CN212874474U

CN212874474U - Wafer paster adds clamping apparatus

Info

Publication number: CN212874474U
Application number: CN202022455253.1U
Authority: CN
Inventors: 杨光宇
Original assignee: Ruijie Xinsheng Tianjin Electronic Technology Co ltd
Current assignee: Ruijie Xinsheng Tianjin Electronic Technology Co ltd
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-04-02
Anticipated expiration: 2030-10-29

Abstract

The utility model provides a wafer paster adds clamping apparatus belongs to wafer paster processing technology field. The wafer paster processing clamp comprises a frame body assembly, a clamping mechanism and a material taking mechanism. The support body subassembly includes base and support, the support is fixed the base surface, fixture includes chuck and clamp plate, the chuck is installed the base surface, the clamp plate is located the chuck top, clamp plate surface mounting has the screw rod, just the screw rod with support threaded connection. The utility model discloses a chuck, screw rod and clamp plate are fixed the wafer, and when unloading to the wafer, make the jack catch and the wafer separation of chuck, utilize first vacuum chuck to absorb the wafer, through rotating the screw rod, drive clamp plate, first vacuum chuck and wafer and remove, do benefit to and take the wafer from the chuck surface, do benefit to and take the wafer, improve the efficiency of wafer unloading.

Description

Wafer paster adds clamping apparatus

Technical Field

The utility model relates to a wafer paster processing field particularly, relates to a wafer paster adds clamping apparatus.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and in the wafer mounting process, it is generally necessary to clamp and fix the wafer and then perform the mounting process.

At present, the wafer is clamped and fixed by the three-jaw chuck, but the wafer is thin and is not easy to take down from the surface of the three-jaw chuck after being processed, so that the blanking efficiency is influenced.

SUMMERY OF THE UTILITY MODEL

In order to compensate the above deficiency, the utility model provides a wafer paster adds clamping apparatus aims at improving the problem that traditional anchor clamps are unfavorable for carrying out the unloading to the wafer.

The utility model discloses a realize like this:

the utility model provides a wafer paster adds clamping apparatus, including support body subassembly, fixture and feeding agencies.

The support body subassembly includes base and support, the support is fixed the base surface, fixture includes chuck and clamp plate, the chuck is installed the base surface, the clamp plate is located the chuck top, clamp plate surface mounting has the screw rod, just the screw rod with support threaded connection, extracting mechanism includes first vacuum chuck and vacuum generator, first vacuum chuck is installed the clamp plate surface, just first vacuum chuck through the connecting pipe with vacuum generator's evacuation end intercommunication.

In an embodiment of the present invention, the bracket is an angle plate, and the bracket and the joint of the base are integrally formed.

In an embodiment of the present invention, the upper end surface of the chuck is embedded with a second vacuum chuck, and the first vacuum chuck and the second vacuum chuck are relatively arranged.

The utility model discloses an in one embodiment, the lower terminal surface of chuck pass through branch with base fixed connection, just the edge of branch the circumference equidistance of chuck is provided with at least threely.

The utility model discloses an in one embodiment, the clamp plate includes plate body and upper plate body down, the upper plate body passes through the extension board and installs plate body up end down, the upper plate body pass through the bearing with the screw rod rotates to be connected.

The utility model discloses an in one embodiment, the jack catch of chuck sets up to cylindric, down the plate surface seted up with the jack catch assorted of chuck leads to the inslot, just the jack catch of chuck slide peg graft in lead to the inslot.

The utility model discloses an in one embodiment, the through-hole has been seted up on the clamp plate surface, first vacuum chuck slip peg graft in the through-hole is downthehole, even the pipe surface fastening has cup jointed the go-between, there is the briquetting extension board one side through spring coupling, just one side of briquetting is hugging closely the go-between.

In an embodiment of the present invention, the supporting plate is a corner plate, a guiding rod is fixed to one side of the pressing block, and one end of the guiding rod slides through the supporting plate.

In an embodiment of the present invention, the connection ring has a circumferential groove, and the press block is slidably inserted into the circumferential groove.

In an embodiment of the present invention, the connecting pipe surface is communicated with the air pipe, and the valve is installed at the mouth of the air pipe.

The utility model has the advantages that: the utility model discloses a wafer paster adds clamping apparatus that above-mentioned design obtained, during the use, utilize the fixed wafer of jack catch centre gripping of chuck, then rotate the screw rod, make the screw rod support clamp plate remove, make the clamp plate extrude the wafer, make fixing that the wafer can be more stable on the chuck surface, when carrying out the unloading, transfer and connect the chuck, the jack catch and the wafer separation that make the chuck, utilize vacuum generator to make the junction of first vacuum chuck and wafer form the negative pressure, first vacuum chuck can absorb the wafer, then rotate the screw rod, make the screw rod drive the clamp plate and remove, alright remove with driving first vacuum chuck and wafer, do benefit to and take the wafer from the chuck surface, do benefit to and take the wafer, improve the efficiency of wafer unloading.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a wafer mounting fixture according to an embodiment of the present invention;

fig. 2 is a schematic view of a pressing plate structure provided in an embodiment of the present invention;

fig. 3 is a schematic view of a connection structure of a lower plate body and a chuck according to an embodiment of the present invention;

fig. 4 is a schematic view of a connection ring structure according to an embodiment of the present invention.

In the figure: 100-a rack assembly; 110-a base; 120-a scaffold; 200-a clamping mechanism; 210-a chuck; 211-a second vacuum chuck; 212-a strut; 220-a press plate; 221-a lower plate body; 222-an upper plate body; 223-support plate; 224-through slots; 225-a via; 226-a spring; 227-briquetting; 228-a guide bar; 230-a screw; 300-a material taking mechanism; 310-a first vacuum chuck; 320-a vacuum generator; 330-connecting pipe; 331-a connection ring; 332-an annular groove; 340-the trachea; 350-valve.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1-4, the present invention provides a wafer mounting fixture, which includes a frame assembly 100, a holding mechanism 200 and a material-taking mechanism 300.

The clamping mechanism 200 is arranged on the surface of the frame assembly 100, the clamping mechanism 200 is used for clamping and fixing a wafer, subsequent processing of the wafer is facilitated, the material taking mechanism 300 is used for sucking the wafer, the surface of the clamping mechanism 200 in the wafer is taken down, and the wafer is taken out more conveniently.

Referring to fig. 1, the frame assembly 100 includes a base 110 and a bracket 120, the bracket 120 is fixed on a surface of the base 110, in an implementation, the bracket 120 is used to support a screw 230, a screw hole matching with the screw 230 may be formed on a surface of the bracket 120, and the screw 230 may be screwed into the screw hole.

In the embodiment, the bracket 120 is an angular plate, and the joint between the bracket 120 and the base 110 is integrally formed, so as to improve the connection strength between the bracket 120 and the base 110.

Referring to fig. 1-3, the clamping mechanism 200 includes a chuck 210 and a pressure plate 220, the chuck 210 is installed on the surface of the base 110, the pressure plate 220 is located above the chuck 210, a screw 230 is installed on the surface of the pressure plate 220, and the screw 230 is in threaded connection with the support 120, in practical implementation, a wafer to be processed is placed on the surface of the chuck 210, the wafer can be clamped and fixed by the chuck 210, the screw 230 can be moved by rotating the screw 230, and the pressure plate 220 can be further supported to move, the pressure plate 220 can press and fix the wafer on the surface of the chuck 210, so that the wafer can be more stably fixed on the surface of the chuck 210, and the fixing effect of the wafer is improved, as can be understood, the chuck 210 can be a three-jaw chuck or a.

In this embodiment, the second vacuum chuck 211 is embedded on the upper end surface of the chuck 210, the first vacuum chuck 310 and the second vacuum chuck 211 are disposed opposite to each other, the second vacuum chuck 211 is additionally disposed to absorb the wafer, so that the wafer is more stably mounted on the surface of the chuck 210, in addition, the first vacuum chuck 310 and the second vacuum chuck 211 have the same specification, the second vacuum chuck 211 can be connected to the evacuation end of another vacuum generator 320, and the second vacuum chuck 211 is vacuumized by using the another vacuum generator 320, which is beneficial for the second vacuum chuck 211 to absorb the wafer; the lower end surface of the chuck 210 is fixedly connected with the base 110 through the support rods 212, at least three support rods 212 are arranged at equal intervals along the circumferential direction of the chuck 210, and the distance between the chuck 210 and the base 110 can be increased by additionally arranging the support rods 212;

it should be noted that the pressing plate 220 includes a lower plate 221 and an upper plate 222, the upper plate 222 is mounted on the upper end surface of the lower plate 221 through a support plate 223, the upper plate 222 is rotatably connected to the screw 230 through a bearing, the screw 230 supports the upper plate 222 to move, and further supports the lower plate 221 and the support plate 223 to move, so that the support plate 223 can move to the surface of the wafer; the clamping jaws of the chuck 210 are cylindrical, through grooves 224 matched with the clamping jaws of the chuck 210 are formed in the surface of the lower plate body 221, the clamping jaws of the chuck 210 are inserted into the through grooves 224 in a sliding mode, the through grooves 224 are additionally formed, and the clamping jaws of the chuck 210 can penetrate through the lower plate body 221 conveniently.

Referring to fig. 1, 2 and 4, the material taking mechanism 300 includes a first vacuum chuck 310 and a vacuum generator 320, the first vacuum chuck 310 is installed on the surface of the pressing plate 220, and the first vacuum chuck 310 is communicated with the vacuum pumping end of the vacuum generator 320 through a connecting pipe 330, in specific implementation, the first vacuum chuck 310 is attached to the wafer, then the vacuum generator 320 is used for vacuuming the first vacuum chuck 310, so that a negative pressure is formed at the joint of the first vacuum chuck 310 and the wafer, the first vacuum chuck 310 can suck the wafer, and then the pressing plate 220 is moved, so that the first vacuum chuck 310 and the wafer can be driven to move, the wafer can be taken down from the surface of the chuck 210, the wafer can be taken, and the wafer blanking efficiency can be improved.

In this embodiment, the surface of the pressing plate 220 is provided with a through hole 225, the first vacuum chuck 310 is inserted into the through hole 225 in a sliding manner, the connecting ring 331 is fixedly sleeved on the surface of the connecting tube 330, one side of the support plate 223 is connected with a pressing block 227 through a spring 226, one side of the pressing block 227 is tightly attached to the connecting ring 331, and the connecting ring 331 is pressed and fixed through the cooperation of the spring 226 and the pressing block 227, so that the connecting tube 330 can be fixed, the mounting and dismounting of the connecting tube 330 are facilitated, and the mounting and dismounting of the first vacuum chuck 310 are facilitated; the support plate 223 is an angle plate, a guide rod 228 is fixed on one side of the pressing block 227, one end of the guide rod 228 penetrates through the support plate 223 in a sliding mode, and the guide rod 228 is additionally arranged, so that the moving stability of the pressing block 227 can be improved; the circumferential surface of the connecting ring 331 is provided with an annular groove 332, the pressing block 227 is inserted in the annular groove 332 in a sliding manner, and the annular groove 332 is additionally arranged, so that the connection tightness between the pressing block 227 and the connecting ring 331 is improved; it can be understood that the surface of the connecting pipe 330 is communicated with the air pipe 340, and the valve 350 is installed at the opening of the air pipe 340, when the vacuum generator 320 is not used to make vacuum on the first vacuum cup 310, the vacuum generator 320 is closed, and the valve 350 is opened, so that the external air can enter the air pipe 340, and further the external air enters the first vacuum cup 310 through the connecting pipe 330, so that positive pressure is formed in the first vacuum cup 310.

Specifically, the working principle of the wafer paster processing clamp is as follows: when the wafer processing device is used, a wafer to be processed is placed on the surface of the chuck 210, the wafer is clamped and fixed through the jaws of the chuck 210, the screw 230 is rotated to enable the screw 230 to move, and then the pressing plate 220 is supported to move, the pressing plate 220 can extrude and fix the wafer on the surface of the chuck 210, so that the wafer can be more stably fixed on the surface of the chuck 210, and the fixing effect of the wafer is improved, in addition, the first vacuum chuck 310 on the surface of the pressing plate 220 is attached to the wafer, when the wafer is taken down from the surface of the chuck 210, the chuck 210 is regulated and controlled to enable the jaws of the chuck 210 to be separated from the wafer, the vacuum generator 320 is used for vacuumizing the first vacuum chuck 310, so that negative pressure is formed at the joint of the first vacuum chuck 310 and the wafer, the first vacuum chuck 310 can absorb the wafer, then the screw 230 is rotated to enable the pressing plate 220 to be driven by the screw 230 to move, so, the wafer can be taken down from the surface of the chuck 210, the wafer can be taken conveniently, and the wafer discharging efficiency is improved.

It should be noted that the specific model specifications of the chuck 210 and the vacuum generator 320 need to be determined by model selection according to the actual specification of the apparatus, and the specific model selection calculation method adopts the prior art, so detailed description is omitted.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer paster adds clamping apparatus, characterized in that, include

The shelf assembly (100), the shelf assembly (100) comprises a base (110) and a bracket (120), and the bracket (120) is fixed on the surface of the base (110);

the clamping mechanism (200) comprises a chuck (210) and a pressure plate (220), the chuck (210) is installed on the surface of the base (110), the pressure plate (220) is located above the chuck (210), a screw rod (230) is installed on the surface of the pressure plate (220), and the screw rod (230) is in threaded connection with the bracket (120);

the material taking mechanism (300) comprises a first vacuum chuck (310) and a vacuum generator (320), wherein the first vacuum chuck (310) is installed on the surface of the pressing plate (220), and the first vacuum chuck (310) is communicated with the vacuumizing end of the vacuum generator (320) through a connecting pipe (330).

2. The wafer patch processing clamp according to claim 1, wherein the bracket (120) is a corner plate, and the connection part of the bracket (120) and the base (110) is integrally formed.

3. The wafer mounting jig according to claim 1, wherein a second vacuum chuck (211) is inserted into an upper end surface of the chuck (210), and the first vacuum chuck (310) and the second vacuum chuck (211) are disposed to face each other.

4. The wafer patch processing clamp as claimed in claim 1, wherein the lower end surface of the chuck (210) is fixedly connected to the base (110) through a support rod (212), and at least three support rods (212) are equidistantly arranged along a circumferential direction of the chuck (210).

5. The wafer patch processing clamp as claimed in claim 1, wherein the pressing plate (220) comprises a lower plate body (221) and an upper plate body (222), the upper plate body (222) is mounted on the upper end surface of the lower plate body (221) through a support plate (223), and the upper plate body (222) is rotatably connected with the screw rod (230) through a bearing.

6. The wafer patch processing clamp as claimed in claim 5, wherein the clamping jaws of the chuck (210) are cylindrical, the surface of the lower plate (221) is provided with through slots (224) matching with the clamping jaws of the chuck (210), and the clamping jaws of the chuck (210) are slidably inserted into the through slots (224).

7. The wafer patch processing clamp as claimed in claim 5, wherein a through hole (225) is formed in the surface of the pressing plate (220), the first vacuum chuck (310) is inserted into the through hole (225) in a sliding manner, a connecting ring (331) is fixedly sleeved on the surface of the connecting tube (330), a pressing block (227) is connected to one side of the support plate (223) through a spring (226), and one side of the pressing block (227) is tightly attached to the connecting ring (331).

8. The wafer paster processing jig of claim 7 wherein said support plate (223) is an angle plate, a guide bar (228) is fixed to one side of said pressing block (227), and one end of said guide bar (228) is slidably inserted through said support plate (223).

9. The wafer patch processing clamp as claimed in claim 7, wherein the connecting ring (331) has a circumferential groove (332), and the pressing block (227) is slidably inserted into the circumferential groove (332).

10. The wafer patch processing clamp as claimed in claim 1, wherein the connecting tube (330) has a connecting tube (340) connected to the surface thereof, and a valve (350) is installed at the opening of the connecting tube (340).