CN212876172U - Chip packaging device with static electricity removal function - Google Patents

Abstract

The utility model discloses a chip packaging hardware of destatic, including chipset and ion fan, fixed surface installs the encapsulation cover on the chipset, the inside lower extreme fixed mounting of encapsulation cover has the chip, fixed surface installs the substrate under the chip, fixed surface is connected with the semiconductor base under the substrate, semiconductor base lower extreme and mainboard connection, the chipset is outside to be connected with the mainboard through the semiconductor stitch, the ion fan lower extreme is close to the edge-fixed air inlet of having seted up, the inside fan of having seted up in ion fan upper end, fan fixed surface installs the fan piece. A chip packaging hardware of destatic, the design through the ion fan has significantly reduced the static of chipset surface gathering, reaches the purpose of static elimination and heat extraction simultaneously, the filter screen that the air inlet middle part set up and the filtration pore of crossing on the filter baffle have reduced static and have produced probably, the design of (air) intake valve and fan buckle, simple structure, low cost.

Description

Chip packaging device with static electricity removal function

Technical Field

The utility model relates to a chip package field, in particular to chip packaging hardware who destatics.

Background

Static electricity is an objective natural phenomenon that occurs in a variety of ways, such as contact, friction, peeling, and the like. In the electrostatic protection technology, such as electrostatic hazard in the electronic industry, semiconductor industry, petroleum industry, weapon industry, textile industry, rubber industry and the fields of aviation and military, the loss caused by static electricity is sought to be reduced, most of electronic devices used in life are provided with chips, but due to the relationship between some external environments and peripheral facilities, the situation that the chips are broken down by the static electricity often occurs, and the chips can damage the devices to cause the breakdown of the devices. However, the static elimination chip package structure used at the present stage cannot reduce the possibility of static electricity generation, and may burn out the motherboard, the chip package structure is complex, the maintenance cost is high, and the heat dissipation is not good.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a chip packaging device with static elimination, which can solve the problem of the prior art that static electricity is generated and the chip packaging structure is complex, the maintenance cost is high and the heat dissipation is not good.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a chip packaging hardware of destatic, includes chipset and ion fan, fixed surface installs the encapsulation cover on the chipset, the inside lower extreme fixed mounting of encapsulation cover has the chip, fixed surface installs the substrate under the chip, fixed surface is connected with the semiconductor base under the substrate, semiconductor base lower extreme and mainboard connection, the mainboard passes through semiconductor stitch and chipset external connection, the ion fan lower extreme is close to the edge and has seted up the air inlet fixedly, the fan has been seted up to ion fan upper end inside, fan fixed surface installs the fan piece.

Preferably, the outer surface of the fan is fixedly connected with a fan blade, the fan is connected with the ion fan through a fixing rod, a motor is fixedly connected below the fixing rod, a rotor is fixedly connected below the motor, and the rotor is connected with the rotating rod.

Preferably, the number of the fan blades is six, the fan blades are uniformly distributed on the outer surface of the fan, and the number of the rotating rods is three, and the rotating rods are uniformly distributed on the inner wall of the fan.

Preferably, the air inlet evenly distributed is close to the bottom position at ion fan lower surface, the inside one side fixedly connected with filter screen of air inlet, the filter screen has two-layerly, filter screen one side fixed mounting has filtering baffle, filtering baffle inside evenly distributed has the filtration pore, filtering baffle one side fixedly connected with (air) intake valve, the (air) intake valve is connected with ion fan's surface through the hinge.

Preferably, the lower end edge of the ion fan is fixedly provided with a fan buckle, the fan buckle is extruded into the mainboard through an inclined angle, and the fan buckle is just overlapped with the mainboard.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, the design through the ion fan has significantly reduced the static of chipset surface gathering, the static on the chipset surface can be in by the ion fan, reach the purpose of eliminating static and heat extraction, the inversion of motor has made things convenient for the air current to flow, the setting of rotary rod has increased the area of ventilation, be favorable to static and thermal emission, the filter screen that the air inlet middle part set up and the filtration pore of crossing on the filtering baffle are in order to prevent that the outside air dust from getting into, one step has improved filtration efficiency in addition, thereby the possibility that static produced has been reduced, the during operation (air) intake valve is automatic to be opened, because the action of gravity self-closing after the end, fan buckle simple to operate and unfavorable not hard up, high convenience.

Drawings

Fig. 1 is a schematic view of the overall structure of a chip packaging device with static electricity removed according to the present invention;

FIG. 2 is an internal cross-sectional view of a fan of a chip package device with electrostatic discharge according to the present invention;

FIG. 3 is a partial cross-sectional view of an air inlet of a chip packaging apparatus for removing static electricity according to the present invention;

fig. 4 is a partial sectional view of the fan buckle of the chip packaging apparatus with static electricity removal function of the present invention.

In the figure: 1. a chipset; 2. a chip; 201. a substrate; 202. a semiconductor base; 203. a semiconductor pin; 204. a package cover; 3. an ion blower; 301. an air inlet; 302. a filtering baffle; 303. a filtration pore; 304. an intake valve; 305. a hinge; 306. a filter screen; 307. a fan buckle; 308. an inclination angle; 4. a fan; 401. a fan blade; 402. fixing the rod; 403. a motor; 404. rotating the rod; 405. a rotor; 5. a main board.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a chip packaging device for removing static electricity comprises a chip set 1 and an ion blower 3, wherein a packaging cover 204 is fixedly installed on the upper surface of the chip set 1, a chip 2 is fixedly installed at the lower end inside the packaging cover 204, a substrate 201 is fixedly installed on the lower surface of the chip 2, a semiconductor base 202 is fixedly connected to the lower surface of the substrate 201, the lower end of the semiconductor base 202 is connected with a motherboard 5, the motherboard 5 is connected with the outside of the chip set 1 through a semiconductor pin 203, an air inlet 301 is fixedly arranged at the lower end of the ion blower 3, which is close to the edge, an air inlet 301 is fixedly arranged at the upper end of the ion blower 3, a fan 4 is arranged inside the upper end of the ion blower 3, a fan 401 is fixedly installed on the outer surface of the fan 4, the static electricity collected on the, when the surface of the chip set 1 is charged with negative charges, the chip set can attract positive charges in the airflow, and when the surface of the chip set 1 is charged with positive charges, the chip set can attract negative charges in the airflow, so that the static electricity on the surface of the chip set 1 is neutralized, and the purposes of eliminating the static electricity and discharging heat are achieved;

the outer surface of the fan 4 is fixedly connected with a fan blade 401, the fan 4 is connected with the ion fan 3 through a fixing rod 402, a motor 403 is fixedly connected below the fixing rod 402, a rotor 405 is fixedly connected below the motor 403, the rotor 405 is connected with a rotating rod 404, the inversion of the motor 403 facilitates the flow of air flow, the arrangement of the rotating rod 404 increases the ventilation area, and the discharge of static electricity and heat is facilitated; six fan blades 401 are uniformly distributed on the outer surface of the fan 4, three rotating rods 404 are uniformly distributed on the inner wall of the fan 4, and the more fan blades 401, the larger wind force is, and the higher static electricity and heat discharge efficiency is; the air inlets 301 are uniformly distributed on the lower surface of the ion fan 3 and close to the bottom end, one side inside the air inlets 301 is fixedly connected with a filter screen 306, the filter screen 306 has two layers, one side of the filter screen 306 is fixedly provided with a filter baffle 302, filter holes 303 are uniformly distributed in the filter baffle 302, one side of the filter baffle 302 is fixedly connected with an air inlet valve 304, the air inlet valve 304 is connected with the surface of the ion fan 3 through a hinge 305, the filter screen 306 in the middle of the air inlets 301 is arranged to prevent external air dust from entering, so that the possibility of electrostatic generation is reduced, in addition, the filter holes 303 on the filter baffle 302 further improve the filtering efficiency, when the fan 4 is opened, the internal pressure becomes low, the air inlet valve 304 is automatically opened; the edge fixed mounting of ion fan 3 lower extreme has fan buckle 307, and fan buckle 307 is crowded into mainboard 5 through angle of inclination 308, and fan buckle 307 just coincides with mainboard 5, and simple to operate and unfavorable not hard up further keep apart the outside air.

It should be noted that the present invention relates to a chip packaging device for removing static electricity, which greatly reduces the collected static electricity on the surface of the chipset 1 through the design of the ion fan 3, the ion fan 3 can generate a large amount of air flow with positive and negative charges, and can neutralize the collected charges on the chipset 1, when the charges on the surface of the chipset 1 are negative charges, it can attract the positive charges in the air flow, and when the charges on the surface of the chipset 1 are positive charges, it can attract the negative charges in the air flow, so that the static electricity on the surface of the chipset 1 is neutralized, and the purpose of removing static electricity and removing heat is achieved, the inversion of the motor 403 facilitates the air flow, the arrangement of the rotating rod 404 increases the ventilation area, which is beneficial to the discharge of static electricity and heat, and the more the fan blades 401 are, the higher the discharge efficiency of static electricity and heat is, the filter screen 306 arranged in the middle of the air inlet 301 is for, thereby reduced the possibility that static produced, filtration hole 303 on the baffle 302 of filtering has further improved filtration efficiency in addition, and internal pressure step-down when fan 4 is opened, intake valve 304 is automatic to be opened, and owing to gravity action self-closing after the completion further keeps apart the outside air, and fan buckle 307 simple to operate and unfavorable not hard up finally further keeps apart the outside air.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (5)

1. A chip packaging device with static electricity removal function is characterized in that: including chipset (1) and ion fan (3), fixed surface installs encapsulation cover (204) on chipset (1), the inside lower extreme fixed mounting of encapsulation cover (204) has chip (2), chip (2) lower fixed surface installs substrate (201), substrate (201) lower fixed surface is connected with semiconductor base (202), semiconductor base (202) lower extreme is connected with mainboard (5), mainboard (5) are through semiconductor stitch (203) and chipset (1) external connection, ion fan (3) lower extreme is close to edge fixed and has been seted up air inlet (301), fan (4) have been seted up to ion fan (3) upper end inside, fan (4) outer fixed surface installs fan piece (401).

2. The chip packaging apparatus according to claim 1, wherein: the outer surface of the fan (4) is fixedly connected with fan blades (401), the fan (4) is connected with the ion fan (3) through a fixing rod (402), a motor (403) is fixedly connected to the lower portion of the fixing rod (402), a rotor (405) is fixedly connected to the lower portion of the motor (403), and the rotor (405) is connected with the rotating rod (404).

3. The chip packaging apparatus according to claim 2, wherein: six fan blades (401) are uniformly distributed on the outer surface of the fan (4), and three rotating rods (404) are uniformly distributed on the inner wall of the fan (4).

4. The chip packaging apparatus according to claim 1, wherein: air inlet (301) evenly distributed is close to the bottom position at ion fan (3) lower surface, air inlet (301) inside one side fixedly connected with filter screen (306), filter screen (306) have two-layerly, filter screen (306) one side fixed mounting has filtering baffle (302), filtering baffle (302) inside evenly distributed has filtration pore (303), filtering baffle (302) one side fixedly connected with (304) intake valve, intake valve (304) are connected with the surface of ion fan (3) through hinge (305).

5. The chip packaging apparatus according to claim 1, wherein: the edge of the lower end of the ion fan (3) is fixedly provided with a fan buckle (307), the fan buckle (307) is extruded into the main board (5) through an inclined angle (308), and the fan buckle (307) is just overlapped with the main board (5).

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