CN212911679U

CN212911679U - Heating assembly and heating atomization device

Info

Publication number: CN212911679U
Application number: CN202020820563.6U
Authority: CN
Inventors: 张蛟; 邓金兴; 周宏明
Original assignee: Shenzhen Smoore Technology Ltd
Current assignee: Shenzhen Smoore Technology Ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2021-04-09
Anticipated expiration: 2030-05-15

Abstract

The utility model provides a heating element and heating atomizing device, wherein, heating element includes: the heating element comprises a base body, and a heating area, an overlapping area and a conductive area which are arranged on the base body, sequentially distributed along the axial direction of the base body and connected with each other, wherein the heating area is provided with a heating circuit and extends to the overlapping area, and the conductive area is provided with a conductive circuit and extends to the overlapping area and is overlapped or connected with the heating circuit in parallel; the heating element is fixed at one end of the fixing seat, and at least part of the fixing seat is in contact with the overlapping area. The fixing seat is arranged in the overlapped area where the conducting circuit of the heating component and the heating circuit are overlapped, so that the electric connection stability of the conducting circuit and the heating circuit is guaranteed.

Description

Heating assembly and heating atomization device

Technical Field

The utility model relates to an atomizing technical field especially relates to a heating element and heating atomizing device.

Background

The tobacco is heated and does not burn and tends to be popular along with popularization of health concepts, the tobacco is heated and does not burn by a special cigarette, the tobacco does not need to be ignited by open fire, substances and fragrance are evaporated in an aerosol form under heating baking at 300 ℃, the aerosol can be sucked by people, the taste similar to that of traditional tobacco is generated, and harmful ingredients released by high-temperature cracking of the traditional tobacco are greatly reduced. The consumer can obtain satisfaction and reduce the harm to the body.

One core component which forms aerosol by heat generation and non-combustion is a heating element, and the heating element heats and then bakes aerosol-forming base materials such as tobacco. However, since the temperature of the heating element is high to meet the demand when the heating is performed, the fixing of the heating element is difficult.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heating element and heating atomizing device, it is fixed the fixing base in overlap area, has increased the electric connection stability of heating circuit and conducting wire.

For solving the above technical problem, the utility model provides a first technical scheme does: provided is a heat generating component including: the heating element comprises a base body, and a heating area, an overlapping area and a conductive area which are arranged on the base body, sequentially distributed along the axial direction of the base body and connected with each other, wherein the heating area is provided with a heating circuit and extends to the overlapping area, and the conductive area is provided with a conductive circuit and extends to the overlapping area and is overlapped or connected with the heating circuit in parallel; the heating element is fixed at one end of the fixing seat, and at least part of the fixing seat is in contact with the overlapping area.

Wherein the substrate is a sheet substrate; or the substrate is a columnar substrate.

Wherein the temperature of the overlapping area when heating is lower than the temperature of the heating area and the conductive area when heating.

Wherein, the heating circuit of the overlapping area is laminated on the conducting circuit of the overlapping area.

Wherein the fixing base further comprises: the heating element penetrates through the through groove to fix at least part of the flange plate on an overlapping area of the heating element, and the flange plate fixes the heating element on the base.

Wherein the flange is in full contact with the overlap region.

The outer side of the columnar base body is wrapped with a heating film, and the heating area, the overlapping area and the conductive area are arranged on one surface, close to the base body, of the heating film; and the surface of the heating film far away from the base body is provided with a conductive disc corresponding to the conductive area, the conductive disc is provided with a through hole penetrating through the heating film corresponding to the conductive area, and conductive substances are arranged in the through hole so as to electrically connect the conductive disc with the conductive circuit in the conductive area.

The heating area, the overlapping area, the conducting area and the conducting disc are arranged on one surface of the flaky base body; the conductive disc is positioned on one side of the conductive area, which is far away from the heating area.

Wherein the heating line comprises a first heating line, the conductive trace comprises a first conductive trace, and the first heating line and the first conductive trace coincide at the overlapping region; the first heating lines are distributed in a U shape, and the first conducting circuits are respectively connected with two ends of the U-shaped first heating lines; the conductive discs comprise a first positive conductive disc and a first negative conductive disc, and the first positive conductive disc and the first negative conductive disc are respectively connected with one end, far away from the first heating circuit, of the first conductive circuit.

Wherein the heating line further comprises a second heating line, the conductive trace further comprises a second conductive trace, and the second heating line and the second conductive trace coincide at the overlapping region; the second heating lines are distributed in a U shape, and the second conductive lines are respectively connected with two ends of the U-shaped second heating lines; the conductive discs comprise a second positive conductive disc and a second negative conductive disc, and the second positive conductive disc and the second negative conductive disc are respectively connected with one end, far away from the second heating circuit, of the second conductive circuit.

The first heating circuit is a line connected with the first conductive circuit in series, and the second heating circuit and the second conductive circuit are positioned on the inner sides of the first heating circuit and the first conductive circuit; or the first heating line is a plurality of lines connected in parallel with the first conductive line, and the second heating line and the second conductive line are located between the plurality of first heating lines and the first conductive line.

Wherein the first heating line and the second heating line share the first positive conductive plate or the second positive conductive plate; or the first heating circuit and the second heating circuit share the first negative conductive plate or the second negative conductive plate.

The sheet-shaped base body and the columnar base body respectively comprise a base part and a pointed part located at one end of the base part, and the heating area is close to the pointed part.

One end of the base part of the columnar matrix, which is far away from the pointed part, is provided with an inwards concave groove body.

And one sides of the heating area, the overlapping area and the conductive area, which are far away from the base body, are provided with covering protective layers, and the protective layers expose part of the conductive area.

And one end of the conductive disc, which is far away from the heating circuit, is further connected with an electrode lead wire, and the electrode lead wire is used for connecting a power supply device so as to connect the heating element with the power supply device.

The heating area, the overlapping area, the conductive area and the conductive disc are arranged on the insulating layer on one surface of the substrate.

Wherein the thickness of the heating film is 0.02-0.5 mm; or the thickness of the heating film is 0.05-0.2 mm.

Wherein the resistance of the first heating circuit is 0.5-2 ohm; and/or the resistance of the second heating line is 5-20 ohms.

Wherein the second heat emitting circuit located in the heat generating region has a resistivity greater than that of the first heat emitting circuit located in the heat generating region; and/or the resistance of the first heating line at the conductive region is equal to the resistance of the second heating line at the conductive region.

In order to solve the above technical problem, the utility model provides a second technical scheme does: provided is a heating atomization device including: a heating component and a power supply device; wherein the heating component is the heating component as described in any one of the above items; the power supply device is connected with the heating component to supply power to the heating component.

The utility model has the advantages that: be different from prior art the utility model provides a heating element is through fixing the fixing base in the overlapping region of heating line and conducting wire to guarantee the electric connection stability of heating line and conducting wire when fixing heating element.

Drawings

Fig. 1 is a schematic structural view of a first embodiment of a heating element according to the present invention;

fig. 2 is a schematic structural view of a second embodiment of the heating element of the present invention;

fig. 3 is a schematic structural view of a third embodiment of the heating assembly of the present invention;

fig. 4 is a schematic structural view of a fourth embodiment of the heating assembly of the present invention;

FIGS. 5a and 5b are schematic structural views of a first embodiment of two surfaces of a heating film in a columnar substrate;

FIG. 5c is a schematic view of the structure of at least one surface of a sheet-like substrate;

FIGS. 6a and 6b are schematic structural views of a second embodiment of two surfaces of a heating film in a columnar substrate;

FIG. 6c is a schematic structural diagram of a third embodiment of a surface of a heat generating film in a columnar substrate;

FIGS. 7a and 7b are schematic structural views of a fourth embodiment of two surfaces of a heating film in a columnar substrate;

fig. 8 is a schematic structural view of an embodiment of the heating and atomizing device of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Please refer to fig. 1, which is a schematic structural diagram of a first embodiment of a heating element according to the present invention. Wherein, the heating component comprises a heating element and a fixed seat. The heating element includes a substrate 11, and the substrate 11 may be cylindrical or sheet-shaped, and is not limited specifically. As shown in fig. 1, the base 11 of the heating element is a columnar base, and the heating area 13, the overlapping area 14 and the conductive area 15 are sequentially distributed from top to bottom along the axial direction of the base 11. Specifically, if the base 11 is a columnar base, the surface of the base 11 is provided with the heating film 12, the heating film 12 surrounds the outer side of the base 11 and covers the base 11, and the heating area 13, the overlapping area 14 and the conductive area 15 are disposed on the heating film 12. Specifically, when the heat generating film 12 wraps the cylindrical base 11, the heat generating region 13, the overlapping region 14, and the conductive region 15 on the heat generating film 12 are in contact with the outer surface of the base 11, that is, the heat generating region 13, the overlapping region 14, and the conductive region 15 are located on one surface of the heat generating film 12 close to the base 11. In one embodiment, the substrate 11 may be a ceramic substrate, such as zirconia, alumina, or the like. The ceramic material of the base 11 can provide rigid mechanical support and uniform heat for the heat generating region 13 of the heat generating film 12, and can prevent the heat generating region from breaking or preventing the heat from being unevenly distributed. Specifically, the heat generating region 13, the overlapping region 14, and the conductive region 15 are provided on one surface of the heat generating film 12, and the heat generating film 12 is provided on the surface of the base 11 by sintering, so that the heat generating region 13, the overlapping region 14, and the conductive region 15 are close to the surface of the base 11. Since the heating film 12 is formed on the outer side of the base 11 by winding, in order to prevent the heating film 12 from breaking, the heating film 12 needs to have a relatively thin thickness, in an embodiment, the thickness of the heating film 12 is 0.02-0.5 mm, and further, the thickness of the heating film may be 0.05-0.2 mm.

In one embodiment, the material of the heat generating film 12 is different from the material of the substrate 11, and the heat generating film 12 can be formed into a flexible film by a casting process, and the heat generating film 12 can be made of one or any combination of glass ceramics, glass-ceramics (such as calborosilicate glass-silicon oxide), and low-temperature ceramics (tin barium borate ceramics and zirconium barium borate ceramics) as long as the sintering can be performed below 1000 ℃.

Further, a surface of the heating film 12 away from the base 11 is further provided with a conductive plate 17 connected with the conductive area 15 for connecting with an external power supply device, so as to connect the heating element with the power supply device, so that the power supply device supplies power to the heating element.

Further, an electrode lead 19 is disposed at an end of the conductive plate 17 away from the heating region 13, and is connected to a power supply device through the electrode lead 19, so as to connect the heating element with the power supply device.

As shown in fig. 2, the base 11 of the heating element is a sheet-shaped base, wherein the base 11 may be a conductive material or a non-conductive insulating material. Specifically, as shown in fig. 2, the substrate 11 is a non-conductive insulating material, and the thickness of the substrate 11 may be 0.2 to 0.8, and preferably, the thickness of the substrate 11 is 0.3 to 0.6 mm. If the base 11 is made of a non-conductive and insulating material, the heat generating region 13, the overlapping region 14 and the conductive region 15 may be directly disposed on a surface of the base 11, and the conductive pad 17 may be disposed on a side of the conductive region 15 away from the heat generating region 13 and connected to the conductive region 15. Furthermore, because the base body 11 is a sheet-shaped base body, the heating area 13, the overlapping area 14 and the conductive area 15 are exposed, a protective layer 21 covering the heating area 13, the overlapping area 14 and the conductive area 15 is further arranged on one side of the heating area 13, the overlapping area 14 and the conductive area 15 away from the base body 11, part of the conductive area 15 is exposed by the protective layer 21, the exposed part of the conductive area 15 is used for connecting an electrode lead 19, and further is connected with a power supply device through the electrode lead 19, and further the heating element is connected with the power supply device.

In an embodiment, the protection layer 21 may be a glaze layer, which can isolate the heating region 13, the overlapping region 14 and the conductive region 15 from the outside air, and prevent the heating region 13 from being oxidized when the temperature is high, so that the heating region 13 can maintain a good heating effect for a long time, the service life and stability of the heating element can be further improved, and the surface roughness of the heating element can be reduced.

In one embodiment, when the electrode lead 19 connected to the conductive pad 17 is disposed, the conductive pad 17 and the electrode lead 19 may be connected by soldering with silver-copper solder at 600-. The electrode lead 19 can also be soldered to the position of the conductive pad 17 by means of a high-temperature solder paste (use temperature greater than 300 c).

In one embodiment, the substrate 11 may be a conductive material, as shown in fig. 3, which differs from the embodiment shown in fig. 2 in that: the substrate 11 is a conductive material. Specifically, the substrate 11 can be made of general metal materials such as stainless steel and titanium alloy, and the metal materials have good toughness, can resist long-term high temperature and mechanical impact, and have good heat conduction, so that the overall temperature of the heating element is uniform. In one embodiment, the material of the substrate 11 is preferably stainless steel, such as 430 and 304 stainless steel.

In a preferred embodiment, the substrate 11 is made of a metal material, which has high mechanical strength, so as to effectively prevent the heating element from breaking under long-term high temperature and mechanical impact (smoke loading), and meanwhile, the metal material has good heat-conducting property, so that the uniformity of the surface temperature of the heating element is ensured, and the substrate which is not burnt can be heated to obtain better taste.

Specifically, when the base 11 is made of a conductive material, it is necessary to provide the insulating layers 22 on both surfaces of the base 11 before providing the heat generating region 13, the overlapping region 14, and the conductive region 15, and to provide the heat generating region 13, the overlapping region 14, and the conductive region 15 on the insulating layers 22. In one embodiment, the insulating layer 22 is a glass layer with alumina and calcium oxide as main components, which can make the substrate 11 non-conductive and prevent the conductive paths of the heat generating region 13, the overlapping region 14 and the conductive region 15 from being short-circuited due to the conductivity of the substrate 11. The insulating layer 22 may be formed by coating the insulating layer 22 paste on the surface of the base 11 by spraying or screen printing, and then firing the coating. The thickness of the insulating layer 22 can be designed according to the requirement of the withstand voltage between the conductive path and the substrate 11. In one embodiment, the thickness of the insulating layer 22 may be set to be less than 0.1 mm.

In one embodiment, the insulating layer 22 may be disposed on one surface of the substrate 11 where the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed, and the other surface may not be disposed. Specifically, as shown in fig. 3, in the present embodiment, only one surface of the substrate 11 is provided with the heat generating region 13, the overlapping region 14 and the conductive region 15, so the insulating layer 22 may be provided on only one surface of the substrate 11. In another embodiment, even if the heat generating region 13, the overlapping region 14 and the conductive region 15 are provided on only one surface of the base 11, the insulating layer 22 may be provided on both surfaces of the base 11, so as to prevent the surface of the base 11 from being oxidized at a high temperature, and the insulating layer 22 is provided to protect the base 11 from air.

In the embodiment shown in fig. 2 and 3, the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed on only one surface of the base 11, and in one embodiment, the heat generating region 13, the overlapping region 14 and the conductive region 15 may be disposed on both surfaces of the base 11, as shown in fig. 4. Both surfaces of the base 11 are provided with a heat generating region 13, an overlapping region 14, and a conductive region 15. Specifically, the base 11 may be made of a non-conductive and insulating material similarly to the embodiment shown in fig. 2, and the base 11 may be made of a conductive material similarly to the embodiment shown in fig. 3, and if the base 11 is made of a conductive material, the insulating layers 22 are provided on both surfaces of the base 11, and the heat generating region 13, the overlapping region 14, and the conductive region 15 are provided on the insulating layers 22, similarly to the embodiment shown in fig. 3.

In the present embodiment, since the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed on both sides of the base 11, the thickness of the base 11 may be 2 times or more than 2 times of the thickness of the base 11 in the embodiments shown in fig. 2 and 3, considering the influence of the heat generating temperature, and is not limited specifically.

Specifically, if the base 11 is a columnar base, the heating film 12 is disposed on the surface of the base, the heating area 13, the overlapping area 14 and the conducting area 15 are disposed on a surface of the heating film 12 close to the base 11, the conducting disc 17 is disposed on a surface of the heating film 12 away from the base 11, an electrode lead 19 connected to the conducting area 15 is disposed at one end of the conducting disc 17 away from the heating area 13, the overlapping area 14 and the conducting area 15, and the electrode lead 19 is connected to a power supply device. If the substrate 11 is a sheet substrate and is electrically conductive, at least one surface of the substrate 11 is provided with the insulating layer 22, and the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed on the surface of the insulating layer 22 away from the substrate 11; if the base 11 is not conductive and insulated, the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed on the base 11. On the surface provided with the heating area 13, the overlapping area 14 and the conductive area 15, one end of the conductive area 15 far away from the heating area 13 is provided with a conductive disc 17, one surface of the heating area 13, the overlapping area 14 and the conductive area 15 far away from the base body 11 is further provided with a protective layer 21, the protective layer 21 exposes part of the conductive area 15, one end of the exposed part far away from the heating area 13 is provided with an electrode lead 19, and the electrode lead 19 is connected with a power supply device. The base 11 may have a heating area 13, an overlapping area 14, and a conductive area 15 on one surface, and may also have a heating area 13, an overlapping area 14, and a conductive area 15 on both surfaces, which is not limited in particular.

The heating assembly as shown in fig. 1 to 4 further includes a fixing base 16 for fixing the heating element. Specifically, in one embodiment, the temperature of the heat generating region 13 is higher than the temperatures of the overlapping region 14 and the conductive region 15, and further, the temperature of the overlapping region 14 is lower than the temperature of the conductive region 15, i.e., the temperature of the overlapping region 14 is the lowest when the heat generating element generates heat. In a specific embodiment, the fixing base 16 is fixed at the position of the overlapping area 14 of the heating element, and further, the fixing base 16 is at least partially in contact with the overlapping area 14.

Specifically, the fixing base 16 includes a flange 161 and a base 162. The flange 161 has a through-hole 163 at a middle position, the heating element passes through the through-hole 163 to fix the flange 161 to the overlapping region 14 of the heating element, and the flange 161 fixes the heating element to the base 162. Specifically, the flange 161 of the fixing base 16 is at least partially installed on the overlapping region 14, and the other part is installed on the conductive region 15, that is, the flange 161 of the fixing base 16 is not installed on the heat generating region 13, which is beneficial to balance the temperature uniformity of the heat generating region, and the conductive region 15 is fixed in the fixing base 16, which can reduce the heat generation and energy loss. In one embodiment, if the size of the overlapping region 14 is sufficient, the flange 161 can be disposed entirely on the overlapping region 14, and the conductive region 15 can be accommodated entirely in the base 162, so as to further reduce the heat generation and energy loss of the conductive region. In one embodiment, the overlap region 14 may be entirely in contact with the flange 161, or the overlap region 14 may be partially in contact with the flange 161, but it is necessary that the flange 161 be entirely located in the overlap region 14.

In one embodiment, a heating circuit is correspondingly disposed on the heating region 13, a conductive circuit is disposed on the conductive region 15, and the heating circuit and the conductive circuit are overlapped in the overlapping region 14. Wherein, the heating circuit can be one, multiple, parallel or series; the conductive line is provided corresponding to the heat emitting line, and it may be provided according to a connection end formed by the heat emitting line, for example, one conductive line connected to one connection end of the heat emitting line.

Specifically, please refer to fig. 5a, fig. 5b and fig. 5c, wherein fig. 5a and fig. 5b are schematic structural diagrams of two surfaces of the heating film in the columnar substrate shown in fig. 1. Fig. 5c is a schematic structural view of at least one surface of the sheet-like substrate shown in fig. 2 to 4. The heat generating region 13 is provided with a heat generating circuit and extends to the overlapping region 14, and the conductive region 15 is provided with a conductive circuit and extends to the overlapping region and overlaps or is connected in parallel with the heat generating circuit. Specifically, referring to fig. 5a, the heat generating region 13 is provided with a heat generating circuit, i.e., a first heat generating circuit 131. Specifically, the first heat-emitting lines 131 are distributed in a U-shape in the heat-emitting region 13 and the overlapping region 14 of the substrate 11, so that the first heat-emitting lines 131 have two connecting ends in the overlapping region 14, in this embodiment, the conductive traces include first conductive traces 151, the first conductive traces 151 are respectively connected to two ends of the U-shaped first heat-emitting lines 131, and the first conductive traces 151 at two ends of the U-shaped first heat-emitting lines 131 are not connected to each other. The first conductive trace 151 extends from the conductive region 15 to the overlap region 14, and overlaps with both connection ends of the first heat-generating line 131 in the overlap region 14. In one embodiment, the heat generating region where the overlapping region overlaps is located above the conductive line.

In one embodiment, the first heating circuit 131 is a resistance heating circuit, which generates joule heat when current passes through the heating circuit, and is capable of heating the heating element, thereby heating the non-combustible substrate. In one embodiment, the first heat emitting circuit 131 may transfer the electronic paste onto the heat emitting film 12 by screen printing the thick film paste, and then sinter the heat emitting film 12 onto the base 11. Specifically, in the present embodiment, the heat generating film 12 wraps only the base 112 of the base 11 when wrapping the base 11, and thus, when the base 11 is a columnar base, the heat generating region 13 is not distributed in the pointed portion 111.

In one embodiment, in order to match a commonly used power supply device and further enable the heating element to obtain higher heating power, the resistance value of the first heating circuit 131 may be between 0.5 ohm and 2 ohm. Specifically, the resistance value of the first heat emitting line 131 may be set according to the material of the electronic paste, the length, width, thickness of the heat emitting line, and the shape of the pattern, but is not limited thereto. In order to make the temperature on the heat generating element relatively uniform so as to obtain a larger amount of aerosol and a better taste when heating the non-combustible substrate, and to make the energy fully utilized, the wires located in different areas are made of different materials, specifically, for example, in one embodiment, the resistivity coefficients of the first heat generating wire 131 in the heat generating area 13 and the first conductive wire 151 in the conductive area 15 are different. Specifically, the resistivity of the material of the first heat emitting line 131 disposed in the heat generating region 13 is greater than the resistivity of the material of the first conductive line 151 disposed in the conductive region 15. For example, the material of the first heat-generating circuit 131 located in the heat-generating region 13 is a high-resistance conductive paste, and for example, a metal or an alloy having a relatively high resistivity, such as Ni (nickel), Ag — Pd (silver-palladium), Ag-Pt (silver-platinum), Ag-RuO (silver-ruthenium oxide), and a relatively high proportion of an inorganic binder are used as the main conducting point electrical component. The material of the first conductive traces 151 in the conductive regions 15 is a conductive paste with a low resistivity, for example, a metal or an alloy with a relatively low resistivity, such as Ag (silver) or Au (gold) as a main conductive component, and a low-ratio inorganic adhesive.

In one embodiment, since the high conductive metal such as Ag (silver), Au (gold) has a low melting point (Tc (Ag) of about 960 deg.C, Tc (Au) of about 1064 deg.C), it must be sintered at a temperature below 1000 deg.C, while the conventional ceramic (alumina, aluminum nitride) is usually sintered at 1400 deg.C and 1600 deg.C, therefore, the material of the first heat-generating circuit 131 with low resistivity in the overlapping region 14 can be disposed according to the heat-generating film 12.

In one embodiment, the corresponding resistance may be provided according to the shape of the heat emitting line and the conductive line, but the overlapping area where the heat emitting line and the conductive line overlap is the smallest regardless of the resistance values of the heat emitting line and the conductive line.

In an embodiment, the lengths of the first heat-generating circuit 131 and the first conductive trace 151 can be flexibly controlled, and the first heat-generating circuit 131 is generally distributed from bottom to top and then from top to bottom in the heat-generating region 13, for example, in a U-shaped distribution as shown in fig. 5a, so that the heat-generating region 13 of the heat-generating device has better temperature uniformity.

In one embodiment, the sheet-shaped substrate and the column-shaped substrate include a base 112 and a tip 111 at one end of the base 112, and the heat generating region 13 is close to the tip 111. Specifically, the base body 11 is provided with the pointed portion 111 to facilitate insertion of the heat generating element into the heat non-combustible substrate.

Referring to fig. 5b, a surface of the heating film 12 away from the base 11 has a conductive pad 17, as shown in fig. 5b, the conductive pad 17 is disposed corresponding to the conductive region 15. Specifically, the conductive pad 17 includes a first positive conductive pad 171 and a first negative conductive pad 172, wherein the first positive conductive pad 171 and the first negative conductive pad 172 are respectively connected to an end of the first conductive trace 151 away from the first heat-generating line 131. Specifically, through holes 18 penetrating through the heating film 12 are formed at positions of the first positive conductive pad 171 and the first negative conductive pad 172 corresponding to the first conductive traces 151, and conductive materials are filled in the through holes 18, so that the first positive conductive pad 171 and the first negative conductive pad 172 are electrically connected to the first conductive traces 15, respectively. Further, an electrode lead 19 is further disposed on the same surface of the heating film 12 as the conductive plate 17, the electrode lead 19 is connected to the conductive plate 17, specifically, one end of the electrode lead 19 is connected to the first positive conductive plate 171 and the first negative conductive plate 172, respectively, and the other end of the electrode lead 19 is connected to a power supply device, so as to connect the heating element to the power supply device.

Please refer to fig. 5c, which is a schematic structural diagram of at least one surface of the sheet-like substrate. Specifically, the sheet-shaped base 11 also includes a base 112 and a pointed portion 111, in this embodiment, the pointed portion 111 of the base 11 is distributed with the heat generating region 13, and specifically, the pointed portion 111 is provided with a first heat generating line 131. Further, the difference from fig. 5a is that in the present embodiment, the conductive pad 17, the heat generating region 13, the overlapping region 14 and the conductive region 15 are disposed on the same surface of the base 11, specifically, the first heat generating line 131 is U-shaped distributed, and the first conductive trace 151 connects both ends of the U-shaped distributed first heat generating line 131, as shown in fig. 5 a. The conductive pad 17 includes a first positive conductive pad 171 and a first negative conductive pad 172, the first positive conductive pad 171 and the first negative conductive pad 172 are connected to an end of the first conductive trace 151 away from the first heat-generating circuit 131, and the electrode lead 19 is connected to an end of the first positive conductive pad 171 and an end of the first negative conductive pad 172 away from the first conductive trace 151, further connecting the heat-generating element to the power supply device.

Specifically, in this embodiment, the first heat-emitting circuit 131 and the first conductive trace 151 may be deposited on the substrate 11 or on the insulating layer 22 covering the surface of the substrate 11 by PVD (physical vapor deposition) or electroplating, or may be formed by printing a conductive paste on the substrate 11 or on the insulating layer 22 covering the surface of the substrate 11 by screen printing and then firing; preferably, the method of screen printing and sintering is adopted, wherein the first heat-emitting circuit 131 may adopt precious metal paste such as commonly-used silver-palladium resistance paste, ruthenium-palladium resistance paste, platinum paste, etc., or may adopt base metal paste such as nickel-based paste, etc., and the first conductive trace 151 may adopt silver-based paste with relatively low resistivity. The pattern of the first heating line 131 can be flexibly set, and a proper resistance value required for the heating element is obtained by matching with the conductive paste characteristic and the thickness of the first heating line 131, wherein the resistance value of the heating element is generally between 0.3 and 2.0 Ω; the thickness of the first heating line 131 is generally less than 0.1mm, preferably less than 20 um.

Referring to fig. 6a, compared with the embodiment shown in fig. 5a, the difference is that the first heat-generating circuit 131 includes a plurality of circuits, and the plurality of circuits of the first heat-generating circuit 131 are arranged in parallel. Specifically, the plurality of first heat-emitting lines 131 are distributed in a U-shape and are distributed in the heat-emitting region 13 and the overlapping region 14, and the first conductive traces 151 are distributed in the conductive region 15 and the overlapping region 14. The first conductive path 151 connects the first heat-emitting lines 131 at the overlapping area 14, and the two first heat-emitting lines 131 are connected in parallel by the first conductive path 151. Specifically, in the present embodiment, the second heat-emitting circuit 132 and the second conductive trace 152 are further included. In one embodiment, the second heat-emitting lines 132 and the second conductive traces 152 are located inside the first heat-emitting lines 131 and the first conductive traces 151, and further, the second heat-emitting lines 132 and the second conductive traces 152 are located between the parallel first heat-emitting lines 131. As shown in fig. 6a, in an embodiment, the heat generating region 13, the overlapping region 14 and the conductive region 15 at the position of the second heat emitting circuit 132 may correspond to the heat generating region 13, the overlapping region 14 and the conductive region 15 at the position of the first heat emitting circuit 131, or may be staggered, for example, as shown in fig. 6a, the heat generating region 13, the overlapping region 14 and the conductive region 15 at the position of the second heat emitting circuit 132 may be staggered from the heat generating region 13, the overlapping region 14 and the conductive region 15 at the position of the first heat emitting circuit 131.

In an embodiment, the second heating line 132 may be a temperature measuring line, which has TCR characteristics of a resistor, that is, a specific corresponding relationship between temperature and the resistor, and when the second heating line 132 is externally connected to a certain power supply device through the second conductive trace 152, a specific current value is obtained when a certain voltage is applied, so as to obtain a resistance value of the second conductive trace 152, and reversely deduct the current temperature of the second conductive trace 152.

In one embodiment, the TCR characteristic may also be present in the first heating line 131. In the present embodiment, the second heating line 132 is provided to have advantages that the second heating line 132 has less self-heating and less current heating introduces a noise signal, which is beneficial to the precise control of the temperature by the electronic component. Meanwhile, since the second heating line 132 does not require heating, its initial resistance value is generally larger than that of the first heating line 131. The resistance value of the second heat emitting line 132 may be a value ranging from 5 to 20 ohms at room temperature, and is also set according to the material of the electronic paste, the length, width, thickness, pattern, and the like of the heat emitting trace.

In one embodiment, for precise control of the temperature, the resistivity of the material of the second heat emitting circuit 132 located at the heat generating region 13 may be set to be higher than the resistivity of the material of the first heat emitting circuit 131 located at the heat generating region 13. Therefore, the second heating circuit 132 in the heating region 13 has a higher resistance and a better Temperature Coefficient of Resistance (TCR) to ensure the sensitivity of the resistance to temperature variation. The material of the second conductive traces 152 in the conductive region 15 may be the same as the material of the first conductive traces 151 in the conductive region 15, or the material properties may be similar, and may be a conductive material with low resistivity, and the sheet resistance may be lower than 5m Ω.

In this embodiment, the second heating line 132 is disposed between the first heating lines 131, so that the temperature measurement portion can be concentrated in a higher temperature range of the heating element, which is more favorable for precise temperature control.

Referring to fig. 6b, in conjunction with fig. 6a, the first and second heat-emitting

lines

131 and 132 are disposed as shown in fig. 6a, and four pins are formed at the first and second

conductive traces

151 and 152. Therefore, the conductive pad 17 on the other surface of the heating film 12 includes four conductive pads corresponding to the four pins, and the difference from the difference shown in fig. 5b is that the conductive pad further includes a second positive conductive pad and a second negative conductive pad, wherein the second positive conductive pad and the second negative conductive pad are respectively connected to one end of the second conductive trace 152 far away from the second heating line 132. Like the embodiment shown in fig. 5b, the second positive and negative conducting pads are likewise connected to the electrode lead 19.

It is understood that, if the substrate 11 is a sheet-shaped substrate, the first and

second heating lines

131 and 132, the first and second

conductive traces

151 and 152, and the conductive pad 17 are located on the same surface, which is the same as the embodiment shown in fig. 5c, and thus, the description thereof is omitted.

In another embodiment, there may be only one first heat emitting circuit 131, and the second heat emitting circuit 132 is located inside the first heat emitting circuit 131, as shown in fig. 6 c. Specifically, when the heating region 13, the overlapping region 14 and the conductive region 15 on one surface of the heating film 12 are the embodiment shown in fig. 6c, the conductive pad 17 on the other surface of the heating film 12 is shown in fig. 6b, and the description thereof is omitted.

In another embodiment, the first and second heat-emitting

lines

131 and 132 share the first positive conductive pad 171 or the second positive conductive pad, and the first and second heat-emitting

lines

131 and 132 share the first negative conductive pad 172 or the second negative conductive pad. Specifically, referring to fig. 7a, one ends of the first and second heat-emitting

lines

131 and 132 are connected to each other, specifically, the first heat-emitting line 131 may be connected in parallel with the second heat-emitting line 132, that is, the positive electrode of the first heat-emitting line 131 is connected to the positive electrode of the second heat-emitting line 132, or the negative electrode of the first heat-emitting line 131 is connected to the negative electrode of the second heat-emitting line 132.

Referring to fig. 7b, after the first heat-generating circuit 131 can be connected in parallel with the second heat-generating circuit 132, three pins are formed in the conductive region 15, and the conductive pad 17 is disposed corresponding to the pins.

In the heating component in the prior art, the fixing seat is fixed on the conductive circuit or the heating circuit of the heating component, which affects the stability of the electrical connection between the conductive circuit and the heating circuit. And the heating element that this application provided installs the overlap region that heating element's conducting wire and heating circuit overlapped through the ring flange with the fixing base to prevent when fixed heating element, conducting wire or heating circuit fracture, guaranteed the electric connection stability of conducting wire and heating circuit. The heating element is provided with a heating line and a temperature measuring line, which can realize accurate temperature control.

Please refer to fig. 8, which is a schematic structural diagram of an embodiment of the heating and atomizing device of the present invention. The heating and atomizing device includes a power supply device 32 and a heating element 31, wherein the power supply device 32 is used for supplying power to the heating element 31, and the heating element 31 is the heating element described in the above fig. 1, fig. 2, fig. 3, and fig. 4, and is not described herein again.

The above is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat generating component, comprising:

the heating element comprises a base body, and a heating area, an overlapping area and a conductive area which are arranged on the base body, sequentially distributed along the axial direction of the base body and connected with each other, wherein the heating area is provided with a heating circuit and extends to the overlapping area, and the conductive area is provided with a conductive circuit and extends to the overlapping area and is overlapped or connected with the heating circuit in parallel;

the heating element is fixed at one end of the fixing seat, and at least part of the fixing seat is in contact with the overlapping area.

2. The heating element of claim 1 wherein said substrate is a sheet-like substrate; or

The substrate is a columnar substrate.

3. The heat generating component of claim 1, wherein the overlapping region generates heat at a temperature less than a temperature at which the heat generating region and the conductive region generate heat.

4. The heat generating component of claim 1, wherein the heat generating circuit of the overlap region is laminated on the conductive circuit of the overlap region.

5. The heat-generating component of claim 1, wherein the anchor block further comprises: a flange plate and a base seat,

the heating element penetrates through the through groove to fix at least part of the flange plate on an overlapping area of the heating element, and the flange plate fixes the heating element on the base.

6. The heat-generating component of claim 5 wherein the flange is entirely in contact with the overlap region.

7. The heating assembly as claimed in claim 2, wherein the columnar base body is wrapped with a heating film, and the heating region, the overlapping region and the conductive region are disposed on a surface of the heating film close to the base body;

and the surface of the heating film far away from the base body is provided with a conductive disc corresponding to the conductive area, the conductive disc is provided with a through hole penetrating through the heating film corresponding to the conductive area, and conductive substances are arranged in the through hole so as to electrically connect the conductive disc with the conductive circuit in the conductive area.

8. The heating assembly as claimed in claim 2, wherein the heating region, the overlapping region, the conductive region and the conductive pad are disposed on one surface of the sheet-shaped base;

the conductive disc is positioned on one side of the conductive area, which is far away from the heating area.

9. The heat-generating component according to claim 7 or 8, wherein the heat-generating line comprises a first heat-generating line, the conductive line comprises a first conductive line, and the first heat-generating line coincides with the first conductive line at the overlapping region;

the first heating lines are distributed in a U shape, and the first conducting circuits are respectively connected with two ends of the U-shaped first heating lines;

the conductive discs comprise a first positive conductive disc and a first negative conductive disc, and the first positive conductive disc and the first negative conductive disc are respectively connected with one end, far away from the first heating circuit, of the first conductive circuit.

10. The heat-generating component of claim 9, wherein the heat-emitting line further comprises a second heat-emitting line, the conductive trace further comprising a second conductive trace, the second heat-emitting line coinciding with the second conductive trace at the overlap region;

the second heating lines are distributed in a U shape, and the second conductive lines are respectively connected with two ends of the U-shaped second heating lines;

the conductive discs comprise a second positive conductive disc and a second negative conductive disc, and the second positive conductive disc and the second negative conductive disc are respectively connected with one end, far away from the second heating circuit, of the second conductive circuit.

11. The heat generating component of claim 10, wherein the first heat generating line is a line in series with the first conductive trace, and the second heat generating line and the second conductive trace are located inside the first heat generating line and the first conductive trace; or

The first heating line is a plurality of lines connected in parallel with the first conductive line, and the second heating line and the second conductive line are located between the plurality of first heating lines and the first conductive line.

12. The heating assembly of claim 11, wherein the first heating circuit and the second heating circuit share the first positive conducting plate or the second positive conducting plate; or

The first heating circuit and the second heating circuit share the first negative conductive plate or the second negative conductive plate.

13. The heating assembly as claimed in claim 2, wherein the sheet-like base and the columnar base each include a base and a tip portion at one end of the base, and the heating region is adjacent to the tip portion.

14. The heating element as claimed in claim 13, wherein an end of the base of the columnar substrate away from the pointed portion has an inwardly concave groove.

15. The heat generating component of claim 8, wherein the heat generating region, the overlapping region and the conductive region are provided with a protective covering on a side thereof away from the base, the protective covering exposing a portion of the conductive region.

16. The heating assembly as claimed in claim 7 or 8, wherein an electrode lead is further connected to an end of the conductive plate away from the heating circuit, and the electrode lead is used for connecting a power supply device, so as to connect the heating element with the power supply device.

17. The heating assembly as claimed in claim 8, wherein the two surfaces of the sheet-like base are respectively provided with an insulating layer, and the heating region, the overlapping region, the conductive region and the conductive disk are disposed on the insulating layer on one surface of the base.

18. The heating element as claimed in claim 7, wherein the thickness of the heating film is 0.02-0.5 mm.

19. The heating element as claimed in claim 7, wherein the thickness of the heating film is 0.05 to 0.2 mm.

20. The heating element according to claim 10, wherein the first heating line has a resistance of 0.5 to 2 ohms; and/or

The resistance of the second heating line is 5-20 ohms.

21. The heat generating component of claim 10, wherein the second heat generating circuit located in the heat generating region has a resistivity greater than a resistivity of the first heat generating circuit located in the heat generating region; and/or

The resistance of the first heat emitting line at the conductive region is equal to the resistance of the second heat emitting line at the conductive region.

22. A heated atomizing device, comprising: a heating component and a power supply device;

wherein the heating element is the heating element according to any one of claims 1 to 21;

the power supply device is connected with the heating component to supply power to the heating component.