CN212970575U

CN212970575U - Embedded MCU structure

Info

Publication number: CN212970575U
Application number: CN202021970200.7U
Authority: CN
Inventors: 叶钧戊; 李明正; 胡刚
Original assignee: Shenzhen Xinglei Technology Co ltd
Current assignee: Shenzhen Xinglei Technology Co ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-04-13
Anticipated expiration: 2030-09-10

Abstract

The utility model discloses an embedded MCU structure, including the epitheca, the top of epitheca has seted up the face groove, and the heating panel has been placed to the inboard of this face groove, the surface equidistance of heating panel has seted up a plurality of radiating grooves, the inner wall middle part of face groove still is fixed with the backup pad that is used for supporting the heating panel, the four corners department of heating panel has run through fixing bolt, fixing bolt's bottom runs through to extend to the inside of backup pad, the inside of face groove has still placed the filter screen, the filter screen is in the bottom of heating panel, the filter screen is porous network structure, link up on the bottom face of face groove and seted up the kerve; through heating panel, face groove and the kerve of design, change the epitheca of current sealed form into the form that link up, in use, the heat of inside miniature circuit board can obtain giving off, and the heat dissipation and the air flow of cooperation outside fan for holistic radiating efficiency is higher, and the filter screen of simultaneous design can avoid the entering of external dust.

Description

Embedded MCU structure

Technical Field

The utility model belongs to the technical field of the MCU, concretely relates to embedded MCU structure.

Background

The micro control unit, also called a single chip microcomputer or a single chip microcomputer, properly reduces the frequency and specification of a central processing unit, integrates peripheral interfaces such as a memory, a counter, a USB, an A/D conversion, a UART, a PLC, a DMA and the like, even an LCD driving circuit on a single chip to form a chip-level computer, and performs different combination control for different application occasions, wherein the embedded single chip microcomputer, namely an embedded microcontroller, refers to a special computer system which takes the microcontroller as a core control unit and is embedded into an object system, and is an embedded system structure with wide application.

The current MCU structure is when using, and self need carry out a large amount of calculations, and in the calculation, the MCU structure can produce great heat, and current MCU structure self does not have any radiating structure of carrying out, can only dispel the heat from the outside through outside fan structure, and not only the radiating efficiency is low, and the energy consumption of fan is great simultaneously, has great limitation in the in-service use, has the space that can improve.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an embedded MCU structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an embedded MCU structure, includes the epitheca, a groove has been seted up at the top of epitheca, and the heating panel has been placed to the inboard in this groove, a plurality of radiating grooves have been seted up to the surface equidistance of heating panel, the inner wall middle part in face groove still is fixed with the backup pad that is used for supporting the heating panel, fixing bolt has been run through in the four corners department of heating panel, fixing bolt's bottom is run through the inside that extends to the backup pad.

Preferably, a filter screen is further placed in the face groove and located at the bottom of the heat dissipation plate, the filter screen is of a porous net structure, and a bottom groove is formed in the bottom end face of the face groove in a penetrating mode.

Preferably, the bottom of the upper shell is provided with a lower shell symmetrical to the upper shell, an angle groove is formed in the edge of the upper shell and the edge of the lower shell, a plurality of pins are arranged on the outer sides of the upper shell and the pins, and the top ends of the pins are embedded into the angle groove.

Preferably, the limiting column is fixed at the edge of the bottom end of the upper shell and on the inner side of the corner groove, and a through hole for the limiting column to penetrate through is formed in the top end face of the pin.

Preferably, a micro circuit board is arranged inside the upper shell and the pins, and the micro circuit board is connected with external equipment through the pins.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the upper shell of the existing sealing shape is changed into a through shape through the designed heat dissipation plate, the surface groove and the bottom groove, so that in use, the heat of the internal miniature circuit board can be dissipated, and the heat dissipation efficiency of the whole body is higher by matching with the heat dissipation of an external fan and the air flow;

2. through the spacing post of design, can conveniently fix in the installation pin, avoid in the maintenance dismantlement of later stage, because of stir the pin cause and upper and lower casing between not hard up, guarantee the stability of connecting.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a sectional view of the upper case of the present invention;

FIG. 3 is an enlarged schematic view of region A of FIG. 2 according to the present invention;

fig. 4 is a schematic view of the installation of the pin of the present invention;

in the figure: 1. an upper shell; 2. a pin; 3. a heat sink; 4. a heat dissipation plate; 5. a filter screen; 6. fixing the bolt; 7. a bottom groove; 8. a support plate; 9. a lower case; 10. an angular groove; 11. a limiting column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1 to 3, the present invention provides a technical solution: an embedded MCU structure comprises an upper shell 1, the top of the upper shell 1 is provided with a face groove, a heat dissipation plate 4 is placed on the inner side of the face groove, the surface of the heat dissipation plate 4 is equidistantly provided with a plurality of heat dissipation grooves 3, the middle part of the inner wall of the face groove is also fixed with a support plate 8 for supporting the heat dissipation plate 4, fixing bolts 6 penetrate through the four corners of the heat dissipation plate 4, the bottom ends of the fixing bolts 6 penetrate and extend to the inside of the support plate 8, the upper shell 1 in the existing sealing state is changed into the penetrating state through the designed heat dissipation plate 4, the face groove and the bottom groove 7, in use, the heat of an internal miniature circuit board can be dissipated, the heat dissipation and the air flow of an external fan are matched, the integral heat dissipation efficiency is higher, the filter screen 5 is designed at the same time, the external dust can be prevented from entering, the filter screen 5 is also placed, the filter screen 5 is a porous net structure, and a bottom groove 7 is arranged on the bottom end surface of the surface groove in a penetrating way.

In this embodiment, preferably, the bottom of the upper casing 1 is provided with a lower casing 9 symmetrical to the bottom, an angular groove 10 is provided at the edge of the upper casing 1 and the lower casing 9, the outer sides of the upper casing 1 and the pins 2 are provided with a plurality of pins 2, and the top ends of the pins 2 are embedded into the angular groove 10.

In this embodiment, preferably, a micro circuit board is disposed inside the upper case 1 and the pins 2, and the micro circuit board is connected to an external device through the pins 2.

Example 2

Referring to fig. 1 to 4, the present invention provides a technical solution: an embedded MCU structure comprises an upper shell 1, the top of the upper shell 1 is provided with a face groove, a heat dissipation plate 4 is placed on the inner side of the face groove, the surface of the heat dissipation plate 4 is equidistantly provided with a plurality of heat dissipation grooves 3, the middle part of the inner wall of the face groove is also fixed with a support plate 8 for supporting the heat dissipation plate 4, fixing bolts 6 penetrate through the four corners of the heat dissipation plate 4, the bottom ends of the fixing bolts 6 penetrate and extend to the inside of the support plate 8, the upper shell 1 in the existing sealing state is changed into the penetrating state through the designed heat dissipation plate 4, the face groove and the bottom groove 7, in use, the heat of an internal miniature circuit board can be dissipated, the heat dissipation and the air flow of an external fan are matched, the integral heat dissipation efficiency is higher, the filter screen 5 is designed at the same time, the external dust can be prevented from entering, the filter screen 5 is also placed, the filter screen 5 is a porous net structure, and a bottom groove 7 is arranged on the bottom end surface of the surface groove in a penetrating way.

In this embodiment, it is preferred, the bottom edge of epitheca 1 just is fixed with spacing post 11 in the inboard of corner groove 10, through the spacing post 11 of design, can be in installation pin 2, conveniently fix, avoid in the maintenance dismantlement in later stage, because of stir pin 2 cause and upper and lower casing between not hard up, guarantee the stability of connecting, offer the through-hole that supplies spacing post 11 to run through on the top face of pin 2.

The utility model discloses a theory of operation and use flow: when the utility model is used, the filter screen 5 is firstly placed in the face groove, then the heat dissipation plate 4 is placed in the face groove, at the moment, the heat dissipation plate 4 is jointed with the filter screen 5, meanwhile, the bottom end surface of the heat dissipation plate 4 is placed on the surface of the supporting plate 8, then the fixing bolt 6 penetrates through the heat dissipation plate 4 and the supporting plate 8, so as to fix the heat dissipation plate 4, then the top end of the pin 2 is placed in the corner groove 10 at the top of the lower shell 9, then the upper shell 1 is covered at the top of the lower shell 9, in the covering process, the limiting column 11 penetrates through the hole formed at the top of the pin 2, so as to limit the position of the pin 2, when the upper shell 1 and the lower shell 9 are closed, the fixing and limiting of the pin 2 are completed, then the pin 2 is welded on electronic elements such as external circuit boards in a soldering mode, in use, the miniature circuit board in the upper shell 1 and the lower, at this time, the heat can flow into the filter screen 5 through the bottom groove 7, pass through the filter screen 5, and be discharged from the heat dissipation groove 3 on the surface of the heat dissipation plate 4, and the heat dissipation efficiency can be improved by matching with the heat dissipation of an external fan.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An embedded MCU structure, includes epitheca (1), its characterized in that: a groove has been seted up at the top of epitheca (1), and heating panel (4) have been placed to the inboard in this groove, a plurality of radiating grooves (3) have been seted up to the surface equidistance of heating panel (4), the inner wall middle part in groove still is fixed with backup pad (8) that are used for supporting heating panel (4), fixing bolt (6) have been run through in the four corners department of heating panel (4), the inside that extends to backup pad (8) is run through to the bottom of fixing bolt (6).

2. An embedded MCU structure according to claim 1, wherein: the novel heat dissipation plate is characterized in that a filter screen (5) is further placed in the face groove, the filter screen (5) is located at the bottom of the heat dissipation plate (4), the filter screen (5) is of a porous net structure, and a bottom groove (7) is formed in the bottom end face of the face groove in a penetrating mode.

3. An embedded MCU structure according to claim 1, wherein: the bottom of epitheca (1) is provided with inferior valve (9) of symmetry with it, angle groove (10) have been seted up with the edge of inferior valve (9) to epitheca (1), the outside of epitheca (1) and pin (2) is provided with a plurality of pins (2), the inside of angle groove (10) is embedded into on the top of pin (2).

4. An embedded MCU structure according to claim 3, wherein: the inner side of the bottom end edge of the upper shell (1) and the inner side of the corner groove (10) are fixed with limiting columns (11), and through holes for the limiting columns (11) to penetrate through are formed in the top end face of the pins (2).

5. An embedded MCU structure according to claim 1, wherein: the miniature circuit board is arranged inside the upper shell (1) and the pins (2) and connected with external equipment through the pins (2).