CN212875338U - Dustproof heat dissipation formula bus duct cooperation mechanism - Google Patents
Dustproof heat dissipation formula bus duct cooperation mechanism Download PDFInfo
- Publication number
- CN212875338U CN212875338U CN202022035811.9U CN202022035811U CN212875338U CN 212875338 U CN212875338 U CN 212875338U CN 202022035811 U CN202022035811 U CN 202022035811U CN 212875338 U CN212875338 U CN 212875338U
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- heat dissipation
- plate
- bus duct
- clamping
- frame body
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Abstract
The utility model discloses a dustproof heat dissipation formula bus duct cooperation mechanism relates to bus duct structure field. The utility model discloses in: a plurality of bus duct guide plates are arranged in the peripheral frame body; the inner side insulation clamping plate is arranged in the peripheral frame body; the inner side insulation clamping plate is provided with an upper layer heat dissipation plate; a top layer heat dissipation shell is clamped on the peripheral frame body; and a plurality of uniformly distributed fourth heat dissipation hole grooves communicated with the inside of the top layer heat dissipation shell and the fourth outer side heat dissipation notch are formed in the fourth side heat dissipation groove plate. The utility model discloses a setting both as the carrier that bears the upper heating panel and as the inboard insulating block board of keeping apart bus duct baffle isolation plate piece, under the insulating property prerequisite of guaranteeing the bus duct baffle, the heat that the efficient produced the bus duct baffle transmits to upper heating panel to discharge through the fourth heat dissipation hole groove on the top layer heat dissipation casing, promoted the radiating efficiency of bus duct, ensured the high-efficient transmission and distribution electrical property of bus duct.
Description
Technical Field
The utility model relates to a bus duct structure field especially relates to a dustproof heat dissipation formula bus duct cooperation mechanism.
Background
With the development of society, the electric load of high-rise buildings, industrial plants, hotels, airports, stations and complex buildings is increased rapidly. The service life of the bus duct is more than twice of that of a cable, and the bus duct is not easy to cause fire, large in current-carrying capacity, small in voltage drop and easy to control temperature, so that more and more projects are provided with bus ducts instead of power cables for power supply. In the use of bus duct, need effectively arrange the heat that produces in the bus duct and dissipate to the power transmission and distribution performance of guarantee bus duct, how high-efficient safety carries out effectively discharging to the heat that produces in the bus duct, becomes the problem that needs to solve.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a dustproof heat dissipation formula bus duct cooperation mechanism to promote the radiating efficiency of bus duct, ensured the high-efficient transmission and distribution electrical property of bus duct.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model provides a dustproof heat dissipation type bus duct matching mechanism, which comprises a peripheral frame body, wherein the inner side of the peripheral frame body is provided with an inner side insulation layer plate; a plurality of bus duct guide plates are arranged in the peripheral frame body; the inner side insulation clamping plate is arranged in the peripheral frame body; the inner side insulation clamping plate is provided with an upper layer heat dissipation plate; the top heat dissipation shell is clamped on the peripheral frame body.
A plurality of second protruding plates are arranged on the inner side insulating clamping plate; a second matching gap is formed between the adjacent second protruding plates; a plurality of second clamping through grooves which are uniformly distributed are formed in the position of the second protruding plate of the inner side insulating clamping plate; second clamping convex plates are arranged on two sides of the inner side insulating clamping plate; a second side clamping groove is formed in the second clamping convex plate; a plurality of heat absorption and conduction columns which are uniformly distributed are fixedly arranged on one side panel of the upper-layer heat dissipation plate; third side clamping plates are arranged on the two sides of the upper-layer heat dissipation plate; a fourth side heat dissipation groove plate is fixedly arranged on two sides of the top layer heat dissipation shell; the bottom side of the fourth side heat dissipation groove plate is fixedly connected with a fourth bottom side clamping plate; a fourth outer heat dissipation notch is formed between the fourth side heat dissipation groove plate and the fourth bottom side clamping plate; and a plurality of uniformly distributed fourth heat dissipation hole grooves communicated with the inside of the top layer heat dissipation shell and the fourth outer side heat dissipation notch are formed in the fourth side heat dissipation groove plate.
As a preferred technical scheme of the utility model, a first inner side slot matched with the second clamping convex plate is arranged on the inner side wall of the peripheral frame body; the position of second cooperation breach cooperatees with the position of bus duct baffle.
As a preferred technical scheme of the utility model, two sides of the peripheral frame body are provided with first side opening and closing convex plates; a fourth bottom clamping groove matched with the first side opening and closing convex plate is formed in the inner side of the fourth bottom clamping plate.
As a preferred technical scheme of the utility model, the second clamping through groove is matched with the heat absorption guide pillar body; the second side clamping groove is matched with the third side clamping plate.
As a preferred technical solution of the present invention, the inner side insulating clamping plate is a polymer heat-resistant insulating material plate; the upper-layer heat dissipation plate is a heat-conducting alloy plate; the top heat dissipation shell is a high-molecular heat-resistant insulating material plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a setting up as the inboard insulating snap-on board that not only bears the carrier of upper heating panel but also keeps apart bus duct baffle separation plate piece, under the insulating property prerequisite of guaranteeing the bus duct baffle, the heat that the efficient produced the bus duct baffle is transmitted to upper heating panel to discharge through the fourth heat dissipation hole groove on the top layer heat dissipation casing, promoted the radiating efficiency of bus duct, ensured the high-efficient transmission and distribution electrical property of bus duct;
2. the utility model discloses a set up fourth outside heat dissipation notch to set up the fourth heat dissipation hole groove that is linked together with fourth outside heat dissipation notch on fourth side heat dissipation frid, effectively reduce and get into inside dust, the impurity of top layer heat dissipation casing.
Drawings
FIG. 1 is a schematic view of the overall structure of the device of the present invention;
FIG. 2 is a schematic diagram of the present invention with parts separated;
FIG. 3 is a schematic structural view of the inner insulating engaging plate and the upper heat dissipating plate of the present invention;
fig. 4 is a schematic structural view of the middle-top heat dissipation casing of the present invention;
wherein: 1-a peripheral frame; 2-inner side insulation layer plate; 3-bus duct guide plate; 4-inner side insulation clamping plate; 5-upper heat dissipation plate; 6-top heat dissipation shell; 7-a first inner side slot; 8-opening and closing the convex plate at the first side; 9-a second clamping convex plate; 10-a second raised plate; 11-a second mating indentation; 12-a second clamping through groove; 13-a second side slot; 14-heat absorbing conductive cylinder; 15-third side snap gauge; 16-fourth side heat sink plate; 17-a fourth bottom side snap plate; 18-a fourth outboard heat sink notch; 19-a fourth heat dissipation hole groove; 20-a fourth bottom side card slot.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The utility model relates to a dustproof heat dissipation type bus duct matching mechanism, which comprises a peripheral frame body 1, wherein the inner side of the peripheral frame body 1 is provided with an inner side insulation layer plate 2; a plurality of bus duct guide plates 3 are arranged in the peripheral frame body 1; the inner side insulation clamping plate 4 is arranged in the peripheral frame body 1; the inner side insulated clamping plate 4 is provided with an upper layer heat dissipation plate 5; the top heat dissipation housing 6 is engaged with the peripheral frame 1.
A plurality of second protruding plates 10 are arranged on the inner side insulating clamping plate 4; a second matching notch 11 is formed in the middle of the adjacent second protruding plate 10; a plurality of second clamping through grooves 12 which are uniformly distributed are formed in the positions of the second protruding plates 10 of the inner side insulating clamping plate 4; the two sides of the inner side insulation clamping plate 4 are provided with second clamping convex plates 9; a second side clamping groove 13 is formed in the second clamping convex plate 9; a plurality of heat absorption and conduction columns 14 which are uniformly distributed are fixedly arranged on one side panel of the upper-layer heat dissipation plate 5; third side clamping plates 15 are arranged on both sides of the upper-layer heat dissipation plate 5; a fourth side heat dissipation groove plate 16 is fixedly arranged at two sides of the top layer heat dissipation shell 6; a fourth bottom side clamping plate 17 is fixedly connected to the bottom side of the fourth side heat dissipation groove plate 16; a fourth outer heat dissipation notch 18 is formed between the fourth side heat dissipation groove plate 16 and the fourth bottom side clamping plate 17; the fourth side heat sink plate 16 is provided with a plurality of uniformly distributed fourth heat sink holes 19 communicating the inside of the top heat sink shell 6 with the fourth outer heat sink notch 18.
Furthermore, a first inner side clamping groove 7 matched with the second clamping convex plate 9 is formed in the inner side wall of the peripheral frame body 1; the position of the second matching notch 11 is matched with the position of the bus duct guide plate 3.
Furthermore, two sides of the peripheral frame body 1 are provided with first side opening and closing convex plates 8; a fourth bottom slot 20 is disposed on the inner side of the fourth bottom engaging plate 17 and is matched with the first side opening/closing convex plate 8.
Further, the second clamping through groove 12 is matched with the heat absorbing and conducting column 14; the second side card slot 13 is matched with the third side card slot 15.
Further, the inner side insulating clamping plate 4 is a polymer heat-resistant insulating material plate; the upper-layer heat dissipation plate 5 is a heat conduction metal plate; the top heat dissipation shell 6 is a high-molecular heat-resistant insulating material plate.
In the utility model discloses in the device:
the inner side insulating clamping plate 4 is arranged and not only serves as a carrier for bearing the upper-layer heat dissipation plate 5, but also serves as a partition plate for partitioning the bus duct guide plate 3, and on the premise that the insulating property of the bus duct guide plate 3 is guaranteed, heat generated by the bus duct guide plate 3 is effectively transmitted to the upper-layer heat dissipation plate 5 and is discharged through the fourth heat dissipation hole groove 19 in the top-layer heat dissipation shell 6;
the second matching notch 11 on the inner side insulating clamping plate 4 is clamped on the bus duct guide plate 3, so that the chance that the bus duct guide plate 3 is contacted with the heat absorbing and conducting cylinder 14 is directly cut off, and the heat absorbing and conducting cylinder 14 efficiently absorbs heat between the bus duct guide plates 3;
the fourth outer side heat dissipation notch 18 is arranged, so that the opening of the fourth heat dissipation hole 19 is not directly outward, and the external dust, impurities and the like are greatly reduced from entering the top layer heat dissipation shell 6;
the third side clamping plate 15 on the upper-layer heat dissipation plate 5 and the second side clamping groove 13 on the second clamping convex plate 9 can adopt a snap fit structure to quickly and conveniently clamp and install the upper-layer heat dissipation plate 5 and the inner-side insulating clamping plate 4.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The utility model provides a dustproof heat dissipation formula bus duct cooperation mechanism which characterized in that:
the insulating frame comprises a peripheral frame body (1), wherein an inner side insulating layer plate (2) is arranged on the inner side of the peripheral frame body (1);
a plurality of bus duct guide plates (3) are arranged in the peripheral frame body (1);
an inner side insulating clamping plate (4) is arranged in the peripheral frame body (1);
an upper-layer heat dissipation plate (5) is arranged on the inner side insulating clamping plate (4);
a top layer heat dissipation shell (6) is clamped on the peripheral frame body (1);
a plurality of second protruding plates (10) are arranged on the inner side insulating clamping plate (4);
a second matching gap (11) is formed between the adjacent second protruding plates (10);
a plurality of second clamping through grooves (12) which are uniformly distributed are formed in the positions of the second protruding plates (10) of the inner side insulating clamping plate (4);
second clamping convex plates (9) are arranged on two sides of the inner side insulating clamping plate (4);
a second side clamping groove (13) is formed in the second clamping convex plate (9);
a plurality of heat absorption and conduction columns (14) which are uniformly distributed are fixedly arranged on one side panel of the upper-layer heat dissipation plate (5);
third side clamping plates (15) are arranged on two sides of the upper-layer heat dissipation plate (5);
a fourth side radiating groove plate (16) is fixedly arranged on two sides of the top layer radiating shell (6);
a fourth bottom clamping plate (17) is fixedly connected to the bottom side of the fourth side heat dissipation groove plate (16);
a fourth outer heat dissipation notch (18) is formed between the fourth side heat dissipation groove plate (16) and the fourth bottom side clamping plate (17);
and a plurality of uniformly distributed fourth heat dissipation hole grooves (19) which are communicated with the inside of the top layer heat dissipation shell (6) and a fourth outer side heat dissipation notch (18) are formed in the fourth side heat dissipation groove plate (16).
2. The dustproof heat dissipation type bus duct matching mechanism of claim 1, which is characterized in that:
a first inner side clamping groove (7) matched with the second clamping convex plate (9) is formed in the inner side wall of the peripheral frame body (1);
the position of the second matching notch (11) is matched with the position of the bus duct guide plate (3).
3. The dustproof heat dissipation type bus duct matching mechanism of claim 1, which is characterized in that:
two sides of the peripheral frame body (1) are provided with first side opening and closing convex plates (8);
and a fourth bottom clamping groove (20) matched with the first side opening and closing convex plate (8) is formed in the inner side of the fourth bottom clamping plate (17).
4. The dustproof heat dissipation type bus duct matching mechanism of claim 1, which is characterized in that:
the second clamping through groove (12) is matched with the heat absorption guide post body (14);
and the second side clamping groove (13) is matched with the third side clamping plate (15).
5. The dustproof heat dissipation type bus duct matching mechanism of claim 1, which is characterized in that:
the inner side insulating clamping plate (4) is a polymer heat-resistant insulating material plate;
the upper-layer heat dissipation plate (5) is a heat-conducting alloy plate;
the top heat dissipation shell (6) is a high-molecular heat-resistant insulating material plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022035811.9U CN212875338U (en) | 2020-09-17 | 2020-09-17 | Dustproof heat dissipation formula bus duct cooperation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022035811.9U CN212875338U (en) | 2020-09-17 | 2020-09-17 | Dustproof heat dissipation formula bus duct cooperation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212875338U true CN212875338U (en) | 2021-04-02 |
Family
ID=75197660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022035811.9U Expired - Fee Related CN212875338U (en) | 2020-09-17 | 2020-09-17 | Dustproof heat dissipation formula bus duct cooperation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212875338U (en) |
-
2020
- 2020-09-17 CN CN202022035811.9U patent/CN212875338U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210402 Termination date: 20210917 |