CN212874417U

CN212874417U - Electron emission device applied to physics

Info

Publication number: CN212874417U
Application number: CN202022350044.0U
Authority: CN
Inventors: 何科荣
Original assignee: Nanchang Normal University
Current assignee: Nanchang Normal University
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-04-02
Anticipated expiration: 2030-10-21

Abstract

The utility model discloses a be applied to electron-emitting device of physics, the loach carrying platform comprises a supporting fram, support frame bottom outer wall is provided with the bottom plate, and bottom plate top outer wall is provided with electron-emitting device, and bottom plate bottom outer wall is opened there is the electron emission mouth, and the electron-emitting device outer wall is provided with heat conduction shell, and heat conduction shell outer wall is provided with four heating panels respectively, and four heating panel outer walls are provided with four heat conduction silica gel layers respectively, and heating panel one side outer wall is provided with the first fin more than three respectively. The utility model discloses a setting is by the second fin of bolt fastening, can be convenient dismantle and install the second fin to let the staff can be according to the heat dissipation demand of reality, at the second fin of the suitable quantity of first fin outer wall installation, thereby let first fin can provide different heat dispersion according to the user demand of reality, effectively improved the radiating effect of first fin.

Description

Electron emission device applied to physics

Technical Field

The utility model relates to an electron emission technical field especially relates to an electron emission device who is applied to physics.

Background

The electron emission is divided into thermionic emission, photoelectronic emission and secondary electron emission according to different excitation modes, a common electron emission device comprises a discharge electrode group, an alternating current power supply and a direct current high-voltage power supply, the voltage output by the alternating current power supply is applied to two electrodes of the discharge electrode group, an air gap between the electrodes is broken down to generate high-temperature electric arcs, so that a large number of negative electrons are released in the surrounding space, the negative electrons fly to a dust-collecting positive electrode under the action of an electric field, the electron emission device can generate high heat and high-temperature electric arcs during working, the electron emission device is a precise electronic element, the requirement of the electronic element on the working temperature is high, the accuracy and the real-time performance of the electron emission of the electronic element can be influenced when the electronic element is in a high-heat environment for a long time, the emission efficiency of the electron emission device is low, and the service life of the electronic element can be reduced when the electronic element, thereby reducing the lifetime of the electron emission device.

Through retrieval, chinese patent application No. CN207425789U discloses a device convenient for electron emission, which comprises a frame, an emission device fixedly connected to the middle of the inner wall of the bottom of the frame, heat dissipation silica gel fixedly connected to the outer wall of the emission device, and heat absorption silica gel fixedly connected to the side wall of the frame installed on both sides of the emission device.

SUMMERY OF THE UTILITY MODEL

The present invention is to provide an electron emission device applied to physics to solve the disadvantages existing in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an electron emission device applied to physics comprises a support frame, wherein the outer wall of the bottom of the support frame is provided with a bottom plate, the outer wall of the top of the bottom plate is provided with an electron emission device, the outer wall of the bottom plate is provided with an electron emission opening, the outer wall of the electron emission device is provided with a heat conduction shell, the outer wall of the heat conduction shell is respectively provided with four heat conduction silica gel layers, the outer wall of one side of each heat conduction plate is respectively provided with more than three first heat dissipation fins, the outer wall of one side of each heat conduction silica gel layer is respectively provided with more than three rectangular through holes, the first heat dissipation fins penetrate through the heat conduction silica gel layers through the rectangular through holes, the outer wall of the support frame is respectively fixed with four sealing doors through hinges, the outer wall of one side of each, the outer wall of the top of the support frame is provided with a control panel.

As a further aspect of the present invention: four top radiating holes are formed in the outer wall of the top cover respectively, and a top dust screen is fixed to the inner wall of each top radiating hole through screws.

As a further aspect of the present invention: the outer wall of one side of the sealing door is provided with a cooling fan, the cooling fan is arranged on the inner wall of the cooling hole, the outer wall of the bottom of the top cover is provided with a temperature sensor, and the cooling fan and the temperature sensor are respectively electrically connected with the control panel.

As a further aspect of the present invention: the outer wall of the bottom of the heat dissipation plate is provided with two T-shaped sliding blocks respectively, the outer wall of the top of the bottom plate is provided with four groups of T-shaped sliding rails respectively, the two T-shaped sliding rails are a group, the two T-shaped sliding blocks are connected to the inner walls of the group of T-shaped sliding rails in a sliding mode respectively, the outer wall of the top of the bottom plate is provided with more than three threaded holes respectively, the outer walls of two sides of the heat dissipation plate are provided with two fixed blocks respectively, and the two.

As a further aspect of the present invention: the outer wall of the heat conduction shell is provided with heat conduction blocks distributed in an array mode, the heat conduction blocks are of a triangular prism structure, and the outer wall of one side of the heat dissipation plate is of a sawtooth structure.

As a further aspect of the present invention: the mounting groove is characterized in that the outer wall of one side of the first cooling fin is provided with more than three mounting grooves respectively, the inner walls of two sides of the mounting groove are provided with two threaded through holes respectively, the inner wall of the mounting groove is fixed with a second cooling fin through a bolt, the outer wall of one side of the second cooling fin is provided with a mounting block and two connecting pieces respectively, and the mounting block is clamped on the inner wall of the mounting groove.

As a further aspect of the present invention: the heat conduction shell, the heat conduction block, the heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate are all made of aluminum metal.

The utility model has the advantages that:

1. through setting up by the second fin of bolt fastening, can be convenient dismantle and install the second fin to let the staff can be according to the heat dissipation demand of reality, at the second fin of first fin outer wall installation suitable quantity, thereby let first fin can provide different heat dispersion according to the user demand of reality, effectively improved the radiating effect of first fin.

2. The heat conduction block in the triangular prism structure is arranged, so that the contact area between the heat conduction shell and the heat dissipation plate can be effectively increased, the heat conduction efficiency between the heat conduction shell and the heat dissipation plate is accelerated, and the heat conduction effect of the heat conduction shell is effectively improved; through setting up temperature sensor and radiator fan, temperature sensor can give control panel with the inside temperature real-time transmission of support frame, and when the inside temperature of support frame exceeded the setting value, control panel control radiator fan rotated the radiating efficiency who accelerates the louvre, avoids the inside high temperature of support frame to influence electron emitter's normal operating.

3. Through setting up T type slider, T type slide rail and fixed block, T type slider and T type slide rail can carry out effectual spacing and direction to the heating panel when installation and dismantlement to make things convenient for the staff to install the heating panel and dismantle, when promoting the heating panel through T type slider and T type slide rail to the position with the contact of heat conduction shell outer wall, can fix two fixed blocks on the top outer wall of bottom plate through the screw, thereby accomplish the fixed to the heating panel.

Drawings

Fig. 1 is a schematic front view of an electron emission device applied to physics according to the present invention;

fig. 2 is a schematic cross-sectional structural diagram of an electron emission device applied in physics according to the present invention;

fig. 3 is a schematic structural diagram of a supporting frame of an electron emission device applied in physics according to the present invention;

fig. 4 is a schematic structural diagram of a heat-conducting casing of an electron emission device applied in physics according to the present invention;

fig. 5 is a schematic view of a heat dissipation plate structure of an electron emission device applied in physics according to the present invention;

fig. 6 is a schematic view of a second heat sink of an electron emission device applied in physics according to the present invention;

fig. 7 is a schematic structural diagram of a second heat sink of an electron emission device applied in physics according to the present invention;

fig. 8 is a schematic circuit flow diagram of an electron emission device applied to physics according to the present invention.

In the figure: 1-support frame, 2-top dust screen, 3-top cover, 4-side dust screen, 5-control panel, 6-sealing door, 7-radiating hole, 8-radiating fan, 9-T type slide rail, 10-radiating plate, 11-first radiating fin, 12-temperature sensor, 13-fixed block, 14-top radiating hole, 15-electronic emission device, 16-heat conducting shell, 17-heat conducting block, 18-heat conducting silica gel layer, 19-mounting groove, 20-T type slide block, 21-second radiating fin, 22-mounting block, 23-connecting piece and 24-bottom plate.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

An electron emission device applied to physics is shown in figures 1-8 and comprises a support frame 1, wherein a bottom plate 24 is arranged on the outer wall of the bottom of the support frame 1, an electron emission device 15 is arranged on the outer wall of the top of the bottom plate 24, an electron emission opening is formed on the outer wall of the bottom plate 24, a heat conduction shell 16 is arranged on the outer wall of the electron emission device 15, four heat dissipation plates 10 are respectively arranged on the outer wall of the heat conduction shell 16, four heat conduction silica gel layers 18 are respectively arranged on the outer walls of the four heat dissipation plates 10, more than three first heat dissipation fins 11 are respectively arranged on the outer wall of one side of the heat conduction silica gel layer 18, more than three rectangular through holes are respectively formed on the outer wall of one side of the heat conduction silica gel layer 11, four sealing doors 6 are respectively fixed on the outer wall of the support frame 1 through hinges, three heat, the top cover 3 is fixed on the outer wall of the top of the support frame 1 through a hinge, and the control panel 5 is arranged on the outer wall of the top of the support frame 1.

In order to improve the heat dissipation effect of the top cover 3; as shown in fig. 1 and 3, four top heat dissipation holes 14 are respectively formed in the outer wall of the top cover 3, and a top dust screen 2 is fixed to the inner wall of each top heat dissipation hole 14 through screws; through setting up top louvre 14, can let the heat that electron-emitting device 15 gived off from the top of support frame 1, improved the radiating effect of support frame 1.

In order to further improve the heat dissipation efficiency of the support frame 1; as shown in fig. 2, the outer wall of one side of the sealing door 6 is provided with a cooling fan 8, the cooling fan 8 is arranged on the inner wall of the cooling hole 7, the outer wall of the bottom of the top cover 3 is provided with a temperature sensor 12, the cooling fan 8 and the temperature sensor 12 are respectively electrically connected with the control panel 5, and the model of the temperature sensor 12 is GX18B 20; through setting up temperature sensor 12 and radiator fan 8, temperature sensor 12 can give control panel 5 with the inside temperature real-time transmission of support frame 1, and when the inside temperature of support frame 1 exceeded the setting value, control panel 5 controlled radiator fan 8 rotated the radiating efficiency who accelerates louvre 7, avoided the inside high temperature of support frame 1 to influence the normal operating of electron emitter 15.

To facilitate the removal and installation of the heat dissipation plate 10; as shown in fig. 2, 3 and 5, the outer wall of the bottom of the heat dissipation plate 10 is respectively provided with two T-shaped sliders 20, the outer wall of the top of the bottom plate 24 is respectively provided with four groups of T-shaped slide rails 9, the two T-shaped slide rails 9 are a group, the two T-shaped sliders 20 are respectively connected to the inner walls of the group of T-shaped slide rails 9 in a sliding manner, the outer wall of the top of the bottom plate 24 is respectively provided with more than three threaded holes, the outer walls of two sides of the heat dissipation plate 10 are respectively provided with two fixing blocks 13, and the two fixing blocks 13 are respectively; through setting up T type slider 20, T type slide rail 9 and fixed block 13, T type slider 20 and T type slide rail 9 can carry out effectual spacing and direction to heating panel 10 when installation and dismantlement, thereby make things convenient for the staff to install and dismantle heating panel 10, when promoting heating panel 10 through T type slider 20 and T type slide rail 9 to the position with the contact of heat conduction shell 16 outer wall, can fix two fixed blocks 13 on the top outer wall of bottom plate 24 through the screw, thereby accomplish the fixed to heating panel 10.

To enhance the heat transfer effect of the heat conductive housing 16; as shown in fig. 4 and 5, the outer walls of the heat-conducting shells 16 are respectively provided with heat-conducting blocks 17 distributed in an array manner, the heat-conducting blocks 17 are in a triangular prism structure, and the outer wall of one side of the heat-dissipating plate 10 is in a sawtooth structure; through setting up the heat conduction piece 17 that is triangular prism type structure, can effectively improve the area of contact between heat conduction shell 16 and the heating panel 10 to accelerate the heat conduction efficiency between heat conduction shell 16 and the heating panel 10, effectively improved heat conduction shell 16's heat conduction effect.

In order to improve the heat dissipation effect of the first heat sink 11; as shown in fig. 5, 6 and 7, the outer wall of one side of the first heat sink 11 is respectively provided with more than three mounting grooves 19, the inner walls of two sides of the mounting grooves 19 are respectively provided with two threaded through holes, the inner wall of the mounting groove 19 is fixed with a second heat sink 21 through bolts, the outer wall of one side of the second heat sink 21 is respectively provided with a mounting block 22 and two connecting pieces 23, and the mounting block 22 is clamped on the inner wall of the mounting groove 19; through setting up by bolt fastening's second fin 21, can be convenient dismantle and install second fin 21 to let the staff can be according to the heat dissipation demand of reality, at the second fin 21 of the suitable quantity of first fin 11 outer wall installation, thereby let first fin 11 can provide different heat dispersion according to the user demand of reality, effectively improved the radiating effect of first fin 11.

In order to effectively reduce the weight of the whole support frame 1; as shown in fig. 2, 4, 5 and 7, the heat conductive housing 16, the heat conductive block 17, the heat dissipation plate 10, the first heat dissipation plate 11 and the second heat dissipation plate 21 are made of aluminum; by arranging the heat-conducting shell 16, the heat-conducting block 17, the heat dissipation plate 10, the first heat dissipation plate 11 and the second heat dissipation plate 21 which are made of aluminum metal, the overall weight of the support frame 1 can be effectively reduced on the premise that the heat dissipation effect of the whole device is not affected.

The working principle is as follows: the heat generated by the electron emission device during operation can be quickly absorbed by the heat conduction shell 16 and then conducted to the heat dissipation plate 10 from the heat conduction shell 16, after the heat is conducted to the heat dissipation plate 10, the heat can be quickly dissipated to the outside through the first heat dissipation fins 11, the efficiency of dissipating the heat from the heat dissipation plate 10 to the outer wall can be further improved by arranging the heat conduction silica gel layer 18, the heat dissipated from the heat dissipation plate 10 can be quickly dissipated to the outside through the heat dissipation holes in the outer wall of the sealing door 6 by arranging the sealing door 6, meanwhile, a worker can debug the electron emission device 15 by opening the sealing door 6, so that the worker can conveniently maintain the equipment, the side dust screen 4 can effectively block outside dust on the support frame 1, and meanwhile, the worker can take down the side dust screen 4 for cleaning by disassembling screws, through the arrangement of the top radiating holes 14, heat emitted by the electron emission device 15 can be emitted from the top of the support frame 1, the temperature sensor 12 can transmit the temperature inside the support frame 1 to the control panel 5 in real time, when the temperature inside the support frame 1 exceeds a set value, the control panel 5 controls the radiating fan 8 to rotate to accelerate the radiating efficiency of the radiating holes 7, and avoids the influence of overhigh temperature inside the support frame 1 on the normal operation of the electron emission device 15, the T-shaped slider 20 and the T-shaped sliding rail 9 can effectively limit and guide the radiating plate 10 during installation and disassembly, thereby facilitating the installation and disassembly of the radiating plate 10 by a worker, when the radiating plate 10 is pushed to a position contacting with the outer wall of the heat conducting shell 16 through the T-shaped slider 20 and the T-shaped sliding rail 9, two fixing blocks 13 can be fixed on the outer wall at the top of the bottom plate 24 through screws, thereby completing the fixation, through setting up the heat conduction piece 17 that is triangular prism type structure, can effectively improve the area of contact between heat conduction shell 16 and the heating panel 10, thereby accelerate the heat conduction efficiency between heat conduction shell 16 and the heating panel 10, through setting up the second fin 21 by the bolt fastening, can be convenient dismantle and install second fin 21, thereby let the staff can be according to the heat dissipation demand of reality, the second fin 21 of suitable quantity of installation at 11 outer walls of first fin, thereby let first fin 11 can provide different heat dispersion according to the user demand of reality.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. An electron emission device applied to physics comprises a support frame (1) and is characterized in that a bottom plate (24) is arranged on the outer wall of the bottom of the support frame (1), an electron emission device (15) is arranged on the outer wall of the top of the bottom plate (24), an electron emission opening is formed in the outer wall of the bottom plate (24), a heat conduction shell (16) is arranged on the outer wall of the electron emission device (15), four heat dissipation plates (10) are respectively arranged on the outer wall of the heat conduction shell (16), four heat conduction silica gel layers (18) are respectively arranged on the outer walls of the four heat dissipation plates (10), more than three first cooling fins (11) are respectively arranged on the outer wall of one side of each heat dissipation plate (10), more than three rectangular through holes are respectively formed in the outer wall of one side of each heat conduction silica gel layer (18), the first cooling fins (11) penetrate, three heat dissipation holes (7) are formed in the outer wall of one side of the sealing door (6) respectively, a side dust screen (4) is fixed to the outer wall of one side of the sealing door (6) through screws, a top cover (3) is fixed to the outer wall of the top of the support frame (1) through hinges, and a control panel (5) is arranged on the outer wall of the top of the support frame (1).

2. The electron emission device as claimed in claim 1, wherein the top cover (3) has four top heat dissipation holes (14) on the outer wall of the top, and the top dust screen (2) is fixed on the inner wall of the top heat dissipation holes (14) by screws.

3. The electron emission device as claimed in claim 2, wherein the outer wall of the sealing door (6) is provided with a heat dissipation fan (8), the heat dissipation fan (8) is disposed on the inner wall of the heat dissipation hole (7), the outer wall of the bottom of the top cover (3) is provided with a temperature sensor (12), and the heat dissipation fan (8) and the temperature sensor (12) are electrically connected to the control panel (5), respectively.

4. The electron emission device applied to physics according to claim 3, wherein the bottom outer wall of the heat dissipation plate (10) is respectively provided with two T-shaped sliders (20), the top outer wall of the bottom plate (24) is respectively provided with four sets of T-shaped slide rails (9), the two T-shaped slide rails (9) form a set, the two T-shaped sliders (20) are respectively slidably connected to the inner walls of the set of T-shaped slide rails (9), the top outer wall of the bottom plate (24) is respectively provided with more than three threaded holes, the two side outer walls of the heat dissipation plate (10) are respectively provided with two fixing blocks (13), and the two fixing blocks (13) are respectively fixed on the top outer wall of the bottom plate (24) through screws.

5. The electron emission device as claimed in claim 4, wherein the heat conduction housing (16) is provided with heat conduction blocks (17) arranged in an array on the outer wall thereof, the heat conduction blocks (17) are triangular prism shaped, and the heat dissipation plate (10) is provided with a saw-toothed outer wall on one side thereof.

6. The electron emission device as claimed in claim 5, wherein the first heat sink (11) has three or more mounting grooves (19) on its outer wall, the mounting grooves (19) have two threaded through holes on its inner walls, the second heat sink (21) is fixed to the inner wall of the mounting grooves (19) by bolts, the second heat sink (21) has a mounting block (22) and two connecting pieces (23) on its outer wall, and the mounting block (22) is engaged with the inner wall of the mounting grooves (19).

7. The electron emission device applied to physics according to claim 6, characterized in that the heat conductive housing (16), the heat conductive block (17), the heat dissipation plate (10), the first heat dissipation plate (11) and the second heat dissipation plate (21) are all made of aluminum metal.