CN212947275U - Centering installation device for silicon wafer chamfering grinding wheel - Google Patents
Centering installation device for silicon wafer chamfering grinding wheel Download PDFInfo
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- CN212947275U CN212947275U CN202021925613.3U CN202021925613U CN212947275U CN 212947275 U CN212947275 U CN 212947275U CN 202021925613 U CN202021925613 U CN 202021925613U CN 212947275 U CN212947275 U CN 212947275U
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- silicon wafer
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- shaft sleeve
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Abstract
The utility model provides a centering installation device for silicon wafer chamfering grinding wheels, which comprises a main shaft, a flange shaft sleeve coaxially sleeved on the main shaft and a grinding wheel coaxially sleeved on the flange shaft sleeve, wherein the grinding wheel and the flange shaft sleeve are installed in a wedge-shaped matching manner; through set up interior wedge face on the emery wheel hole, the cooperation sets up outer wedge face on the axle journal of flange axle sleeve, makes and is connected through wedge fit mode between emery wheel and the flange axle sleeve to guarantee the complete centering installation of emery wheel, ensure the installation accuracy, and can cooperate the dismantlement screw to carry out quick ejecting dismantlement, solved the convenient but inaccurate technical problem of installation centering of dismantlement that exists among the prior art.
Description
Technical Field
The utility model relates to a silicon chip chamfer device field, concretely relates to centering installation device of silicon chip chamfer emery wheel.
Background
The silicon wafer chamfering is to grind the sharp edge of the silicon wafer which is cut by a plurality of lines by an electric plating diamond grinding wheel and trim the sharp edge into a specified shape, so as to achieve the effect of blunt rounding and smoothness. The method mainly aims to eliminate stress concentration at the edge of the silicon wafer and prevent the edge of the silicon wafer from cracking, edge breakage, lattice defects and the like in the subsequent processing process of the silicon wafer.
The Chinese utility model patent with application number CN200820132834.8 discloses a high-pressure high-precision energy-saving dynamic and static pressure bearing of a numerical control crankshaft grinder, which mainly comprises a grinding wheel frame body, a main shaft, a front bearing, a rear bearing and a lubricating system; the main shaft is arranged on the grinding wheel frame body in a penetrating mode, the front end of the main shaft is provided with a grinding wheel assembly consisting of a compression nut, a gasket, a grinding wheel flange plate, a grinding wheel gland and a grinding wheel, and the main shaft is connected with the grinding wheel flange plate of the grinding wheel assembly.
However, in the conventional chamfering machine, the flange shaft sleeve and the inner hole of the grinding wheel are mounted through clearance fit in consideration of convenience in disassembly and assembly of the grinding wheel, and the clearance is generally controlled to be 0.015-0.02mm or even larger. However, in this matching manner, after the silicon wafer is fixed, the silicon wafer still has eccentricity with a certain gap, so that the microscopic distance between the edge of the silicon wafer and the grinding wheel groove is inconsistent, the abrasion of the grinding wheel groove is not uniform, and the service life of the grinding wheel and the quality of the edge of the silicon wafer are finally affected.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a centering installation device of silicon chip chamfer emery wheel, through set up interior wedge face on the emery wheel hole, the cooperation sets up outer wedge face on the axle journal of flange axle sleeve, makes and is connected through the wedge fit mode between emery wheel and the flange axle sleeve to guarantee the complete centering installation of emery wheel, ensure the installation accuracy, and can cooperate the dismantlement screw to carry out quick ejecting dismantlement, but solved the convenient inaccurate technical problem of installation centering of dismantlement that exists among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme:
the centering and mounting device for the silicon wafer chamfering grinding wheel comprises a main shaft, a flange shaft sleeve coaxially sleeved on the main shaft and the grinding wheel coaxially sleeved on the flange shaft sleeve, wherein the grinding wheel and the flange shaft sleeve are mounted in a wedge-shaped matching mode.
Preferably, a first inner hole penetrates through the axis of the grinding wheel, the lower part of the first inner hole is an inner wedge-shaped surface, and the upper part of the shaft neck of the flange shaft sleeve is an outer wedge-shaped surface which is matched with the inner wedge-shaped surface.
Preferably, the taper of the inner wedge surface and the taper of the outer wedge surface are both 1: 5.
preferably, the grinding wheel further comprises a locking screw, an internal threaded hole is formed in the output end of the spindle in an inward coaxial mode, the locking screw penetrates through the first inner hole from top to bottom and is installed in the internal threaded hole in a threaded fit mode, and the grinding wheel is fixed.
Preferably, a gasket is further arranged between the grinding wheel and the locking screw.
Preferably, the axle center of the flange shaft sleeve is provided with a second inner hole for installing the output end of the main shaft in an interference fit manner in a penetrating manner.
Preferably, the end cover is coaxially sleeved on the main shaft, and the end cover is in threaded fit connection with the flange shaft sleeve.
Preferably, the cross section of the grinding wheel is of a T-shaped structure and comprises a grinding wheel disc and an upper boss which is coaxial with the grinding wheel disc and is integrally formed, and the first inner hole penetrates through the upper boss and the grinding wheel disc from top to bottom in sequence.
Preferably, the grinding wheel further comprises a dismounting screw, the upper portion of the first inner hole is provided with an inner threaded surface, and the dismounting screw can be connected with the inner threaded surface in a threaded mode and then rotates downwards to abut against the flange shaft sleeve so as to dismount the grinding wheel.
The beneficial effects of the utility model reside in that:
(1) the utility model optimizes the structure of the grinding wheel, the lower part of the inner hole of the grinding wheel is provided with the inner wedge surface, the outer wedge surface is arranged on the shaft neck of the flange shaft sleeve in a matching way, so that the grinding wheel is connected with the flange shaft sleeve in a wedge matching way, and the locking screw is used for fixing in a matching way, thereby ensuring the complete centering installation of the grinding wheel, ensuring the installation precision and stability, and further ensuring the processing quality of silicon wafers and the service life of the grinding wheel;
(2) the utility model discloses a set up the internal thread face on emery wheel hole upper portion to correspond the configuration and dismantle the screw, be connected the back lapse through dismantling the screw with the internal thread face, and then can be with the quick ejecting outer wedge face of emery wheel, the dismouting of being convenient for reduces the operation degree of difficulty and intensity of labour.
To sum up, the utility model has the advantages of emery wheel centering installation accuracy is high, easy dismounting especially are applicable to silicon chip chamfer device field.
Drawings
FIG. 1 is a front sectional view of the grinding wheel according to the present invention;
FIG. 2 is a schematic front sectional view of the grinding wheel structure of the present invention;
FIG. 3 is a schematic front sectional view of the flange sleeve of the present invention;
fig. 4 is a front sectional view of the grinding wheel in a disassembled state.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Example one
As shown in fig. 1, the centering and mounting device for the silicon wafer chamfering grinding wheel comprises a main shaft 1, a flange shaft sleeve 2 coaxially sleeved on the main shaft 1, and a grinding wheel 3 coaxially sleeved on the flange shaft sleeve 2, wherein the grinding wheel 3 and the flange shaft sleeve 2 are mounted in a wedge-shaped matching manner.
Preferably, as shown in fig. 2 to 3, a first inner hole 31 is formed through an axial center of the grinding wheel 3, a lower portion of the first inner hole 31 is provided with an inner wedge surface 301, and an upper portion of a journal of the flange shaft sleeve 2 is provided with an outer wedge surface 201 fitted with the inner wedge surface 301.
In this embodiment, the inner wedge surface 301 is arranged on the lower portion of the inner hole of the grinding wheel 3, the outer wedge surface 201 matched with the inner wedge surface 301 is arranged on the upper portion of the shaft neck of the flange shaft sleeve 2 in a matched mode, the grinding wheel 3 and the flange shaft sleeve 2 are connected in a wedge matching mode, and the fixing through the locking screw 4 is assisted, so that the complete centering installation of the grinding wheel 3 is guaranteed, the installation precision and stability are guaranteed, the silicon wafer processing quality and the service life of the grinding wheel are further guaranteed, the problem of the influence of eccentric errors on the service life of the grinding wheel and the chamfering quality of the edge of the silicon wafer due to the large matching gap is effectively solved in the traditional matching installation mode.
Preferably, the taper of the inner wedge surface 301 and the taper of the outer wedge surface 201 are both 1: 5.
preferably, as shown in fig. 1, the grinding wheel spindle further comprises a locking screw 4, an internal threaded hole 11 is coaxially formed in the output end of the spindle 1, and the locking screw 4 passes through the first inner hole 31 from top to bottom and is installed in the internal threaded hole 11 in a threaded fit manner to fix the grinding wheel 3.
In this embodiment, after the grinding wheel 3 and the flange sleeve 2 are installed in a wedge-shaped fit manner, the grinding wheel 3 and the spindle 1 are fixed by using the locking screw 4.
Preferably, a gasket 5 is further arranged between the grinding wheel 3 and the locking screw 4.
Preferably, a second inner hole 21 for installing the output end of the main shaft 1 in an interference fit manner is formed through the axis of the flange shaft sleeve 2.
In this embodiment, the flange shaft sleeve 2 is installed on the output end of the main shaft 1 through interference fit, and transmits the power of the main shaft 1 to the grinding wheel 3, so as to realize high-speed rotation, and further complete the processing work of silicon wafer chamfering.
Preferably, the end cover 6 is coaxially sleeved on the main shaft 1 and rotates along with the rotation of the main shaft 1, and the end cover 6 is connected with the flange shaft sleeve 2 through thread matching.
In this embodiment, the flange shaft sleeve 2 includes a shaft sleeve main body and a mounting portion arranged around the outer circumferential surface of the shaft sleeve main body, threaded holes are uniformly distributed on the mounting portion, and the end cover 6 is fixedly mounted in cooperation with the mounting portion through screws; the journal of the flange shaft sleeve 2 positioned above the mounting part is set to be an external wedge-shaped surface 201, and the journal of the flange shaft sleeve 2 positioned below the mounting part is arranged in a cylindrical shape and matched with the end cover 6 in shape.
Example two
For simplicity, only the differences between the second embodiment and the first embodiment will be described below; the second embodiment is different from the first embodiment in that:
preferably, as shown in fig. 2, the grinding wheel 3 has a T-shaped cross section, and includes a grinding wheel disk 32 and an upper boss 33 that is coaxial with the grinding wheel disk 32 and is integrally formed, and the first inner hole 31 sequentially penetrates through the upper boss 33 and the grinding wheel disk 32 from top to bottom.
In this embodiment, the structure of the grinding wheel 3 is optimized, and the boss 33 is concentrically and convexly arranged on the original grinding wheel disk 32 to form a T-shaped structure, so that the height of the first inner hole 31 is increased, the inner thread surface 302 and the inner wedge surface 301 are conveniently arranged at the upper and lower parts of the inner part of the inner hole, and the grinding wheel is convenient to disassemble and the stability of the wedge-shaped matching installation of the grinding wheel is improved.
Preferably, as shown in fig. 4, a disassembly screw 7 is further included, an upper portion of the first inner hole 31 is provided with an internally threaded surface 302, and the disassembly screw 7 can be screwed with the internally threaded surface 302 and then rotated downwards against the flange bushing 2 to disassemble the grinding wheel 3.
The utility model discloses a set up internal thread face 302 on 3 hole upper portions of emery wheel, and correspond the configuration and be used for dismantling the dismantlement screw 7 of emery wheel 3, when emery wheel 3 is dismantled to needs, will dismantle screw 7 and revolve down after screwing into internal thread face 302, prop up flange axle sleeve 2 to the dismantlement screw 7 front end, continue the rotatory dismantlement screw 7 that descends, can be with closely complex emery wheel 3 ejecting outer wedge face 201 fast, accomplish the light dismantlement of emery wheel 3, realize easy dismounting, the operation degree of difficulty and the intensity of labour of operator have been reduced.
The working process is as follows:
installation: the inner wedge-shaped surface 301 of the grinding wheel 3 is matched and sleeved with the outer wedge-shaped surface 201 of the flange shaft sleeve 2, and after the gasket 5 is correspondingly placed, the locking screw 4 penetrates through the first inner hole 31 of the grinding wheel 3 from top to bottom and is completely installed in the inner threaded hole 11 of the main shaft 1 in a threaded fit mode, and the grinding wheel 3 is fixed.
Disassembling: firstly screwing out the locking screw 4, then screwing the disassembling screw 7 into the internal thread surface 302 of the grinding wheel 3 and then rotating downwards until the front end of the disassembling screw 7 props against the upper end surface of the flange shaft sleeve 2, and continuing to rotate the disassembling screw 7 downwards, so that the grinding wheel 3 can be quickly ejected out of the external wedge-shaped surface 201, and the grinding wheel 3 can be disassembled easily.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The centering and mounting device for the silicon wafer chamfering grinding wheel comprises a main shaft (1), a flange shaft sleeve (2) coaxially sleeved on the main shaft (1) and a grinding wheel (3) coaxially sleeved on the flange shaft sleeve (2), and is characterized in that the grinding wheel (3) and the flange shaft sleeve (2) are mounted in a wedge-shaped matching mode.
2. The silicon wafer chamfering grinding wheel centering and mounting device according to claim 1, wherein a first inner hole (31) is formed through the axis of the grinding wheel (3), the lower part of the first inner hole (31) is provided with an inner wedge-shaped surface (301), and the upper part of the journal of the flange shaft sleeve (2) is provided with an outer wedge-shaped surface (201) which is matched with the inner wedge-shaped surface (301) for mounting.
3. The centering mounting device for the silicon wafer chamfering grinding wheel according to claim 2, wherein the conicity of the inner wedge-shaped surface (301) and the conicity of the outer wedge-shaped surface (201) are both 1: 5.
4. the centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 2, further comprising a locking screw (4), wherein an internal threaded hole (11) is formed coaxially inwards on the output end of the spindle (1), and the locking screw (4) passes through the first inner hole (31) from top to bottom and is installed in the internal threaded hole (11) in a threaded fit manner to fix the grinding wheel (3).
5. The centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 4, characterized in that a gasket (5) is further arranged between the grinding wheel (3) and the locking screw (4).
6. The centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 1, wherein a second inner hole (21) for mounting the output end of the spindle (1) in an interference fit manner penetrates through the axis of the flange shaft sleeve (2).
7. The centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 1, further comprising an end cover (6) coaxially sleeved on the main shaft (1), wherein the end cover (6) is connected with the flange shaft sleeve (2) in a threaded fit manner.
8. The centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 2, wherein the cross section of the grinding wheel (3) is a T-shaped structure, and the T-shaped structure comprises a grinding wheel disc (32) and an upper boss (33) which is coaxial with and integrally formed with the grinding wheel disc (32), and the first inner hole (31) penetrates through the upper boss (33) and the grinding wheel disc (32) from top to bottom in sequence.
9. The centering and mounting device for the silicon wafer chamfering grinding wheel according to claim 8, further comprising a dismounting screw (7), wherein the upper part of the first inner hole (31) is provided with an internally threaded surface (302), and the dismounting screw (7) can be screwed with the internally threaded surface (302) and then rotated downwards to abut against the flange bushing (2) so as to dismount the grinding wheel (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021925613.3U CN212947275U (en) | 2020-09-07 | 2020-09-07 | Centering installation device for silicon wafer chamfering grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021925613.3U CN212947275U (en) | 2020-09-07 | 2020-09-07 | Centering installation device for silicon wafer chamfering grinding wheel |
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| CN212947275U true CN212947275U (en) | 2021-04-13 |
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| CN202021925613.3U Active CN212947275U (en) | 2020-09-07 | 2020-09-07 | Centering installation device for silicon wafer chamfering grinding wheel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114278675A (en) * | 2021-12-31 | 2022-04-05 | 常州冠日电器工具有限公司 | Method for connecting flange set and grinding wheel wafer by using flange riveting rod |
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2020
- 2020-09-07 CN CN202021925613.3U patent/CN212947275U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114278675A (en) * | 2021-12-31 | 2022-04-05 | 常州冠日电器工具有限公司 | Method for connecting flange set and grinding wheel wafer by using flange riveting rod |
| CN114278675B (en) * | 2021-12-31 | 2023-08-22 | 江苏冠日新材料科技有限公司 | Method for connecting flange sleeve and grinding wheel wafer by using flange riveting rod |
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