CN212936367U - Shell with heat dissipation function - Google Patents

Shell with heat dissipation function Download PDF

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Publication number
CN212936367U
CN212936367U CN202021753765.XU CN202021753765U CN212936367U CN 212936367 U CN212936367 U CN 212936367U CN 202021753765 U CN202021753765 U CN 202021753765U CN 212936367 U CN212936367 U CN 212936367U
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China
Prior art keywords
heat dissipation
layer
shell
dissipation function
sheet
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CN202021753765.XU
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Chinese (zh)
Inventor
曹祖铭
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Shenzhen Yimingyue Technology Co ltd
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Shenzhen Yimingyue Technology Co ltd
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Priority to CN202021753765.XU priority Critical patent/CN212936367U/en
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Abstract

The utility model discloses a shell with heat dissipation function, by interior and outer in proper order including the heat dissipation layer, mould plastics the layer and spray coating. The heat dissipation layer comprises a sheet and a heat dissipation fin embedded in the sheet. The injection molding layer covers one surface of the heat dissipation layer. The spraying layer is arranged on the surface of the injection layer and is formed by spraying wear-resistant UV finish on the surface of the injection layer. The utility model discloses a shell with heat dissipation function is favorable to making the electron product dispel the heat fast, reaches better radiating effect. The utility model discloses a shell, the heat dissipation function is realized by the shell, can save the inner space of product to reduce the volume of product, also can be with the space of saving out being used as other usage.

Description

Shell with heat dissipation function
Technical Field
The utility model relates to an electronic product's shell, in particular to shell with heat dissipation function.
Background
With the rapid development of information technology, electronic products are more and more widely applied, and the variety of products is more and more. Users have requirements for the quality and the aesthetic degree of the housings of these electronic products, and also have requirements for the heat dissipation performance of the housings. Traditional shell body itself does not possess the heat dissipation function, and the heat dissipation function is generally inside the product, and this will lead to heat dispersion poor. Moreover, when the heat dissipation function is arranged inside the product, the heat dissipation function occupies a certain internal space, which is not favorable for the miniaturization development of the product. Therefore, the shell of the electronic product is to be improved, so that the heat dissipation performance of the electronic product is better.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems of the prior art, the utility model aims at providing a shell with heat dissipation function, the utility model aims at realizing through following technical scheme:
a shell with a heat dissipation function sequentially comprises a heat dissipation layer, an injection molding layer and a spraying layer from inside to outside; the heat dissipation layer comprises a sheet and a heat dissipation fin embedded in the sheet.
Further, the injection molding layer covers one surface of the heat dissipation layer.
Further, the spraying layer is arranged on the surface of the injection layer and is formed by spraying wear-resistant UV finish on the surface of the injection layer.
Further, the sheet material is PET, PC, TPU, PVC, PMMA, wood, leather, basalt fiber or carbon fiber.
Furthermore, the material of the injection molding layer is injection molding material rice.
The utility model discloses an outer shell with heat dissipation function uses new manufacturing process production to form, makes shell itself have the heat dissipation function, is favorable to using the electronic product of this shell to dispel the heat fast, reaches better radiating effect. In addition, after the shell has the heat dissipation function, the heat dissipation function is moved to the shell from the inside of the electronic product, certain internal space can be saved without internal heat dissipation, the size of the electronic product can be further reduced, and the saved space can be used for other more favorable purposes, such as increasing the battery capacity and prolonging the standby time.
Drawings
The drawings of the present invention are only for illustrating the structure of the housing and cannot be used to define the present invention nor the specific dimensions of the layers of the housing.
Fig. 1 is a schematic structural diagram of a housing with a heat dissipation function according to the present invention.
The reference numerals are explained below:
1: heat dissipation layer, 11: sheet, 12: a heat sink, 2: injection layer, 3: and (4) spraying a coating.
Detailed Description
The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
The embodiments of the present disclosure are described below with specific examples, and other advantages and effects of the present disclosure will be readily apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. The disclosure may be embodied or carried out in various other specific embodiments, and various modifications and changes may be made in the details within the description without departing from the spirit of the disclosure. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "inner", "outer", "front", "back", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Fig. 1 is a schematic structural diagram of a housing with a heat dissipation function of the present invention, which includes a heat dissipation layer 1, an injection molding layer 2 and a spraying layer 3. The heat dissipation layer comprises a sheet 11 and a heat dissipation sheet 12 embedded in the sheet 11.
The heat dissipation layer 1 is formed by embedding the heat dissipation fins 12 in the sheet 11. The heat dissipation layer is used for realizing the hardness, rigidity and heat dissipation function of the product.
The sheet material can be PET, PC, TPU, PVC, PMMA, wood, leather, basalt fiber or carbon fiber.
The injection molding layer 2 covers one surface of the heat dissipation layer 1, and the injection molding layer 2 is formed after the heat dissipation layer 1 is subjected to injection molding. The injection molding layer 2 is used to realize the structural shape (such as a snap position) of the shell.
The material of layer 2 of moulding plastics is injection moulding material rice.
The spraying layer 3 is arranged on the surface of the injection molding layer 2 and is formed by spraying wear-resistant UV finish on the surface of the injection molding layer 2. The sprayed layer is used to realize the surface color and hardness of the shell.
The present invention relates to a method for embedding the heat sink 12 in the sheet 11, and more particularly, to an ultrasonic embedding method, a laser cutting embedding method, or a CNC embedding method.
The specific process of embedding the radiating fins into the sheet by using the ultrasonic embedding method comprises the following steps:
the current of 50/60 Hz is converted into high-frequency electric energy of 15, 20, 30 or 40 KHz by an ultrasonic generator, and the high-frequency electric energy is converted into mechanical vibration with the same frequency by a transducer. The mechanical vibrations are then transmitted to the horn through a set of horn assemblies that vary in amplitude. The horn transmits the received vibrational energy to the joint of the sheet material into which the heat sink is to be embedded, where the vibrational energy is frictionally converted to thermal energy that melts the joint of the sheet material and sinks the heat sink therein. The temperature of the fusion bond is about 150 and 180 degrees.
The specific process of embedding the radiating fins into the sheet by using the laser cutting embedding method comprises the following steps:
the laser beam energy is gathered into a small light spot through the focusing lens and is projected to a combination part of the sheet to be embedded into the radiating fin, the focal point reaches high power density, and the combination part is irradiated and heated to vaporization temperature quickly and is evaporated to form a hole. The light spot moves on the sheet material to form a cutting seam, thereby achieving the purpose of cutting the sheet material. In this way, the maximum shape of the heat sink is cut out from the sheet, and then the heat sink is implanted manually and fixed by high temperature resistant glue. The power of the laser beam energy is 30W, the wavelength is 930nm, and the frequency is 1000-.
CNC machining refers to computer numerical control precision machining. The specific process of embedding the heat sink into the sheet material by using the CNC embedding method is as follows:
the control system of the CNC machining center controls the machine tool to finish automatic start, stop, reversing and speed change of a main shaft according to a digital program instruction, can automatically control the feeding speed, direction and machining path to machine, can select a cutter, adjust the tool-cutting amount and the walking track according to the dimension of the cutter, can finish various auxiliary actions required in machining, and further finish sheet cutting. In this way, the maximum shape of the heat sink is cut out from the sheet, and then the heat sink is implanted manually and fixed by high temperature resistant glue.
The utility model discloses in, the mode that layer 2 formed of moulding plastics does: and placing the heat dissipation layer 1 into a cavity of an injection mold, and placing one surface of the heat dissipation layer 1 in a manner of being attached to the cavity of the mold. Injecting liquid plastic, and cooling to form an injection molding layer 2 on the other surface of the heat dissipation layer 1.
The specific process for manufacturing the injection molding layer comprises the following steps: the plastic particles are injected into the injection mold cavity by means of screw heating and hydraulic pressure (the screw temperature is between 230 and 360 degrees). The operation sequence is as follows: placing a heat dissipation layer → mold closing → premolding → inverse shrinkage → nozzle advancing → injection → pressure maintaining → nozzle retreating → cooling → mold opening → ejection → door opening → workpiece taking → next shell injection molding.
The reason for the cooling during the injection molding process is that the heat sink is afraid of high temperature and will burst at a temperature higher than 60 ℃. The temperature of the injection molding material is 320 ℃, and the temperature reaches at least 150 ℃ to the inside of the cavity of the injection mold, so a water cooling system needs to be added in the structure of the injection mold to cool the temperature around the radiating fins.
The above description is for illustrative purposes only and is not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. that do not depart from the spirit and principles of the present invention should be construed as within the scope of the present invention.

Claims (5)

1. A shell with a heat dissipation function is characterized by sequentially comprising a heat dissipation layer, an injection molding layer and a spraying layer from inside to outside; the heat dissipation layer comprises a sheet and a heat dissipation fin embedded in the sheet.
2. The housing with a heat dissipation function as recited in claim 1, wherein the injection molded layer covers a surface of the heat dissipation layer.
3. The shell with the heat dissipation function as recited in claim 1, wherein the spray coating layer is arranged on the surface of the injection layer and is formed by spraying wear-resistant UV finish on the surface of the injection layer.
4. The shell with the heat dissipation function of claim 1, wherein the sheet is made of PET, PC, TPU, PVC, PMMA, wood, leather, basalt fiber or carbon fiber.
5. The shell with the heat dissipation function as recited in claim 1, wherein the injection molded layer is made of injection molded plastic.
CN202021753765.XU 2020-08-20 2020-08-20 Shell with heat dissipation function Active CN212936367U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021753765.XU CN212936367U (en) 2020-08-20 2020-08-20 Shell with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021753765.XU CN212936367U (en) 2020-08-20 2020-08-20 Shell with heat dissipation function

Publications (1)

Publication Number Publication Date
CN212936367U true CN212936367U (en) 2021-04-09

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CN202021753765.XU Active CN212936367U (en) 2020-08-20 2020-08-20 Shell with heat dissipation function

Country Status (1)

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CN (1) CN212936367U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795138B (en) * 2021-12-23 2023-03-01 今展科技股份有限公司 Method for attaching heat sink to base material and base material with heat sink attached

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795138B (en) * 2021-12-23 2023-03-01 今展科技股份有限公司 Method for attaching heat sink to base material and base material with heat sink attached

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