CN212966054U

CN212966054U - High-efficient radiating MCU module

Info

Publication number: CN212966054U
Application number: CN202021968938.XU
Authority: CN
Inventors: 叶钧戊; 李明正; 胡刚
Original assignee: Shenzhen Xinglei Technology Co ltd
Current assignee: Shenzhen Xinglei Technology Co ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-04-13
Anticipated expiration: 2030-09-10

Abstract

The utility model discloses a high-efficient radiating MCU module, comprising a main body, the outside of main part is provided with a plurality of connectors all around equidistantly, the top edge of main part is provided with the top edge groove, the outside block of top edge groove is provided with the protective cover, the inboard surface of protective cover is provided with a pair of second protruding card strip, the main part bottom edge in the utility model designs the bottom edge groove, and has designed the support heat dissipation cover outside the bottom edge groove, and the support heat dissipation cover is connected with the splice groove block through the inboard concatenation arch, makes the heat on the main part can transmit to the support heat dissipation cover and give off, and the opening all around of support heat dissipation cover bottom can guarantee the circulation of air, guarantees good heat dispersion; the upper edge groove is designed at the top of the main body, and the protective cover is clamped outside the upper edge groove to protect the module when the portable electric water heater is carried.

Description

High-efficient radiating MCU module

Technical Field

The utility model belongs to the technical field of the MCU module, concretely relates to high-efficient radiating MCU module.

Background

The MCU module is also called a micro control unit, namely a commonly called single chip microcomputer. The MCU is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a counter, a USB, A/D conversion, UART and the like on a silicon chip by adopting a super-large scale integrated circuit technology, and can provide different controls in different application occasions. The MCU plays the role of a processor and a main controller in the field of wireless modules.

When the existing MCU module runs for a long time and works, the heat dissipation effect is poor, the existing MCU module is inconvenient to carry, and the connector is easy to damage.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient radiating MCU module to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient radiating MCU module, includes the main part, the outside of main part equidistance all around is provided with a plurality of connectors, the top edge of main part is provided with the top edge groove, the outside block in top edge groove is provided with the protective cover, the internal side surface of protective cover is provided with the protruding card strip of a pair of second, the both sides in top edge groove are provided with first protruding card strip with the protruding card strip staggered position department of second, the bottom of main part is provided with the bottom edge groove, the outside in bottom edge groove is provided with the support heat dissipation cover, the internal side surface equidistance of support heat dissipation cover is provided with a plurality of concatenation archs, the surface in bottom edge groove has the protruding department of correspondence of concatenation to be provided with the splice groove, the concatenation arch extends to splice groove joint.

Preferably, the outer edges of the first protruding clamping strip and the second protruding clamping strip are both arc-shaped structures.

Preferably, the supporting heat dissipation sleeve and the splicing protrusion are of an integrated structure, and the shape and the size of the splicing protrusion are consistent with those of the splicing groove.

Preferably, the edges of the lower end of the peripheral surface of the supporting heat dissipation sleeve are provided with communicating openings.

Preferably, the shape and size of the inside of the protective cover are matched with the shape and size of the module appearance.

Compared with the prior art, the beneficial effects of the utility model are that: the lower edge groove is designed on the edge of the bottom of the main body in the utility model, the supporting heat dissipation sleeve is designed outside the lower edge groove and is clamped and connected with the splicing groove through the splicing bulge at the inner side, so that the heat on the main body can be transferred to the supporting heat dissipation sleeve for dissipation, and the openings around the bottom of the supporting heat dissipation sleeve can ensure the circulation of air and good heat dissipation performance; the upper edge groove is designed at the top of the main body, and the protective cover is clamped outside the upper edge groove to protect the module when the portable electric water heater is carried.

Drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a front sectional view of the present invention;

fig. 3 is a schematic bottom view of the present invention;

in the figure: 1. a main body; 2. an upper edge groove; 3. a connector; 4. a first raised clamping strip; 5. a second raised clamping strip; 6. a protective cover; 7. supporting the heat dissipation sleeve; 8. splicing grooves; 9. splicing the bulges; 10. a lower edge groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1 to 3, the present invention provides a technical solution: an MCU module with high-efficiency heat dissipation comprises a main body 1, a plurality of connectors 3 are equidistantly arranged on the periphery of the outer side of the main body 1, an upper edge groove 2 is arranged on the edge of the top of the main body 1, a protective cover 6 is clamped on the outer side of the upper edge groove 2, in order to play a role of protection, the inner side surface of the protective cover 6 is provided with a pair of second protruding clamping strips 5, the positions of the two sides of the upper edge groove 2, which are staggered with the second protruding clamping strips 5, are provided with first protruding clamping strips 4, the bottom of the main body 1 is provided with a lower edge groove 10, the outer side of the lower edge groove 10 is provided with a supporting heat dissipation sleeve 7, for the convenience of heat dissipation, the inner side surface of the supporting heat dissipation sleeve 7 is provided with a plurality of splicing protrusions 9 at equal intervals, the surface of the lower edge groove 10 is provided with splicing grooves 8 at the positions corresponding to the splicing protrusions 9, the splicing protrusions 9 extend into the splicing grooves 8 and are connected in a clamping mode, and the mounting and the dismounting are convenient and flexible.

In this embodiment, preferably, the outer edges of the first protruding clamping strip 4 and the second protruding clamping strip 5 are both arc-shaped structures, so as to facilitate engagement and disengagement.

In this embodiment, preferably, the supporting heat dissipation sleeve 7 and the splicing protrusion 9 are of an integral structure, and the shape and size of the splicing protrusion 9 and the shape and size of the splicing groove 8 are consistent, so as to ensure firm clamping.

In this embodiment, preferably, the lower end edges of the peripheral surfaces of the supporting heat dissipation sleeve 7 are provided with communication openings. In order to ensure the circulation of air, the heat dissipation efficiency is ensured.

In this embodiment, the inside shape and size of the protecting cover 6 is preferably matched with the module appearance shape and size, so as to ensure a good protecting effect.

The utility model discloses a theory of operation and use flow: a supporting heat dissipation sleeve 7 is arranged outside a lower edge groove 10 at the bottom of the main body 1, the supporting heat dissipation sleeve 7 is connected with a splicing groove 8 in a clamping manner through a splicing bulge 9 on the inner side, so that heat on the main body 1 can be transferred to the supporting heat dissipation sleeve 7 to be dissipated, and the openings on the periphery of the bottom of the supporting heat dissipation sleeve 7 can ensure air circulation and good heat dissipation performance; the protection cover 6 is designed on the outer side of the upper edge groove 2 at the top of the main body 1 in a clamping mode, and the module is protected when the portable multifunctional portable computer is carried.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-efficient radiating MCU module, includes main part (1), its characterized in that: a plurality of connectors (3) are arranged on the periphery of the outer side of the main body (1) at equal intervals, an upper edge groove (2) is arranged at the top edge of the main body (1), a protective cover (6) is clamped at the outer side of the upper edge groove (2), the inner side surface of the protective cover (6) is provided with a pair of second raised clamping strips (5), the two sides of the upper edge groove (2) and the staggered position of the second convex clamping strip (5) are provided with a first convex clamping strip (4), a lower edge groove (10) is arranged at the bottom of the main body (1), a supporting heat dissipation sleeve (7) is arranged on the outer side of the lower edge groove (10), a plurality of splicing bulges (9) are arranged on the inner side surface of the supporting heat dissipation sleeve (7) at equal intervals, the surface of the lower edge groove (10) is provided with a splicing groove (8) at the corresponding position of the splicing bulge (9), the splicing bulges (9) extend into the splicing grooves (8) for splicing connection.

2. The MCU module of claim 1, wherein: the outer side edges of the first protruding clamping strip (4) and the second protruding clamping strip (5) are both arc-shaped structures.

3. The MCU module of claim 1, wherein: the supporting heat dissipation sleeve (7) and the splicing protrusion (9) are of an integrated structure, and the shape and the size of the splicing protrusion (9) are consistent with those of the splicing groove (8).

4. The MCU module of claim 1, wherein: the lower end edges of the peripheral surface of the supporting heat dissipation sleeve (7) are provided with communicated openings.

5. The MCU module of claim 1, wherein: the shape and size of the inside of the protective cover (6) are matched with the shape and size of the module appearance.