CN212934376U - Surface mount type inductor - Google Patents
Surface mount type inductor Download PDFInfo
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- CN212934376U CN212934376U CN202021173020.6U CN202021173020U CN212934376U CN 212934376 U CN212934376 U CN 212934376U CN 202021173020 U CN202021173020 U CN 202021173020U CN 212934376 U CN212934376 U CN 212934376U
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Abstract
The utility model discloses a SMD inductance is provided with from screen external member and electromagnetism external member, the electromagnetism external member set up in from on the screen external member. The arrangement of the self-shielding protective shell and the self-shielding support plate can prevent an external magnetic field from entering the accommodating cavity, so that the external magnetic field is prevented from influencing the normal work of the electromagnetic external member, and the anti-interference capability of the surface mount inductor is improved; meanwhile, the electromagnetic external member is arranged in the accommodating cavity, so that a magnetic field generated by the electromagnetic external member in the working process can be prevented from leaking out of the self-shielding external member, the self-shielding property of the surface mount type inductor is improved, and the magnetic field generated by the surface mount type filter is prevented from influencing surrounding parts; the arrangement of the containing cavity enables a manufacturer to accurately install the top magnetic coil, the magnetic ring and the bottom magnetic coil into the containing cavity without expanding the size specification of the self-shielding protective shell, namely, workers can accurately sleeve the top magnetic coil, the magnetic ring and the bottom magnetic coil on the core column, and the assembly efficiency and the integral compactness of the surface mount inductor are improved.
Description
Technical Field
The utility model relates to an inductance field especially relates to a SMD inductance.
Background
The inductor mainly plays the roles of filtering, oscillating, delaying, trapping and the like in a circuit, and also has the roles of copying and screening signals, filtering noise, stabilizing current, inhibiting electromagnetic wave interference and the like. According to the difference of the structure, the inductor can be roughly divided into a fully open inductor, a semi-closed inductor, a fully closed inductor and a patch inductor, and various inductors have advantages and disadvantages, and the following will be explained for the disadvantages of the patch inductor:
firstly, the chip inductor has the defect of weak anti-interference capability in the use process, and the work of the inductor is influenced by an external electric field, a magnetic field and the like, specifically, the work efficiency of the chip inductor is reduced under the influence of an external magnetic field, namely, the filtering capability of the chip inductor is reduced;
secondly, common-mode inductors, which are chip inductors, exist in various chip inductors, and the chip inductors are provided with two coils in an inductor shell, so that the chip inductors not only can filter out common-mode interference on a specified signal line, but also can inhibit electromagnetic interference which is not emitted outwards, and normal work of other electronic equipment under the same electromagnetic environment is avoided being influenced;
meanwhile, in the assembly process of the conventional surface mount inductor, the problem that the coil is difficult to align and align often occurs, namely, workers are difficult to accurately transfer the coil into the inductor shell, and the assembly efficiency is low; in this regard, in order to improve the assembly productivity of the inductor, manufacturers increase the overall volume of the housing so that an assembly worker can quickly and accurately place the coil in the housing, but this reduces the overall compactness of the chip inductor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a SMD inductance, this SMD inductance has that the interference killing feature is strong, from the shielding nature high, whole compact degree is high and the advantage of the equipment of being convenient for.
The purpose of the utility model is realized through the following technical scheme:
a chip inductor, comprising:
the self-shielding assembly comprises a self-shielding protective shell, a core column and a self-shielding support plate, wherein the core column is arranged in the self-shielding protective shell, the self-shielding support plate is connected with the core column, and the self-shielding support plate, the core column and the side wall of the self-shielding protective shell jointly enclose an accommodating cavity; and
the electromagnetic kit comprises a top magnetic coil, a magnetic ring, a bottom magnetic coil and a pin group, wherein the top magnetic coil, the magnetic ring and the bottom magnetic coil are respectively arranged in the accommodating cavity, the magnetic ring is positioned between the top magnetic coil and the bottom magnetic coil, the bottom magnetic coil is arranged close to the self-screen support plate, the pin group is respectively connected with the top magnetic coil and the bottom magnetic coil, and part of the pin group is exposed on the side surface of the self-screen support plate far away from the self-screen protective shell.
In one embodiment, the pin group comprises a plurality of conductive pins, one end of each conductive pin is exposed on the side surface of the self-shielding carrier plate far away from the self-shielding protective shell, the other ends of part of the conductive pins are connected with the top magnetic coil, and the other ends of the rest of the conductive pins are connected with the bottom magnetic coil.
In one embodiment, each conductive pin comprises a connecting portion, a U-shaped portion and a soldering portion, a part of the connecting portion is connected with the top magnetic coil, the other part of the connecting portion is connected with the bottom magnetic coil, the U-shaped portions are connected with the connecting portions in a one-to-one correspondence, and the soldering portions are connected with the U-shaped portions in a one-to-one correspondence.
In one embodiment, the pin set is an axisymmetric structure.
In one embodiment, in one of the conductive pins, the connecting portion, the U-shaped portion and the soldering portion are of an integrally molded structure.
In one embodiment, the self-screen carrier plate is provided with a plurality of pin grooves, and the parts of the welding parts are correspondingly positioned in the pin grooves one by one.
In one embodiment, the chip inductor further includes an adhesive layer, the adhesive layer is located between the core column and the self-shielding support plate, one side of the adhesive layer is connected to the core column, and the other side of the adhesive layer is connected to the self-shielding support plate.
In one embodiment, the self-shielding protective shell is provided with a avoiding groove, the avoiding groove and the self-shielding carrier plate jointly enclose a avoiding hole, and the pin group penetrates through the avoiding hole.
In one embodiment, the self-shielding shell is provided with a position-identifying hole.
In one embodiment, a dispensing gap is arranged between the top magnetic coil and the magnetic ring.
Compared with the prior art, the utility model discloses advantage and beneficial effect below having at least:
the utility model discloses a SMD inductance is provided with from screen external member and electromagnetism external member, the electromagnetism external member set up in from on the screen external member. The arrangement of the self-shielding protective shell and the self-shielding support plate can prevent an external magnetic field from entering the accommodating cavity, so that the external magnetic field is prevented from influencing the normal work of the electromagnetic external member, and the anti-interference capability of the surface mount inductor is improved; meanwhile, the electromagnetic external member is arranged in the accommodating cavity, so that a magnetic field generated by the electromagnetic external member in the working process can be prevented from leaking out of the self-shielding external member, the self-shielding property of the surface mount type inductor is improved, and the magnetic field generated by the surface mount type filter is prevented from influencing surrounding parts; the arrangement of the containing cavity enables a manufacturer to accurately install the top magnetic coil, the magnetic ring and the bottom magnetic coil into the containing cavity without expanding the size specification of the self-shielding protective shell, namely, workers can accurately sleeve the top magnetic coil, the magnetic ring and the bottom magnetic coil on the core column, and the assembly efficiency and the integral compactness of the surface mount inductor are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a chip inductor according to an embodiment of the present invention;
fig. 2 is an exploded view of a chip inductor according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of a chip inductor according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and fig. 2, the chip inductor 10 includes a self-shielding kit 100 and an electromagnetic kit 200, wherein the electromagnetic kit 200 is disposed on the self-shielding kit 100.
It should be noted that the chip inductor 10 is used for being mounted on a circuit to perform a filtering function; the self-shielding kit 100 plays a role in shielding the magnetic field generated by the electromagnetic kit 200; the electromagnetic assembly 200 is used for power-on operation.
Referring to fig. 1, fig. 2 and fig. 3, the self-shielding kit 100 includes a self-shielding casing 110, a stem 120 and a self-shielding carrier 130, the stem 120 is disposed in the self-shielding casing 110, the self-shielding carrier 130 is connected to the stem 120, and the receiving cavity 140 is defined by the side walls of the self-shielding casing 110, the stem 120 and the self-shielding casing 130.
It should be noted that the self-shielding shell 110 and the self-shielding carrier plate 130 jointly play a role of shielding a magnetic field, and in addition, the self-shielding shell 110 and the self-shielding carrier plate 130 also play a role of protecting the electromagnetic suite 200; the stem 120 is used to provide a magnetic field; the receiving cavity 140 is used for receiving the electromagnetic assembly 200.
Referring to fig. 1, 2 and 3, the electromagnetic assembly 200 includes a top magnetic coil 210, a magnetic ring 220, a bottom magnetic coil 230, and a pin set 240, wherein the top magnetic coil 210, the magnetic ring 220, and the bottom magnetic coil 230 are respectively disposed in the accommodating cavity 140, the magnetic ring 220 is disposed between the top magnetic coil 210 and the bottom magnetic coil 230, the bottom magnetic coil 230 is disposed adjacent to the self-shielding carrier plate 130, the pin set 240 is respectively connected to the top magnetic coil 210 and the bottom magnetic coil 230, and a portion of the pin set 240 is exposed on a side of the self-shielding carrier plate 130 away from the self-shielding shell 110.
Note that, both the top magnetic coil 210 and the bottom magnetic coil 230 are used for energization; the magnetic ring 220 not only functions to isolate the top magnetic coil 210 from the bottom magnetic coil 230, but also functions to provide a magnetic field; the pin groups 240 are used for soldering to an external circuit, thereby respectively conducting the top magnetic coil 210 and the bottom magnetic coil 230 with the external circuit.
It should be added that, due to the arrangement of the self-shielding protective case 110 and the self-shielding carrier 130, the magnetic field generated after the top magnetic coil 210 and the bottom magnetic coil 230 are powered on cannot penetrate through the self-shielding kit 100, so that the components arranged near the chip inductor 10 cannot normally work due to the interference of the magnetic field generated by the chip inductor 10, and the self-shielding property of the chip inductor 10 is improved; meanwhile, due to the arrangement of the self-shielding protective shell 110 and the self-shielding carrier plate 130, an external magnetic field can be prevented from entering the accommodating cavity 140, so that the electromagnetic kit 200 is prevented from being incapable of working normally due to the external magnetic field, the anti-interference capability of the chip inductor 10 is improved, and the working efficiency of the chip inductor 10 is ensured.
It should be noted that, in the process of assembling the chip inductor 10, an operator only needs to sleeve the top magnetic coil 210, the magnetic ring 220, and the bottom magnetic coil 230 on the stem 120 according to a predetermined sequence, and then the top magnetic coil 210, the magnetic ring 220, and the bottom magnetic coil 230 can be accurately assembled to the self-shielding shell 110, so that a manufacturer can quickly and accurately complete the assembly of the top magnetic coil 210, the magnetic ring 220, and the bottom magnetic coil 230 without increasing the size and specification of the self-shielding shell 110, which not only improves the efficiency of assembling the chip inductor 10 by a worker, but also improves the overall compactness of the chip inductor 10.
Referring to fig. 3 again, in one embodiment, the chip inductor 10 further includes an adhesive layer 300, the adhesive layer 300 is located between the core pillar 120 and the self-shielding carrier 130, one side of the adhesive layer 300 is connected to the core pillar 120, and the other side of the adhesive layer 300 is connected to the self-shielding carrier 130.
It should be noted that the adhesive layer 300 serves to adhere the panel carrier 130 and the stem 120 together, so as to prevent the panel carrier 130 and the stem 120 from being separated from each other.
Referring to fig. 1, fig. 2 and fig. 3, in one embodiment, the self-shielding shell 110 is provided with a avoiding groove 111, the avoiding groove and the self-shielding carrier 130 together enclose a avoiding hole 112, and the pin group 240 passes through the avoiding hole 112.
It should be noted that the avoiding groove 111 is used for vacating an installation space for the rest of the components; the avoidance hole 112 is formed to make room for the installation of the pin group 240; in addition, in practical application, the heat generated by the top magnetic coil 210 and the bottom magnetic coil 230 will be transferred to the outside through the position-avoiding holes 112, so as to prevent the chip inductor 10 from being burned out due to overheating.
Referring again to fig. 1, in one embodiment, a locating hole 113 is formed in the shield case.
It should be noted that the opening of the positioning hole 113 enables an installer to quickly identify the correct mounting position of the chip inductor 10, thereby improving the efficiency of the installer in mounting the chip inductor 10.
Referring to fig. 3 again, in one embodiment, a dispensing gap 250 is disposed between the top magnetic coil 210 and the magnetic ring 220.
It should be noted that the dispensing gap 250 is used for accommodating glue; in the actual assembly process, the glue is coated in the dispensing gap 250, so that the top magnetic coil 210 and the magnetic ring 220 can be fixed, the top magnetic coil 210 and the magnetic ring 220 are prevented from shaking, and the top magnetic coil 210 and the magnetic ring 220 are prevented from being damaged due to mutual collision.
Referring to fig. 1, 2 and 3, in one embodiment, the lead set 240 includes a plurality of conductive leads 241, one end of each conductive lead 241 is exposed on the side of the self-shielding carrier 130 away from the self-shielding shell 110, the other end of a portion of the conductive leads 241 is connected to the top magnetic coil 210, and the other end of the remaining portion of the conductive leads 241 is connected to the bottom magnetic coil 230.
It should be noted that each conductive pin 241 is used for conducting the electromagnetic suite 200 with an external circuit; wherein a portion of the conductive pins 241 are used to conduct the top magnetic coil 210 to an external circuit and the remaining portion of the conductive pins 241 are used to conduct the bottom magnetic coil 230 to an external circuit.
Specifically, referring to fig. 1, fig. 2 and fig. 3, in one embodiment, each conductive pin 241 includes a connection portion 2411, a U-shaped portion 2412 and a soldering portion 2413, a portion of the connection portion 2411 is connected to the top magnetic coil 210, the remaining portion of the connection portion 2411 is connected to the bottom magnetic coil 230, each U-shaped portion 2412 is connected to each connection portion 2411 in a one-to-one correspondence, and each soldering portion 2413 is connected to each U-shaped portion 2412 in a one-to-one correspondence.
The connection portion 2411 is used for connecting the electromagnetic kit 200; the U-shaped portion 2412 is for bringing the connection portion 2411 into conduction with the welding portion 2413; the welding portion 2413 is used for welding to an external circuit, so as to connect the U-shaped portion 2412 with the external circuit, and thus connect the electromagnetic suite 200 with the external circuit; wherein a portion of the connection 2411 is adapted to connect with the top magnetic coil 210 and the remaining portion of the connection 2411 is adapted to connect with the bottom magnetic coil 230.
Referring to fig. 1, fig. 2 and fig. 3, in one embodiment, the lead group 240 has an axisymmetric structure.
It should be noted that, the pin group 240 is set to be an axisymmetric structure, which can improve the mounting stability of the chip inductor 10; specifically, after the worker completes soldering of each lead group 240, the contact surfaces of the chip inductor 10 and the external circuit board can be prevented from being separated from each other due to too low local connection strength.
Referring to fig. 1 and fig. 3, in one embodiment, in one conductive lead 241, the connection portion 2411, the U-shaped portion 2412 and the soldering portion 2413 are integrally formed.
By integrally forming the connection portion 2411, the U-shaped portion 2412 and the soldering portion 2413, the mechanical strength of the conductive pin 241 can be improved, and the durability of the conductive pin 241 can be improved.
Referring to fig. 3 again, in one embodiment, a plurality of pin grooves 131 are formed on the self-screen carrier 130, and the portions of the soldering portions 2413 are located in the pin grooves 131 in a one-to-one correspondence manner.
It should be noted that the opening of the pin slot 131 provides an installation space for the welding portion 2413; meanwhile, since the parts of the welding parts 2413 are accommodated in the pin grooves 131 in a one-to-one correspondence manner, the overall structural compactness of the chip inductor 10 can be improved due to the opening of the pin grooves 131.
Compared with the prior art, the utility model discloses advantage and beneficial effect below having at least:
the utility model discloses a SMD inductance is provided with from screen external member and electromagnetism external member, the electromagnetism external member set up in from on the screen external member. The arrangement of the self-shielding protective shell and the self-shielding support plate can prevent an external magnetic field from entering the accommodating cavity, so that the external magnetic field is prevented from influencing the normal work of the electromagnetic external member, and the anti-interference capability of the surface mount inductor is improved; meanwhile, the electromagnetic external member is arranged in the accommodating cavity, so that a magnetic field generated by the electromagnetic external member in the working process can be prevented from leaking out of the self-shielding external member, the self-shielding property of the surface mount type inductor is improved, and the magnetic field generated by the surface mount type filter is prevented from influencing surrounding parts; the arrangement of the containing cavity enables a manufacturer to accurately install the top magnetic coil, the magnetic ring and the bottom magnetic coil into the containing cavity without expanding the size specification of the self-shielding protective shell, namely, workers can accurately sleeve the top magnetic coil, the magnetic ring and the bottom magnetic coil on the core column, and the assembly efficiency and the integral compactness of the surface mount inductor are improved.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A surface mount inductor, comprising:
the self-shielding assembly comprises a self-shielding protective shell, a core column and a self-shielding support plate, wherein the core column is arranged in the self-shielding protective shell, the self-shielding support plate is connected with the core column, and the self-shielding support plate, the core column and the side wall of the self-shielding protective shell jointly enclose an accommodating cavity; and
the electromagnetic kit comprises a top magnetic coil, a magnetic ring, a bottom magnetic coil and a pin group, wherein the top magnetic coil, the magnetic ring and the bottom magnetic coil are respectively arranged in the accommodating cavity, the magnetic ring is positioned between the top magnetic coil and the bottom magnetic coil, the bottom magnetic coil is arranged close to the self-screen support plate, the pin group is respectively connected with the top magnetic coil and the bottom magnetic coil, and part of the pin group is exposed on the side surface of the self-screen support plate far away from the self-screen protective shell.
2. The chip inductor according to claim 1, wherein the set of leads comprises a plurality of conductive leads, one end of each of the conductive leads is exposed on a side of the self-shielding carrier plate away from the self-shielding casing, the other ends of some of the conductive leads are connected to the top magnetic coil, and the other ends of the other conductive leads are connected to the bottom magnetic coil.
3. The chip inductor according to claim 2, wherein each of the conductive leads comprises a connection portion, a U-shaped portion and a soldering portion, a portion of the connection portion is connected to the top magnetic coil, a remaining portion of the connection portion is connected to the bottom magnetic coil, each of the U-shaped portions is connected to each of the connection portions in a one-to-one correspondence, and each of the soldering portions is connected to each of the U-shaped portions in a one-to-one correspondence.
4. The surface mount inductor according to any one of claims 1-3, wherein the lead group has an axisymmetric structure.
5. The chip inductor according to claim 3, wherein the connecting portion, the U-shaped portion and the soldering portion are integrally formed in one of the conductive leads.
6. The chip inductor according to claim 3, wherein the self-shielding carrier plate has a plurality of pin slots, and the soldering portions are located in the pin slots in a one-to-one correspondence.
7. The chip inductor according to claim 1, further comprising an adhesive layer, wherein the adhesive layer is located between the core column and the self-shielding carrier plate, one side of the adhesive layer is connected to the core column, and the other side of the adhesive layer is connected to the self-shielding carrier plate.
8. The chip inductor according to claim 1, wherein the self-shielding shield has a clearance groove, the clearance groove and the self-shielding carrier plate together define a clearance hole, and the lead group passes through the clearance hole.
9. The surface mount inductor according to claim 1, wherein the self-shielding casing has a positioning hole.
10. The chip inductor according to claim 1, wherein a dispensing gap is disposed between the top magnetic coil and the magnetic ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021173020.6U CN212934376U (en) | 2020-06-22 | 2020-06-22 | Surface mount type inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021173020.6U CN212934376U (en) | 2020-06-22 | 2020-06-22 | Surface mount type inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212934376U true CN212934376U (en) | 2021-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021173020.6U Active CN212934376U (en) | 2020-06-22 | 2020-06-22 | Surface mount type inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212934376U (en) |
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2020
- 2020-06-22 CN CN202021173020.6U patent/CN212934376U/en active Active
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