CN212983083U - Local electroplating device for SMD0.5 packaging shell - Google Patents
Local electroplating device for SMD0.5 packaging shell Download PDFInfo
- Publication number
- CN212983083U CN212983083U CN202021446513.2U CN202021446513U CN212983083U CN 212983083 U CN212983083 U CN 212983083U CN 202021446513 U CN202021446513 U CN 202021446513U CN 212983083 U CN212983083 U CN 212983083U
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- Prior art keywords
- fixedly connected
- plate
- screw rod
- extrusion screw
- porcelain plate
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- 238000009713 electroplating Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 238000001125 extrusion Methods 0.000 claims abstract description 28
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims 6
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a SMD0.5 packaging shell local electroplating device, including the porcelain plate, the big polar plate of lower extreme left side fixedly connected with of porcelain plate, the lower extreme right side fixedly connected with small electrode of porcelain plate, the fixed inside of pegging graft at the right side inserting groove of porcelain plate of upper end plug-in block of small electrode, the upper end fixedly connected with shielding glue film of plug-in block, the fixed frame of the upper end outside fixedly connected with of porcelain plate, the right side of fixed frame is pegged graft through the screw thread and is had the extrusion screw rod, the left side of extrusion screw rod is connected with the stripper plate through the bearing, open the inside of fixed frame and the left side of porcelain plate has fixed chamber. The utility model discloses a device is electroplated to SMD0.5 encapsulation shell part, through the overall structure of equipment, the positive and negative rotation of extrusion screw rod can drive displacement about the stripper plate to through the effect of bearing, can not rotate along with the extrusion screw rod rotates behind the stripper plate atress, can protect SMD0.5 encapsulation shell.
Description
Technical Field
The utility model relates to the technical field of electric power, specifically a SMD0.5 packaging shell local electroplating device.
Background
With the continuous progress of scientific technology, new processes and new materials are continuously emerging in industrial production, the electroplating technology in the production process of products is also changed day by day, common electroplating processes such as anodic oxidation, electrogalvanizing, chemical nickel plating, stainless steel passivation and electropolishing, chemical conversion coatings and the like are emerging, and special surface treatment processes such as secondary electroplating, local electroplating, composite electroplating, pulse electroplating, electroforming, mechanical plating, dacromet electroplating and the like are derived. The advent of these electroplating techniques has made products aesthetically pleasing and durable, and even more fully enhanced in performance. In surface treatment processes, plating and coating are often required for a pattern or the like to be partially or partially decorated on a part. The insulation protection of the non-processed part is an important process of the pretreatment. The quality of insulation protection will affect the quality of the plating layer and the product percent of pass, but when the ordinary SMD0.5 packaging shell is locally electroplated, the fixing device outside the SMD0.5 packaging shell is inconvenient to fix the shell and the shell is easy to damage, so the SMD0.5 packaging shell local electroplating device is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a SMD0.5 encapsulation shell local electroplating device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a SMD0.5 packaging casing local electroplating device, includes the porcelain plate, the big polar plate of lower extreme left side fixedly connected with of porcelain plate, the lower extreme right side fixedly connected with microelectrode of porcelain plate, the fixed inside of pegging graft in the right side inserting groove of porcelain plate in the upper end of microelectrode, the upper end fixedly connected with shielding glue film of pegging graft piece, the fixed frame of the upper end outside fixedly connected with of porcelain plate, the right side of fixed frame is pegged graft through the screw thread and is had the extrusion screw rod, the left side of extrusion screw rod is connected with the stripper plate through the bearing, fixed chamber has been opened in the inside of fixed frame and the left side of porcelain plate.
Preferably, the right end of the extrusion screw is fixedly connected with a manual rotating disc.
Preferably, the fixing frame is an insulating frame.
Preferably, the extrusion plate is movably inserted in the containing groove in the middle of the right end of the inner side wall of the fixed frame.
Preferably, the inner side wall of the fixed cavity is smooth and vertical.
Compared with the prior art, the beneficial effects of the utility model are that: this SMD0.5 encapsulation shell local electroplating device, overall structure through equipment, extrusion screw's positive and negative rotation can drive displacement about the stripper plate to through the effect of bearing, can not rotate along with extrusion screw rotates after the stripper plate atress, can protect SMD0.5 encapsulation shell.
Drawings
Fig. 1 is a sectional view of a SMD0.5 package housing local plating apparatus of the present invention.
In the figure: 1 porcelain plate, 2 fixed frames, 3 fixed cavities, 4 extrusion plates, 5 extrusion screws, 6 inserting grooves, 7 small electrodes, 8 shielding glue layers and 9 large polar plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a SMD0.5 encapsulation shell local electroplating device, includes porcelain plate 1, the big polar plate 9 of lower extreme left side fixedly connected with of porcelain plate 1, big polar plate 9 are the current conducting plate, the positive pole of power is connected, the lower extreme right side fixedly connected with microelectrode 7 of porcelain plate 1, microelectrode 7 are the current conducting plate, the negative pole of power is connected, the fixed inside of pegging graft at the right side inserting groove 6 of porcelain plate 1 of upper end grafting piece of microelectrode 7, the upper end fixedly connected with shielding glue film 8 of grafting piece, shielding glue film 8 can shield the part that SMD0.5 encapsulation shell need not to electroplate, the fixed frame 2 of upper end outside fixedly connected with of porcelain plate 1, fixed frame 2 is the insulating frame. The right side of the fixed frame 2 is inserted with an extrusion screw rod 5 through threads, the extrusion screw rod 5 rotates positively and negatively, the left and right displacement of the extrusion plate 4 can be driven, the extrusion plate 4 can not rotate along with the rotation of the extrusion screw rod 5 after being stressed under the action of a bearing, a manual turntable is fixedly connected to the right end of the extrusion screw rod 5, and the manual turntable facilitates the manual driving of the extrusion screw rod 5 to rotate. The left side of the extrusion screw rod 5 is connected with an extrusion plate 4 through a bearing, the left displacement of the extrusion plate 4 can extrude and fix an SMD0.5 packaging shell inserted in a fixed cavity, and the extrusion plate 4 is movably inserted in the middle of the right end of the inner side wall of the fixed frame 2. Fixed chamber 3 has been opened with the left side of porcelain plate 1 to the inside of fixed frame 2, the inside wall in fixed chamber 3 is smooth and vertical.
The principle is as follows: the pressing screw 5 is manually rotated so that the pressing plate 4 is displaced to the inside of the receiving groove, then the SMD0.5 package housing is placed inside the fixing chamber 3, and then the pressing plate 4 presses the SMD0.5 package housing by manually rotating the pressing screw 5.
It should be noted that, for the sake of simplicity, the foregoing embodiments are described as a series of combinations of acts, but it should be understood by those skilled in the art that the present invention is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that acts and modules referred to are not necessarily required by the invention.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the above-described division of the units is only one type of division of logical functions, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or communication connection may be an indirect coupling or communication connection between devices or units through some interfaces, and may be in a telecommunication or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The above embodiments are only used to illustrate the technical solution of the present invention, and do not limit the protection scope of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from these embodiments without any inventive step, are within the scope of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still make no creative work on the condition of conflict, and make mutual combination, addition and deletion, or other adjustments according to the features in the embodiments of the present invention, thereby obtaining other technical solutions which are different and do not depart from the concept of the present invention, and these technical solutions also belong to the scope to be protected by the present invention.
Claims (5)
1. The utility model provides a SMD0.5 encapsulation shell local electroplating device, includes porcelain plate (1), its characterized in that: the ceramic tile comprises a ceramic tile body (1), a large polar plate (9) fixedly connected to the left side of the lower end of the ceramic tile body (1), a small electrode (7) fixedly connected to the right side of the lower end of the ceramic tile body (1), an upper end inserting block of the small electrode (7) is fixedly inserted into a right side inserting groove (6) of the ceramic tile body (1), a shielding glue layer (8) fixedly connected to the upper end of the inserting block, a fixing frame (2) fixedly connected to the outer side of the upper end of the ceramic tile body (1), an extrusion screw rod (5) is inserted into the right side of the fixing frame (2) through threads, the left side of the extrusion screw rod (5) is connected with an extrusion plate (4) through a bearing, and a fixing cavity (3) is formed in the inner portion.
2. The SMD0.5 package housing partial plating apparatus of claim 1 wherein: the right end of the extrusion screw rod (5) is fixedly connected with a manual turntable.
3. The SMD0.5 package housing partial plating apparatus of claim 1 wherein: the fixing frame (2) is an insulating frame.
4. The SMD0.5 package housing partial plating apparatus of claim 1 wherein: the extrusion plate (4) is movably inserted in the containing groove at the middle part of the right end of the inner side wall of the fixed frame (2).
5. The SMD0.5 package housing partial plating apparatus of claim 1 wherein: the inner side wall of the fixed cavity (3) is smooth and vertical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021446513.2U CN212983083U (en) | 2020-07-21 | 2020-07-21 | Local electroplating device for SMD0.5 packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021446513.2U CN212983083U (en) | 2020-07-21 | 2020-07-21 | Local electroplating device for SMD0.5 packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212983083U true CN212983083U (en) | 2021-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021446513.2U Active CN212983083U (en) | 2020-07-21 | 2020-07-21 | Local electroplating device for SMD0.5 packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212983083U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059142A (en) * | 2021-11-22 | 2022-02-18 | 深圳市宏钢机械设备有限公司 | Hanger and local gold plating process |
-
2020
- 2020-07-21 CN CN202021446513.2U patent/CN212983083U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114059142A (en) * | 2021-11-22 | 2022-02-18 | 深圳市宏钢机械设备有限公司 | Hanger and local gold plating process |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |