CN212850231U

CN212850231U - Air-cooled and water-cooled high-voltage power module structure

Info

Publication number: CN212850231U
Application number: CN202021577753.6U
Authority: CN
Inventors: 张军
Original assignee: Shenzhen Tianshun Wisdom Energy Technology Co ltd
Current assignee: Shenzhen Tianshun Wisdom Energy Technology Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-03-30
Anticipated expiration: 2030-07-31

Abstract

The utility model relates to a but forced air cooling and water-cooled high-pressure power modular structure, including casing, radiator, electric capacity subassembly and power device, power device and electric capacity subassembly are connected respectively in the casing, and the radiator is connected in the casing, and the radiator sets up in the below of power device, and is equipped with logical groove on the rear end face of casing, and logical inslot is arranged in to the outer end of radiator. The utility model discloses a set up casing, radiator, electric capacity subassembly and power device, wherein, be equipped with logical groove on the rear end face of casing, and place the bottom at the casing with the radiator to improve the radiating efficiency, set up the takeover problem that leads to the groove and can realize the water-cooling process, need not change the height and the width of whole casing, only need adjust the size and the specification of radiator, realize can carrying out forced air cooling or water-cooling according to actual requirement.

Description

Air-cooled and water-cooled high-voltage power module structure

Technical Field

The utility model relates to a high-voltage power supply, more specifically say and indicate but forced air cooling and water-cooled high-voltage power modular structure.

Background

The development trend of the high-voltage power cabinet body is modularization, miniaturization, high power density and the like, but the high-voltage power unit has high power and large capacity, so that the cabinet body has a large number of power units and various overall dimensions, and the sizes of cabinets are different. At present, most of high-voltage cabinet type power units are independent and single in-out structures. According to different capacities, unit structures with different sizes need to be designed, and along with the increase of the capacity, the air cooling structure which is independently configured in the cabinet body cannot meet the requirement.

Therefore, it is necessary to design a new structure that can perform air cooling or water cooling according to actual requirements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, but provide air-cooled and water-cooled high-voltage power modular structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme: but forced air cooling and water-cooled high-voltage power modular structure, including casing, radiator, electric capacity subassembly and power device, power device and electric capacity subassembly connect respectively in the casing, the radiator connect in the casing, just the radiator set up in the below of power device, just be equipped with logical groove on the rear end face of casing, the outer end of radiator is arranged in logical inslot.

The further technical scheme is as follows: the radiator is an air-cooled radiator.

The further technical scheme is as follows: the power device is characterized by further comprising a parallel copper bar, and the parallel copper bar is connected with the power device.

The further technical scheme is as follows: the rear end face of the shell is provided with a direct current copper bar hole, and the outer end of the parallel copper bar penetrates through the direct current copper bar hole.

The further technical scheme is as follows: the radiator is a water-cooling radiator, and is provided with a water connector hole; the water joint hole is connected with a joint, the outer end of the joint penetrates through the through groove, and the outer end of the joint is connected with water supply equipment.

The further technical scheme is as follows: one end of the power device is connected with an output copper bar.

The further technical scheme is as follows: a laminated copper bar is connected above the capacitor assembly; and a driving insulating panel is connected above the laminated copper bar.

The further technical scheme is as follows: and a driving plate is connected above the driving insulation panel.

The further technical scheme is as follows: the shell comprises a front insulation panel, a rear insulation panel, side plates and a bottom plate, wherein the side plates are connected to two ends of the front insulation panel, the two ends of the rear insulation panel are respectively connected with the side plates, and the bottom plate is connected to the lower parts of the front insulation panel, the rear insulation panel and the side plates; the rear insulating panel is provided with the through groove.

The further technical scheme is as follows: the side plates are made of metal.

Compared with the prior art, the utility model beneficial effect be: the utility model discloses a set up casing, radiator, electric capacity subassembly and power device, wherein, be equipped with logical groove on the rear end face of casing, and place the bottom at the casing with the radiator to improve the radiating efficiency, set up the takeover problem that leads to the groove and can realize the water-cooling process, need not change the height and the width of whole casing, only need adjust the size and the specification of radiator, realize can carrying out forced air cooling or water-cooling according to actual requirement.

The invention is further described with reference to the accompanying drawings and specific embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic diagram of an internal structure of a high-voltage power module structure capable of air cooling and water cooling according to an embodiment of the present invention;

fig. 2 is a schematic top view of a high voltage power module structure capable of air cooling and water cooling according to an embodiment of the present invention;

fig. 3 is a schematic diagram of an internal structure of a high-voltage power module structure capable of air cooling and water cooling according to an embodiment of the present invention;

fig. 4 is a schematic top view of a high voltage power module structure capable of air cooling and water cooling according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and the following detailed description.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

As shown in fig. 1 to 4, the high voltage power module structure capable of air cooling and water cooling provided in this embodiment can be applied to a high voltage power supply structure, and air cooling or water cooling can be performed according to actual requirements.

Referring to fig. 1, the air-cooling and water-cooling high-voltage power module structure includes a housing, a heat sink 60, a capacitor assembly 100 and a power device 90, wherein the power device 90 and the capacitor assembly 100 are respectively connected in the housing, the heat sink 60 is disposed below the power device 90, a through groove is disposed on a rear end surface of the housing, and an outer end of the heat sink 60 is disposed in the through groove.

In this embodiment, according to actual conditions, the heat sink 60 uses air-cooled or water-cooled plates as required, and the heat sink 60 may use 2 small heat sinks or 1 large heat sink in series or in parallel, where the heat sink refers to an air-cooled heat sink or a water-cooled heat sink, and is substantially in the shape of a heat sink, and the length of the heat sink 60 or the thickness of the water-cooled plate may be appropriately increased according to different heating requirements of the power device 90, without changing the height and width of the whole unit, so that air-cooled or water-cooled operation can be performed according to actual requirements.

The number of the radiators 60 is one or two, and water cooling or air cooling can be matched according to actual conditions.

The heat sink 60 is disposed below the power device 90, and the heat sink 60 is disposed at the bottom, so that a larger heat dissipation space is available, and effective heat dissipation of the power device 90 is facilitated.

In an embodiment, referring to fig. 1 and fig. 2, the heat sink 60 is an air-cooled heat sink.

In an embodiment, referring to fig. 1, the structure further includes a parallel copper bar 80, and the parallel copper bar 80 is connected to the power device 90.

In addition, referring to fig. 1, a dc copper bar hole is formed on the rear end surface of the housing, and the outer end of the parallel copper bar 80 passes through the dc copper bar hole.

Specifically, the power device 90 includes a first insulated gate bipolar transistor, one end of which is connected to the capacitor assembly 100 through a connecting copper bar, and the other end of which is connected to the parallel copper bar 80; one end of the second insulated gate bipolar transistor is connected with the capacitor assembly 100 through the connecting copper bar, and the other end of the second insulated gate bipolar transistor is connected with one end of the parallel copper bar 80; one end of the third insulated gate bipolar transistor is connected with the capacitor assembly 100 through a connecting copper bar, and the other end of the third insulated gate bipolar transistor is connected with the other end of the parallel copper bar 80; one end of the fourth insulated gate bipolar transistor is connected with the second capacitor assembly 100 through a connecting copper bar, and the other end of the fourth insulated gate bipolar transistor is connected with the parallel copper bar 80, namely the first insulated gate bipolar transistor and the second insulated gate bipolar transistor are output after being connected in parallel through the parallel copper bar 80; the third insulated gate bipolar transistor and the fourth insulated gate bipolar transistor are connected in parallel through the parallel copper bar 80 and then output.

In another embodiment, referring to fig. 3 and 4, the heat sink 60 is a water-cooling heat sink, and the heat sink 60 is provided with a water joint hole; the water joint hole is connected with a joint 61, the outer end of the joint 61 penetrates through the through groove, and the outer end of the joint 61 is connected with water supply equipment.

The radiator 60 is replaced with a water-cooled radiator according to actual conditions, and in the present embodiment, the water-cooled radiator has a plate shape.

In another embodiment, referring to fig. 3, one end of the power device 90 is connected to an output copper bar 81.

When the water cooling mode is adopted, the serial connection mode is adopted at the moment, each power device 90 corresponds to one output copper bar 81, and the serial connection mode and the parallel connection mode are adopted. The same size and configuration meets two different requirements.

Specifically, the overall height and width of the unit are not changed, and the length of the metal side plate 40 and the length of the bottom plate 30 can be adjusted to meet the requirements of different capacities. The size and model of the radiator 60 are changed only, the requirements of different capacities can be met, and the radiator is compatible with a water-cooling radiator.

In addition, in other embodiments, the heat sink 60 can be classified as an insert heat sink, a relieved tooth heat sink with heat pipe, or a water-cooled heat sink as required; the size of the heat sink 60 may be specifically adjusted in length and thickness according to the amount of heat generation.

In one embodiment, referring to fig. 1 and 3, a laminated copper bar 70 is connected above the capacitor element 100; a driving insulation panel is connected above the laminated copper bar 70.

However, the heat dissipation mode is air cooling or water cooling, except for the difference between the parallel connection mode and the serial connection mode and the difference between the selection of the heat dissipater 60, the other settings are consistent, the switching between the parallel connection and the serial connection is more convenient, and the replacement of the heat dissipater 60 is also more convenient.

Specifically, the capacitors are uniform in type, and several standard sizes can be uniform in selection of the laminated copper bars 70, so that the cost is reduced.

In this embodiment, the capacitor assembly 100 considers mainly 2 rows, 3 rows and 4 rows of capacitors, which are divided into different lengths according to the number of capacitors.

In an embodiment, a driving board is further connected above the driving insulation panel.

In an embodiment, the housing includes a front insulation panel 10, a rear insulation panel 50, side plates 40 and a bottom plate 30, the side plates 40 are connected to two ends of the front insulation panel 10, two ends of the rear insulation panel 50 are respectively connected to the side plates 40, and the bottom plate 30 is connected to the lower portions of the front insulation panel 10, the rear insulation panel 50 and the side plates 40; the rear insulating panel 50 is provided with a through groove.

The front insulating panel 10, the rear insulating panel 50, the side plates 40 and the bottom plate 30 enclose a rectangular housing.

In an embodiment, the side plate 40 is made of metal.

The front insulating panel 10 and the rear insulating panel 50 are uniformly shaped, and are subjected to die sinking batch production, so that the attractiveness of the product is improved, and the cost can be integrally reduced.

The front insulation panel 10 is an SMC plate, and after the die sinking is finished, screws need to be installed, and a PVC facial mask is used for sticking the label plate and the like. The rear insulating panel 50 is an SMC panel, and the opening of the mold is completed, requiring back-side mounting of screws. In order to be compatible with various requirements, different requirements of the air cooling plate and the water cooling plate need to be considered, 61 holes of the water connectors of the water cooling plate are reserved, and direct-current copper bar holes are reserved, so that special test requirements can be met conveniently. The side plates 40 and the bottom plate 30 are made of aluminum-zinc-coated plates, and the like, and the overall height and width are determined, and the length can be properly changed according to different capacities.

The high-voltage power module structure capable of air cooling and water cooling is characterized in that the shell, the radiator 60, the capacitor assembly 100 and the power device 90 are arranged, wherein the through groove is formed in the rear end face of the shell, the radiator 60 is placed at the bottom of the shell, the heat dissipation efficiency is improved, the connecting pipe problem in the water cooling process can be realized by arranging the through groove, the height and the width of the whole shell do not need to be changed, the size and the specification of the radiator 60 only need to be adjusted, and air cooling or water cooling can be realized according to actual requirements.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. But forced air cooling and water-cooled high-voltage power modular structure, its characterized in that, including casing, radiator, electric capacity subassembly and power device, the power device and electric capacity subassembly connect respectively in the casing, the radiator connect in the casing, just the radiator set up in the below of power device, just be equipped with logical groove on the rear end face of casing, the outer end of radiator is arranged in logical inslot.

2. The air-and water-coolable high-voltage power module structure of claim 1, wherein the heat sink is an air-cooled heat sink.

3. The structure of an air-and water-coolable high-voltage power module as claimed in claim 2, further comprising parallel copper bars, the parallel copper bars being connected to the power devices.

4. The structure of an air-and water-cooled high-voltage power module as claimed in claim 3, wherein a direct-current copper bar hole is formed on the rear end surface of the housing, and the outer end of the parallel copper bar passes through the direct-current copper bar hole.

5. The air-and water-coolable high-voltage power module structure of claim 1, wherein the heat sink is a water-cooled heat sink, the heat sink being provided with water joint holes; the water joint hole is connected with a joint, the outer end of the joint penetrates through the through groove, and the outer end of the joint is connected with water supply equipment.

6. The structure of an air-and water-cooled high-voltage power module as claimed in claim 5, wherein an output copper bar is connected to one end of the power device.

7. The structure of an air-and water-cooled high-voltage power module according to any one of claims 1 to 6, wherein laminated copper bars are connected above the capacitor assembly; and a driving insulating panel is connected above the laminated copper bar.

8. The modular structure of high voltage power module capable of being air-cooled and water-cooled according to claim 7, wherein a driving plate is further connected above the driving insulation panel.

9. The structure of an air-and water-cooled high-voltage power module according to claim 7, wherein the housing comprises a front insulation panel, a rear insulation panel, side plates and a bottom plate, wherein the side plates are connected to two ends of the front insulation panel, the two ends of the rear insulation panel are respectively connected to the side plates, and the bottom plate is connected to the lower parts of the front insulation panel, the rear insulation panel and the side plates; the rear insulating panel is provided with the through groove.

10. The structure of an air-and water-cooled high-voltage power module as claimed in claim 9, wherein the side plate is made of metal.