CN212966037U - Wall-mounted mainframe box - Google Patents
Wall-mounted mainframe box Download PDFInfo
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- CN212966037U CN212966037U CN202022448400.2U CN202022448400U CN212966037U CN 212966037 U CN212966037 U CN 212966037U CN 202022448400 U CN202022448400 U CN 202022448400U CN 212966037 U CN212966037 U CN 212966037U
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- box
- air
- cooling
- mainframe box
- heat dissipation
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Abstract
The utility model discloses a wall-mounted mainframe box, which comprises a mainframe box, wherein mainframe equipment is arranged in the mainframe box, a partition plate is arranged in the mainframe box, the partition plate divides the mainframe box into an upper case and a lower case, a cooling device is arranged in the lower case, the mainframe equipment is arranged in the upper case, the cooling device is connected with an air distribution device arranged above the partition plate, and an exhaust fan is arranged above the mainframe box; the utility model discloses a cooling device's setting can be so that the host computer equipment in the mainframe box obtains fine cooling to improve host computer equipment's working property, through the setting of air discharge fan, accelerated the air flow on host computer equipment surface, make host computer equipment obtain fine cooling.
Description
Technical Field
The utility model relates to a computer equipment technical field, concretely relates to wall-hanging mainframe box.
Background
With the development of science and technology, computers are widely used due to small size, high flexibility, low price and convenient use, and include various types such as desktop computers, notebook computers, tablet computers and industrial computers, taking industrial computers as examples, hardware devices of industrial computers include host equipment and display devices connected with the host equipment, and the like, and on one hand, the hardware devices are used for sending detection data of industrial production processes into the computers for processing; on the other hand, commands and information for controlling the production process are converted into control variable signals of an industrial control object by a computer, and then the control variable signals are sent to a controller of the industrial control object, and the controller controls the operation of the production equipment; during the use process of industrial computers and other computers, the host equipment can be hung on a wall to be used under the influence of use environments and use conditions, and therefore a wall-mounted host is formed.
However, the central processing unit and other components of the host device of the computer generate heat during high-speed operation, and if the heat dissipation control of the computer is not reasonable, the service life of computer hardware is affected, computer hardware faults are easy to occur, and meanwhile, the operation speed of the computer is reduced, and the performance is weakened. The heat dissipation of the host equipment of the existing computer is mostly carried out by adopting a direct heat dissipation mode of the heat dissipation holes, the heat dissipation efficiency is low, and the problems that the host equipment is over-temperature, the service life of the host equipment is influenced, or hardware faults are caused, the performance is weakened and the like are possibly caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a wall-hanging mainframe box can carry out fine heat dissipation to the host computer equipment to the performance of host computer equipment has been improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a wall-hanging mainframe box, includes the mainframe box, be provided with the host computer equipment in the mainframe box, be provided with the baffle in the mainframe box, the baffle divide into quick-witted case and lower quick-witted case with the mainframe box, the quick-witted incasement that is provided with cooling device down, the host computer equipment sets up at last quick-witted incasement, cooling device is connected with the cloth wind device that sets up in the baffle top, the mainframe box top is provided with the air discharge fan.
As a preferred technical solution of the present invention: a longitudinal first partition plate is arranged in the lower case, the lower case is divided into a cooling chamber and a heat dissipation chamber by the first partition plate, the cooling device comprises a cooling air box and a heat dissipation air box, the cooling air box is arranged in the cooling chamber, an air inlet fan is arranged at the front end of the cooling air box, an air outlet is arranged at the rear end of the cooling air box, and an air inlet is arranged on a lower case body in front of the air inlet fan; the cooling air box is internally provided with a plurality of semiconductor refrigeration pieces, the cold ends of the semiconductor refrigeration pieces are arranged in the cooling air box, and the hot ends of the semiconductor refrigeration pieces are arranged in the heat dissipation air box.
As a preferred technical solution of the present invention: and a condensed water collecting device is arranged at the lower end of the cooling air box.
As a preferred technical solution of the present invention: one side of heat dissipation bellows is provided with the air inlet, the opposite side of heat dissipation bellows is provided with first exhaust fan.
As a preferred technical solution of the present invention: the air distribution device comprises a main pipe and a plurality of air outlet pipes, the main pipe is connected with the air outlet of the cooling air box, and the main pipe is connected with the plurality of air outlet pipes; the air outlet pipes are arranged on the partition board, and a plurality of air outlet holes are formed in the upper ends of the air outlet pipes.
As a preferred technical solution of the present invention: the main pipe is connected with the cooling air box through a connecting pipe, and the connecting pipe is arc-shaped.
The utility model discloses following beneficial effect has:
1. through the setting of cooling device, can make the host computer equipment in the mainframe box obtain fine cooling to improve the working property of host computer equipment, through the setting of air discharge fan, accelerated the air flow on host computer equipment surface, make the host computer equipment obtain fine cooling.
2. The air distribution device is arranged, so that cold air blown to the host equipment is more uniform, and the heat dissipation effect is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the cooling apparatus;
FIG. 3 is a schematic view of the internal structure of the cooling apparatus;
in fig. 1-3, 1, a main cabinet, 2, a main device, 3, a partition board, 4, an upper cabinet, 5, a lower cabinet, 6, an exhaust fan, 7, a first partition board, 8, a cooling chamber, 10, an air inlet, 11, a semiconductor refrigeration sheet, 12, a cooling air box, 13, an air inlet fan, 14, a connecting pipe, 15, a heat dissipation air box, 16, a condensate water collecting device, 17, an air inlet, 18, a first exhaust fan, 19, a main pipe, 20, an air outlet pipe, 21, an air outlet, 22, a water outlet pipe, 23, a first air inlet, 24, and an air outlet.
Detailed Description
In order to make the objects and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the embodiment of the utility model provides a wall-hanging mainframe box 1, including mainframe box 1, it has the cabinet door to articulate on the mainframe box 1, be provided with host computer equipment 2 in the mainframe box 1, be provided with baffle 3 in the mainframe box 1, baffle 3 divide into mainframe box 1 and lower quick-witted case 4 and lower quick-witted case 5, be provided with cooling device in the quick-witted case 5 down, host computer equipment 2 sets up in last machine case 4, cooling device is connected with the cloth wind device that sets up in baffle 3 top, mainframe box 1 top is provided with air discharge fan 6, cooling device sends cold wind into in the machine case 4 through the cloth wind device, make the interior host computer equipment 2 cooling of last machine case 4, the flow of the interior air of machine case 4 has been accelerated in the setting of air discharge fan 6, the cooling of host computer equipment 2 in the machine case 4.
A longitudinal first partition plate 7 is arranged in the lower case 5, the lower case 5 is divided into a cooling chamber 8 and a heat dissipation chamber 9 by the first partition plate 7, the first partition plate 7 is made of a material with low heat conductivity, the heat dissipation chamber 9 can be prevented from influencing the temperature in the cooling chamber 8, the cooling device comprises a cooling air box 12, the cooling air box is arranged in the cooling chamber 8, an air inlet fan 13 is arranged at the front end of the cooling air box 12, an air outlet 24 is arranged at the rear end of the cooling air box, an air inlet 10 is arranged on the lower case 5 in front of the air inlet fan 13, the air inlet 10 consists of a plurality of air inlet holes, a filter screen or a dehumidifying device can be arranged on the inner side of the air inlet 10 according to needs, for example, an activated carbon layer is arranged on the side of the lower case 5 and used for drying the air entering the cooling; a plurality of semiconductor refrigerating sheets 11 are arranged in the cooling air box 12, the cold ends of the semiconductor refrigerating sheets 11 are arranged in the cooling air box 12, and the hot ends of the semiconductor refrigerating sheets 11 are arranged in the heat dissipation air box 15; a condensed water collecting device 16 is arranged at the lower end of the cooling air box 12, the condensed water collecting device 16 is positioned below the cold end of the semiconductor refrigeration sheet 11, a water outlet pipe 22 is arranged on the side surface of the condensed water collecting device 16 and used for discharging condensed water outwards, and a water receiving device can be arranged at the water outlet pipe according to the actual situation on site if water cannot be directly discharged; an air inlet 17 is arranged on one side of the heat dissipation air box 15, a first air inlet 23 corresponding to the air inlet 17 is arranged on the lower box body 5, the first air inlet is also composed of a plurality of air inlet holes, a first exhaust fan 18 is arranged on the other side of the heat dissipation air box 15, the first exhaust fan 18 enables air to continuously enter the heat dissipation air box 15 from the air inlet 17, and therefore heat dissipation of the hot end of the semiconductor refrigerating sheet 11 is accelerated, in order to enable the heat dissipation air box 15 to be as large as possible and convenient to dissipate heat, and meanwhile, manufacturing cost is saved, the heat dissipation chamber 9 is used as the heat dissipation air box 15, and the air inlet 17 and the first exhaust fan 18 are directly arranged on two sides of the lower; outside air is sucked into the cooling air box 12 through the air inlet fan 13, and when the air passes through the cold end of the semiconductor refrigeration sheet 11 in the cooling air box 12, the air is condensed and dried, enters the upper machine box 4 through the air distribution device, and is cooled for the host machine equipment 2.
The air distribution device comprises a main pipe 19 and a plurality of air outlet pipes 20, the main pipe 19 is connected with an air outlet 24 of the cooling air box 12, and the main pipe 19 is connected with the plurality of air outlet pipes 20; a plurality of air outlet pipes 20 are arranged on the partition plate 3, and a plurality of air outlet holes 21 are formed in the upper ends of the air outlet pipes 20; the main pipe 19 is connected with the cooling air box 12 through the connecting pipe 14, the connecting pipe 14 is arc-shaped, and the arrangement of the air outlet pipes 20 is beneficial to uniformly blowing cold air to the host machine device 2, so that the heat dissipation effect is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. The utility model provides a wall-hanging mainframe box, includes the mainframe box, be provided with host computer equipment in the mainframe box, its characterized in that: the improved air distribution device is characterized in that a partition plate is arranged in the mainframe box, the partition plate divides the mainframe box into an upper case and a lower case, a cooling device is arranged in the lower case, mainframe equipment is arranged in the upper case, the cooling device is connected with an air distribution device arranged above the partition plate, and an exhaust fan is arranged above the mainframe box.
2. A wall mountable master cabinet according to claim 1, wherein: a longitudinal first partition plate is arranged in the lower case, the lower case is divided into a cooling chamber and a heat dissipation chamber by the first partition plate, the cooling device comprises a cooling air box and a heat dissipation air box, the cooling air box is arranged in the cooling chamber, an air inlet fan is arranged at the front end of the cooling air box, an air outlet is arranged at the rear end of the cooling air box, and an air inlet is arranged on a lower case body in front of the air inlet fan; the cooling air box is internally provided with a plurality of semiconductor refrigeration pieces, the cold ends of the semiconductor refrigeration pieces are arranged in the cooling air box, and the hot ends of the semiconductor refrigeration pieces are arranged in the heat dissipation air box.
3. A wall mountable main cabinet according to claim 2, wherein: and a condensed water collecting device is arranged at the lower end of the cooling air box.
4. A wall mountable main cabinet according to claim 2, wherein: one side of heat dissipation bellows is provided with the air inlet, the opposite side of heat dissipation bellows is provided with first exhaust fan.
5. A wall mountable master cabinet according to claim 1, wherein: the air distribution device comprises a main pipe and a plurality of air outlet pipes, the main pipe is connected with the air outlet of the cooling air box, and the main pipe is connected with the plurality of air outlet pipes; the air outlet pipes are arranged on the partition board, and a plurality of air outlet holes are formed in the upper ends of the air outlet pipes.
6. A wall mountable master cabinet according to claim 5, wherein: the main pipe is connected with the cooling air box through a connecting pipe, and the connecting pipe is arc-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022448400.2U CN212966037U (en) | 2020-10-29 | 2020-10-29 | Wall-mounted mainframe box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022448400.2U CN212966037U (en) | 2020-10-29 | 2020-10-29 | Wall-mounted mainframe box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212966037U true CN212966037U (en) | 2021-04-13 |
Family
ID=75372991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022448400.2U Active CN212966037U (en) | 2020-10-29 | 2020-10-29 | Wall-mounted mainframe box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212966037U (en) |
-
2020
- 2020-10-29 CN CN202022448400.2U patent/CN212966037U/en active Active
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