CN212873375U - Electronic equipment and test system - Google Patents

Abstract

The application discloses electronic equipment and test system belongs to the circuit field. According to the application, the hardware equipment required in the application program testing process is modularized, all the components are integrated in the case with the small size, the electronic equipment capable of testing the application program is constructed, the electronic equipment is deployed in the machine room as the cloud testing platform, a large amount of hardware equipment does not need to be connected when the testing platform is deployed, the deployment difficulty of the testing platform can be reduced, and the testing platform can be deployed in a large amount and efficiently.

Description

Electronic equipment and test system

Technical Field

The present disclosure relates to circuit technologies, and in particular, to an electronic device and a test system.

Background

The application program test is an important link in application program development, and the main task is to test the operation effect of the application program on terminals of different models. At present, when an application program is tested, a cloud real machine testing platform is used for remote testing based on a cloud technology, the cloud real machine testing platform is composed of various models of hardware devices such as testing terminals, a host, a router and a switch, and developers can complete testing by using the testing terminals in the cloud real machine testing platform without preparing testing devices by themselves.

However, because the number of hardware devices included in the cloud real machine test platform is large, the hardware devices occupy a large amount of space when deployed in a machine room, and the connection between the devices is complex, the difficulty of device deployment is large, and the efficiency is extremely low.

Disclosure of Invention

The embodiment of the application provides electronic equipment and a test system, and the deployment efficiency of the test equipment can be improved. The technical scheme is as follows:

in one aspect, an electronic device is provided, which includes a chassis, a system control component, a network component, at least one terminal controller, and at least one terminal, where the system control component, the network component, the at least one terminal controller, and the at least one terminal are located inside the chassis;

the system control assembly comprises a main board and a monitoring board, wherein the main board is in communication connection with the monitoring board, and the monitoring board is used for controlling the at least one terminal controller based on an instruction of the main board;

each terminal controller is in communication connection with the corresponding terminal, and the terminal controllers are used for supplying power to the terminals and controlling the running states of the terminals;

the at least one terminal is in communication connection with the mainboard and is used for testing the application program based on the installation package of the application program provided by the mainboard and outputting a test result of the application program;

the network component is in communication connection with the system control component, the at least one terminal controller and the at least one terminal, and the network component is used for providing data communication services for the system control component, the at least one controller and the at least one terminal.

In one aspect, a test system is provided, where the test system includes the electronic device and a control terminal, and the control terminal is in communication connection with the electronic device;

the control terminal is used for sending a test instruction and an installation package of an application program to be tested to the electronic equipment;

the electronic equipment is used for testing the application program to be tested based on the test instruction and sending a test result to the control terminal.

According to the technical scheme, the hardware equipment required in the application program testing process is modularized, all the components are integrated in the case with the small size, the electronic equipment capable of being used for testing the application program is constructed, the electronic equipment is deployed in a machine room as a remote testing platform, the testing platform is not required to be connected with a large number of hardware equipment, the deployment difficulty of the testing platform can be reduced, and the testing platform can be deployed in a large number and efficiently.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic component diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic internal structure diagram of a chassis of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a chassis provided in an embodiment of the present application;

FIG. 4 is a schematic view of a front panel of a chassis according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a rear panel of a chassis according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of an internal network topology of a chassis according to an embodiment of the present application;

FIG. 7 is a schematic view of an internal organization structure of a chassis according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a connection mode of a monitoring board according to an embodiment of the present disclosure;

FIG. 9 is a schematic diagram of a power load provided by an embodiment of the present application;

fig. 10 is a schematic diagram of a terminal controller unit according to an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

The terms "first," "second," and the like in this application are used for distinguishing between similar items and items that have substantially the same function or similar functionality, and it should be understood that "first," "second," and "nth" do not have any logical or temporal dependency or limitation on the number or order of execution.

For the sake of clarity, the following description is made of terms referred to in the examples of the present application:

cloud technology refers to a hosting technology for unifying serial resources such as hardware, software, network and the like in a wide area network or a local area network to realize calculation, storage, processing and sharing of data. In the embodiment of the application, various hardware related to the cloud real machine testing system are integrated into one electronic device, and the electronic device is used as a cloud testing server and deployed in a machine room to realize cloud real machine testing.

IDC: an Internet Data Center (IDC for short) is a service platform with perfect equipment (including high-speed Internet access bandwidth, high-performance local area network, safe and reliable computer room environment, etc.), specialized management and perfect application.

Cloud true machine: the real mobile phone is located at the cloud end, a developer can send an installation package of the application program to be tested to the cloud real machine, the cloud real machine carries out application test based on the installation package, a test result is output, and the application cloud real machine can realize real machine test anytime and anywhere.

The electronic equipment provided by the embodiment of the application can be applied to various application scenes, for example, can be applied to a cloud real machine test service scene. In the embodiment of the application, each hardware device in the cloud real machine testing system is modularized and integrated into one electronic device, and the electronic device has the characteristics of small size, strong mobility and simple connection, can be deployed in an IDC machine room rapidly in batches, and effectively improves the deployment efficiency of the cloud real machine testing system. Moreover, the user can remotely control the electronic equipment through the network, the electronic equipment is remotely maintained, and compared with a management mode of the equipment in a traditional machine room, the manual operation and maintenance cost of a machine room manager is saved, and the operation and maintenance efficiency of the equipment is greatly improved.

Fig. 1 is a schematic assembly diagram of an electronic device according to an embodiment of the present application, fig. 2 is a schematic internal structure diagram of a chassis of an electronic device according to an embodiment of the present application, and the internal structure of the electronic device is briefly described below with reference to fig. 1 and fig. 2. In the embodiment of the present application, the electronic device includes a chassis 1, a system control component 2, a network component 3, at least one terminal controller 4, and at least one terminal 5, as shown in fig. 2, the system control component 2, the network component 3, the at least one terminal controller 4, and the at least one terminal 5 are all located inside the chassis 1. Wherein, the case 1 has a front panel 11 and a rear panel 12; the system control component 2 includes a main board 21 and a monitoring board 22, the main board 21 is in communication connection with the monitoring board 22, and the monitoring board 22 is configured to control the at least one terminal controller 4 based on an instruction of the main board 21, for example, to control the terminal controller to restart, to implement the terminal controller reset, and the like; each terminal controller 4 is in communication connection with a corresponding terminal 5, and the terminal controllers 4 are used for supplying power to the corresponding terminals 5 and controlling the operating states of the terminals 5; the at least one terminal 5 is fixed in the case 1 through a binding band, the at least one terminal 5 is in communication connection with the main board 21, and the at least one terminal 5 is used for performing an application program test based on an installation package of an application program provided by the main board 21 and outputting an application program test result; the network component 3 is communicatively connected to the system control component 2, the at least one terminal controller 4 and the at least one terminal 5, the network component 3 is configured to provide data communication services for the system control component 2, the at least one controller 4 and the at least one terminal 5, and as shown in fig. 2, the network component may be located below the at least one terminal controller. It should be noted that the terminal may be a device capable of running an application, such as a smart phone or a tablet computer, and in the embodiment of the present application, the terminal is only described as a smart phone.

As shown in fig. 1 and 2, the inside of the case 1 of the electronic device further includes a power supply assembly 6 for supplying power to other components inside the case. In a possible design, the electronic device case 1 further includes a heat dissipation assembly 7, and the heat dissipation assembly 7 is located between the system control assembly 2 and the terminal controller 4, and is used for adjusting the temperature inside the case 1 to avoid component damage of the electronic device due to an excessively high temperature inside the case 1.

The following describes the enclosure of the electronic device in detail with reference to fig. 3 to 5.

Fig. 3 is a schematic diagram of a chassis provided in an embodiment of the present application, and referring to fig. 3, in a possible design, the external size of the electronic device, that is, the size of the chassis 1 is 2U. Where U is a unit representing the external size of the server, and is an abbreviation of unit, 1U is equal to 4.445cm, and 2U is twice 1U, which is 8.89 cm. In one possible design, the parameters of the enclosure 1 are shown in table 1.

TABLE 1

It should be noted that, the number of each interface in table 1 is only an exemplary description, and the number of each interface may be more or less, and the embodiment of the present application does not limit this.

In the embodiment of the present application, the front panel of the chassis has at least one SIM (Subscriber identity Module) card slot, at least one status light, at least one reset button, and a power-on key. Fig. 4 is a schematic diagram of a front panel of a chassis according to an embodiment of the present disclosure, and as shown in fig. 4, in a possible design, the front panel 11 of the chassis has 10 SIM card slots 111, 10 status lights 112, and 10 reset keys 113. Of course, a power-on key and the like may also be included, which is not limited in the embodiment of the present application. The at least one SIM card slot is used for installing the SIM card of the at least one terminal, and one SIM card slot is connected with one corresponding terminal controller through a lead, namely, the SIM card slot is connected with the terminal through the terminal controller. In this embodiment, each status light on the front panel is used to indicate an operating status of the corresponding terminal controller, the at least one status light is connected to the monitoring panel through a wire, and the monitoring panel triggers a change of the status light corresponding to a certain terminal controller when adjusting the operating status of the certain terminal controller. For example, when the terminal controller operates normally, the corresponding status light is normally on; when the terminal controller stops running, the corresponding status light is normally dark; when the terminal controller is reset, the corresponding status light flickers. Each reset key is used for restarting the corresponding terminal controller, the at least one reset key is connected with the monitoring board through a lead, and the monitoring board can read the key state of each reset key.

The numbers of the SIM card slots, the status lights, and the reset keys are determined based on the number of terminals that can be mounted on the electronic device, and the embodiments of the present application do not limit this. For example, if the number of terminals that can be mounted on the electronic device is 10, the number of SIM card slots, status lights, and reset keys is also 10. In the embodiment of the application, the SIM card slot of the terminal is externally connected and arranged on the front panel of the case, so that the SIM card of the terminal can be conveniently replaced. Set up the status light that each terminal control ware corresponds on the front panel, can be convenient for know the current running state of each terminal control ware, and come out the control part that resets of terminal control ware is external, set up on the front panel of quick-witted case, need not dismouting quick-witted case when resetting terminal control ware, be convenient for reset terminal control ware fast.

In this embodiment, the back panel of the chassis has a network cable Interface, a Universal Serial Bus (USB) Interface, a High Definition Multimedia Interface (HDMI), and a Serial communication Interface (COM Interface). Fig. 5 is a schematic diagram of a rear panel of a chassis according to an embodiment of the present invention, and as shown in fig. 5, the rear panel 12 of the chassis has 1 network cable interface 121, 2 universal serial bus interfaces 122, 1 high-definition multimedia interface 123, and 1 serial communication interface 124. Wherein, the network cable interface 121 is connected to the network component 3 through a wire; the usb interface 122, the high-definition multimedia interface 123 and the serial communication interface 124 are connected to the motherboard 21 by wires, and the usb interface 122, the high-definition multimedia interface 123 and the serial communication interface 124 can be connected to external devices. For example, the high-definition multimedia interface 123 can transmit uncompressed audio and video signals, and can be connected to audio and video playing devices such as televisions and notebook computers. The universal serial bus interface 122 can support connections between electronic devices and types of external devices, for example, the universal serial bus interface 122 can connect a mouse, a keyboard, a floppy drive, a removable memory device, and the like. The serial communication interface 124 can be connected to an external modem, a serial printer, or the like. Taking the rear panel of the chassis shown in fig. 5 as an example, the rear panel further has a power interface, and the power interface is connected to the power supply assembly.

In the embodiment of the application, on one hand, hardware equipment required by the cloud real machine testing service is modularized, and each component is integrated into a 2U standard server case, so that electronic equipment for performing the cloud real machine testing service has high integration and portability, and due to the small volume, the electronic equipment can be deployed in a large number of computer rooms. On the other hand, the external wiring of the case of the electronic equipment is few, the electronic equipment can be operated only by one network cable and one power line, a test platform is not required to be assembled by connecting a plurality of hardware equipment like the prior art, and the deployment efficiency of the electronic equipment, namely the test platform, can be effectively improved; when external equipment such as a display and input equipment is connected, the external equipment is connected through an interface on the electronic equipment case, the external equipment does not need to be connected to each hardware device respectively as in the past, and links of equipment line management and maintenance can be effectively simplified. Compared with the traditional equipment deployment and management mode in the machine room, the method can effectively save the manual operation and maintenance cost and improve the operation and maintenance efficiency.

Each component inside the chassis and the connection method between the components will be specifically described below with reference to fig. 6 to 10.

Fig. 6 is a schematic diagram of an internal network topology of a chassis according to an embodiment of the present application, and details of network components and a network topology in the chassis are described with reference to fig. 6. In one possible design, network component 3 includes a router 31, a switch 32, and a wireless access point 33. The router 31 is connected to a Network interface on a rear panel of the chassis through a wire, and the router 31 is connected to a Wide Area Network (WAN) through the Network interface. The router 31, the switch 32, and the wireless access point 33 inside the Network component 3 access a Local Area Network (LAN), the router 31 and the switch 32 are connected in communication, the switch 32 is connected in communication with at least one terminal controller and a main board, and the wireless access point 33 is connected in communication with the router 31 and the at least one terminal. In the embodiment of the application, the network component can provide data communication service between the mainboard and the mobile phone controller in the chassis, so that the mainboard and the mobile phone controller can send information mutually, and the network connection requirements of each terminal can be met. And because the network component provides a good network environment for the electronic equipment, developers can directly remotely control each component in the electronic equipment through the network, thereby being convenient for remotely maintaining each component and effectively improving the maintenance efficiency of the components.

Fig. 7 is a schematic diagram of an internal organization structure of a chassis according to an embodiment of the present application, and fig. 7 illustrates a connection manner between various components inside an electronic device and a power supply manner inside the electronic device. Fig. 8 is a schematic diagram of a connection manner of a monitoring board according to an embodiment of the present application, and a system control component in the electronic device is specifically described below with reference to fig. 7 and 8. In a possible design, the motherboard 21 in the system control module 2 may be a motherboard based on an intel NUC host, and the monitoring board 22 uses an STM32 single-chip microcomputer, for example, the monitoring board uses an STM32F103RBT6 as a master. It should be noted that the main board and the monitor board may also adopt devices of different types, which is not limited in this application embodiment, and in this application embodiment, the intel NUC host and the STM32 single chip microcomputer are only used as examples for description. The data communication between the main board 21 and the monitoring board 22 can be established through a serial port, and in a possible design, because the interfaces for communication between the main board 21 and the monitoring board 22 are different, the connection between the main board 21 and the monitoring board 22 needs an interface conversion chip, and the communication between two devices with different communication interfaces is established through the interface conversion chip. For example, the monitoring board 22 has an interface conversion chip, and the interface conversion chip is in communication connection with the main board 21, that is, a pin of the interface conversion chip is connected to the monitoring board 22 and connected to the main board 21 through a USB data line, so as to implement communication connection between the main board 21 and the monitoring board 22. As shown in fig. 8, the interface conversion chip may be FT232, but other interface conversion chips may also be applied, which is not limited in this embodiment of the present application. As shown in fig. 8, in a possible design, the monitoring board 22 is further connected to a power-on triggering module, in this embodiment, since the main board 21 is located inside the chassis, the power-on triggering module needs to simulate a power-on key of the main board 21 to trigger the main board to power on when the power is turned on. For example, the motherboard 21 has a power-on trigger circuit, and in a normal case, pressing a power-on button of the motherboard can trigger the power-on trigger circuit to operate, so that the motherboard is powered on. In the embodiment of the present application, after the monitor board 22 is powered on, the power-on trigger module sends a power-on signal to the motherboard 21, and the power-on signal acts on the power-on trigger circuit of the motherboard 21 to operate the power-on trigger circuit, so that the effect of pressing the power-on key of the motherboard 21 can be simulated, and the motherboard 21 is powered on.

As shown in fig. 8, the monitoring board 22 has a digital temperature sensor, which may be DS18B20, thereon for detecting the temperature in the cabinet in real time. In the embodiment of the present application, the monitoring board 22 is also connected to the heat dissipation assembly, so as to adjust the temperature inside the chassis. In one possible design, the heat sink assembly may consist of 3 8025 dedicated silent fans that meet the 2U standard server chassis size, including the motor drive and the fan. The motor drive can be designed based on a BTN7970 chip, is connected with the monitoring board through a wire, and drives the fan to rotate when rotating. In one possible design, the monitoring board can control the motor to rotate and stop based on the temperature in the case, and the fan is driven to be turned on by the motor to dissipate heat when the temperature in the case is greater than a temperature threshold value. For example, the monitoring board sends a first control signal to the motor drive in response to the temperature in the chassis being greater than or equal to a temperature threshold, the first control signal being used to control the motor drive to start rotating; and the monitoring board responds to the situation that the temperature in the case is less than the temperature threshold value, and sends a second control signal to the motor drive, wherein the second control signal is used for controlling the motor drive to stop rotating. The temperature threshold is set by a developer, and the embodiment of the present application is not limited thereto. In one possible design, the monitoring board further has an N-MOS, and the heat dissipation assembly is controlled based on a conduction state of the N-MOS, for example, when the N-MOS is conducted, the motor driver determines to receive the first control signal, and when the N-MOS is not conducted, the motor driver determines to receive the second control signal. It should be noted that the above description of the control manner of the monitoring board for the heat dissipation assembly is only an exemplary description of one possible implementation manner, and the embodiment of the present application does not limit how the monitoring board controls the heat dissipation assembly specifically. In this application embodiment, through installing digital temperature sensor on the control board, come the temperature of real-time supervision quick-witted incasement, drive radiator unit in time dispels the heat to quick-witted case when the temperature is too high, avoids each subassembly to damage because of the high temperature.

It should be noted that the above description of the connection manner between the monitoring board and each device is only an exemplary description, as shown in fig. 8, the monitoring board may further be connected with 12 optical couplers, and the optical couplers may transmit electrical signals by using light as a medium, and have the characteristics of small volume, long service life, no contact, and strong anti-interference capability; and the 12 paths of optical couplers are connected with the 12 paths of relays, and the relays can play the roles of automatic adjustment, safety protection, circuit conversion and the like. It should be noted that, in the embodiments of the present application, there is no limitation on what devices are specifically connected to the monitoring board.

Hereinafter, a power supply module and a power supply method in the electronic device will be specifically described with reference to fig. 7. In one possible design, the power supply assembly 6 includes a dual redundant power supply 61 and a boost module 62, as shown in fig. 7. The dual-path redundant power supply consists of two identical power supplies, the chip controls the power supplies to carry out load balancing, when one power supply fails, the other power supply can take over the work of the other power supply, and the dual-path redundant power supply is used for realizing high availability of the electronic equipment. The boost module is used for adjusting an output power supply of the power supply, and if the driving voltage required by any component in the electronic equipment is higher than the output voltage of the power supply, the boost module can be used for adjusting the output voltage and then supplying power to the component so as to ensure the normal operation of each component in the electronic equipment. In a possible design, the two-way redundant power supply 61 is connected with the boosting module 62, the network component and at least one terminal controller through conducting wires, the boosting module 62 is connected with the two-way redundant power supply 61 and the system control component through conducting wires, and the driving voltage required by the main board is higher than the driving voltage of other components under normal conditions, so that the output voltage of the two-way redundant power supply can be adjusted through the boosting module arranged between the main board and the two-way redundant power supply. For example, the output voltage of the dual redundant power supply is 12V, the motherboard of the intel NUC host is used as the motherboard, and the driving voltage required by the motherboard is 19V, so that the 12V voltage output by the dual redundant power supply needs to be increased to 19V by the boost module 62 and then provided to the motherboard. In a possible design, the power board of the dual redundant power supply 61 employs a dual redundant server integrated power supply and voltage regulation module to ensure stable power supply for each component in the electronic device, as shown in fig. 8, the voltage regulation module is connected to the monitoring board, and of course, may also be connected to other devices, which is not limited in this embodiment. In the embodiment of the application, the power supply assembly adopts a combined design of a double-path redundant power supply and a boosting module, so that on one hand, stable power supply can be provided for each assembly, and the condition that equipment is powered off due to a certain power failure is avoided; on the other hand, the arrangement of the boosting module can flexibly adjust the output voltage of the power supply to adapt to the driving voltage of each component. Fig. 9 is a schematic diagram of a power supply load provided in an embodiment of the present application, referring to fig. 9, the power supply assembly is connected to a 240V or VDC power supply through a power interface to provide a 1200W/12V standard power supply for an electronic device, and a total load of the power supply is 700W at most, where each terminal controller consumes 20W of power, the network assembly consumes 150W of power, the motherboard consumes 230W of power, each fan in the heat dissipation assembly consumes 25W of power, and the monitor board consumes 1W of power.

Fig. 10 is a schematic diagram of a terminal controller unit according to an embodiment of the present application, in the embodiment of the present application, a plurality of terminal controllers may be divided into a group, taking 10 terminal controllers integrated in an electronic device as an example, and 5 terminal controllers may be divided into a group and integrated on a single board to form a terminal controller unit. Taking the internal structure of the chassis shown in fig. 2 as an example, two terminal controller units are installed in two rows in the chassis, and each terminal controller has a terminal corresponding to the terminal controller unit. In a possible design, the terminal controller is designed by relying on a raspberry pi, and can provide functions of terminal power supply and on-off control, USB on-off control, startup key simulation of a terminal and the like. In the embodiment of the application, the terminal controller is based on the Raspberry Pi design, so that the size of the terminal controller can be effectively reduced, and a plurality of terminal controllers can be integrated in a smaller case. In one possible design, a switch is arranged between each independent terminal controller and the two-way redundant power supply, the switch is connected with the monitoring board through a lead, and the switch is used for resetting the terminal controller based on a control signal of the monitoring board. That is, the on-off control of the switch is performed through the monitoring board, and the reset operation of the terminal controller is realized. In one possible design, the switch control device is a normally closed relay, i.e. in a default state in a conducting state, and is switched off when a control signal is applied. In the embodiment of the application, a switch is arranged between each terminal controller and the power supply, so that the independent terminal controllers can be flexibly controlled; the switch is controlled by a monitoring board in the system control assembly, and the system control assembly can receive a remote control signal, namely, a developer can remotely control the switch, so that the terminal controller is reset through remote operation, and the operation and maintenance efficiency of the electronic equipment is effectively improved.

In the embodiment of the application, the hardware equipment required in the application program testing process is modularized, and then all the components are integrated in a case with a small size to form the electronic equipment capable of testing the application program, the electronic equipment is used as a remote testing platform to be deployed in a machine room, and a large amount of hardware equipment does not need to be connected when the testing platform is deployed, so that the deployment difficulty of the testing platform can be reduced, and the testing platform can be deployed in a large amount and efficiently. Moreover, the network component is arranged in the electronic equipment, and each component in the electronic equipment can be controlled through the network, so that the remote operation and maintenance of the internal component of the electronic equipment are realized.

In the embodiment of the application, a test system is further provided, and the test system can be used for processing cloud real machine test service. In one possible design, the test system includes the electronic device and a control terminal. The control terminal can be a terminal used by a developer, the control terminal is in communication connection with the electronic device, the control terminal can be used for sending a test instruction and an installation package of an application program to be tested to the electronic device, and the electronic device is used for testing the application program to be tested based on the test instruction and sending a test result to the control terminal. For example, in an application program testing process, a developer sends an installation package and a test instruction of an application program to be tested to an electronic device through the control terminal, in one possible implementation manner, a mainboard in the electronic device receives the installation package and the test instruction, the installation package is sent to each terminal for testing in the electronic device through the mainboard, the control terminal starts testing the application program, the terminal sends a test result to the mainboard, and the mainboard sends the test result to the control terminal.

The following describes an application of the test system, taking an example of testing a game application program. In a possible implementation manner, the control terminal may display a test interface corresponding to the test system, where the test interface includes an installation package uploading entry, a tester type selection area, a test item selection area, and a test control. It should be noted that, the above description of the test interface in the embodiment of the present application is only an exemplary description, and the content included in the test interface in the embodiment of the present application is not limited. The developer can upload the installation package of the game on the test interface, select the test item and the used test model of the test, and the control terminal responds to the trigger operation of the developer on the test control to generate the test instruction, which may include information of the test item and the test model, and the embodiment of the application is not limited thereto. And the control terminal sends the test instruction and the installation package to the electronic equipment, and the electronic equipment executes the subsequent application program test steps. In a possible implementation manner, a motherboard in the electronic device receives the installation package and the test instruction, the motherboard sends the installation package to a terminal corresponding to the test model in the electronic device based on the test model in the test instruction, and the terminal installs and runs the installation package to test the application program. After the terminal completes the application program test, a test result may be generated, where the test result may include operation condition information of the application program on terminals of different models, and the like, which is not limited in this embodiment of the application. And the terminal sends the test result to the mainboard, the mainboard sends the test result to the control terminal used by the developer, and the control terminal displays the test result on the test result viewing interface. In the embodiment of the application, the electronic equipment is integrated with the test terminals of various models, the electronic equipment can communicate with the control terminal used by a developer, remote test can be performed through the electronic equipment deployed in a machine room in the game test process, the test terminals of various models do not need to be prepared, and the test efficiency is improved. In addition, the electronic equipment is provided with the network component to provide data communication service for other components in the case, so that each component in the electronic equipment can communicate with the control terminal, namely, the control terminal can control each component respectively to maintain each component, so as to ensure that each component operates normally in the test process, and further ensure that the test result is accurate.

It should be noted that the above description of performing the application test on the application electronic device is only an exemplary description of one possible implementation manner, for example, the control terminal may also send the installation package to a terminal in the electronic device, and the embodiment of the present application does not limit a specific test process.

In the embodiment of the application, the test system is built based on the electronic equipment, due to the portability of the electronic equipment and the characteristic of convenient maintenance, the electronic equipment can be deployed and migrated quickly and on a large scale, the electronic equipment with high integration level is beneficial to the deployment of overseas IDCs, and further the internationalization process of the cloud real machine test service can be accelerated.

All the above optional technical solutions may be combined arbitrarily to form optional embodiments of the present application, and are not described herein again.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (11)

1. An electronic device is characterized by comprising a case, a system control component, a network component, at least one terminal controller and at least one terminal, wherein the system control component, the network component, the at least one terminal controller and the at least one terminal are positioned in the case;

the system control assembly comprises a main board and a monitoring board, the main board is in communication connection with the monitoring board, and the monitoring board is used for controlling the at least one terminal controller based on instructions of the main board;

each terminal controller is in communication connection with the corresponding terminal, and the terminal controllers are used for supplying power to the terminals and controlling the running states of the terminals;

the at least one terminal is in communication connection with the mainboard, and the at least one terminal is used for testing the application program based on the installation package of the application program provided by the mainboard and outputting the test result of the application program;

the network component is in communication connection with the system control component, the at least one terminal controller and the at least one terminal, and the network component is used for providing data communication services for the system control component, the at least one controller and the at least one terminal.

2. The electronic device of claim 1, further comprising a heat dissipation component located inside the chassis between the system control component and the at least one terminal controller;

the heat dissipation assembly comprises a motor drive and a fan, the motor drive is connected with the monitoring board through a wire, and the motor drive drives the fan to rotate when rotating.

3. The electronic device of claim 2, wherein the monitor board has a digital temperature sensor thereon, the digital temperature sensor being configured to detect a temperature within the chassis;

the monitoring board is used for controlling the motor to drive and stop based on the temperature in the case.

4. The electronic device of claim 3, wherein the monitor board sends a first control signal to the motor drive in response to the temperature inside the chassis being greater than or equal to a temperature threshold, the first control signal being used to control the motor drive to start rotating;

and the monitoring board responds to the situation that the temperature in the case is smaller than the temperature threshold value, and sends a second control signal to the motor drive, wherein the second control signal is used for controlling the motor drive to stop rotating.

5. The electronic device of claim 1, wherein the front panel of the chassis has at least one SIM card slot, at least one status light, at least one reset key, and a power on key;

the at least one SIM card slot is connected with the at least one terminal controller through a lead, and the at least one SIM (Subscriber identity Module) card slot is used for installing the SIM card of the at least one terminal;

the at least one status lamp is connected with the monitoring board through a lead, and each status lamp is used for indicating the running state of the corresponding terminal controller;

the at least one reset key is connected with the monitoring board through a wire, and each reset key is used for restarting the corresponding terminal controller.

6. The electronic device of claim 1, wherein the back panel of the chassis has a network cable interface, a universal serial bus interface, a high-definition multimedia interface, and a serial communication interface;

the network cable interface is connected with the network component through a lead;

the universal serial bus interface, the high-definition multimedia interface and the serial communication interface are connected with the mainboard through wires.

7. The electronic device according to claim 1, wherein the monitoring board has an interface conversion chip thereon, and the interface conversion chip is communicatively connected to the main board to implement the communication connection between the main board and the monitoring board.

8. The electronic device of claim 1, further comprising a power supply assembly located inside the chassis, the power supply assembly comprising a dual redundant power supply and a boost module;

the two-way redundant power supply is connected with the boosting module, the network component and the at least one terminal controller through leads, and the boosting module is connected with the two-way redundant power supply and the system control component through leads;

the dual-path redundant power supply is used for supplying power to the system control assembly, the network assembly and the at least one terminal controller, and the boosting module is used for adjusting the output voltage of the dual-path redundant power supply.

9. The electronic device of claim 8, wherein there is a switch between the terminal controller and the dual redundant power supply;

the switch is connected with the monitoring board through a wire, and the switch is used for resetting the terminal controller based on the control signal of the monitoring board.

10. The electronic device of claim 1, wherein the network components comprise a router, a switch, and a wireless access point;

the router is in communication connection with the switch, and the router is connected with the network cable interface through a lead;

the switch is in communication connection with the at least one terminal controller and the main board;

the wireless access point is in communication connection with the router and the at least one terminal.

11. A test system comprising the electronic device of any one of claims 1-10 and a control terminal communicatively coupled to the electronic device;

the control terminal is used for sending a test instruction and an installation package of an application program to be tested to the electronic equipment;

the electronic equipment is used for testing the application program to be tested based on the testing instruction and sending a testing result to the control terminal.

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