.
The existing cooling device for the high-power semiconductor device generally adopts a cooling pipe for cooling treatment, the structure of the existing cooling pipe is simple, the retention time of water in the cooling pipe is short, the water hardly absorbs the heat of the high-power semiconductor device, the water consumption is large, in addition, the cooling mode of the high-power semiconductor device is single, and the rapid cooling of the high-power semiconductor device is difficult to realize.
SUMMERY OF THE UTILITY MODEL
The utility model provides a cooling device for high power semiconductor device can lengthen the water dwell time in the cooling tube for water fully absorbs the heat on the high power semiconductor device, reaches water heat absorption maximize, can utilize wind to dispel the heat and cool down the high power semiconductor device with the water in the cooling tube to the high power semiconductor device simultaneously, makes the high power semiconductor device cooling effect better, in order to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a cooling device for a high power semiconductor device includes a cooling tube;
a plurality of heat conduction rings which are uniformly distributed are fixed in the cooling tube, hollow balls are fixed in the heat conduction rings, a plurality of through holes are formed in the surfaces of the hollow balls, and the through holes extend into the hollow balls;
the cooling pipe top is equipped with the tuber pipe, the butt fusion of tuber pipe upside has a plurality of rather than communicating wind blowing head, just the tuber pipe right-hand member is the blind end, the tuber pipe left end is fixed with rather than communicating air-supply line, air-supply line upper end is installed rather than communicating fan.
Preferably, a water outlet pipe communicated with the cooling pipe is fixed at the left end of the cooling pipe, and a water inlet pipe communicated with the cooling pipe is fixed at the right end of the cooling pipe.
Preferably, the left side and the right side of the air inlet pipe are both fixed with fixing lugs.
Preferably, the tuber pipe external fixation has the solid fixed ring of a plurality of, gu fixed ring and wind-jet head staggered distribution, just gu fixed ring bottom all is fixed with branch.
Preferably, the surface of the supporting rod is provided with two clamping grooves which are distributed up and down, a plurality of clamping rings which correspond to the supporting rod one to one are fixed in front of the cooling pipe, and the clamping rings are clamped in the clamping grooves.
Preferably, the heat conduction ring and the hollow ball are made of stainless steel, and the cooling pipe and the air pipe are plastic hoses.
Compared with the prior art, the beneficial effects of the utility model are that:
according to the cooling device for the high-power semiconductor device, the heat conducting ring and the hollow ball are made of stainless steel, so that the heat conducting property is good, heat on the high-power semiconductor device can be quickly absorbed, and the heat is guided into water, so that the quick cooling is realized;
the cooling pipe is internally provided with the plurality of heat-conducting rings and the hollow ball, so that water can pass through the through hole on one side of the hollow ball to enter the hollow ball when flowing and then is discharged through the through hole on the other side of the hollow ball, water is always in the hollow ball, the heat on the hollow ball can be quickly absorbed, the water retention time in the cooling pipe can be prolonged besides heat conduction by the hollow ball and the heat-conducting rings, the water can fully absorb the heat on a high-power semiconductor device, and the heat absorption maximization of the water is achieved;
the high-power semiconductor device can be cooled by using the wind and the water in the cooling pipe, so that the high-power semiconductor device is better in cooling effect.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic front sectional view of the cooling tube of the present invention;
FIG. 3 is a schematic view of a portion of the structure of FIG. 1 according to the present invention;
fig. 4 is a schematic view of a partial structure at B of fig. 2 according to the present invention.
The labels in the figure are: 1-a cooling tube; 2-water inlet pipe; 3-water outlet pipe; 4-a snap ring; 5-a strut; 6-heat conducting ring; 7-hollow spheres; 8-a through hole; 9-air pipe; 10-a fixed ring; 11-a nozzle head; 12-an air inlet pipe; 13-fixing the ear; 14-a fan; 15-card slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of a cooling apparatus for a high power semiconductor device is further illustrated;
a cooling device for a high power semiconductor device includes a cooling tube 1;
an air pipe 9 is arranged above the cooling pipe 1, a plurality of fixing rings 10 are fixed outside the air pipe 9, the fixing rings 10 and the air spray heads 11 are distributed in a staggered mode, supporting rods 5 are fixed at the bottoms of the fixing rings 10, two clamping grooves 15 which are distributed vertically are formed in the surfaces of the supporting rods 5, a plurality of clamping rings 4 which correspond to the supporting rods 5 one by one are fixed in front of the cooling pipe 1, and the clamping rings 4 are clamped in the clamping grooves 15;
the cooling pipe 1 and the air pipe 9 are both plastic hoses;
specifically, the cooling pipe 1 is used for cooling the high-power semiconductor device, the high-power semiconductor device is hot when working and needs to be cooled, the fixing ring 10 is used for fixing the air pipe 9, and the clamping ring 4 is clamped at the clamping groove 15, so that the clamping ring 4 and the support rod 5 are clamped together, and the air pipe 9 and the fixing ring 10 are connected with the cooling pipe 1;
because the cooling pipe 1 and the air pipe 9 are both plastic hoses, workers can wind the cooling pipe 1 and the air pipe 9 on the surface of the high-power semiconductor device;
a plurality of air injection heads 11 communicated with the air pipe 9 are welded on the upper side of the air pipe 9, the right end of the air pipe 9 is a closed end, an air inlet pipe 12 communicated with the air pipe 9 is fixed at the left end of the air pipe 9, and a fan 14 communicated with the air inlet pipe 12 is installed at the upper end of the air inlet pipe 12; the left side and the right side of the air inlet pipe 12 are both fixed with fixing lugs 13;
specifically, the air inlet pipe 12 can be fixed on the high-power semiconductor device through the two fixing lugs 13, when the high-power semiconductor device works, a worker can switch on the fan 14, the fan 14 can suck external air into the air inlet pipe 12 to form air, then the air can enter the air pipe 9, and the air in the air pipe 9 can be sprayed out through the air spray head 11 due to the fact that the air spray head 11 is communicated with the air pipe 9, and the air can radiate the surface of the high-power semiconductor device;
a plurality of heat conduction rings 6 which are uniformly distributed are fixed inside the cooling pipe 1, hollow balls 7 are fixed inside the heat conduction rings 6, a plurality of through holes 8 are formed in the surfaces of the hollow balls 7, and the through holes 8 extend into the hollow balls 7;
a water outlet pipe 3 communicated with the cooling pipe 1 is fixed at the left end of the cooling pipe 1, and a water inlet pipe 2 communicated with the cooling pipe 1 is fixed at the right end of the cooling pipe 1;
the heat conducting ring 6 and the hollow ball 7 are both made of stainless steel;
specifically, when the cooling pipe 1 is wound on the high-power semiconductor device, the water inlet pipe 2 is positioned above the surface of the high-power semiconductor device, and the water outlet pipe 3 is positioned below the surface of the high-power semiconductor device, so that water can automatically flow downwards in the later period;
when the fan 14 works, cold water is injected into the water inlet pipe 2, the water can be guided into the cooling pipe 1 through the water inlet pipe 2, and the water in the cooling pipe 1 can absorb the heat on the surface of the high-power semiconductor device, so that the high-power semiconductor device achieves the effect of cooling;
because the cooling pipe 1 is internally provided with the plurality of heat conducting rings 6 and the hollow ball 7, water can penetrate through the through hole 8 on one side of the hollow ball 7 to enter the hollow ball 7 when flowing, and then is discharged through the through hole 8 on the other side of the hollow ball 7, water is always in the hollow ball 7, the heat on the hollow ball 7 can be quickly absorbed, the hollow ball 7 and the heat conducting rings 6 can increase the water retention time in the cooling pipe 1 besides heat conduction, so that the water can fully absorb the heat on a high-power semiconductor device, and the heat absorption maximization of the water is achieved;
the high-power semiconductor device can be cooled by using wind and water in the cooling pipe 1, so that the high-power semiconductor device is better in cooling effect.
Claims (6)
1. A cooling device for high power semiconductor devices, comprising a cooling tube (1), characterized in that:
a plurality of heat conduction rings (6) which are uniformly distributed are fixed inside the cooling pipe (1), hollow balls (7) are fixed inside the heat conduction rings (6), a plurality of through holes (8) are formed in the surfaces of the hollow balls (7), and the through holes (8) extend into the hollow balls (7);
cooling tube (1) top is equipped with tuber pipe (9), tuber pipe (9) upside butt fusion has a plurality of rather than communicating blast nozzle (11), just tuber pipe (9) right-hand member is the blind end, tuber pipe (9) left end is fixed with rather than communicating air-supply line (12), air-supply line (12) upper end is installed rather than communicating fan (14).
2. A cooling apparatus for a high power semiconductor device according to claim 1, wherein: the left end of the cooling pipe (1) is fixedly provided with a water outlet pipe (3) communicated with the cooling pipe, and the right end of the cooling pipe (1) is fixedly provided with a water inlet pipe (2) communicated with the cooling pipe.
3. A cooling apparatus for a high power semiconductor device according to claim 1, wherein: the left side and the right side of the air inlet pipe (12) are both fixed with fixing lugs (13).
4. A cooling apparatus for a high power semiconductor device according to claim 1, wherein: tuber pipe (9) external fixation has the solid fixed ring of a plurality of (10), gu fixed ring (10) and spout wind head (11) dislocation distribution, just gu fixed ring (10) bottom all is fixed with branch (5).
5. A cooling apparatus for high power semiconductor device according to claim 4, wherein: the cooling tube is characterized in that the surface of the supporting rod (5) is provided with two clamping grooves (15) which are distributed up and down, a plurality of clamping rings (4) which correspond to the supporting rod (5) one to one are fixed in front of the cooling tube (1), and the clamping rings (4) are connected to the clamping grooves (15) in a clamped mode.
6. A cooling apparatus for a high power semiconductor device according to claim 1, wherein: the heat conducting rings (6) and the hollow spheres (7) are both made of stainless steel, and the cooling pipes (1) and the air pipes (9) are both plastic hoses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021712433.7U CN212991084U (en) | 2020-08-17 | 2020-08-17 | Cooling device for high-power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021712433.7U CN212991084U (en) | 2020-08-17 | 2020-08-17 | Cooling device for high-power semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212991084U true CN212991084U (en) | 2021-04-16 |
Family
ID=75433312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021712433.7U Expired - Fee Related CN212991084U (en) | 2020-08-17 | 2020-08-17 | Cooling device for high-power semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212991084U (en) |
-
2020
- 2020-08-17 CN CN202021712433.7U patent/CN212991084U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210416 |