CN212933536U - Fingerprint module and photosensitive module combination structure and electronic device - Google Patents

Fingerprint module and photosensitive module combination structure and electronic device Download PDF

Info

Publication number
CN212933536U
CN212933536U CN202021494567.6U CN202021494567U CN212933536U CN 212933536 U CN212933536 U CN 212933536U CN 202021494567 U CN202021494567 U CN 202021494567U CN 212933536 U CN212933536 U CN 212933536U
Authority
CN
China
Prior art keywords
module
circuit board
fingerprint module
fingerprint
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021494567.6U
Other languages
Chinese (zh)
Inventor
安宏鹏
黄梅峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Oumaisi Microelectronics Co Ltd
Original Assignee
OFilm Microelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OFilm Microelectronics Technology Co Ltd filed Critical OFilm Microelectronics Technology Co Ltd
Priority to CN202021494567.6U priority Critical patent/CN212933536U/en
Application granted granted Critical
Publication of CN212933536U publication Critical patent/CN212933536U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Image Input (AREA)

Abstract

The application discloses fingerprint module and sensitization module integrated configuration and electron device. Fingerprint module and sensitization module integrated configuration include fingerprint module, sensitization module and circuit board, and the first region of circuit board is used for bearing and electrically connects sensitization module, and the second region is used for bearing and electrically connects the fingerprint module, and the circuit board still is used for the electricity to connect external circuit to make fingerprint module and sensitization module pass through the circuit board can with the external circuit between the transmission signal of telecommunication. Install fingerprint module and sensitization module in the different regions of same circuit board jointly, need not to be equipped with a circuit board respectively for fingerprint module and sensitization module again, save installation space. Also need not the rethread and install fingerprint module and sensitization module alone, save installation procedure. Fingerprint module and sensitization module can have multiple mounting means on the circuit board to make fingerprint module and sensitization module integrated configuration install the mounting means on electron device also nimble various.

Description

Fingerprint module and photosensitive module combination structure and electronic device
Technical Field
The application relates to fingerprint module and sensitization module packaging technology field especially relate to a fingerprint module and sensitization module integrated configuration and electron device.
Background
Along with the development of electronic equipment fingerprint identification technique and sensitization technique, install optics fingerprint module and sensitization module in electronic equipment's display area simultaneously and have obtained more and more extensive application. The optical fingerprint module transmits light to the area touched by the finger of the user and receives light reflected back by the finger to sense and acquire a fingerprint image of the user. The photosensitive module senses ambient light through a light intensity difference value detected by the two optical sensors to adjust the brightness of the display area. In the correlation technique, optics fingerprint module and sensitization module are independently installed, and every module all need be connected with a circuit board and an electric connector with supporting, occupy installation space, increase the equipment process.
SUMMERY OF THE UTILITY MODEL
The application provides a fingerprint module and sensitization module integrated configuration and electron device can simplify fingerprint module and sensitization module mounting structure.
First aspect, this application embodiment provides a fingerprint module and sensitization module integrated configuration, including fingerprint module, sensitization module and circuit board. The circuit board is provided with a first area and a second area, the first area is used for bearing and electrically connecting the photosensitive module, the second area is used for bearing and electrically connecting the fingerprint module, and the circuit board is also used for electrically connecting an external circuit, so that the fingerprint module and the photosensitive module can transmit electric signals with the external circuit through the circuit board.
Fingerprint module and sensitization module integrated configuration based on this application embodiment installs fingerprint module and sensitization module in the different regions of same circuit board jointly, need not to be equipped with a circuit board respectively for fingerprint module and sensitization module again, saves installation space. During the equipment, also need not the rethread and install fingerprint module and sensitization module alone, save installation procedure.
In some embodiments, the fingerprint module and photosensitive module combined structure further includes an electrical connector disposed on the circuit board and electrically connected to the circuit board, the electrical connector being further configured to electrically connect to an external circuit and transmit an electrical signal between the circuit board and the external circuit; the electric connector comprises a fingerprint signal end, a photosensitive signal end and an external circuit connecting end, the circuit board is provided with a first conductive circuit and a second conductive circuit, the two ends of the first conductive circuit are respectively connected with the photosensitive module and the photosensitive signal end, and the two ends of the second conductive circuit are respectively connected with the fingerprint module and the fingerprint signal end.
Based on above-mentioned embodiment, fingerprint module and sensitization module public electric connector transmit the signal of telecommunication to external circuit. The electric connector is also installed on the circuit board, and during the equipment, shifts electric connector, fingerprint module, sensitization module and circuit board to the installation position together, only need with electric connector and mainboard electricity be connected can. The first conductive circuit and the second conductive circuit are independently arranged on the circuit board and transmit the photosensitive signal and the fingerprint signal to the electric connector without mutual interference.
In some embodiments, the circuit board includes a main body portion and a connecting portion connected to the main body portion, the first region and the second region are both disposed on the main body portion, the electrical connector is disposed on the connecting portion, and the first conductive trace and the second conductive trace are led out from the main body portion to the connecting portion to be connected to the electrical connector.
Based on above-mentioned embodiment, install fingerprint module and sensitization module side by side on the circuit board, the modularization installation of the fingerprint module of being convenient for and sensitization module.
In some embodiments, the circuit board includes a first portion, a second portion, a first connection portion connecting the first portion and the second portion, and a second connection portion connected to at least one of the first portion, the second portion, and the first connection portion, the first region is disposed on the first portion, the second region is disposed on the second portion, and the electrical connector is disposed on the second connection portion; the first conductive traces extend from the first portion to the second connection portion to be connected with the electrical connector, and the second conductive traces extend from the second portion to the first connection portion, the first portion, and the second connection portion to be connected with the electrical connector.
Based on above-mentioned embodiment, install fingerprint module, sensitization module and electric connector in the part of three difference on the circuit board, through the connected mode of adjustment second connecting portion and first part, second part and first connecting portion, change position relation and interval between fingerprint module, sensitization module and the electric connector three, the installation is more nimble.
In some embodiments, the circuit board includes a first surface on one side and a second surface opposite to the first surface, the fingerprint module and the photosensitive module are both disposed on the same side of the circuit board and disposed on the first surface, and the electrical connector is disposed on the second surface.
Based on above-mentioned embodiment, the circuit board homonymy is located to the sensitization side of fingerprint module and the sensitization side of sensitization module, and the fingerprint module of being convenient for and sensitization module send and receive light.
In some embodiments, at least one of the first region of the circuit board and the second region of the circuit board is provided with a mounting opening, and the fingerprint module and the photosensitive module are mounted corresponding to the mounting opening.
Based on above-mentioned embodiment, can further save installation space, reduce fingerprint module and sensitization module integrated configuration installation thickness.
In some of these embodiments, the circuit board is a flexible circuit board; fingerprint module and sensitization module integrated configuration still include the stiffening plate, and the quantity of stiffening plate includes one, and the stiffening plate extends to the second region from first region, or the quantity of stiffening plate includes two, and one of two stiffening plates corresponds first region and installs on the surface that the sensitization module was kept away from to the circuit board, and another one of two stiffening plates corresponds the second region and installs on the surface that the fingerprint module was kept away from to the circuit board.
Based on the above embodiment, the circuit board is a flexible circuit board, so that the fingerprint module, the photosensitive module and the electric connector are not required to be constrained and installed in a certain plane, the installation of the fingerprint module and the photosensitive module combined structure is more flexible, and the electric connector is convenient to be connected with an external circuit. The installation steadiness that installation stiffening plate can effectively improve fingerprint module and sensitization module, and then improves the equipment yield.
In some embodiments, the fingerprint module and photosensitive module combination structure further comprises a light shielding member for blocking light between the fingerprint module and the photosensitive module; the light-shading part is arranged around one of the peripheries of the fingerprint module and the photosensitive module or arranged between the fingerprint module and the photosensitive module.
Based on above-mentioned embodiment, all need receiving and dispatching light in fingerprint module and the sensitization module course of operation, add and establish the light-shading piece and can prevent fingerprint module and sensitization module light mutual interference.
In a second aspect, an embodiment of the present application provides an electronic device, including the fingerprint module and the photosensitive module integrated configuration and display screen as described above. Fingerprint module and sensitization module all have the sensitization side, and the display screen covers in the sensitization side of fingerprint module and sensitization module.
Based on this application embodiment provides electron device, be applied to electron device with fingerprint module and sensitization module integrated configuration, be convenient for this electron device frivolous design.
In some embodiments, the electronic device further includes a middle frame, the middle frame is located between the display screen and the circuit board, two avoiding openings are arranged on the middle frame, the circuit board is installed on one side of the middle frame, which is far away from the display screen, and the fingerprint module and the photosensitive module are installed corresponding to the two avoiding openings respectively.
Based on above-mentioned embodiment, can adjust and control the installation interval between two keep away a position openings according to fingerprint module and sensitization module installation interval's requirement, fingerprint module and sensitization module are installed respectively and still can be saved installation space in two keep away a position opening.
In some embodiments, the electronic device further includes a middle frame, the middle frame is provided with a avoiding opening, the first region of the circuit board and the photosensitive module are mounted in the avoiding opening, and the second region of the circuit board and the fingerprint module are located between the middle frame and the display screen.
Based on above-mentioned embodiment, there is the difference at fingerprint module and sensitization module along the thickness of perpendicular to display screen panel face direction under the condition, sets up on the center and keeps away a position opening, installs fingerprint module or sensitization module in keeping away a position opening, the distance between nimble adjustment fingerprint module or sensitization module and the display screen of being convenient for.
In some embodiments, the electronic device further includes a middle frame, a mounting groove is disposed on a side of the middle frame adjacent to the display screen, and the first region and the photosensitive module of the circuit board, the second region and the fingerprint module of the circuit board are disposed in the mounting groove.
Based on above-mentioned embodiment, the bottom surface of mounting groove can set up to the plane, and the circuit board is kept away from fingerprint module and sensitization module one side and the installation of mounting groove bottom surface laminating, helps improving the installation roughness of fingerprint module and sensitization module on the circuit board.
In some embodiments, the display screen further has an opening area on a side thereof adjacent to the combined structure of the fingerprint module and the photosensitive module, the opening area corresponding to the fingerprint module or the fingerprint module and the photosensitive module; the electronic device further comprises a buffer layer, the buffer layer is arranged between the display screen and the fingerprint module and between the fingerprint module and the photosensitive module combined structure, and the buffer layer and the perforated area are arranged independently along the vertical direction of the display screen.
Based on the above embodiment, the opening area can enable light to smoothly pass through the display screen. The buffer layer is used for providing the support for fingerprint module and sensitization module integrated configuration, prevents that fingerprint module and sensitization module integrated configuration from contacting with the display screen outside, still can be used to the light between separation fingerprint module and the sensitization module.
The application provides a fingerprint module and sensitization module integrated configuration and electron device installs fingerprint module and sensitization module in the different regions of same circuit board jointly, need not to be equipped with a circuit board respectively for fingerprint module and sensitization module again, saves installation space. Also need not the rethread and install fingerprint module and sensitization module alone, save installation procedure. Fingerprint module and sensitization module can have multiple mounting means on the circuit board to make fingerprint module and sensitization module integrated configuration install the also nimble various of mounting means on electron device, be convenient for improve fingerprint module and sensitization module integrated configuration's suitability.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic perspective view of a combined structure of a fingerprint module and a photosensitive module according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a three-dimensional structure of a fingerprint module and a photosensitive module at another view angle in FIG. 1;
FIG. 3 is a schematic perspective view of a combined structure of a fingerprint module and a photosensitive module according to another embodiment of the present application;
FIG. 4 is a schematic perspective view of a combined structure of a fingerprint module and a photosensitive module according to another embodiment of the present application;
FIG. 5 is a cross-sectional view of an electronic device according to an embodiment of the present application;
FIG. 6 is a cross-sectional view of an electronic device according to a second embodiment of the present application;
FIG. 7 is a cross-sectional view of an electronic device in accordance with a third embodiment of the present application;
fig. 8 is a cross-sectional view of an electronic device in accordance with a fourth embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The installation space is occupied to fingerprint module and the sensitization module of considering independent installation, and can increase assembly process, and this application embodiment provides a fingerprint module and sensitization module integrated configuration, optimizes fingerprint module and sensitization module mounting structure. As shown in fig. 1, the fingerprint module and the photosensitive module assembly structure 100 include a fingerprint module 110, a photosensitive module 120 and a circuit board 130, wherein the fingerprint module 110 and the photosensitive module 120 are installed on the same circuit board 130.
Specifically, in the embodiment of the present application, the circuit board 130 has a first area and a second area, the first area is used for carrying and electrically connecting the photosensitive module 120, the second area is used for carrying and electrically connecting the fingerprint module 110, and the circuit board 130 is further used for electrically connecting an external circuit, so that the fingerprint module 110 and the photosensitive module 120 can transmit an electrical signal with the external circuit through the circuit board 130. The fingerprint signal generated by the fingerprint module 110 and the photosensitive signal generated by the photosensitive module 120 are transmitted to the external circuit by the conductive circuit on the circuit board 130, and then the fingerprint information and the photosensitive information are respectively detected by the external circuit. Install fingerprint module 110 and sensitization module 120 in the different regions of same circuit board 130 jointly, need not to be equipped with a circuit board 130 respectively for fingerprint module 110 and sensitization module 120 again, save installation space. During the equipment, still be convenient for shift fingerprint module 110 and sensitization module 120 to the installation position with circuit board 130 together, need not the rethread and install fingerprint module 110 and sensitization module 120 respectively, save installation procedure.
As shown in fig. 2, the fingerprint module and photosensitive module assembly 100 in the embodiment of the present invention further includes an electrical connector 140, the electrical connector 140 is disposed on the circuit board 130 and electrically connected to the circuit board 130, the electrical connector 140 is used for electrically connecting to an external circuit and transmitting an electrical signal between the circuit board 130 and the external circuit, that is, the fingerprint module 110 and the photosensitive module 120 share one electrical connector 140 to transmit the electrical signal to the external circuit. If the fingerprint module 110 and the photosensitive module 120 are connected to the external circuit through one electrical connector 140 respectively to transmit the electrical signal, the two electrical connectors 140 are independently installed and still need to be connected to the external circuit respectively, and the assembling process is relatively complicated. When the fingerprint module 110, the electrical connector 140, the fingerprint module 120 and the circuit board 130 are transferred to the installation position, and the electrical connector 140 is electrically connected to the main board.
Specifically, the electrical connector 140 may include a fingerprint signal terminal, a photosensitive signal terminal and an external circuit connection terminal, the circuit board 130 has a first conductive trace and a second conductive trace, two ends of the first conductive trace are respectively connected to the photosensitive module 120 and the photosensitive signal terminal, the photosensitive module 120 transmits the photosensitive signal to the electrical connector 140 through the first conductive trace, and then transmits the photosensitive signal to the external circuit for photosensitive analysis through the electrical connector 140. The second conducting circuit both ends are connected with fingerprint module 110 and fingerprint signal end respectively, and fingerprint module 110 passes through the second conducting circuit and gives electric connector 140 with fingerprint signal transmission, transmits by electric connector 140 again and carries out fingerprint analysis for external circuit. The first conductive trace and the second conductive trace are independently disposed on the circuit board 130, and transmit the light sensing signal and the fingerprint signal to the electrical connector 140 without interfering with each other.
Fingerprint module 110 and sensitization module 120 all need the sensing light, and in the installation, but the position of sensitization is located with the sensitization side of fingerprint module 110 and the sensitization side of sensitization module 120. The electrical connector 140 is connected to an external circuit, and therefore, the area on the circuit board 130 is divided so that the fingerprint module 110, the photosensitive module 120 and the electrical connector 140 are respectively mounted at suitable positions. For example, when the electrical connector 140 is installed at a relatively long distance from the fingerprint module 110 and the photosensitive module 120, the circuit board 130 needs to extend to an external circuit to connect the electrical connector 140 with the external circuit.
In some embodiments, as shown in fig. 3, the circuit board 130 may include a main body 1311 and a connection portion 1312 connected to the main body 1311, wherein a first area and a second area are both disposed on the main body 1311, the electrical connector 140 is disposed on the connection portion 1312, and the first conductive trace and the second conductive trace are led out from the main body 1311 to the connection portion 1312 to be connected to the electrical connector 140, that is, the first area and the second area are disposed adjacent to each other, so that the fingerprint module 110 and the photo sensor module 120 are mounted on the circuit board 130 side by side, which facilitates the modular mounting of the fingerprint module 110 and the photo sensor module 120. The extending direction of the connecting portion 1312 may be set according to actual installation requirements, for example, the connecting portion 1312 may be a straight strip or a multi-stage bent extending in a direction away from the main body 1311 to connect the electrical connector 140 with an external circuit.
In some embodiments, as shown in fig. 1 and 4, the circuit board 130 may include a first portion 1321, a second portion 1323, a first connection portion 1322 connecting the first portion 1321 and the second portion 1323, and a second connection portion 1324 connected to at least one of the first portion 1321, the second portion 1323, and the first connection portion 1322, wherein the first region is disposed on the first portion 1321, the second region is disposed on the second portion 1323, and the electrical connector 140 is disposed on the second connection portion 1324. Install fingerprint module 110, sensitization module 120 and electric connector 140 in the three different parts on circuit board 130, through the connected mode of adjustment second connecting portion 1324 and first part 1321, second part 1323 and first connecting portion 1322, change the interval between fingerprint module 110, sensitization module 120 and the electric connector 140 three, the installation is more nimble.
Referring again to fig. 1, the second area for mounting the fingerprint module 110 may extend to cover the second portion 1323 completely. Referring to fig. 4, the second area for mounting the fingerprint module 110 may partially cover the second portion 1323, so as to mount other components on other areas of the circuit board 130.
The first connection portion 1322 is connected to the first portion 1321 and the second portion 1323 at two ends, and the second connection portion 1324 can be installed in three ways, that is, the second connection portion 1324 can be separately connected to one of the first portion 1321, the second connection portion 1324 and the second portion 1323, and the position of the second connection portion 1324 can be adjusted to facilitate flexible installation of the electrical connector 140.
When the second connection portion 1324 is connected to the first portion 1321, the first conductive trace extends from the first portion 1321 to the second connection portion 1324 to be connected to the electrical connector 140, and the second conductive trace extends from the second portion 1323 to the first connection portion 1322, the first portion 1321, and the second connection portion 1324 to be connected to the electrical connector 140.
When the second connection portion 1324 is connected to the second portion 1323, the first conductive trace extends from the first portion 1321 to the first connection portion 1322, the second portion 1323, and the second connection portion 1324 to be connected to the electrical connector 140, and the second conductive trace extends from the second portion 1323 to the second connection portion 1324 to be connected to the electrical connector 140.
When the second connection portion 1324 is connected to the first connection portion 1322, the first conductive trace extends from the first portion 1321 to the first connection portion 1322 and the second connection portion 1324 to be connected to the electrical connector 140, and the second conductive trace extends from the second portion 1323 to the first connection portion 1322 and the second connection portion 1324 to be connected to the electrical connector 140.
In order to facilitate the flexible installation of the fingerprint module 110, the photosensitive module 120 and the electrical connector 140, the circuit board 130 is a flexible circuit board 130 in the embodiment of the present application, so that the fingerprint module 110, the photosensitive module 120 and the electrical connector 140 are not necessarily constrained to be installed in a certain plane. For example, the electrical connector 140 may be bent to a side of the circuit board 130 away from the fingerprint module 110 and the photosensitive module 120 and then connected to an external circuit, so as to save the installation space and facilitate adjustment of the interval between the installation board provided with the external circuit and the circuit board 130; or under the condition that the photosensitive module 120 and the fingerprint module 110 are respectively installed on the first portion 1321 and the second portion 1323 of the circuit board 130, the first connecting portion 1322 connected with the first portion 1321 and the second portion 1323 is bent and installed, so that the installation positions of the photosensitive module 120 and the fingerprint module 110 can be conveniently adjusted.
The circuit board 130 includes the first surface that is located one side and the second surface that backs on the back with the first surface, and in some embodiments, the fingerprint module 110, sensitization module 120 all locate circuit board 130 homonymy and locate the first surface, make the sensitization side of fingerprint module and the sensitization side of sensitization module locate circuit board 130 homonymy, the installation of fingerprint module 110 and sensitization module 120 of being convenient for, for example, be convenient for install fingerprint module 110 and sensitization module 120 in the display screen below jointly, listen the light that comes from the display screen side jointly. The electrical connector 140 may be disposed on the same side of the first surface as the fingerprint module 110 and the photosensitive module 120, and the electrical connector 140 may also be disposed on the second surface, specifically, the mounting position of the electrical connector 140 may be set according to the mounting requirement. For example, when the mounting board for mounting the external circuit and the circuit board 130 are stacked, the electrical connector 140 may also be disposed on the second surface and installed on the opposite side of the fingerprint module 110 and the photosensitive module 120, so that the second connecting portion 1324 is bent to drive the electrical connector 140 to be connected to the external circuit on the side away from the fingerprint module 110 and the photosensitive module 120.
In order to save the installation space and reduce the installation thickness of the fingerprint module and photosensitive module assembly structure 100, in some embodiments, at least one of the first region of the circuit board 130 and the second region of the circuit board 130 is provided with an installation opening 134, and the fingerprint module 110 and the photosensitive module 120 are installed corresponding to the installation opening 134. For example, as shown in fig. 4, a mounting opening 134 may be disposed in a first region of the circuit board 130, the photosensitive module 120 is mounted in the mounting opening 134, and the fingerprint module 110 in a second region of the circuit board 130 is mounted on the surface of the circuit board 130; alternatively, as shown in fig. 3, a mounting opening 134 is respectively disposed in the first region of the circuit board 130 and the second region of the circuit board 130, and the photosensitive modules 120 and the fingerprint modules 110 are correspondingly mounted at the mounting openings 134. The fingerprint module 110 and the photosensitive module 120 installed at the installation opening 134 can be fixed at the installation opening 134 by the protection adhesive 170. The protective adhesive 170 may be UV adhesive or the like.
Fingerprint module 110 and sensitization module 120 are installed on circuit board 130, need to ensure fingerprint module 110 and sensitization module 120's installation stability. Especially, under the condition that one of them part of circuit board 130 need buckle the installation, can lead to the regional warp deformation of sensitization module 120 or fingerprint module 110, and then influence the sensitization performance of sensitization module 120 or the fingerprint identification performance of fingerprint module 110. In the embodiment of this application, fingerprint module and sensitization module integrated configuration 100 still include stiffening plate 150, and stiffening plate 150 corresponds first region or second region and installs in circuit board 130 and keep away from the surface of sensitization module 120 or fingerprint module 110 to reduce the angularity of sensitization module 120 and fingerprint module 110 on circuit board 130, protect sensitization module 120 and fingerprint module 110, improve fingerprint module and sensitization module integrated configuration 100's mechanical strength. The reinforcing plate 150 may be a steel reinforcing plate or the like.
In some embodiments, the number of the reinforcing plates 150 includes one, and the reinforcing plate 150 extends from the first area to the second area, so as to protect the photosensitive module 120 and the fingerprint module 110 more completely. Meanwhile, the reinforcing plate 150 also covers the region between the first region and the second region in the process of extending from the first region to the second region, so that the region between the first region and the second region is not bent any more, the installation stability of the fingerprint module 110 and the photosensitive module 120 is improved, and the assembly yield is further improved. Of course, the reinforcing plate 150 may extend to cover other areas of the circuit board 130 besides the first area and the second area, so as to improve the flatness of the circuit board 130 and protect other components mounted on the circuit board 130.
In some embodiments, the number of the reinforcing plates 150 includes two, one of the two reinforcing plates 150 corresponds to the first region and is mounted on the surface of the circuit board 130 away from the photosensitive module 120, and the other of the two reinforcing plates 150 corresponds to the second region and is mounted on the surface of the circuit board 130 away from the fingerprint module 110. Make two stiffening plates 150 and fingerprint module 110 and sensitization module 120 correspond the installation, protect fingerprint module 110 and sensitization module 120 respectively. Because of the protection of the reinforcing plates 150, even if the circuit board 130 between the two reinforcing plates 150 is partially bent, the installation smoothness of the fingerprint module 110 and the photosensitive module 120 is not affected.
All need emitted light in fingerprint module 110 and the sensitization module 120 course of work, for preventing light mutual interference between fingerprint module 110 and the sensitization module 120, in this application embodiment, fingerprint module and sensitization module integrated configuration 100 still including being used for the separation fingerprint module 110 and the piece 160 that shades of light between the sensitization module 120. The light shielding member 160 is installed around one of the fingerprint module 110 and the photosensitive module 120 or located between the fingerprint module 110 and the photosensitive module 120. The light shielding member 160 can be adhered to the circuit board 130 by a light shielding material, for example, the light shielding member 160 can be made of rubber, silica gel or foam, the light shielding member 160 can be configured to be an annular structure adhered to the circuit board 130 and annularly disposed on the periphery of one of the fingerprint module 110 and the photosensitive module 120, and the light shielding member 160 can also be configured to be a flat plate or a straight strip adhered to the circuit board 130 and located between the fingerprint module 110 and the photosensitive module 120.
The embodiment of the present application further provides an electronic device 200. The electronic device 200 includes the fingerprint module and photosensitive module assembly 100 and the display screen 210. As shown in fig. 5, the fingerprint module 110 and the photosensitive module 120 both have a photosensitive side, and the display screen 210 covers the photosensitive side of the fingerprint module 110 and the photosensitive module 120. When the user's finger touches the display screen 210, the fingerprint module 110 emits light to the finger and receives the light reflected back by the finger, and the light is transmitted to the external control circuit through the electric connector 140, and the fingerprint sensing condition is analyzed by the external control circuit. The photosensitive module 120 emits light to the direction of the display screen 210, and transmits the sensed light signal to the external control circuit through the electrical connector 140, and the external control circuit analyzes the ambient light change. The external control circuit may control the circuits on the motherboard for the electronic device 200.
For the installation that makes things convenient for fingerprint module 110 and sensitization module 120, electronic device 200 still includes center 220, through the structure of adjustment center 220, adjustable fingerprint module 110 and sensitization module 120's installation space, and then the installation space that fingerprint module 110 and sensitization module 120 occupy on electronic device 200 are convenient for adjust.
In some embodiments, as shown in fig. 5, the middle frame 220 is located between the display screen 210 and the circuit board 130, two avoiding openings 221 are formed in the middle frame 220, the circuit board 130 is installed on one side of the middle frame 220 away from the display screen 210, the fingerprint module 110 and the photosensitive module 120 are installed corresponding to the two avoiding openings 221, the installation distance between the two avoiding openings 221 can be adjusted according to the requirement of the installation distance between the fingerprint module 110 and the photosensitive module 120, and the installation space occupied by the fingerprint module 110 and the photosensitive module 120 can be further saved.
In some embodiments, as shown in fig. 6, a avoiding opening 221 is formed on the middle frame 220, the first area of the circuit board 130 and the photosensitive module 120 are mounted in the avoiding opening 221, and the second area of the circuit board 130 and the fingerprint module 110 are located between the middle frame 220 and the display screen 210. Alternatively, the first area of the circuit board 130 and the photosensitive module 120 may be mounted between the middle frame 220 and the display screen 210, and the second area of the circuit board 130 and the fingerprint module 110 may be mounted at the avoiding opening 221. Under the condition that there is the difference in thickness of fingerprint module 110 and sensitization module 120 along perpendicular to display screen 210 face direction, set up on center 220 and keep away a opening 221, install fingerprint module 110 or sensitization module 120 in keeping away a opening 221, be convenient for adjust the distance between fingerprint module 110 or sensitization module 120 and the display screen 210 in a flexible way. Furthermore, a containing groove 223 communicated with the avoiding opening 221 may be further disposed on the middle frame 220, one of the second area of the circuit board 130 and the fingerprint module 110 or the first area of the circuit board 130 and the photosensitive module 120 is mounted at the avoiding opening 221, and the other is contained in the containing groove 223.
In some embodiments, a mounting groove 222 is disposed on a side of the middle frame 220 adjacent to the display screen 210, and the first region of the circuit board 130 and the photosensitive module 120, the second region of the circuit board 130 and the fingerprint module 110 are disposed in the mounting groove 222, so that the fingerprint module and the photosensitive module assembly structure 100 can be conveniently mounted in the mounting groove 222 together. The bottom surface of mounting groove 222 can set up to the plane, and fingerprint module 110 and sensitization module 120 are kept away from to circuit board 130 one side and the installation of mounting groove 222 bottom surface laminating, help improving the installation roughness of fingerprint module 110 and sensitization module 120 on circuit board 130.
One side of the display screen 210 adjacent to the fingerprint module and the photosensitive module combined structure 100 further has an opening area 211, and the opening area 211 corresponds to the fingerprint module 110 or the fingerprint module 110 and the photosensitive module 120, so that the light transmitted and received by the fingerprint module 110 or the photosensitive module 120 can smoothly pass through the display screen 210. The electronic device 200 further includes a buffer layer 230, the buffer layer 230 is disposed between the display screen 210 and the fingerprint module and photosensitive module assembly 100, and the buffer layer 230 and the opening area are disposed independently along a direction perpendicular to the panel of the display screen 210. Specifically, the opposite sides of the buffer layer 230 may be attached to the surfaces of the display screen 210 and the circuit board 130. Buffer layer 230 is used for providing the support in order to prevent fingerprint module and sensitization module integrated configuration 100 and display screen 210 contact for fingerprint module and sensitization module integrated configuration 100, still can be used to the light between separation fingerprint module 110 and the sensitization module 120. The buffer layer 230 can be made of rubber, silica gel or foam.
The following description will be made with reference to the specific embodiments to describe the mounting structure of the fingerprint module and photosensitive module assembly 100 on the electronic device 200.
Example one
As shown in fig. 5, in the present embodiment, the circuit board 130 is a flexible circuit board 130, the circuit board 130 includes a first portion 1321, a second portion 1323, a first connection portion 1322 and a second connection portion 1324, two ends of the first connection portion 1322 are respectively connected to the first portion 1321 and the second portion 1323, and the second connection portion 1324 is connected to the second portion 1323. The photosensitive module 120 is installed on the first portion 1321 of the circuit board 130, the fingerprint module 110 is installed on the second portion 1323 of the circuit board 130, and the second area where the fingerprint module 110 is installed completely covers the surface of the second portion 1323. The photosensitive module 120 and the fingerprint module 110 are mounted on the same side of the first surface of the circuit board 130, and the electrical connector 140 is mounted on the second surface of the mounting board, where the first surface and the second surface are disposed opposite to each other. The first conductive traces are connected to the photo module 120 and extend from the first portion 1321 to the first connection portion 1322, the second portion 1323, and the second connection portion 1324 to be connected to the electrical connector 140, and the second conductive traces are connected to the fingerprint module 110 and extend from the second portion 1323 to the second connection portion 1324 to be connected to the electrical connector 140. The number of the reinforcing plates 150 is two, one of the two reinforcing plates 150 corresponds to the first region and is installed on the surface of the circuit board 130 away from the photosensitive module 120, and the other one of the two reinforcing plates 150 corresponds to the second region and is installed on the surface of the circuit board 130 away from the fingerprint module 110. The periphery of the photosensitive module 120 is circumferentially provided with a light shielding member 160, and the light shielding member 160 is mounted on the surface of the circuit board 130.
When installing fingerprint module and sensitization module integrated configuration 100 on center 220, make center 220 be located between display screen 210 and the circuit board 130, be equipped with two on the center 220 and keep away a position opening 221, circuit board 130 is installed in one side that center 220 kept away from display screen 210, fingerprint module 110 is installed in one of them keeps away a position opening 221, first connecting portion 1322 buckles to set up and drives sensitization module 120 and install in another keep away a position opening 221 department, and make the sensitization side of fingerprint module 110 and the sensitization side of sensitization module 120 correspond two open hole regions on the display screen 210 respectively. The second connecting portion 1324 can be bent to drive the electrical connector 140 to connect with a circuit on the electronic device 200, for example, the electrical connector 140 can be connected with a circuit on a motherboard of the electronic device 200. The peripheral light-shielding piece 160 tip of light-shielding piece 160 of sensitization module 120 is located to the ring and is installed in display screen 210 surface, and light between separation fingerprint module 110 and the sensitization module 120, light-shielding piece 160 still can provide the support for sensitization module 120, prevents sensitization module 120 and display screen 210 contact.
Example two
As shown in fig. 6, the present embodiment is different from the first embodiment in that: fingerprint module 110 installs in the second portion 1323 of circuit board 130, and the second area of installation fingerprint module 110 all covers second portion 1323 surface, and second portion 1323 is equipped with an installing opening 134, is equipped with protection in the installing opening 134 and glues 170, and fingerprint module 110 is located in the installing opening 134, and fingerprint module 110 direct mount is on stiffening plate 150 surface, and fingerprint module 110 is peripheral to be glued 170 and installing opening 134 wall through the protection.
When the fingerprint module and photosensitive module combination structure 100 is mounted on the middle frame 220, the middle frame 220 is provided with a avoiding opening 221, one side of the middle frame 220 close to the display screen 210 is provided with a containing groove 223 communicated with the avoiding opening 221, the first area of the circuit board 130 and the photosensitive module 120 are mounted on the avoiding opening 221, and the first connecting portion 1322 is bent to enable the second area of the circuit board 130 and the fingerprint module 110 to be mounted in the containing groove 223. The buffer layer 230 arranged between the display screen 210 and the fingerprint module and photosensitive module combined structure 100 is partially arranged on the surface of the first portion 1321, and the other side of the buffer layer 230 is attached to the display screen 210, so that the buffer layer 230 arranged in this way can simultaneously take buffering and shading effects into consideration.
EXAMPLE III
As shown in fig. 7, in the present embodiment, the circuit board 130 is a flexible circuit board, the circuit board 130 includes a main body 1311 and a connection portion 1312 connected to the main body 1311, the first region and the second region are both disposed on the main body 1311, the electrical connector 140 is disposed on the connection portion 1312, and the first conductive trace and the second conductive trace are led out from the main body 1311 to the connection portion 1312 to be connected to the electrical connector 140. The number of the reinforcing plates 150 includes one and is mounted to the second surface of the circuit board 130, and the reinforcing plates 150 extend from the first region to the second region. The fingerprint module 110 is mounted on the first surface of the circuit board 130, the main body 1311 has a mounting opening 134, and the photosensitive module 120 is disposed in the mounting opening 134 and mounted on the surface of the reinforcing plate 150. The periphery of the photosensitive module 120 is circumferentially provided with a light shielding member 160, and the light shielding member 160 is mounted on the surface of the reinforcing plate 150. The electrical connector 140 is mounted on a second surface of the circuit board 130, and the first surface is opposite to the second surface.
When installing fingerprint module and sensitization module integrated configuration 100 on center 220, one side that center 220 is close to display screen 210 is equipped with mounting groove 222, and the first region of circuit board 130 and sensitization module 120, the second region of circuit board 130 and fingerprint module 110 are located mounting groove 222, and the bottom surface of mounting groove 222 is the plane, and stiffening plate 150 directly laminates and installs on the bottom surface of mounting groove 222. And the photosensitive side of the fingerprint module 110 and the photosensitive side of the photosensitive module 120 correspond to the two opening regions on the display screen 210 respectively. The connecting portion 1312 can be bent to drive the electrical connector 140 to connect with a circuit on the electronic device 200, for example, the electrical connector 140 can be connected with a circuit on a motherboard of the electronic device 200. The end of the light shielding member 160 surrounding the periphery of the photosensitive module 120 is mounted on the surface of the display screen 210 to block light between the fingerprint module 110 and the photosensitive module 120. The buffer layer 230 disposed between the display screen 210 and the fingerprint module and photosensitive module assembly 100 is partially disposed on the surface of the main body 1311, and the other side of the buffer layer 230 is attached to the display screen 210, so that the buffer layer 230 can play a role of buffering and can play a role of shielding light together with the light shielding member 160.
Example four
As shown in fig. 8, the present embodiment is different from the third embodiment in that two mounting openings 134 are formed on the main body 1311, and the photosensitive modules 120 and the fingerprint modules 110 are mounted in the mounting openings 134 and on the surface of the reinforcing plate 150 in a one-to-one correspondence manner. Be equipped with protection in the installation opening 134 of installation fingerprint module 110 and glue 170, fingerprint module 110 connects in installation opening 134 wall through protection glue 170.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (13)

1. The utility model provides a fingerprint module and sensitization module integrated configuration which characterized in that includes:
a fingerprint module;
a photosensitive module; and
the circuit board is provided with a first area and a second area, the first area is used for bearing and electrically connecting the photosensitive module, the second area is used for bearing and electrically connecting the fingerprint module, and the circuit board is also used for electrically connecting an external circuit, so that the fingerprint module and the photosensitive module can transmit electric signals with the external circuit through the circuit board.
2. The assembly structure of fingerprint module and photosensitive module of claim 1 further comprising an electrical connector disposed on the circuit board and electrically connected to the circuit board, the electrical connector further electrically connected to the external circuit and transmitting electrical signals between the circuit board and the external circuit;
the electric connector includes fingerprint signal end, sensitization signal end and external circuit link, the circuit board has first conducting wire and second conducting wire, first conducting wire both ends respectively with sensitization module with the sensitization signal end is connected, second conducting wire both ends respectively with the fingerprint module with the fingerprint signal end is connected.
3. The combination of a fingerprint module and a photosensitive module according to claim 2, wherein the circuit board comprises a main body portion and a connecting portion connected to the main body portion, the first region and the second region are both disposed on the main body portion, the electrical connector is disposed on the connecting portion, and the first conductive trace and the second conductive trace are led out from the main body portion to the connecting portion to be connected to the electrical connector.
4. The fingerprint module and photosensitive module combination structure of claim 2, wherein the circuit board comprises a first portion, a second portion, a first connection portion connecting the first portion and the second portion, and a second connection portion connected to at least one of the first portion, the second portion, and the first connection portion, the first area is disposed on the first portion, the second area is disposed on the second portion, and the electrical connector is disposed on the second connection portion;
the first conductive traces extend from the first portion to the second connection portion to connect with the electrical connector, and the second conductive traces extend from the second portion to the first connection portion, the first portion, the second connection portion to connect with the electrical connector.
5. The combination structure of the fingerprint module and the photosensitive module of claim 2, wherein the circuit board comprises a first surface on one side and a second surface opposite to the first surface, the fingerprint module and the photosensitive module are both disposed on the same side of the circuit board and disposed on the first surface, and the electrical connector is disposed on the second surface.
6. The assembly structure of fingerprint module and photosensitive module according to claim 2, wherein said first area and said second area are provided with mounting openings, and said fingerprint module and said photosensitive module are mounted corresponding to said mounting openings.
7. The fingerprint module and photosensitive module assembly of claim 1, wherein the circuit board is a flexible circuit board; the fingerprint module and photosensitive module combined structure further comprises one reinforcing plate, and the number of the reinforcing plates comprises one, and the reinforcing plate extends from the first area to the second area; or the quantity of stiffening plate includes two, two one of the stiffening plate corresponds first region and installs the circuit board is kept away from the surface of sensitization module, two another one of the stiffening plate corresponds the second region and installs the circuit board is kept away from the surface of fingerprint module.
8. The assembly structure of fingerprint module and photosensitive module according to claim 1, wherein the assembly structure of fingerprint module and photosensitive module further comprises a light shielding member for blocking light between the fingerprint module and the photosensitive module; the light shading piece is annularly arranged and installed on the periphery of one of the fingerprint module and the photosensitive module or installed between the fingerprint module and the photosensitive module.
9. An electronic device is characterized in that a first electronic component is connected to a second electronic component,
the fingerprint module and photosensitive module combination structure comprises the fingerprint module and photosensitive module combination structure as claimed in any one of claims 1 to 8, wherein the fingerprint module and the photosensitive module are provided with photosensitive sides; and
the display screen, the display screen cover in the fingerprint module with the sensitization side of sensitization module.
10. The electronic device according to claim 9, further comprising a middle frame, wherein the middle frame is located between the display screen and the circuit board, two avoiding openings are formed in the middle frame, the circuit board is installed on one side of the middle frame, which is far away from the display screen, and the fingerprint module and the photosensitive module are installed corresponding to the two avoiding openings respectively.
11. The electronic device according to claim 9, further comprising a middle frame, wherein a space-avoiding opening is formed in the middle frame, the first region of the circuit board and the photosensitive module are mounted in the space-avoiding opening, and the second region of the circuit board and the fingerprint module are located between the middle frame and the display screen.
12. The electronic device according to claim 9, further comprising a middle frame, wherein a mounting groove is formed in a side of the middle frame adjacent to the display screen, and the first region and the photosensitive module of the circuit board, the second region of the circuit board and the fingerprint module are located in the mounting groove.
13. The electronic device according to claim 9, wherein the display screen further has an opening area on a side thereof adjacent to the combined structure of the fingerprint module and the photosensitive module, the opening area corresponding to the fingerprint module or the fingerprint module and the photosensitive module; the electronic device further comprises a buffer layer, wherein the buffer layer is arranged between the display screen and the fingerprint module and photosensitive module combined structure and is arranged in the direction vertical to the panel surface of the display screen, and the buffer layer and the opening area are mutually independently arranged.
CN202021494567.6U 2020-07-23 2020-07-23 Fingerprint module and photosensitive module combination structure and electronic device Active CN212933536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021494567.6U CN212933536U (en) 2020-07-23 2020-07-23 Fingerprint module and photosensitive module combination structure and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021494567.6U CN212933536U (en) 2020-07-23 2020-07-23 Fingerprint module and photosensitive module combination structure and electronic device

Publications (1)

Publication Number Publication Date
CN212933536U true CN212933536U (en) 2021-04-09

Family

ID=75332174

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021494567.6U Active CN212933536U (en) 2020-07-23 2020-07-23 Fingerprint module and photosensitive module combination structure and electronic device

Country Status (1)

Country Link
CN (1) CN212933536U (en)

Similar Documents

Publication Publication Date Title
KR102362598B1 (en) Printed circuit board and display device comprising the same
KR102651992B1 (en) Electronic device including acoustic module
KR100850400B1 (en) Liquid crystal display device
EP1637921B1 (en) Liquid crystal display device and a mobile information terminal including a liquid crystal display device
KR20200117137A (en) Electronic device including display
US11245207B2 (en) Stack structure of printed circuit boards using interposer and electronic device including the same
US20210243907A1 (en) Electronic device including air vent
US10602249B2 (en) Electronic device conduit structure and electronic device including same
EP3770673B1 (en) Electronic device including optical sensor module
KR20200117427A (en) Electronic device including 3d depth sensor module
KR20200126570A (en) Electronic device having waterproof structure for electronic component
US11729918B2 (en) Electronic device comprising removable adhesive member
JP7271162B2 (en) Electronics
CN108087793B (en) Backlight module and electronic equipment
CN212933536U (en) Fingerprint module and photosensitive module combination structure and electronic device
EP4207962A1 (en) Electronic device including waterproof structure
CN214138245U (en) Thinned vehicle-mounted touch backlight device and display device
CN108683750B (en) Electronic device and method for manufacturing the same
KR20200001221A (en) Antenna clip and electronic device comprising the same
EP4124004A1 (en) Electronic device including sound module
US20210212209A1 (en) Electronic device including structure for stacking substrates
CN112866443B (en) Middle frame of electronic equipment and electronic equipment
CN115191154A (en) Electronic device including interposer
KR20220108947A (en) Electronic device including waterproof structure
CN115066875A (en) Electronic device including printed circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi oumaisi Microelectronics Co., Ltd

Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue.

Patentee before: Oufei Microelectronics Technology Co.,Ltd.

CP03 Change of name, title or address